Heat exchange plate, heat exchange module and electronic equipment

Abstract

The utility model provides a heat exchange plate, a heat exchange module and electronic equipment, the heat exchange plate comprises a plate body, the plate body comprises a first area and a second area, and the first area is configured to correspond to a heating area of an electronic product; the plate body is provided with a plurality of heat exchange flow channels, each heat exchange flow channel extends to the first area, and the heat exchange flow channels are not communicated with one another; and at least one part of each heat exchange runner extends to the second area.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation for electronic products, and more specifically, to a heat exchange plate, a heat exchange module, and an electronic device. Background Art

[0002] The existing heat exchange plates for electronic products create a circulation path between the high-temperature area and the low-temperature area of the electronic product, and achieve heat exchange through the circulation of the heat exchange liquid. However, the problem with the existing heat exchange plates is that the heat exchange liquid only flows through the high-temperature area and the low-temperature area once within one cycle time, which limits the effective transfer of heat, resulting in low heat exchange efficiency and thus easily causing local overheating of the electronic product. Utility Model Content

[0003] This application provides a new technical solution for a heat exchange plate, which can at least solve the problem of low heat exchange efficiency of the existing heat exchange plate.

[0004] This application also provides a new technical solution for a heat exchange module.

[0005] This application also provides a new technical solution for an electronic device.

[0006] According to the first aspect of this application, there is provided a heat exchange plate, including: a plate body, the plate body includes a first region and a second region, the first region is configured to correspond to the heat generating area of the electronic product; the plate body is provided with a plurality of heat exchange channels, each of the heat exchange channels extends to the first region, and the heat exchange channels are not connected to each other; at least a part of each of the heat exchange channels extends to the second region.

[0007] Optionally, the plate body includes a plurality of first regions, and different heat exchange channels extend from each of the first regions.

[0008] Optionally, the plate body includes a plurality of second regions, and each of the heat exchange channels extends to a different second region.

[0009] Optionally, the heat exchange channel itself has at least two sets of series-connected sub-channels; each set of sub-channels has a first channel segment and a second channel segment; the first channel segment is located in the first region, the second channel segment is located in the second region, and the second channel segments of adjacent two sets of sub-channels are connected to each other to form the series connection between the sub-channels.

[0010] Optionally, the plate body includes a plurality of first regions, and each of the first regions extends multiple sets of the sub-channels.

[0011] Optionally, the plate body includes a plurality of second regions, and the sub-channels extend to different second regions.

[0012] Optionally, the first flow channel segment of each group of the sub-flow channels extends in a bent manner in their respective corresponding first regions.

[0013] Optionally, the first region includes a plurality of hot zones, and the first flow channel segment of each group of the sub-flow channels is located in a different hot zone; and / or, the second region includes a plurality of cold zones, and the second flow channel segment of each group of the sub-flow channels is located in a different cold zone.

[0014] Optionally, the cross-sectional area of the first flow channel segment is smaller than that of the second flow channel segment.

[0015] Optionally, the distribution density of the heat exchange flow channels in the first region is greater than that in the second region.

[0016] Optionally, the plate body is provided with liquid through holes, the liquid through holes include a plurality of first liquid through holes and a plurality of second liquid through holes, and a micropump is used to communicate between the first liquid through holes and the second liquid through holes, and each heat exchange flow channel corresponds to a group of liquid through holes.

[0017] Optionally, the plate body is provided with liquid through holes, the liquid through holes include a first liquid through hole and a second liquid through hole, and each heat exchange flow channel corresponds to a group of liquid through holes; the plate body is provided with at least one transition flow channel, and a micropump is used to communicate between the first end of the transition flow channel and the first liquid through hole and between the second end of the transition flow channel and the second liquid through hole.

[0018] Optionally, the first region is divided into the same number of first sub-regions as the number of the heat exchange flow channels, and each heat exchange flow channel extends to a different first sub-region; and / or, the second region is divided into the same number of second sub-regions as the number of the heat exchange flow channels, and each heat exchange flow channel extends to a different second sub-region.

[0019] According to a second aspect of the present application, there is provided a heat exchange module, including: the heat exchange plate according to any one of the above; a micropump, each heat exchange flow channel corresponds to at least one micropump, and the micropump and the heat exchange flow channel are communicated to form a circulation path.

[0020] According to a third aspect of the present application, there is provided an electronic device, including the above heat exchange module.

[0021] According to the heat exchange plate of the present application, by providing a plurality of heat exchange flow channels in the first region and the second region of the plate body, it is realized that the heat exchange liquid in the heat exchange plate can flow through the first region multiple times within a single circulation time, so that the heat exchange liquid can absorb heat multiple times in the first region within a single circulation time and transfer the heat to the second region, avoiding the heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate, and effectively preventing the problem of local overheating of electronic products and ensuring the uniform temperature of electronic products.

[0022] Other features and advantages of the present application will become clear from the following detailed description of exemplary embodiments of the present application with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The drawings incorporated in and constituting a part of this specification illustrate embodiments of the present application and, together with the description thereof, serve to explain the principles of the present application.

[0024] Figure 1 is a schematic structural view of a heat exchange plate according to an embodiment provided by the present application;

[0025] Figure 2 is a schematic structural view of a sub-channel of a heat exchange plate according to an embodiment provided by the present application;

[0026] Figure 3 is a partial schematic structural view of a heat exchange plate according to an embodiment provided by the present application.

[0027] REFERENCE NUMERALS

[0028] 100, heat exchange plate;

[0029] 10, first region; 11, hot zone;

[0030] 20, second region; 21, cold zone;

[0031] 30, heat exchange flow channel; 31, sub-channel; 31a, first flow channel section; 31b, second flow channel section;

[0032] 40, first liquid inlet; 50, second liquid inlet; 60, transition flow channel. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and values set forth in these embodiments do not limit the scope of the present application.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended as a limitation on the present application or its application or use.

[0035] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be considered as part of the specification.

[0036] In all examples shown and discussed herein, any specific values should be construed as merely exemplary and not as limitations. Thus, other examples of exemplary embodiments may have different values.

[0037] It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

[0038] Next, the heat exchange plate 100 according to an embodiment of the present application will be specifically described with reference to the accompanying drawings.

[0039] As Figure 1 and Figure 3 shown, the heat exchange plate 100 according to an embodiment of the present application includes a plate body.

[0040] Specifically, the plate body includes a first region 10 and a second region 20. The first region 10 is configured to correspond to the heat generating area of the electronic product. The plate body is provided with a plurality of heat exchange channels 30, and each heat exchange channel 30 extends to the first region 10, and the heat exchange channels 30 are not connected to each other. At least a part of each heat exchange channel 30 extends to the second region 20.

[0041] In other words, as Figure 1 and Figure 3 shown, the heat exchange plate 100 according to an embodiment of the present application is mainly used for heat exchange of electronic products. The heat exchange plate 100 mainly includes a plate body. The plate body may include a first region 10 and a second region 20. The area of the second region 20 may be larger than the area of the first region 10. The plate body is provided with heat exchange channels 30. A part of the heat exchange channels 30 may extend in the first region 10 of the plate body, and another part of the heat exchange channels 30 may extend in the second region 20 of the plate body, thereby forming a passage for circulating the heat exchange liquid. The first region 10 of the plate body is adapted to the heat generating area of the electronic product (for example, the area where the processor of the electronic product is located), so that the first region 10 of the plate body can cooperate with the heat generating area of the electronic product, and thus the heat in the heat generating area can be transferred to the second region 20 through the heat exchange liquid flowing in the heat exchange channels 30.

[0042] As Figure 1 and Figure 2 shown in this embodiment, the plate body is provided with a plurality of non-connected heat exchange channels 30. During a single cycle time, the heat exchange liquid in the plurality of heat exchange channels 30 can flow through the first region 10 and the second region 20 at least once, that is, the heat exchange liquid in the heat exchange plate 100 can flow through the first region 10 multiple times (at least the number of times of flow is the same as the number of the heat exchange channels 30) during a single cycle time, so as to absorb heat in the first region 10 multiple times and transfer the heat to the second region 20, which can effectively avoid the heat exchange liquid reaching the heat exchange saturation state, and thus can ensure that the heat exchange liquid can continuously and efficiently perform heat exchange within a better temperature range.

[0043] Thus, according to the heat exchange plate 100 provided in this embodiment, by providing a plurality of heat exchange channels 30 in the first region 10 and the second region 20 of the plate body, it is realized that the heat exchange liquid in the heat exchange plate 100 can flow through the first region 10 multiple times within a single circulation time, so that the heat exchange liquid can absorb heat in the first region 10 multiple times within a single circulation time and transfer the heat to the second region 20, avoiding heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing the problem of local overheating of electronic products and ensuring the uniform temperature of electronic products.

[0044] According to an embodiment of the present application, the plate body includes a plurality of first regions 10, and different heat exchange channels 30 extend in each first region 10.

[0045] That is to say, as Figure 1 shown, the plate body can be provided with a plurality of first regions 10, the plurality of first regions 10 are matched with a plurality of heat generating regions of the electronic product, and different heat exchange channels 30 extend in each first region 10, that is, at least two heat exchange channels 30 extend in each first region 10, so that the heat exchange liquid in the plate body can absorb heat from different first regions 10 multiple times within a single circulation time and transfer the heat to the second region 20.

[0046] In this embodiment, the heat exchange liquid in the plurality of heat exchange channels 30 can absorb heat in a plurality of heat generating regions of the electronic product, so that the electronic product does not need to be provided with a plurality of heat exchange plates 100, and the heat exchange liquid in the heat exchange plate 100 can flow through each first region 10 multiple times within a single circulation time, which can ensure efficient heat exchange.

[0047] In some specific embodiments of the present application, the plate body includes a plurality of second regions 20, and each heat exchange channel 30 extends to a different second region 20.

[0048] Specifically, as Figure 1 shown, the plate body can be provided with a plurality of second regions 20, and each heat exchange channel 30 can extend into one or more corresponding second regions 20, so that the heat exchange liquid in the plate body can transfer the heat absorbed in the first region 10 multiple times to different second regions 20 within a single circulation time, ensuring efficient heat exchange, effectively improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing the problem of local overheating of electronic products and ensuring the uniform temperature of electronic products.

[0049] According to an embodiment of the present application, the heat exchange flow channel 30 itself has at least two sets of series-connected sub-flow channels 31; each set of sub-flow channels 31 has a first flow channel section 31a and a second flow channel section 31b; the first flow channel section 31a is located in the first region 10, and the second flow channel section 31b is located in the second region 20. The second flow channel sections 31b of two adjacent sets of sub-flow channels 31 are connected to each other to form a series connection between the sub-flow channels 31.

[0050] That is to say, as Figure 1 shown, the heat exchange flow channel 30 includes multiple sets of sub-flow channels 31. The sub-flow channels 31 extend in the first region 10 and the second region 20. The part of the sub-flow channel 31 located in the first region 10 constitutes the first flow channel section 31a of the sub-flow channel 31, and the part of the sub-flow channel 31 located in the second region 20 constitutes the second flow channel section 31b of the sub-flow channel 31. Two adjacent sets of sub-flow channels 31 can be communicated with each other through one end of their respective second flow channel sections 31b. Here, two sets of sub-flow channels 31 are taken as an example for specific illustration. One end of the second flow channel section 31b of the first set of sub-flow channels 31 is communicated with one end of the second flow channel section 31b of the second set of sub-flow channels 31, so as to realize the series connection between the sub-flow channels 31.

[0051] In this embodiment, as Figure 1 shown, two adjacent sets of sub-flow channels 31 are connected in series through their respective corresponding second flow channel sections 31b, so that the heat exchange liquid in a single heat exchange flow channel 30 flows through the first region 10 and the second region 20 multiple times within a single circulation time. The heat exchange liquid in a single heat exchange flow channel 30 can absorb the heat of the heat generating area of the electronic product in the first region 10 multiple times and transfer the heat to the second region 20, avoiding the heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing the problem of local overheating of the electronic product and ensuring the uniform temperature of the electronic product.

[0052] Moreover, when the heat exchange liquid flows through multiple sets of sub-flow channels 31, it only needs to travel back and forth between the first region 10 and the second region 20 multiple times, without passing through non-target regions, which can ensure that the heat exchange liquid can focus on efficient heat exchange between the first region 10 (for the heat generating area of the electronic product) and the second region 20 (for the low heat area of the electronic product), thereby effectively avoiding the ineffective heat exchange that may occur when the heat exchange liquid flows through non-target regions.

[0053] In some specific embodiments of the present application, the plate body includes multiple first regions 10, and each first region 10 extends multiple sets of sub-flow channels 31.

[0054] Specifically, the plate body may be provided with a plurality of first regions 10, the plurality of first regions 10 are matched with a plurality of heat - generating regions of the electronic product, and each first region 10 extends with a plurality of groups of sub - flow channels 31. The plurality of groups of sub - flow channels 31 may be the sub - flow channels 31 of the same heat - exchange flow channel 30 or the sub - flow channels 31 of different heat - exchange flow channels 30, so that the heat - exchange liquid in the plate body can absorb heat from different first regions 10 multiple times during a single - cycle time and transfer the heat to the second region 20.

[0055] In this embodiment, the heat - exchange liquid flowing through one or more heat - exchange flow channels 30 can absorb heat in a plurality of heat - generating regions of the electronic product, so that the electronic product does not need to be provided with a plurality of heat - exchange plates 100, and the heat - exchange liquid in the heat - exchange plate 100 can flow through each first region 10 multiple times during a single - cycle time, which can ensure efficient heat exchange.

[0056] According to an embodiment of the present application, the plate body includes a plurality of second regions 20, and the sub - flow channels 31 extend to different second regions 20.

[0057] That is to say, the plate body may be provided with a plurality of first regions 10, and each group of sub - flow channels 31 can extend to different second regions 20, so that the heat - exchange liquid in one heat - exchange flow channel 30 can flow through different second regions 20. Thus, the heat - exchange liquid in the plate body can transfer the heat absorbed multiple times in the first region 10 to different second regions 20 during a single - cycle time, ensuring efficient heat exchange, effectively improving the heat - exchange efficiency of the heat - exchange plate 100, and effectively preventing the problem of local overheating of the electronic product and ensuring the uniform temperature of the electronic product.

[0058] In some specific embodiments of the present application, the first flow - channel segments 31a of each group of sub - flow channels 31 are bent and extended in their respective corresponding first regions 10.

[0059] Specifically, as Figure 1 and Figure 2 shown, the first flow - channel segments 31a of the plurality of groups of sub - flow channels 31 each have one or more bent portions, so that the first flow - channel segments 31a can fully cover their respective corresponding first regions 10. In this way, it can ensure that the heat - exchange liquid fully exerts its heat - exchange efficiency, optimize the heat - exchange area, significantly improve the uniform temperature of the heat - generating regions of the electronic product, effectively prevent local overheating phenomena, and thus ensure the stable operation of the electronic product.

[0060] According to an embodiment of the present application, the first region 10 includes a plurality of hot regions 11, and the first flow - channel segments 31a of each group of sub - flow channels 31 are located in different hot regions 11; and / or, the second region 20 includes a plurality of cold regions 21, and the second flow - channel segments 31b of each group of sub - flow channels 31 are located in different cold regions 21.

[0061] That is to say, asFigure 1 As shown, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the first region 10 of the plate body can be divided into a plurality of heat zones 11 (i.e., the regions that absorb the heat of the heat - generating zone), and the first flow channel segments 31a of each group of sub - flow channels 31 are extended to different heat zones 11. That is, each heat zone 11 is only configured with one first flow channel segment 31a. In this way, the heat - exchange liquid flowing through each first flow channel segment 31a can dissipate heat from the heat - generating zone of the electronic product at different positions, which is beneficial to maintaining the uniform temperature of the heat - generating zone of the electronic product, can effectively prevent local overheating, and thus ensure the stable operation of the electronic product.

[0062] As Figure 1 As shown, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate body can be divided into a plurality of cold zones 21 (i.e., the regions that dissipate heat to the low - heat zone and / or the outside), and the second flow channel segments 31b of each group of sub - flow channels 31 are extended to different cold zones 21. That is, each cold zone 21 is only configured with the second flow channel segment 31b of a group of sub - flow channels 31. In this way, when the heat - exchange liquid flows in the second flow channel segment 31b, it can efficiently disperse and transfer the heat to different positions of the low - heat zone of the electronic product, promoting the rapid transfer and distribution of heat. At the same time, it effectively prevents the local heat saturation phenomenon in the second region 20, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0063] In some specific embodiments of the present application, the cross - sectional area of the first flow channel segment 31a is smaller than that of the second flow channel segment 31b.

[0064] Specifically, in each group of sub - flow channels 31, the cross - sectional areas (i.e., the cross - sectional areas) of the first flow channel segment 31a and the second flow channel segment 31b can be different. In this embodiment, the cross - sectional area of the first flow channel segment 31a is smaller than that of the second flow channel segment 31b. The first flow channel segment 31a with a smaller cross - sectional area can ensure that the heat - exchange liquid can quickly pass through when flowing through the first region 10, effectively reducing the residence time of the heat - exchange liquid in this region, and effectively avoiding the heat saturation phenomenon caused by the heat - exchange liquid contacting high temperature for a long time, thus ensuring that the heat - exchange process can continue and be efficient; at the same time, the second flow channel segment 31b with a larger cross - sectional area can ensure that the heat - exchange liquid flows through the second region 20 more slowly, which is beneficial to transferring heat to the low - heat zone of the electronic product, can ensure that the temperature of the heat - exchange liquid entering the first region 10 is not too high, and thus can ensure that the heat - exchange liquid can continuously and efficiently absorb heat in the first region 10.

[0065] According to an embodiment of the present application, the distribution density of the heat - exchange channels 30 in the first region 10 is greater than the distribution density of the heat - exchange channels 30 in the second region 20.

[0066] That is to say, the distribution density of the heat exchange channels 30 in the first region 10 and the second region 20 can be different. In this embodiment, the distribution density of the heat exchange channels 30 in the first region 10 (i.e., the first flow channel segment 31a) is greater than that in the second region 20 (i.e., the second flow channel segment 31b). That is, the heat exchange channels 30 are relatively densely arranged in the first region 10 and relatively sparsely arranged in the second region 20. That is, the area ratio of the heat exchange channels 30 in the first region 10 is greater than that in the second region 20.

[0067] In this embodiment, the dense layout of the heat exchange channels 30 in the first region 10 greatly increases the heat exchange area between the heat exchange liquid and the heat generating area of the electronic product, thereby accelerating the heat transfer process, facilitating the heat exchange liquid to quickly absorb and carry away the heat generated in the heat generating area, avoiding the occurrence of local overheating, significantly improving the temperature uniformity performance of the electronic product, and ensuring the stable operation of the electronic product.

[0068] In some specific embodiments of the present application, the plate body is provided with liquid through holes, and the liquid through holes include a plurality of first liquid through holes 40 and a plurality of second liquid through holes 50. A micropump is used to connect between the first liquid through holes 40 and the second liquid through holes 50, and each heat exchange channel 30 corresponds to a set of liquid through holes.

[0069] In other words, as Figure 1 shown, the plate body is provided with liquid through holes, and each heat exchange channel 30 corresponds to a set of liquid through holes. Specifically, the liquid through holes include a first liquid through hole 40 and a second liquid through hole 50 that are connected to the heat exchange channel 30. In use, the first liquid through hole 40 can be connected to the liquid outlet of the micropump, and the second liquid through hole 50 can be connected to the liquid inlet of the micropump, thereby forming a circulation path for the heat exchange liquid. When the electronic product is working, the micropump can be used to drive the heat exchange liquid to circulate in the circulation path.

[0070] In this embodiment, a set of liquid through holes includes a plurality of first liquid through holes 40 and a plurality of second liquid through holes 50. Each first liquid through hole 40 and the second liquid through hole 50 can be connected to the micropump, so that a parallel setting of multiple micropumps can be realized in the circulation path. When one of the micropumps fails, the other micropumps can still continue to work, thereby effectively improving the reliability of the heat exchange module; at the same time, by setting a plurality of micropumps, the pressure drop of the heat exchange liquid during the circulation process can be significantly reduced, ensuring that the pressure distribution at each position in the circulation path is more uniform, and further ensuring the consistency of the heat exchange effect and the temperature uniformity of the electronic product.

[0071] According to an embodiment of the present application, the plate body is provided with liquid through ports, and the liquid through ports include a first liquid through port 40 and a second liquid through port 50. Each heat exchange flow channel 30 corresponds to a group of liquid through ports; the plate body is provided with at least one transition flow channel 60, and both between the first end of the transition flow channel 60 and the first liquid through port 40 and between the second end of the transition flow channel 60 and the second liquid through port 50 are used to connect to a micro pump.

[0072] That is to say, as Figure 2 shown, the plate body is provided with liquid through ports and a transition flow channel 60. Each heat exchange flow channel 30 corresponds to a group of liquid through ports and at least one transition flow channel 60. Specifically, the liquid through ports include a first liquid through port 40 and a second liquid through port 50 that are connected to the heat exchange flow channel 30.

[0073] When each heat exchange flow channel 30 corresponds to one transition flow channel 60, the liquid outlet of the first micro pump can be connected to the first end of the transition flow channel 60, the liquid inlet of the first micro pump can be connected to the first liquid through port 40, the liquid inlet of the second micro pump can be connected to the second end of the transition flow channel 60, and the liquid outlet of the second micro pump can be connected to the second liquid through port 50, thereby forming a circulation path for the heat exchange liquid. When each heat exchange flow channel 30 corresponds to multiple transition flow channels 60, the ends of two transition flow channels 60 can also be connected to the micro pump, so that the circulation path can achieve a series connection of three or more micro pumps.

[0074] In this embodiment, by means of the cooperation of the provided transition flow channel 60 with the first liquid through port 40 and the second liquid through port 50, a series connection of multiple micro pumps can be achieved, effectively increasing the flow rate of the heat exchange liquid in the circulation path, and thus significantly improving the heat exchange efficiency of the heat exchange plate 100.

[0075] In some specific embodiments of the present application, the first region 10 is divided into the same number of first sub-regions as the number of heat exchange flow channels 30, and each heat exchange flow channel 30 extends to a different first sub-region; and / or, the second region 20 is divided into the same number of second sub-regions as the number of heat exchange flow channels 30, and each heat exchange flow channel 30 extends to a different second sub-region.

[0076] In order to further improve the heat exchange efficiency of the heat exchange plate 100, the first region 10 of the plate body can be divided into multiple first sub-regions, and each heat exchange flow channel 30 is made to extend to a different first sub-region, that is, each first sub-region is only configured with one heat exchange flow channel 30, so that the heat exchange liquid flowing through each heat exchange flow channel 30 can dissipate heat from the heat generating area of the electronic product at different positions, which is beneficial to maintaining the uniform temperature of the heat generating area of the electronic product, can effectively prevent local overheating phenomena, and thus ensure the stable operation of the electronic product.

[0077] To further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate body can be divided into multiple second sub-regions, and each heat exchange channel 30 extends to different cold regions 21. That is, each second sub-region is only provided with one heat exchange channel 30. In this way, when the heat exchange liquid flows in the heat exchange channel 30, it can efficiently disperse and transfer heat to different positions in the low-heat region of the electronic product, promoting the rapid transfer and distribution of heat. At the same time, it effectively prevents the occurrence of local heat saturation in the second region 20, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0078] In summary, according to the heat exchange plate 100 provided in this embodiment, by providing multiple heat exchange channels 30 in the first region 10 and the second region 20 of the plate body, it is realized that the heat exchange liquid in the heat exchange plate 100 can flow through the first region 10 multiple times within a single circulation time, so that the heat exchange liquid can absorb heat in the first region 10 multiple times within a single circulation time and transfer the heat to the second region 20, avoiding heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing the problem of local overheating of the electronic product and ensuring the uniform temperature of the electronic product.

[0079] The embodiment of the present application also provides a heat exchange module, including the heat exchange plate 100 described in any of the above embodiments; a micro pump, each heat exchange channel 30 corresponds to at least one micro pump, and the micro pump is connected to the heat exchange channel 30 to form a circulation path. Since the heat exchange plate 100 according to the embodiment of the present application has the above technical effects, the heat exchange module according to the embodiment of the present application also has corresponding technical effects, which will not be elaborated in this embodiment.

[0080] In some embodiments of the present application, the micro pump can be a piezoelectric micro pump. The length and width of the micro pump can be about 7 mm, and the thickness of the micro pump can be about 1 mm, which is beneficial for installation on smaller electronic products.

[0081] The embodiment of the present application also provides an electronic device. The electronic device is, for example, but not limited to, a wearable device. The electronic device includes the heat exchange module described in the above embodiment. Since the heat exchange plate 100 according to the embodiment of the present application has the above technical effects, the electronic device according to the embodiment of the present application also has corresponding technical effects, which will not be elaborated in this embodiment.

[0082] In some embodiments of the application, the electronic device is a VR device. The first region 10 of the heat exchange plate 100 can be arranged in the heat generation area of the VR device (for example, the area where the processor in the VR device is located), and the second region 20 of the heat exchange plate 100 can be arranged on the strap of the VR device. When the heat exchange module operates, the heat of the processor located in the VR device can be transferred to the strap through the circulating heat exchange liquid, and the heat can be transferred to the external environment through the strap.

[0083] Although some specific embodiments of the present application have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A heat exchange plate, characterized in that, Comprising: A plate body, the plate body including a first region and a second region, the first region being configured to correspond to the heat generating area of the electronic product; The plate body is provided with a plurality of heat exchange channels, each of the heat exchange channels extending to the first region, and the heat exchange channels are not connected to each other; Each of the heat exchange channels has at least a part extending to the second region.

2. The heat exchange plate according to claim 1, wherein The plate body includes a plurality of first regions, and different heat exchange channels extend from each of the first regions.

3. The heat exchange plate according to claim 1, characterized in that, The plate body includes a plurality of second regions, and each of the heat exchange channels extends to a different second region.

4. The heat exchange plate according to claim 1, wherein, The heat exchange channel itself has at least two sets of series-connected sub-channels; Each set of the sub-channels has a first channel section and a second channel section; The first channel section is located in the first region, the second channel section is located in the second region, and the second channel sections of two adjacent sets of the sub-channels are connected to each other to form a series connection between the sub-channels.

5. The heat exchange plate according to claim 4, wherein, The plate body includes a plurality of first regions, and multiple sets of the sub-channels extend from each of the first regions.

6. The heat exchange plate according to claim 4, characterized in that, The plate body includes a plurality of second regions, and the sub-channels extend to different second regions.

7. The heat exchange plate according to claim 4, wherein The first channel section of each set of the sub-channels extends in a bent manner in the respective corresponding first region.

8. The heat exchange plate according to claim 4, wherein The first region includes a plurality of hot zones, and the first channel section of each set of the sub-channels is located in a different hot zone; and / or, The second region includes a plurality of cold zones, and the second channel section of each set of the sub-channels is located in a different cold zone.

9. The heat exchange plate according to claim 4, characterized in that The flow-through area of the first channel section is smaller than the flow-through area of the second channel section.

10. The heat exchange plate according to claim 1, wherein The distribution density of the heat exchange channels in the first region is greater than the distribution density of the heat exchange channels in the second region.

11. The heat exchange plate according to claim 1, wherein, The plate body is provided with liquid inlets, the liquid inlets including a plurality of first liquid inlets and a plurality of second liquid inlets, and a micropump is used to be connected between the first liquid inlets and the second liquid inlets, and each of the heat exchange channels corresponds to a set of liquid inlets.

12. The heat exchange plate according to claim 1, wherein, The plate body is provided with liquid inlets, the liquid inlets including a first liquid inlet and a second liquid inlet, and each of the heat exchange channels corresponds to a set of liquid inlets; The plate body is provided with at least one transition channel, and a micropump is used to be connected between the first end of the transition channel and the first liquid inlet and between the second end of the transition channel and the second liquid inlet.

13. The heat exchange plate according to claim 1, wherein The first region is divided into the same number of first sub-regions as the number of the heat exchange channels, and each of the heat exchange channels extends to a different first sub-region; and / or, The second region is divided into the same number of second sub-regions as the number of the heat exchange channels, and each of the heat exchange channels extends to a different second sub-region.

14. A heat exchange module, characterized in that, Comprising: The heat exchange plate according to any one of claims 1 to 13; A micropump, each of the heat exchange channels corresponding to at least one micropump, and the micropump is connected to the heat exchange channel to form a circulation path.

15. An electronic device, characterized in that, Including the heat exchange module according to claim 14.

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