Heat exchange plate, heat exchange module and electronic equipment

Abstract

The utility model provides a heat exchange plate, a heat exchange module and electronic equipment, the heat exchange plate comprises a plate body, the plate body comprises a first area and a second area, and the first area is configured to correspond to a heating area of an electronic product; the plate body is provided with a heat exchange flow channel, and the heat exchange flow channel at least extends in the second area and the first area to form a complete passage; the heat exchange runner comprises at least two groups of sub-runners; each group of sub-runners is provided with a first runner; the first flow channel of each group of sub-flow channels is located in the first area; the first flow channels of the two sets of sub-flow channels are indirectly communicated through the heat exchange flow channel extending to the second area.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation of electronic products, and more specifically, to a heat exchange plate, a heat exchange module, and an electronic device. Background Art

[0002] The existing heat exchange plate of electronic products creates a circulation path between the high-temperature area and the low-temperature area of the electronic product, and realizes heat exchange through the circulation of the heat exchange liquid. However, the problem with the existing heat exchange plate is that the heat exchange liquid only flows through the high-temperature area and the low-temperature area once in one cycle, which limits the effective transfer of heat, resulting in low heat exchange efficiency and thus prone to local overheating of the electronic product. Summary of the Utility Model

[0003] This application provides a new technical solution for a heat exchange plate, which can at least solve the problem of low heat exchange efficiency of the existing heat exchange plate.

[0004] This application also provides a new technical solution for a heat exchange module.

[0005] This application also provides a new technical solution for an electronic device.

[0006] According to the first aspect of this application, a heat exchange plate is provided, including: a plate body, the plate body includes a first area and a second area, the first area is configured to correspond to the heat generating area of the electronic product; the plate body is provided with a heat exchange flow channel, the heat exchange flow channel extends at least in the second area and the first area to form a complete path; the heat exchange flow channel includes at least two groups of sub-flow channels; each group of the sub-flow channels has a first flow channel; the first flow channel of each group of the sub-flow channels is located in the first area; the first flow channels of the two groups of sub-flow channels are indirectly connected through the heat exchange flow channel extending to the second area.

[0007] Optionally, each group of the sub-flow channels has a second flow channel, the second flow channel is located in the second area, the second area is configured to correspond to the low-heat area of the electronic product, and the heat generation amount of the low-heat area is lower than that of the heat generating area; in each group of the sub-flow channels, the head and tail ends of the first flow channel are both connected to the second flow channel of this group of sub-flow channels.

[0008] Optionally, the second flow channels of adjacent two groups of the sub-flow channels are connected.

[0009] Optionally, each group of the sub-flow channels is connected in series through the second flow channel.

[0010] Optionally, the first area includes multiple heat areas, and the first flow channel of each group of the sub-flow channels respectively corresponds to and extends to one of the heat areas.

[0011] Optionally, the first flow channel of each group of the sub-flow channels extends in a bent manner in its respective corresponding heat area.

[0012] Optionally, the second region includes a plurality of cold regions, and the second flow channels of each group of the sub-flow channels respectively extend to one of the cold regions.

[0013] Optionally, the plate body includes a plurality of second regions.

[0014] Optionally, in each group of the sub-flow channels, the extension length of the first flow channel is less than that of the second flow channel.

[0015] Optionally, the flow-through area of the first flow channel is less than that of the second flow channel.

[0016] Optionally, the distribution density of the heat exchange flow channels in the first region is greater than that in the second region.

[0017] Optionally, the plate body is formed with a plurality of first liquid through holes and a plurality of second liquid through holes, the first liquid through holes and the second liquid through holes are communicated with the heat exchange flow channels, and a micropump is used for communication between the first liquid through holes and the second liquid through holes.

[0018] Optionally, the plate body is formed with a first liquid through hole and a second liquid through hole, the first liquid through hole and the second liquid through hole are communicated with the heat exchange flow channels; the plate body is provided with at least one transition flow channel, and a micropump is used for communication between the first end of the transition flow channel and the first liquid through hole and between the second end of the transition flow channel and the second liquid through hole.

[0019] According to a second aspect of the present application, there is provided a heat exchange module, including: the heat exchange plate according to any one of the above; a micropump, the heat exchange flow channels correspond to at least one of the micropumps, and the micropump and the heat exchange flow channels are communicated to form a circulation path.

[0020] According to a third aspect of the present application, there is provided an electronic device, including the above heat exchange module.

[0021] According to the heat exchange plate of the present application, by connecting the first flow channels of two groups of sub-flow channels located in the first region through the heat exchange flow channels extending to the second region, the heat exchange liquid can flow through the first region and the second region multiple times in a single cycle, so that the heat exchange liquid can absorb the heat of the heat generating area of the electronic product in the first region multiple times and transfer the heat to the second region, avoiding heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate, and effectively preventing the problem of local overheating of the electronic product and ensuring the temperature uniformity of the electronic product.

[0022] Through the following detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings, other features and advantages of the present application will become clear. Description of the Drawings

[0023] The drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description thereof, serve to explain the principles of the present application.

[0024] Figure 1 is a schematic structural view of a heat exchange plate according to an embodiment provided by the present application;

[0025] Figure 2 is a schematic structural view of a sub-channel of a heat exchange plate according to an embodiment provided by the present application;

[0026] Figure 3 is a partial schematic structural view of a heat exchange plate according to an embodiment provided by the present application.

[0027] Reference numerals

[0028] 100, heat exchange plate;

[0029] 10, first region; 11, hot zone;

[0030] 20, second region; 21, cold zone;

[0031] 30, heat exchange flow channel; 31, sub-channel; 31a, first flow channel; 31b, second flow channel;

[0032] 40, first liquid inlet; 50, second liquid inlet; 60, transition flow channel. Detailed embodiments

[0033] Various exemplary embodiments of the present application will now be described in detail with reference to the drawings. It should be noted that: unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application.

[0034] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present application or its application or use.

[0035] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0036] In all examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.

[0037] It should be noted that: like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0038] First, the heat exchange plate 100 according to the embodiments of the present application will be specifically described below with reference to the accompanying drawings.

[0039] As Figure 1 and Figure 3 shown, the heat exchange plate 100 according to the embodiments of the present application includes a plate body.

[0040] Specifically, the plate body includes a first region 10 and a second region 20. The first region 10 is configured to correspond to the heat - generating area of the electronic product. The plate body is provided with a heat exchange flow channel 30. The heat exchange flow channel 30 extends at least in the second region 20 and the first region 10 to form a complete path. The heat exchange flow channel 30 includes at least two groups of sub - flow channels 31. Each group of sub - flow channels 31 has a first flow channel 31a. The first flow channel 31a of each group of sub - flow channels 31 is located in the first region 10. The first flow channels 31a of the two groups of sub - flow channels 31 are indirectly connected through the heat exchange flow channel 30 extending to the second region 20.

[0041] In other words, as Figures 1 to 3 shown, the heat exchange plate 100 according to the embodiments of the present application is mainly used for heat - exchanging the electronic product. The heat exchange plate 100 mainly includes a plate body. The plate body may include a first region 10 and a second region 20. The plate body is provided with a heat exchange flow channel 30. A part of the heat exchange flow channel 30 can extend in the first region 10 of the plate body, and another part of the heat exchange flow channel 30 can extend in the second region 20 of the plate body, thereby forming a path for circulating the heat - exchange liquid. The first region 10 of the plate body is adapted to the heat - generating area of the electronic product (for example, the area where the processor of the electronic product is located), so that the first region 10 of the plate body can cooperate with the heat - generating area of the electronic product. Thus, the heat in the heat - generating area can be transferred to the second region 20 through the heat - exchange liquid flowing in the heat exchange flow channel 30.

[0042] As Figure 1 and Figure 2 shown, the heat exchange flow channel 30 includes multiple groups of sub - flow channels 31. Multiple groups of sub - flow channels 31 all have a first flow channel 31a. The first flow channels 31a of multiple groups of sub - flow channels 31 are all arranged in the first region 10 of the plate body, and the first flow channels 31a of multiple groups of sub - flow channels 31 are not connected in the first region 10. Instead, the first flow channels 31a of two groups of sub - flow channels 31 are connected through the heat exchange flow channel 30 passing through the second region 20. In this way, the heat - exchange liquid can flow through the first region 10 and the second region 20 multiple times in a single cycle, so as to absorb heat in the first region 10 multiple times and transfer the heat to the second region 20. This can effectively prevent the heat - exchange liquid from reaching the heat - exchange saturation state prematurely, ensuring that the heat - exchange liquid can continuously and efficiently perform heat exchange within a better temperature range.

[0043] Thus, according to the heat exchange plate 100 provided in this embodiment, by means of the heat exchange flow channels 30 extending to the second region 20 to connect the first flow channels 31a of the two groups of sub-flow channels 31 located in the first region 10, it can be realized that the heat exchange liquid flows through the first region 10 and the second region 20 multiple times in a single cycle, so that the heat exchange liquid can absorb the heat of the heat generating area of the electronic product in the first region 10 multiple times and transfer the heat to the second region 20, avoiding the heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing the problem of local overheating of the electronic product and ensuring the uniform temperature of the electronic product.

[0044] According to an embodiment of the present application, each group of sub-flow channels 31 has a second flow channel 31b. The second flow channel 31b is located in the second region 20, and the second region 20 is configured to correspond to the low-heat region of the electronic product, and the heat generation amount of the low-heat region is lower than that of the heat generating area; in each group of sub-flow channels 31, the head and tail ends of the first flow channel 31a are both connected to the second flow channel 31b of this group of sub-flow channels 31.

[0045] Specifically, as Figure 1 and Figure 2 shown, the second region 20 of the plate body is adapted to the low-heat region of the electronic product, so that the second region 20 of the plate body can cooperate with the low-heat region of the electronic product, so that the heat of the heat generating area of the electronic product can be transferred to the low-heat region of the electronic product through the heat exchange liquid flowing in the heat exchange flow channels 30.

[0046] It should be noted that the low-heat region of the electronic product refers to the region where the temperature of the electronic product is lower than that of the heat generating area during use, that is, the region with a heat generation amount lower than that of the above-mentioned heat generating area (for example, the area where the battery with a relatively low heat generation amount is located, or the area where the electronic product does not generate heat) can be used as the low-heat region of the electronic product. In this way, the heat of the higher-temperature heat generating area can be transferred to the lower-temperature low-heat region, which can improve the uniform temperature of the electronic product and avoid overheating of the electronic product.

[0047] In this embodiment, each group of sub-flow channels 31 has a second flow channel 31b. Specifically, both ends of the first flow channel 31a of each group of sub-flow channels 31 are provided with second flow channels 31b communicating therewith. The second flow channels 31b can be located in the second region 20, so that the heat exchange liquid can exchange heat in the second region 20 of the plate body before flowing into the first flow channel 31a and after flowing out of the first flow channel 31a, which is beneficial to the heat transfer between the heat generating area and the low-heat region of the electronic product and can effectively avoid overheating of the electronic product.

[0048] In some specific embodiments of the present application, the second flow channels 31b of adjacent two groups of sub-flow channels 31 are connected.

[0049] That is to say, as Figure 1 and Figure 2As shown, two adjacent groups of sub-channel 31 are connected through corresponding second channels 31b. Here, two groups of sub-channel 31 are taken as an example for specific description. The second channel 31b at the end of the first channel 31a of the first group of sub-channel 31 is connected to the second channel 31b at the head of the first channel 31a of the second group of sub-channel 31, that is, one or more positions of the above two second channels 31b are connected to each other.

[0050] When there are multiple connection positions, it can cause the heat exchange liquid to be branched and converged when flowing through these two second channels 31b. By branching the heat exchange liquid, it is beneficial for the heat exchange liquid to perform heat exchange more fully in the second region 20, so as to more effectively transfer heat to the low-heat region of the electronic product.

[0051] In this embodiment, two adjacent groups of sub-channel 31 are connected through their respective corresponding second channels 31b, so that the heat exchange liquid can quickly enter the first channel 31a after flowing out of the second channel 31b, enabling the heat exchange liquid to focus on efficiently cooling the heat-generating area of the electronic product in the first region 10, effectively avoiding the heat exchange liquid from absorbing unnecessary heat when flowing through non-target areas, thus being more conducive to concentrating on cooling the heat-generating area of the electronic product.

[0052] According to an embodiment of the present application, each group of sub-channel 31 is connected in series through the second channel 31b.

[0053] Specifically, as Figure 1 shown, two adjacent groups of sub-channel 31 are connected in series through their respective corresponding second channels 31b. Here, two groups of sub-channel 31 are taken as an example for specific description. The end of the second channel 31b at the end of the first channel 31a of the first group of sub-channel 31 is connected to the end of the second channel 31b at the head of the first channel 31a of the second group of sub-channel 31, so as to realize the series connection of two adjacent groups of sub-channel 31.

[0054] In this embodiment, two adjacent groups of sub-channel 31 are connected in series through their respective corresponding second channels 31b, so that when the heat exchange liquid flows through multiple groups of sub-channel 31, it only needs to travel back and forth between the first region 10 and the second region 20 for multiple times, without passing through non-target areas, which can ensure that the heat exchange liquid can focus on efficient heat exchange between the first region 10 (for the heat-generating area of the electronic product) and the second region 20 (for the low-heat region of the electronic product), thus effectively avoiding the ineffective heat exchange that may occur when the heat exchange liquid flows through non-target areas.

[0055] In some specific embodiments of the present application, the first region 10 includes multiple heat zones 11, and the first channel 31a of each group of sub-channel 31 respectively extends to a heat zone 11.

[0056] That is to say, as Figure 1As shown, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the first region 10 of the plate body can be divided into multiple heat zones 11 (i.e., the regions that absorb the heat of the heat generating zone), and the first flow channels 31a of each group of sub-flow channels 31 are extended to different heat zones 11, that is, each heat zone 11 is only configured with one first flow channel 31a, so that the heat exchange liquid flowing through each first flow channel 31a can dissipate heat from the heat generating zone of the electronic product at different positions, which is beneficial to maintaining the uniform temperature of the heat generating zone of the electronic product, effectively preventing local overheating, and thus ensuring the stable operation of the electronic product.

[0057] According to an embodiment of the present application, the first flow channels 31a of each group of sub-flow channels 31 are bent and extended in their respective corresponding heat zones 11.

[0058] Specifically, as Figure 1 shown, the first flow channels 31a of multiple groups of sub-flow channels 31 each have one or more bent portions, so that the first flow channels 31a can fully cover their respective corresponding heat zones 11, thereby ensuring that the heat exchange liquid can fully exert its heat exchange efficiency, optimizing the heat exchange area, significantly improving the uniform temperature of the heat generating zone of the electronic product, effectively preventing local overheating, and thus ensuring the stable operation of the electronic product.

[0059] In some specific embodiments of the present application, the second region 20 includes multiple cold zones 21, and the second flow channels 31b of each group of sub-flow channels 31 respectively extend to a cold zone 21.

[0060] That is to say, as Figure 1 shown, in order to further improve the heat exchange efficiency of the heat exchange plate 100, the second region 20 of the plate body can be divided into multiple cold zones 21 (i.e., the regions that dissipate heat to the low heat zone and / or the outside), and the second flow channels 31b of each group of sub-flow channels 31 are extended to different cold zones 21, that is, each cold zone 21 is only configured with the second flow channel 31b of one group of sub-flow channels 31, so that when the heat exchange liquid flows in the second flow channel 31b, it can efficiently disperse and transfer the heat to different positions of the low heat zone of the electronic product, promoting the rapid transfer and distribution of the heat. At the same time, it effectively prevents the local heat saturation phenomenon in the second region 20, thereby improving the heat exchange efficiency of the heat exchange plate 100.

[0061] According to an embodiment of the present application, the plate body includes multiple second regions 20.

[0062] Specifically, the plate body has at least two second regions 20. For a clearer illustration, the following takes two second regions 20 as an example for a detailed description. The plate body has two second regions 20. A part of the first flow channels 31a of the adjacent sub-flow channels 31 is connected through the heat exchange flow channels 30 in one of the second regions 20, and another part of the first flow channels 31a of the adjacent sub-flow channels 31 is connected through the heat exchange flow channels 30 in the other second region 20.

[0063] In this embodiment, one first region 10 can correspond to multiple second regions 20. After the heat exchange liquid flows through the first region 10 and absorbs heat, it can be split into different second regions 20, thereby realizing the efficient dispersion and transfer of heat, and effectively improving the heat exchange efficiency of the heat exchange plate 100.

[0064] In some alternative examples of the present application, the multiple second regions 20 are spaced apart. The first region 10 can be located between two second regions 20; alternatively, the multiple second regions 20 are distributed on the outer periphery of the first region 10.

[0065] In some specific embodiments of the present application, in each group of sub-flow channels 31, the extension length of the first flow channel 31a is less than the extension length of the second flow channel 31b.

[0066] In other words, in each group of sub-flow channels 31, the extension lengths of the first flow channel 31a and the second flow channel 31b can be different. In this embodiment, the extension length of the first flow channel 31a is less than the extension length of the second flow channel 31b. The shorter first flow channel 31a can ensure that the heat exchange liquid can quickly pass through when flowing through the first region 10, effectively reducing the residence time of the heat exchange liquid in this region, and effectively avoiding the thermal saturation phenomenon caused by the heat exchange liquid contacting high temperature for a long time, thereby ensuring that the heat exchange process can proceed continuously and efficiently; at the same time, the longer second flow channel 31b can ensure that the heat exchange liquid fully flows through the second region 20, which is beneficial to transfer heat to the low-heat area of the electronic product, and can ensure that the temperature of the heat exchange liquid entering the first region 10 is not too high, so as to ensure that the heat exchange liquid can continuously and efficiently absorb heat in the first region 10.

[0067] According to an embodiment of the present application, the flow-through area of the first flow channel 31a is less than the flow-through area of the second flow channel 31b.

[0068] Specifically, as Figure 1 and Figure 2As shown, in each group of sub-flow channels 31, the flow-through areas (i.e., cross-sectional areas) of the first flow channel 31a and the second flow channel 31b can be different. In this embodiment, the flow-through area of the first flow channel 31a is smaller than that of the second flow channel 31b. The first flow channel 31a with a smaller flow-through area can ensure that the heat exchange liquid can quickly pass through when flowing through the first region 10, effectively reducing the residence time of the heat exchange liquid in this region, and effectively avoiding the thermal saturation phenomenon caused by the heat exchange liquid contacting high temperature for a long time, thereby ensuring that the heat exchange process can proceed continuously and efficiently; at the same time, the second flow channel 31b with a larger flow-through area can ensure that the heat exchange liquid flows through the second region 20 relatively slowly, which is beneficial to transferring heat to the low-temperature area of the electronic product, and can ensure that the temperature of the heat exchange liquid entering the first region 10 is not too high, so as to ensure that the heat exchange liquid can continuously and efficiently absorb heat in the first region 10.

[0069] In some specific embodiments of the present application, the distribution density of the heat exchange flow channel 30 in the first region 10 is greater than the distribution density of the heat exchange flow channel 30 in the second region 20.

[0070] That is to say, as Figure 1 shown, the distribution densities of the heat exchange flow channel 30 in the first region 10 and the second region 20 can be different. In this embodiment, the distribution density of the heat exchange flow channel 30 in the first region 10 (i.e., the first flow channel 31a) is greater than the distribution density of the heat exchange flow channel 30 in the second region 20 (i.e., the second flow channel 31b), that is, the heat exchange flow channel 30 is arranged relatively densely in the first region 10 and relatively sparsely in the second region 20. That is, the area ratio of the heat exchange flow channel 30 in the first region 10 is greater than the area ratio of the heat exchange flow channel 30 in the second region 20.

[0071] In this embodiment, the dense layout of the heat exchange flow channel 30 in the first region 10 greatly increases the heat exchange area between the heat exchange liquid and the heat-generating area of the electronic product, thereby accelerating the heat transfer process, being beneficial to the heat exchange liquid quickly absorbing and taking away the heat generated by the heat-generating area, avoiding the occurrence of local overheating phenomenon, significantly improving the temperature uniformity performance of the electronic product, and ensuring the stable operation of the electronic product.

[0072] According to an embodiment of the present application, the plate body is formed with a plurality of first liquid through holes 40 and a plurality of second liquid through holes 50. The first liquid through holes 40 and the second liquid through holes 50 are communicated with the heat exchange flow channel 30, and a micro pump is used to communicate between the first liquid through holes 40 and the second liquid through holes 50.

[0073] As Figure 1As shown, specifically, the plate body is provided with a first liquid passage port 40 and a second liquid passage port 50 that communicate with the heat exchange flow channel 30. During use, the first liquid passage port 40 can communicate with the liquid outlet of the micropump, and the second liquid passage port 50 can communicate with the liquid inlet of the micropump, thereby forming a circulation path for the heat exchange liquid. When the electronic product is working, the micropump can drive the heat exchange liquid to circulate in the circulation path.

[0074] In this embodiment, the plate body is provided with a plurality of first liquid passage ports 40 and a plurality of second liquid passage ports 50. Each first liquid passage port 40 and the second liquid passage port 50 can communicate with the micropump, enabling a parallel arrangement of multiple micropumps in the circulation path. When one of the micropumps fails, the other micropumps can still continue to work, effectively improving the reliability of the heat exchange module. At the same time, by setting a plurality of micropumps, the pressure drop of the heat exchange liquid during circulation can be significantly reduced, ensuring a more uniform pressure distribution at various positions in the circulation path, and further guaranteeing the consistency of the heat exchange effect and the uniform temperature of the electronic product.

[0075] According to some embodiments of the present application, the plate body forms a first liquid passage port 40 and a second liquid passage port 50, and the first liquid passage port 40 and the second liquid passage port 50 communicate with the heat exchange flow channel 30. The plate body is provided with at least one transition flow channel 60. The first end of the transition flow channel 60 and the first liquid passage port 40, and the second end of the transition flow channel 60 and the second liquid passage port 50 are both used to communicate with the micropump.

[0076] That is to say, as Figure 3 shown, the plate body is provided with at least one first liquid passage port 40 and at least one second liquid passage port 50. The first liquid passage port 40 communicates with the first end of the heat exchange flow channel 30, the second liquid passage port 50 communicates with the second end of the heat exchange flow channel 30, and the plate body is provided with one or more transition flow channels 60.

[0077] As Figure 3 shown, when the plate body is provided with one transition flow channel 60, the liquid outlet of the first micropump can communicate with the first end of the transition flow channel 60, the liquid inlet of the first micropump can communicate with the first liquid passage port 40, the liquid inlet of the second micropump can communicate with the second end of the transition flow channel 60, and the liquid outlet of the second micropump can communicate with the second liquid passage port 50, thereby forming a circulation path for the heat exchange liquid. When the plate body is provided with multiple transition flow channels 60, the ends of two transition flow channels 60 can also communicate with the micropump, enabling a series arrangement of three or more micropumps in the circulation path.

[0078] In this embodiment, by setting the transition flow channel 60 in cooperation with the first liquid passage port 40 and the second liquid passage port 50, a series arrangement of multiple micropumps can be achieved, effectively increasing the flow rate of the heat exchange liquid in the circulation path, and thus significantly improving the heat exchange efficiency of the heat exchange plate 100.

[0079] In summary, for the heat exchange plate 100 provided according to this embodiment, by means of the heat exchange flow channels 30 extending to the second region 20 to connect the first flow channels 31a of two groups of sub-flow channels 31 located in the first region 10, it is possible to enable the heat exchange liquid to flow through the first region 10 and the second region 20 multiple times in a single cycle, so that the heat exchange liquid can absorb the heat of the heat generating area of the electronic product in the first region 10 multiple times and transfer the heat to the second region 20, avoiding heat exchange saturation of the heat exchange liquid, ensuring efficient heat exchange, improving the heat exchange efficiency of the heat exchange plate 100, and effectively preventing the problem of local overheating of the electronic product and ensuring the temperature uniformity of the electronic product.

[0080] The embodiment of the present application also provides a heat exchange module, which includes the heat exchange plate 100 described in any of the above embodiments; a micro pump, where the heat exchange flow channels 30 correspond to at least one micro pump, and the micro pump is connected to the heat exchange flow channels 30 to form a circulation path. Since the heat exchange plate 100 according to the embodiment of the present application has the above technical effects, the heat exchange module according to the embodiment of the present application also has corresponding technical effects, which will not be elaborated in this embodiment.

[0081] In some embodiments of the present application, the micro pump can be a piezoelectric micro pump. The length and width of the micro pump can be about 7 mm, and the thickness of the micro pump can be about 1 mm, which is conducive to being installed on smaller electronic products.

[0082] The embodiment of the present application also provides an electronic device. The electronic device is, for example, but not limited to, a wearable device. The electronic device includes the heat exchange module described in the above embodiments. Since the heat exchange plate 100 according to the embodiment of the present application has the above technical effects, the electronic device according to the embodiment of the present application also has corresponding technical effects, which will not be elaborated in this embodiment.

[0083] In some embodiments of the application, the electronic device is a VR device. The first region 10 of the heat exchange plate 100 can be arranged in the heat generating area of the VR device (for example, the area where the processor in the VR device is located), and the second region 20 of the heat exchange plate 100 can be arranged on the strap of the VR device. When the heat exchange module is operating, the heat of the processor located in the VR device can be transferred to the strap through the circulating heat exchange liquid, and the heat can be transferred to the external environment through the strap.

[0084] Although some specific embodiments of the present application have been described in detail by way of examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A heat exchange plate, characterized in that, Comprising: A plate body, the plate body including a first region and a second region, the first region being configured to correspond to the heat generating area of the electronic product; The plate body is provided with a heat exchange flow channel, the heat exchange flow channel extending at least in the first region and the second region to form a complete passage; The heat exchange flow channel includes at least two sets of sub-flow channels; Each set of the sub-flow channels has a first flow channel; The first flow channel of each set of the sub-flow channels is located in the first region; The first flow channels between the two sets of sub-flow channels are indirectly connected through the heat exchange flow channel extending to the second region.

2. The heat exchange plate according to claim 1, wherein, Each set of the sub-flow channels has a second flow channel, the second flow channel being located in the second region, the second region being configured to correspond to the low heat area of the electronic product, and the heat generation amount of the low heat area being lower than that of the heat generating area; In each set of the sub-flow channels, both the head and the tail ends of the first flow channel are connected to the second flow channel of the set of sub-flow channels.

3. The heat exchange plate according to claim 2, characterized in that, The second flow channels of adjacent two sets of the sub-flow channels are connected.

4. The heat exchange plate according to claim 2, wherein Each set of the sub-flow channels is connected in series through the second flow channel.

5. The heat exchange plate according to claim 1, characterized in that, The first region includes a plurality of heat zones, and the first flow channel of each set of the sub-flow channels respectively extends to one of the heat zones.

6. The heat exchange plate according to claim 5, wherein The first flow channel of each set of the sub-flow channels extends in a bent manner in its respective corresponding heat zone.

7. The heat exchange plate according to claim 2, characterized in that, The second region includes a plurality of cold zones, and the second flow channels of each set of the sub-flow channels respectively extend to one of the cold zones.

8. The heat exchange plate according to any one of claims 1-7, characterized in that The plate body includes a plurality of second regions.

9. The heat exchange plate according to claim 2, characterized in that, In each set of the sub-flow channels, the extension length of the first flow channel is less than the extension length of the second flow channel.

10. The heat exchange plate according to claim 2, characterized in that, The flow-through area of the first flow channel is less than the flow-through area of the second flow channel.

11. The heat exchange plate according to claim 1, wherein, The distribution density of the heat exchange flow channel in the first region is greater than the distribution density of the heat exchange flow channel in the second region.

12. The heat exchange plate according to claim 1, characterized in that, The plate body is formed with a plurality of first liquid through ports and a plurality of second liquid through ports, the first liquid through ports and the second liquid through ports being communicated with the heat exchange flow channel, and a micro pump is used to be communicated between the first liquid through ports and the second liquid through ports.

13. The heat exchange plate according to claim 1, characterized in that, The plate body is formed with a first liquid through port and a second liquid through port, the first liquid through port and the second liquid through port being communicated with the heat exchange flow channel; The plate body is provided with at least one transition flow channel, and a micro pump is used to be communicated between the first end of the transition flow channel and the first liquid through port and between the second end of the transition flow channel and the second liquid through port.

14. A heat exchange module, characterized in that, Comprising: The heat exchange plate according to any one of claims 1 to 13; A micro pump, the heat exchange flow channel corresponding to at least one of the micro pumps, and the micro pump being communicated with the heat exchange flow channel to form a circulation passage.

15. An electronic device, characterized in that, Including the heat exchange module according to claim 14.

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