High-power LED support packaging structure

Abstract

The utility model belongs to the technical field of LED packaging, and particularly relates to a high-power LED support packaging structure which comprises a support body. The pull rod is pulled to drive the connecting rod to move, the connecting rod drives the connecting block to move, the connecting block drives the clamping pin to slide on the fixing rod, the clamping pin compresses the corresponding first spring in the moving process, so that the clamping pin is separated from the corresponding clamping groove, and the sealing cover is moved upwards to be separated from the frame body. Then the light-emitting wafer is detached from the interior of the frame body, a new light-emitting wafer is installed in the frame body, then the new light-emitting wafer is connected with the support electrodes through the conductive metal wires to form a conductive loop, the installation blocks on the sealing cover are inserted into the corresponding installation grooves, and when the top of the frame body makes contact with the top of the sealing cover, the pulling force on the pull rod is released, and then the light-emitting wafer is installed in the frame body. The first spring in the compressed state is reset, the first spring drives the corresponding clamping pin to be clamped with the clamping groove, the sealing cover is fixed, and in the disassembling and assembling process, operation is easy and convenient, and only the pull rod needs to be pulled.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, and specifically relates to a high-power LED bracket packaging structure. Background Technique

[0002] LED (semiconductor light-emitting diode) packaging refers to the packaging of light-emitting chips, mainly providing sufficient protection for the chips to prevent the chips from failing due to long-term exposure in the air or mechanical damage, so as to improve the stability of the chips, enable the LEDs to have better luminous efficiency and heat dissipation environment, and then extend the lifespan of the LEDs;

[0003] Chinese Patent No.: CN212230453U discloses an LED bracket packaging structure, which relates to the technical field of LED packaging. The LED bracket packaging structure includes a frame body. One side of the frame body is connected with a positive terminal, and the side of the frame body opposite to the positive terminal is connected with a negative terminal. The top of the frame body is covered with a cover, and a bracket electrode is installed inside the frame body. Three light-emitting wafers are installed inside the frame body and inside the bracket electrode. The top of the cover is recessed to form a glue groove, and two connecting columns are symmetrically installed on both sides of the bottom of the cover. Connecting holes are formed inside the four connecting columns. The glue groove is filled with a packaging colloid. Through the settings of the connecting columns, connecting grooves, connecting rods and connecting holes, the utility model realizes the quick disassembly and assembly of the packaging structure, thereby realizing the quick replacement of the light-emitting wafers, effectively improving the replacement efficiency of the light-emitting wafers, and ensuring the normal use of LED products;

[0004] However, there are still certain problems with its device. In the actual use process, it is necessary to screw out the four connecting rods from the connecting holes one by one. This step not only increases the complexity of the operation, but also may cause the disassembly process to take a long time and reduce the maintenance efficiency. Therefore, we propose a high-power LED bracket packaging structure to solve the above problems. Content of the Utility Model

[0005] (I) Technical Problems to be Solved

[0006] Aiming at the deficiencies of the prior art, the utility model provides a high-power LED bracket packaging structure, which solves the problems raised in the above background technique.

[0007] (II) Technical Solutions

[0008] The utility model specifically adopts the following technical solutions to achieve the above purposes:

[0009] A high-power LED bracket packaging structure includes a bracket body. Two cavities are provided on the bracket body. A square block is fixedly connected to the inner wall of one side of the cavity. A fixing rod is fixedly connected to one side of the square block. A latch is slidably connected to the fixing rod. A first spring is welded between the end of the latch and one side of the corresponding square block. The first spring is movably sleeved on the corresponding fixing rod. Two installation grooves are provided on the top of the bracket body. A connecting block is welded to the bottom of the latch. A connecting rod is welded to one side of the connecting block. The ends of the two connecting rods both extend outside the bracket body and are fixedly connected to the same pull rod. A cover is movably in contact with the top of the bracket body. Two installation blocks are fixedly connected to the bottom of the cover. A card slot is provided on one side of the installation block. The card slot is clamped with the corresponding latch.

[0010] Further, a ring is fixedly connected to the connecting rod. A second spring is fixedly connected between one side of the ring and the inner wall of the other side of the corresponding cavity. The second spring is movably sleeved on the corresponding connecting rod.

[0011] Further, a light-transmitting colloid is provided on the cover. A plurality of positive electrodes are fixedly connected to the left side of the bracket body. A plurality of negative electrodes are fixedly connected to the right side of the bracket body.

[0012] Further, two bracket electrodes are provided inside the bracket body. A plurality of light-emitting wafers are installed inside the bracket body.

[0013] Further, a wire clamping mechanism is provided between the bracket electrode and the light-emitting wafer.

[0014] Further, a guiding hole is provided on the inner wall of one side of the installation groove. The guiding hole is slidably connected to the corresponding latch.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the present utility model provides a high-power LED bracket packaging structure, which has the following beneficial effects:

[0017] In this utility model, by pulling the pull rod, the connecting rod is driven to move, the connecting rod drives the connecting block to move, the connecting block drives the latch to slide on the fixed rod, and during the movement of the latch, the corresponding first spring is compressed, so that the latch is separated from the corresponding card slot. The cover is moved upward to be separated from the frame body, then the light-emitting chip is disassembled from the inside of the frame body, and a new light-emitting chip is installed inside the frame body. Then, the new light-emitting chip and the support electrode are connected by a conductive metal wire to form a conductive circuit. The mounting block on the cover is inserted into the corresponding mounting slot. When the top of the frame body contacts the top of the cover, at this time, the pulling force on the pull rod is released, and the first spring in the compressed state resets. The first spring drives the corresponding latch to be engaged with the card slot, thereby fixing the cover. During the disassembly and assembly process, the operation is simple and convenient, and only the pull rod needs to be pulled. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0019] Figure 2 is a three-dimensional structural schematic diagram of the cover of the present utility model being removed;

[0020] Figure 3 is a three-dimensional structural schematic diagram of the frame body of the present utility model being cut open;

[0021] Figure 4 is a three-dimensional structural schematic diagram of the connection between the cover and the mounting block of the present utility model;

[0022] Figure 5 For the present utility model Figure 3 is an enlarged structural schematic diagram of area A in the figure.

[0023] In the figure: 1, frame body; 2, cavity; 3, square block; 4, fixed rod; 5, latch; 6, first spring; 7, mounting slot; 8, connecting block; 9, connecting rod; 10, pull rod; 11, cover; 12, mounting block; 13, card slot; 14, ring; 15, second spring; 16, light-transmitting colloid; 17, positive terminal; 18, support electrode; 19, light-emitting chip; 20, wire clamping mechanism; 21, negative terminal. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Embodiment

[0026] As Figures 1 - 5As shown in the figure, a high-power LED bracket packaging structure proposed by an embodiment of the present utility model includes a frame body 1. Two cavities 2 are opened on the frame body 1. A square block 3 is fixedly connected to one inner wall of the cavity 2. A fixing rod 4 is fixedly connected to one side of the square block 3. A latch 5 is slidably connected to the fixing rod 4. A first spring 6 is welded between the end of the latch 5 and one side of the corresponding square block 3. The first spring 6 is movably sleeved on the corresponding fixing rod 4. Two installation grooves 7 are opened on the top of the frame body 1. A connecting block 8 is welded to the bottom of the latch 5. A connecting rod 9 is welded to one side of the connecting block 8. The ends of the two connecting rods 9 both extend outside the frame body 1 and are fixedly connected to the same pull rod 10. The top of the frame body 1 is in movable contact with a cover 11. Two installation blocks 12 are fixedly connected to the bottom of the cover 11. A card slot 13 is opened on one side of the installation block 12. The card slot 13 is engaged with the corresponding latch 5. Pull the pull rod 10. The pull rod 10 drives the connecting rod 9 to move. The connecting rod 9 drives the corresponding ring 14 to move and compress the second spring 15. At the same time, the connecting rod 9 drives the corresponding connecting block 8 to move. The connecting block 8 drives the corresponding latch 5 to slide on the fixing rod 4. During the movement of the latch 5, the corresponding first spring 6 is compressed, so that the latch 5 is separated from the corresponding card slot 13, and at the same time, the latch 5 is received into the corresponding cavity 2. Then, move the cover 11 upward to separate the cover 11 from the frame body 1. Then, disassemble the light-emitting wafer 19 from the inside of the frame body 1, and install a new light-emitting wafer 19 inside the frame body 1. Then, connect the new light-emitting wafer 19 and the bracket electrode 18 through a conductive metal wire to form a conductive circuit. Insert the installation block 12 on the cover 11 into the corresponding installation groove 7. When the top of the frame body 1 contacts the top of the cover 11, at this time, release the pulling force on the pull rod 10. The first spring 6 in the compressed state resets. Under the action of the self-elastic force of the first spring 6, the first spring 6 drives the corresponding latch 5 to be engaged with the card slot 13, so as to fix the cover 11. During the disassembly and assembly process, the operation is simple and convenient, and only need to pull the pull rod 10.

[0027] In some embodiments, a ring 14 is fixedly connected to the connecting rod 9. A second spring 15 is fixedly connected between one side of the ring 14 and the other inner wall of the corresponding cavity 2. The second spring 15 is movably sleeved on the corresponding connecting rod 9. The setting of the second spring 15 plays a role in resetting.

[0028] In some embodiments, a light-transmitting colloid 16 is provided on the cover 11. A plurality of positive terminals 17 are fixedly connected to the left side of the frame body 1. A plurality of negative terminals 21 are fixedly connected to the right side of the frame body 1.

[0029] In some embodiments, two bracket electrodes 18 are provided inside the frame body 1. A plurality of light-emitting wafers 19 are installed inside the frame body 1.

[0030] In some embodiments, a wire clamping mechanism 20 is provided between the bracket electrode 18 and the light-emitting wafer 19. The provision of the wire clamping mechanism 20 improves stability.

[0031] In some embodiments, a guiding hole is formed in one inner wall of the mounting groove 7. The guiding hole is slidably connected to the corresponding pin 5. The provision of the pin 5 facilitates quick disassembly and assembly.

[0032] Working principle or structural principle: During use, the user can respectively install the three light-emitting wafers 19 inside the frame body 1, and respectively weld the three light-emitting wafers 19 to the bracket electrode 18 through conductive metal wires to form a conductive circuit. Then, the positive electrode end 17 and the negative electrode end 21 on both sides of the frame body 1 are respectively connected to an external circuit, so that the light-emitting wafer 19 is connected to the circuit and emits light to form a light source. The light passes through the light-transmissive colloid 16 and is emitted for illumination. When welding the conductive metal wires, the wire clamping mechanism 20 supports and positions the conductive metal wires, effectively improving the stability during the welding of the conductive metal wires, preventing the conductive metal wires from shaking and breaking, ensuring the normal light emission of the light-emitting wafer 19, and helping to extend the service life of the LED product. When the light-emitting wafer 19 is damaged, pull the pull rod 10. The pull rod 10 drives the connecting rod 9 to move. The connecting rod 9 drives the corresponding ring 14 to move and compress the second spring 15. At the same time, the connecting rod 9 drives the corresponding connecting block 8 to move. The connecting block 8 drives the corresponding pin 5 to slide on the fixing rod 4. During the movement of the pin 5, the corresponding first spring 6 is compressed, so that the pin 5 is separated from the corresponding card slot 13, and at the same time, the pin 5 is received in the corresponding cavity 2. Then, move the cover 11 upward to separate the cover 11 from the frame body 1. Then, disassemble the light-emitting wafer 19 from inside the frame body 1, install a new light-emitting wafer 19 inside the frame body 1, and connect the new light-emitting wafer 19 and the bracket electrode 18 through a conductive metal wire to form a conductive circuit. Insert the mounting block 12 on the cover 11 into the corresponding mounting groove 7. When the top of the frame body 1 contacts the top of the cover 11, at this time, release the pulling force on the pull rod 10. The first spring 6 in the compressed state resets. Under the action of the self-elastic force of the first spring 6, the first spring 6 drives the corresponding pin 5 to be clamped with the card slot 13, thereby fixing the cover 11. During the disassembly and assembly process, the operation is simple and convenient, and only the pull rod 10 needs to be pulled.

[0033] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-power LED bracket packaging structure, including a bracket body (1), characterized in that: Two cavities (2) are formed in the frame body (1). A square block (3) is fixedly connected to the inner wall of one side of the cavity (2). A fixing rod (4) is fixedly connected to one side of the square block (3). A latch (5) is slidably connected to the fixing rod (4). A first spring (6) is welded between the end of the latch (5) and one side of the corresponding square block (3). The first spring (6) is movably sleeved on the corresponding fixing rod (4). Two mounting grooves (7) are formed in the top of the frame body (1). A connecting block (8) is welded to the bottom of the latch (5). A connecting rod (9) is welded to one side of the connecting block (8). The ends of the two connecting rods (9) both extend outside the frame body (1) and are fixedly connected to the same pull rod (10). A cover (11) is in movable contact with the top of the frame body (1). Two mounting blocks (12) are fixedly connected to the bottom of the cover (11). A card slot (13) is formed in one side of the mounting block (12). The card slot (13) is clamped with the corresponding latch (5).

2. The high-power LED bracket packaging structure according to claim 1, wherein: A ring (14) is fixedly connected to the connecting rod (9). A second spring (15) is fixedly connected between one side of the ring (14) and the inner wall of the other side of the corresponding cavity (2). The second spring (15) is movably sleeved on the corresponding connecting rod (9).

3. A high-power LED bracket packaging structure according to claim 1, characterized in that: A light-transmitting colloid (16) is provided on the cover (11). A plurality of positive electrodes (17) are fixedly connected to the left side of the frame body (1). A plurality of negative electrodes (21) are fixedly connected to the right side of the frame body (1).

4. A high-power LED bracket packaging structure according to claim 1, characterized in that: Two support electrodes (18) are arranged inside the frame body (1). A plurality of light-emitting wafers (19) are installed inside the frame body (1).

5. The high-power LED bracket packaging structure according to claim 4, wherein: A wire clamp mechanism (20) is arranged between the support electrode (18) and the light-emitting wafer (19).

6. The high-power LED bracket packaging structure according to claim 1, characterized in that: A guiding hole is formed in the inner wall of one side of the mounting groove (7). The guiding hole is slidably connected to the corresponding latch (5).

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