Device and system for grinding and polishing diamond

Through the coordination of the clamping parts and the driving parts, combined with the adjustment mechanism and the multi-grinding and polishing device, efficient diamond nano-scale grinding and polishing are achieved, solving the problems of low efficiency and high roughness in the prior art, and improving the surface flatness and yield of diamonds.

CN223160629UActive Publication Date: 2025-07-29HANZHONG DE MENG TE SEMICON TECH CO LTD
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Patent Information

Application Number
CN202421763801.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-24
Publication Date
2025-07-29
Estimated Expiration
2034-07-24

AI Technical Summary

Technical Problem

The existing grinding and polishing devices have low processing efficiency and high roughness on the diamond surface, which cannot meet the flatness needs of nano-scale single-crystal diamonds.

Method used

The diamond is clamped with a clamping member and driven by the drive member to repeatedly rub the grinding piece. The distance between the diamond and the grinding piece is adjusted in combination with the adjustment mechanism, and the grinding piece is efficiently ground and polished around the grinding piece provided by the mounting frame using multiple grinding and polishing devices.

Benefits of technology

The efficiency of diamond surface grinding and polishing is improved, and diamond with nano-level surface roughness meets the requirements is obtained, which improves the yield rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a device and system for grinding and polishing diamond, which comprises a clamping piece used for clamping the diamond and enabling the to-be-ground and polished part of the diamond to repeatedly rub on a grinding disc until the roughness of the to-be-ground and polished part of the diamond meets the requirement; the diamond surface grinding and polishing efficiency is effectively improved, the nanoscale diamond surface can be obtained, and the diamond yield can be greatly improved.
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Description

Technical Field

[0001] The utility model belongs to the field of diamond grinding and polishing, and in particular relates to a device and a system for grinding and polishing diamonds. Background Art

[0002] With the rapid development of social economy and science and technology, high-power electronic devices, as the core of power electronic devices, play a vital role in high-tech industries such as aerospace and 5G communications. However, the development of carrier concentration, mobility and heat dissipation of traditional semiconductor materials has reached their theoretical limits, resulting in the application of devices in high-power and high-temperature fields being restricted, which has become a technical bottleneck that needs to be solved urgently. As a new type of ultra-wide bandgap semiconductor material, diamond has excellent properties such as large bandgap width, high carrier mobility, large breakdown electric field, and high thermal conductivity compared to other semiconductor materials. It is called the ultimate semiconductor and is expected to break through the technical bottlenecks faced by existing semiconductor materials.

[0003] Diamond also has excellent thermal properties. It has high thermal conductivity, and bonding conventional semiconductors to diamond can effectively reduce the operating temperature of high-power optoelectronic and high-power electronic devices, directing the heat generated by the devices away from the diamond, thereby improving device performance.

[0004] Diamond has excellent optical properties and high transmittance from the near-ultraviolet to the far-infrared, making it an ideal window material for high-power lasers. Radar waves are not easily distorted when passing through diamond, giving it great potential for application in radomes.

[0005] All of these diamond applications require a smooth surface. However, the surface of newly produced diamond material is generally uneven and cannot meet the requirements for manufacturing electronic devices. The diamond surface needs to be ground and polished, or polished. The flatness of the polished diamond surface directly affects the performance of diamond electronic devices, and the diamond surface generally needs to be polished to 1nm. Due to the extremely high hardness of diamond material, surface processing is very difficult. Existing polishing devices have low efficiency and yield when polishing diamond surfaces, and the roughness is high. Summary of the Invention

[0006] The purpose of the utility model is to provide a device and system for grinding and polishing diamonds, which can efficiently complete the grinding and polishing of nano-scale single-crystal diamond surfaces, solving the problems of low efficiency and high roughness when processing diamonds in existing grinding and polishing equipment.

[0007] The utility model adopts the following technical solution: a device for grinding and polishing diamonds, comprising:

[0008] A clamping member, which is used to clamp a diamond and make the part of the diamond to be ground and polished repeatedly rub against a grinding disc until the roughness of the part of the diamond to be ground and polished meets the requirements;

[0009] A driving member, which is used to drive the clamping member to move reciprocally;

[0010] The clamping member includes:

[0011] A clamping rod, on which a diamond is installed; the clamping rod is used to drive the clamping rod to move repeatedly under the drive of the driving member, so that the diamond is ground and polished by the grinding disc.

[0012] Further, the clamping rod is arranged vertically, and a diamond is installed at its lower end.

[0013] Further, the clamping member further includes:

[0014] A positioning plate, which is strip-shaped and arranged horizontally; a first through hole for the clamping rod to pass through and fix the clamping rod is opened thereon. The positioning plate is connected to the driving member and is used to drive the clamping rod to move repeatedly under the drive of the driving member, so that the diamond is ground and polished by the grinding disc.

[0015] Further, the clamping member further includes: a fixed bottom plate, the two sides of which are respectively connected to the driving member and the positioning plate, and is used to drive the positioning plate to move reciprocally under the drive of the driving member;

[0016] The fixed bottom plate is fixedly connected with an adjusting mechanism, and the adjusting mechanism is used to adjust the height of the positioning plate, and further adjust the distance between the diamond and the grinding disc.

[0017] Further, the fixed bottom plate is located below the positioning plate.

[0018] Further, the adjusting mechanism includes:

[0019] An adjusting column, the lower side of which is fixed on the upper side of the fixed bottom plate; an external thread is provided on its outer wall;

[0020] An adjusting cylinder, which is a cylindrical structure with openings at both the upper and lower ends. An internal thread is opened on its inner wall. The upper side of it abuts against the lower side of the positioning plate. The adjusting cylinder is used to sleeved on the adjusting column, and further adjust the height of the positioning plate by adjusting the depth of the adjusting cylinder screwing into the adjusting column.

[0021] Further, a second through hole is also opened on the positioning plate;

[0022] The adjusting mechanism further includes:

[0023] A positioning rod, which is located above the adjusting column and coaxially arranged with the adjusting column. The lower end of it is fixedly connected to the upper end of the adjusting column; the upper end of it extends upward and passes through the second through hole, and then clamps the positioning plate.

[0024] A system for grinding and polishing diamond, comprising:

[0025] A mounting bracket;

[0026] A plurality of grinding and polishing devices; all are mounted on the mounting bracket and arranged around the mounting bracket;

[0027] A grinding disc, located at the central position of the mounting bracket; its lower side is electrically connected to a rotating motor and is used to rotate driven by the rotating motor; thereby enabling the diamond installed on each grinding and polishing device to be ground and polished on the grinding disc.

[0028] The beneficial effects of the present utility model are:

[0029] The present utility model effectively improves the efficiency of grinding and polishing the diamond surface, can obtain a nano-level diamond surface, and can also greatly improve the yield of diamond;

[0030] The present utility model clamps the diamond by setting a clamping member and repeatedly rubs it on the grinding disc until the roughness of the to-be-ground-and-polished part of the diamond meets the requirements;

[0031] The present utility model drives the clamping member by setting a driving member, such as a motor, thereby enabling the clamping member to reciprocate and grind and polish the diamond, avoiding manual grinding and polishing of the diamond, and greatly improving the grinding and polishing efficiency of the diamond;

[0032] The present utility model limits the positioning plate by setting a clamping rod, a positioning rod and a limiting rod, thereby preventing the positioning plate from shifting left and right and front and back due to the driving of the driving member, thereby ensuring that the to-be-ground-and-polished part of the diamond does not shift and ensuring the grinding and polishing effect;

[0033] The present utility model sets an adjusting cylinder sleeved on an adjusting column, and can adjust the height of the positioning plate by adjusting the depth of the adjusting cylinder screwed into the adjusting column, thereby facilitating the adjustment of the distance between the diamond and the grinding disc, and also facilitating the removal of the diamond or the stop of grinding and polishing. Description of the Drawings

[0034] Figure 1 It is a schematic structural diagram of the device of the present utility model;

[0035] Figure 2 It is a schematic structural diagram of the system of the present utility model;

[0036] Wherein: 10, clamping member; 11, driving member; 12, clamping rod; 13, positioning plate; 14, fixed bottom plate; 15, adjusting column; 16, adjusting cylinder; 17, positioning rod; 18, limiting rod; 19, mounting bracket; 20, grinding disc. Detailed Embodiments

[0037] The present utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0038] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more. The "orientation" in the present utility model is described based on the orientation of the present utility model in Figure 1 the state.

[0039] The present utility model discloses a device for grinding and polishing diamond, as Figure 1 shown, which includes: a clamping member 10 for clamping the diamond and causing the to-be-ground-and-polished part of the diamond to repeatedly rub on the grinding disc 20 until the roughness of the to-be-ground-and-polished part of the diamond meets the requirements.

[0040] The present utility model further includes: a driving member 11 for driving the clamping member 10 to reciprocate.

[0041] The clamping member 10 includes: a clamping rod 12 with a diamond mounted thereon; the clamping rod 12 is used to drive the clamping rod 12 to move repeatedly under the drive of the driving member 11, so that the diamond is ground and polished by the grinding disc 20.

[0042] The clamping rod 12 is vertically arranged and a diamond is mounted at its lower end. The clamping rod 12 can also be horizontally arranged as long as it can mount the diamond and enable the diamond to be ground and polished on the grinding disc 20.

[0043] The clamping member 10 further includes: a positioning plate 13 which is strip-shaped and horizontally arranged; a first through hole for the clamping rod 12 to pass through and fix the clamping rod 12 is provided on the positioning plate 13. The positioning plate 13 is connected to the driving member 11 and is used to drive the clamping rod 12 to move repeatedly under the drive of the driving member 11, so that the diamond is ground and polished by the grinding disc 20.

[0044] The fixing method of the positioning plate 13 and the clamping rod 12 is not limited, as long as it can drive the clamping rod 12 to move.

[0045] The clamping member 10 further includes: a fixed bottom plate 14, both sides of the fixed bottom plate 14 are respectively connected to the driving member 11 and the positioning plate 13, and the fixed bottom plate 14 is used to drive the positioning plate 13 to reciprocate under the drive of the driving member 11; the fixed bottom plate 14 is fixedly connected with an adjusting mechanism, and the adjusting mechanism is used to adjust the height of the positioning plate 13, thereby adjusting the distance between the diamond and the grinding disc 20.

[0046] The adjusting mechanism can be located on the lower side or the upper side of the positioning plate 13. If the adjusting mechanism is located on the upper side of the positioning plate 13, the fixing method of the positioning plate 13 and the adjusting mechanism needs to be changed. If the adjusting mechanism is located on the lower side of the positioning plate 13, it is relatively simple, and the positioning plate 13 can be directly lifted and clamped by the adjusting structure.

[0047] When the fixed bottom plate 14 is located on the lower side of the positioning plate 13, the adjusting mechanism includes: an adjusting column 15 and an adjusting cylinder 16.

[0048] The lower side of the adjusting column 15 is fixed on the upper side of the fixed bottom plate 14; an external thread is provided on the outer wall of the adjusting column 15; the adjusting cylinder 16 is a cylindrical structure with openings at both the upper and lower ends, an internal thread is provided on the inner wall of the adjusting cylinder 16, the upper side of the adjusting cylinder 16 abuts against the lower side of the positioning plate 13, and the adjusting cylinder 16 is used to be sleeved on the adjusting column 15, thereby adjusting the height of the positioning plate 13 by the depth of the adjusting cylinder 16 screwed into the adjusting column 15.

[0049] A second through hole is further opened on the positioning plate 13; therefore, the adjusting mechanism further includes: a positioning rod 17, the positioning rod 17 is located above the adjusting column 15 and is coaxially arranged with the adjusting column 15, and the lower end of the positioning rod 17 is fixedly connected to the upper end of the adjusting column 15; the upper end of the positioning rod 17 extends upward and passes through the second through hole, thereby clamping the positioning plate 13.

[0050] By inserting the positioning rod 17 into the second through hole of the positioning plate 13, it is convenient to drive the positioning plate 13 to reciprocate through the positioning rod 17 under the drive of the driving member 11, thereby completing the grinding and polishing of the diamond.

[0051] Such as Figure 1As shown in the figure, if the positioning plate 13 is only driven to reciprocate left and right by the positioning rod 17, then the positioning plate 13 will inevitably sway back and forth during the movement. Therefore, a third through hole is also provided on the positioning plate 13; the clamping member 10 further includes: a limiting rod 18, the lower end of the limiting rod 18 is fixedly connected to the fixed bottom plate 14, the upper end of the limiting rod 18 extends upward and passes through the third through hole, and then cooperates with the positioning rod 17 to drive the positioning plate 13 to reciprocate; the limiting rod 18 is also used to reduce the swing amplitude of the positioning plate 13 during reciprocation. By providing the limiting rod 18, the front-back swaying of the positioning plate 13 can be avoided.

[0052] The lower side of the fixed bottom plate 14 is connected to the driving member 11 through a slide rail. The driving member 11 is a motor. By providing the slide rail, the movement amplitude of the positioning plate 13 can be increased, and the diamond can be polished efficiently and precisely.

[0053] The present utility model also discloses a system for polishing a diamond, as Figure 2 shown, including: a mounting frame 19, a plurality of polishing devices, and a polishing disc 20.

[0054] A plurality of polishing devices are all mounted on the mounting frame 19 and are arranged around the mounting frame 19; the polishing disc 20 is located at the central position of the mounting frame 19; the lower side of the polishing disc 20 is electrically connected to a rotating motor, and the polishing disc 20 is used to rotate driven by the rotating motor; thereby enabling the diamond mounted on each polishing device to be polished on the polishing disc 20.

[0055] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A device for grinding and polishing diamond, characterized in that, Comprising: A clamping member (10) for clamping a diamond and causing the portion of the diamond to be ground and polished to repeatedly rub against a grinding disc (20) until the roughness of the portion of the diamond to be ground and polished meets the requirements; A driving member (11) for driving the clamping member (10) to reciprocate; The clamping member (10) includes: A clamping rod (12) on which a diamond is mounted; the clamping rod (12) is used to drive the clamping rod (12) to move repeatedly under the drive of the driving member (11), so that the diamond is ground and polished by the grinding disc (20).

2. The device for grinding and polishing diamond according to claim 1, characterized in that, The clamping rod (12) is vertically arranged, and a diamond is mounted at its lower end.

3. A device for grinding and polishing diamond according to claim 2, characterized in that, The clamping member (10) further includes: A positioning plate (13), which is strip-shaped and horizontally arranged; a first through hole for the clamping rod (12) to pass through and fix the clamping rod (12) is formed thereon. The positioning plate (13) is connected to the driving member (11) and is used to drive the clamping rod (12) to move repeatedly under the drive of the driving member (11), so that the diamond is ground and polished by the grinding disc (20).

4. A device for grinding and polishing diamond according to claim 3, characterized in that, The clamping member (10) further includes: a fixed bottom plate (14), the two sides of which are respectively connected to the driving member (11) and the positioning plate (13), and is used to drive the positioning plate (13) to reciprocate under the drive of the driving member (11); The fixed bottom plate (14) is fixedly connected with an adjusting mechanism, and the adjusting mechanism is used to adjust the height of the positioning plate (13), thereby adjusting the distance between the diamond and the grinding disc (20).

5. A device for grinding and polishing diamond according to claim 4, characterized in that, The fixed bottom plate (14) is located below the positioning plate (13).

6. The device for grinding and polishing diamond according to claim 5, wherein The adjusting mechanism includes: An adjusting column (15), the lower side of which is fixed on the upper side of the fixed bottom plate (14); an external thread is provided on its outer wall; An adjusting cylinder (16), which is a cylindrical structure with openings at both the upper and lower ends, and an internal thread is provided on its inner wall. The upper side of it abuts against the lower side of the positioning plate (13). The adjusting cylinder (16) is used to be sleeved on the adjusting column (15), and thereby the height of the positioning plate (13) is adjusted by adjusting the depth of the adjusting cylinder (16) screwed into the adjusting column (15).

7. The device for grinding and polishing diamond according to claim 6, characterized in that, A second through hole is further formed on the positioning plate (13); The adjusting mechanism further includes: A positioning rod (17), which is located above the adjusting column (15) and coaxially arranged with the adjusting column (15). The lower end of it is fixedly connected to the upper end of the adjusting column (15); its upper end extends upward and passes through the second through hole, thereby clamping the positioning plate (13).

8. A system for grinding and polishing diamond, characterized in that, Comprising: A mounting frame (19); A plurality of grinding and polishing devices; all are mounted on the mounting frame (19) and are arranged around the mounting frame (19); A grinding disc (20), which is located at the central position of the mounting frame (19); its lower side is electrically connected to a rotating motor and is used to rotate under the drive of the rotating motor; thereby the diamonds mounted on each grinding and polishing device are ground and polished on the grinding disc (20). Wherein, the grinding and polishing device is a device for grinding and polishing a diamond according to any one of claims 1-7.