Mechanical arm for transferring semiconductor wafer

Abstract

The utility model discloses a mechanical arm for semiconductor wafer transfer, and relates to the technical field of semiconductor transfer. The device comprises a mounting plate, a rotating assembly is arranged at the top of the mounting plate, a lifting assembly is arranged in the rotating assembly, an adsorption assembly is arranged at the top end of the lifting assembly, the adsorption end of the adsorption assembly is rotationally connected with a protection assembly, and a linkage assembly is arranged between the protection assembly and the rotating assembly. According to the utility model, through the arrangement of the linkage assembly, when the adsorption assembly moves downwards, the protection assembly can rotate to the upper side of the adsorption end of the adsorption assembly, and when the adsorption assembly completes adsorption and moves upwards, the protection assembly can rotate to the lower side of the adsorption end of the adsorption assembly again and shield and protect the adsorbed wafer. According to the arrangement, even if the wafer falls off when the wafer is transferred, the wafer cannot be damaged under the protection of the protection assembly, so that the protection effect of the mechanical arm when the wafer is transferred is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor transfer, and particularly relates to a robotic arm for transferring semiconductor wafers. Background Art

[0002] A wafer is a thin slice of semiconductor. The warpage of the wafer affects the quality of direct wafer bonding. The smaller the warpage, the flatter the surface, the less work done to overcome elastic deformation, and the easier it is to bond the wafer. To ensure the overall production quality of semiconductor wafers, during the production of semiconductor wafers, a robotic arm is required to transfer the wafers on the conveyor belt to a warpage detection device for warpage detection.

[0003] In Chinese Patent CN221391108U, a robotic arm for facilitating workpiece transfer is disclosed. When the device operates, a pneumatic suction cup adsorbs the wafer on the conveyor belt, and at the same time, a rotating arm drives the adsorbed wafer to move to the test position of the warpage testing device, enabling the warpage testing device to detect the wafer. After the detection is completed, under the cooperation of the pneumatic suction cup and the rotating arm, the wafer is transferred back to the conveyor belt again, and the above work process is repeated in a cycle to achieve the transfer and detection of the wafer.

[0004] When the pneumatic suction cup completes the adsorption of the wafer and is driven by the rotating arm for transfer, it is prone to poor sealing between the pneumatic suction cup and the wafer, resulting in the pneumatic suction cup not firmly adsorbing the wafer, so that the wafer is likely to be damaged due to dropping during the transfer process. This phenomenon makes the protection effect of the robotic arm on the wafer poor during wafer transfer.

[0005] Regarding the problems in the related art, no effective solution has been proposed yet. Summary of the Utility Model

[0006] Regarding the problems in the related art, the utility model proposes a robotic arm for transferring semiconductor wafers to overcome the above technical problems existing in the prior related art.

[0007] To solve the above technical problems, the utility model is realized through the following technical solutions:

[0008] The utility model provides a robotic arm for transferring semiconductor wafers, including a mounting plate. A rotating assembly is arranged on the top of the mounting plate. A lifting assembly is arranged inside the rotating assembly. An adsorption assembly is arranged at the top end of the lifting assembly. A protection assembly is rotatably connected to the adsorption end of the adsorption assembly. A linkage assembly is arranged between the protection assembly and the rotating assembly. When the lifting assembly drives the adsorption assembly to move downward, the protection assembly rotates to the upper side of the adsorption end of the adsorption assembly under the drive of the linkage assembly.

[0009] Further, the rotating assembly includes a rotating cylinder, the rotating cylinder is rotatably connected to the mounting plate, the bottom of the rotating cylinder penetrates through the mounting plate and is fixedly connected with a driven gear, the outer surface of the driven gear is engaged with a driving gear, the bottom of the mounting plate is fixedly installed with a motor, and the output end of the motor is fixedly connected with the driving gear.

[0010] Further, the lifting assembly includes a lifting rod, the lifting rod is movably connected to the rotating cylinder, the bottom of the driven gear is fixedly installed with a hydraulic cylinder, and the output end of the hydraulic cylinder is fixedly connected with the bottom end of the lifting rod.

[0011] Further, the adsorption assembly includes a connecting arm, the connecting arm is fixedly connected to the lifting rod, the bottom of the connecting arm is fixedly connected with a connecting pipe, the bottom of the connecting pipe is fixedly installed with a pneumatic suction cup, and the top end of the connecting pipe penetrates through the connecting arm and is fixedly connected with an air pipe.

[0012] Further, the protection assembly includes a linkage rod and a rotating rod, the linkage rod and the rotating rod are respectively rotatably connected to both sides of the connecting pipe, L-shaped connecting rods are fixedly connected to the outer surfaces of the linkage rod and the rotating rod, the bottom ends of the L-shaped connecting rods are fixedly connected with a protection frame, and synchronous gears are fixedly connected to the outer surfaces of the linkage rod and the rotating rod, and the two synchronous gears are engaged with each other.

[0013] Further, the linkage assembly includes a toothed plate, the toothed plate is fixedly connected to the outer surface of the rotating cylinder, a linkage gear is engaged with one side of the toothed plate, and the linkage gear is fixedly connected to the linkage rod.

[0014] Further, a support frame is fixedly connected to the bottom of the connecting arm, the linkage rod is rotatably connected to the support frame, and a through groove is formed in the top of the connecting arm corresponding to the toothed plate.

[0015] The utility model has the following beneficial effects:

[0016] 1. By setting the linkage assembly, when the adsorption assembly moves downward to adsorb the wafer, the protection assembly can rotate to the upper side of the adsorption end of the adsorption assembly. When the adsorption assembly completes adsorption and moves upward, the protection assembly can rotate to the lower side of the adsorption end of the adsorption assembly again to shield and protect the adsorbed wafer. This setting enables that even if the wafer drops during the transfer of the wafer, it will not be damaged under the protection of the protection assembly, thereby improving the protection effect when the robotic arm transfers the wafer.

[0017] 2. By providing a toothed plate and a linkage gear, when the pneumatic suction cup moves downward, the linkage gear can drive the linkage rod to rotate with the assistance of the toothed plate, so that the linkage rod drives the two protective frames to rotate upward through two meshing synchronous gears and a rotating rod, enabling the pneumatic suction cup to normally adsorb the wafer. When the pneumatic suction cup moves upward, the two protective frames can automatically reset and shield the adsorbed wafer. The above settings result in a high degree of linkage between the adsorption component and the protection component when the robotic arm adsorbs the wafer.

[0018] Of course, it is not necessary for any product implementing the present utility model to simultaneously achieve all the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the following will briefly introduce the drawings required for describing the embodiments. Obviously, the drawings in the following description are only some embodiments of the utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0020] Figure 1 is a schematic diagram of the external contour structure of the present utility model;

[0021] Figure 2 of the present utility model Figure 1 is a schematic diagram of the upward view structure;

[0022] Figure 3 is a schematic diagram of the sectional view of the rotating cylinder of the present utility model;

[0023] Figure 4 is a schematic diagram of the adsorption component structure of the present utility model;

[0024] Figure 5 is a schematic diagram of the protection component structure of the present utility model;

[0025] Figure 6 is a schematic diagram of the upward view structure of the pneumatic suction cup of the present utility model.

[0026] In the drawings, the list of components represented by each reference numeral is as follows:

[0027] 1. Mounting plate; 2. Rotating assembly; 201. Rotating cylinder; 202. Driven gear; 203. Driving gear; 204. Motor; 3. Lifting assembly; 301. Lifting rod; 302. Hydraulic cylinder; 4. Adsorption assembly; 401. Connecting arm; 402. Connecting pipe; 403. Pneumatic suction cup; 404. Air pipe; 5. Protection assembly; 501. Linking rod; 502. Rotating rod; 503. L-shaped connecting rod; 504. Protection frame; 505. Synchronous gear; 6. Linkage assembly; 601. Rack; 602. Linkage gear; 7. Support frame; 8. Through slot. Detailed implementation manner

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the utility model with reference to the accompanying drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the utility model.

[0029] In the description of the present utility model, it should be understood that the terms "opening", "upper", "lower", "top", "middle", "inner", etc. indicating the orientation or position relationship are only for the convenience of describing the utility model and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation to the utility model.

[0030] Please refer to Figures 1-6 As shown, the present utility model is a robotic arm for transferring semiconductor wafers, including a mounting plate 1. A rotating assembly 2 is arranged at the top of the mounting plate 1. A lifting assembly 3 is arranged inside the rotating assembly 2. An adsorption assembly 4 is arranged at the top end of the lifting assembly 3. A protection assembly 5 is rotatably connected to the adsorption end of the adsorption assembly 4. A linkage assembly 6 is arranged between the protection assembly 5 and the rotating assembly 2. When the lifting assembly 3 drives the adsorption assembly 4 to move downward, the protection assembly 5 rotates to the upper side of the adsorption end of the adsorption assembly 4 under the drive of the linkage assembly 6.

[0031] When using the device, the mounting plate 1 can be installed at a suitable position on the side of the transport device through fixing bolts. When adsorbing the wafers on the conveyor belt, the lifting assembly 3 drives the adsorption assembly 4 to move downward so that the adsorption end of the adsorption assembly 4 can contact the wafers on the conveyor belt. During this process, the protection assembly 5 can rotate upward under the drive of the linkage assembly 6 so that the whole protection assembly 5 can rotate to the upper side of the adsorption end of the adsorption assembly 4. When the adsorption is completed, the lifting assembly 3 drives the adsorption assembly 4 to move upward. At this time, under the drive of the linkage assembly 6, the protection assembly 5 can rotate downward and rotate to the lower side of the adsorption end of the adsorption assembly 4 again.

[0032] By setting the linkage assembly 6 and the protection assembly 5, when the adsorption assembly 4 moves downward to adsorb the wafers, the protection assembly 5 can rotate upward under the drive of the linkage assembly 6 so that the adsorption assembly 4 can normally adsorb the wafers. When the adsorption assembly 4 drives the adsorbed wafers to move upward, the protection assembly 5 rotates to the lower side of the adsorption end of the adsorption assembly 4 again under the drive of the linkage assembly 6 to protect the adsorbed wafers, thus avoiding the phenomenon that the wafers are damaged due to dropping when being transported, and improving the protection effect when the robotic arm transports the wafers.

[0033] In one embodiment, for the above-mentioned rotating assembly 2, the rotating assembly 2 includes a rotating cylinder 201. The rotating cylinder 201 is rotatably connected to the mounting plate 1. The bottom of the rotating cylinder 201 penetrates through the mounting plate 1 and is fixedly connected with a driven gear 202. The outer surface of the driven gear 202 is engaged with a driving gear 203. The bottom of the mounting plate 1 is fixedly installed with a motor 204. The output end of the motor 204 is fixedly connected with the driving gear 203.

[0034] By driving the motor 204, the motor 204 drives the driven gear 202 to rotate through the driving gear 203. At this time, the driven gear 202 can drive the rotating cylinder 201 to rotate on the mounting plate 1. The rotating cylinder 201 drives the adsorbed wafers to be transported through the lifting assembly 3 and the adsorption assembly 4. The above setting enables the automatic transfer of the wafers on the conveyor belt to the warpage detection device for detection.

[0035] In one embodiment, for the above-mentioned lifting assembly 3, the lifting assembly 3 includes a lifting rod 301. The lifting rod 301 is movably connected to the rotating cylinder 201. The bottom of the driven gear 202 is fixedly installed with a hydraulic cylinder 302. The output end of the hydraulic cylinder 302 is fixedly connected with the bottom end of the lifting rod 301.

[0036] By driving the hydraulic cylinder 302, the hydraulic cylinder 302 drives the lifting rod 301 to move up and down inside the rotating cylinder 201. At this time, the lifting rod 301 can drive the adsorption component 4 to move up and down, so that the adsorption component 4 can normally adsorb the wafer. The setting of installing the hydraulic cylinder 302 on the driven gear 202 enables the driven gear 202 to drive the adsorption component 4 to rotate through the hydraulic cylinder 302 and the lifting rod 301, so that both the lifting and rotation of the adsorption component 4 can proceed normally.

[0037] In one embodiment, for the above-mentioned adsorption component 4, the adsorption component 4 includes a connecting arm 401. The connecting arm 401 is fixedly connected to the lifting rod 301. A connecting pipe 402 is fixedly connected to the bottom of the connecting arm 401. A pneumatic suction cup 403 is fixedly installed at the bottom of the connecting pipe 402. The top end of the connecting pipe 402 penetrates through the connecting arm 401 and is fixedly connected to an air pipe 404.

[0038] By connecting the air pipe 404 to an external vacuum device, the pneumatic suction cup 403 can adsorb the wafer after contacting the wafer. The setting of the connecting pipe 402 makes there be a certain distance between the pneumatic suction cup 403 and the connecting arm 401. This setting enables the protective component 5 to normally rotate to the upper side of the pneumatic suction cup 403 when adsorbing the wafer, so that the pneumatic suction cup 403 can normally contact the wafer and adsorb it.

[0039] In one embodiment, for the above-mentioned protective component 5, the protective component 5 includes a linkage rod 501 and a rotating rod 502. The linkage rod 501 and the rotating rod 502 are respectively rotatably connected to both sides of the connecting pipe 402. L-shaped connecting rods 503 are fixedly connected to the outer surfaces of the linkage rod 501 and the rotating rod 502. A protective frame 504 is fixedly connected to the bottom end of the L-shaped connecting rod 503. Synchronous gears 505 are fixedly connected to the outer surfaces of the linkage rod 501 and the rotating rod 502. The two synchronous gears 505 are engaged with each other.

[0040] By rotating the linkage rod 501, the rotating linkage rod 501 can make the rotating rod 502 rotate together through the two engaged synchronous gears 505, so that the linkage rod 501 and the rotating rod 502 can drive the two protective frames 504 to rotate to the bottom of the pneumatic suction cup 403 through the corresponding L-shaped connecting rods 503, so that the two protective frames 504 can block the lower side of the wafer adsorbed by the pneumatic suction cup 403. This setting enables the wafer not to be damaged due to bumping even if it drops, under the block of the two protective frames 504.

[0041] In one embodiment, for the above-mentioned linkage assembly 6, the linkage assembly 6 includes a toothed plate 601, the toothed plate 601 is fixedly connected to the outer surface of the rotating cylinder 201, and a linkage gear 602 is engaged with one side of the toothed plate 601. The linkage gear 602 is fixedly connected to a linkage rod 501.

[0042] When the lifting rod 301 drives the connecting pipe 402 and the pneumatic suction cup 403 to move downward through the connecting arm 401, since the toothed plate 601 is connected to the rotating cylinder 201, the toothed plate 601 will not move up and down. At this time, the linkage gear 602 can move downward and rotate on one side of the toothed plate 601, so that the linkage gear 602 can drive the linkage rod 501 to rotate. The above setting enables the two protective frames 504 to automatically rotate to the upper side of the pneumatic suction cup 403 when adsorbing the wafer, and when the pneumatic suction cup 403 completes the adsorption of the wafer and moves upward, the two protective frames 504 can automatically rotate to the lower side of the pneumatic suction cup 403 again to shield and protect the adsorbed wafer, thereby making the overall linkage of the device relatively high.

[0043] In one embodiment, for the above-mentioned connecting arm 401, a support frame 7 is fixedly connected to the bottom of the connecting arm 401. The linkage rod 501 is rotatably connected to the support frame 7, and a through groove 8 is formed in the top of the connecting arm 401 corresponding to the toothed plate 601.

[0044] The linkage rod 501 can rotate on the support frame 7. With the support of the support frame 7, the stability of the linkage rod 501 during rotation can be ensured. At the same time, when the connecting arm 401 moves downward, the upper end of the toothed plate 601 can move into the through groove 8. This setting ensures that the presence of the toothed plate 601 does not hinder the up and down movement of the connecting arm 401.

[0045] Through the above technical solutions: 1. By providing the linkage component 6, when the adsorption component 4 moves downward to adsorb the wafer, the protection component 5 can rotate to the upper side of the adsorption end of the adsorption component 4. When the adsorption component 4 completes adsorption and moves upward, the protection component 5 can rotate to the lower side of the adsorption end of the adsorption component 4 again to shield and protect the adsorbed wafer. This setting ensures that even if the wafer drops during transfer, it will not be damaged under the protection of the protection component 5, thus improving the protection effect of the robotic arm during wafer transfer. 2. By providing the toothed plate 601 and the linkage gear 602, when the pneumatic suction cup 403 moves downward, the linkage gear 602 can drive the linkage rod 501 to rotate with the assistance of the toothed plate 601, so that the linkage rod 501 drives the two protection frames 504 to rotate upward through the two meshing synchronous gears 505 and the rotating rod 502, enabling the pneumatic suction cup 403 to normally adsorb the wafer. When the pneumatic suction cup 403 moves upward, the two protection frames 505 can automatically reset to shield and protect the adsorbed wafer. The above settings result in a high degree of linkage between the adsorption component 4 and the protection component 5 when the robotic arm adsorbs the wafer.

[0046] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0047] The preferred embodiments of the utility model disclosed above are only used to assist in explaining the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. These embodiments are selected and specifically described in this specification to better explain the principle and practical application of the utility model, so that those skilled in the relevant technical field can understand and utilize the utility model well. The utility model is only limited by the claims and their full scope and equivalents.

Claims

1. A robotic arm for transferring semiconductor wafers, comprising a mounting plate (1), characterized in that, A rotating assembly (2) is provided at the top of the mounting plate (1). An elevating assembly (3) is provided inside the rotating assembly (2). An adsorption assembly (4) is provided at the top end of the elevating assembly (3). A protective assembly (5) is rotatably connected to the adsorption end of the adsorption assembly (4). A linkage assembly (6) is provided between the protective assembly (5) and the rotating assembly (2). When the elevating assembly (3) drives the adsorption assembly (4) to move downward, the protective assembly (5) rotates to the upper side of the adsorption end of the adsorption assembly (4) under the drive of the linkage assembly (6).

2. The robotic arm for transferring semiconductor wafers according to claim 1, characterized in that, The rotating assembly (2) includes a rotating cylinder (201). The rotating cylinder (201) is rotatably connected to the mounting plate (1). The bottom of the rotating cylinder (201) penetrates through the mounting plate (1) and is fixedly connected to a driven gear (202). A driving gear (203) is meshed with the outer surface of the driven gear (202). A motor (204) is fixedly installed at the bottom of the mounting plate (1). The output end of the motor (204) is fixedly connected to the driving gear (203).

3. A robotic arm for transferring semiconductor wafers according to claim 2, characterized in that, The elevating assembly (3) includes an elevating rod (301). The elevating rod (301) is movably connected to the rotating cylinder (201). A hydraulic cylinder (302) is fixedly installed at the bottom of the driven gear (202). The output end of the hydraulic cylinder (302) is fixedly connected to the bottom end of the elevating rod (301).

4. A robotic arm for transferring semiconductor wafers according to claim 3, wherein, The adsorption assembly (4) includes a connecting arm (401). The connecting arm (401) is fixedly connected to the elevating rod (301). A connecting pipe (402) is fixedly connected to the bottom of the connecting arm (401). A pneumatic suction cup (403) is fixedly installed at the bottom of the connecting pipe (402). The top end of the connecting pipe (402) penetrates through the connecting arm (401) and is fixedly connected to an air pipe (404).

5. The robotic arm for transferring semiconductor wafers according to claim 4, wherein The protective assembly (5) includes a linkage rod (501) and a rotating rod (502). The linkage rod (501) and the rotating rod (502) are respectively rotatably connected to both sides of the connecting pipe (402). L-shaped connecting rods (503) are fixedly connected to the outer surfaces of the linkage rod (501) and the rotating rod (502). A protective frame (504) is fixedly connected to the bottom end of the L-shaped connecting rod (503). Synchronous gears (505) are fixedly connected to the outer surfaces of the linkage rod (501) and the rotating rod (502). The two synchronous gears (505) are meshed with each other.

6. The robotic arm for transferring semiconductor wafers according to claim 5, characterized in that, The linkage assembly (6) includes a toothed plate (601). The toothed plate (601) is fixedly connected to the outer surface of the rotating cylinder (201). A linkage gear (602) is meshed with one side of the toothed plate (601). The linkage gear (602) is fixedly connected to the linkage rod (501).

7. A robotic arm for transferring semiconductor wafers according to claim 6, wherein, A support frame (7) is fixedly connected to the bottom of the connecting arm (401). The linkage rod (501) is rotatably connected to the support frame (7). A through groove (8) is formed in the top of the connecting arm (401) corresponding to the toothed plate (601).

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