Composite film and electronic equipment accessory
Through the hot pressing fixation of composite film and glass fiber substrate, the high cost and low yield of glass fiber substrate electronic equipment accessories are solved, and yield improvement and cost reduction are achieved.
Patent Information
- Application Number
- CN202422120318.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-08-29
AI Technical Summary
As a base material, electronic equipment accessories have problems with high process costs and low yields.
The composite film structure is adopted, including a protective layer, an outer texture layer, a varnish layer, an electroplating layer, an inner texture layer and a pattern structure. It is fixed with the glass fiber substrate through a hot pressing process. The pattern structure is integrated into the substrate at high temperature and cooled and solidified to ensure no separation.
It effectively improves the yield of electronic equipment accessories for glass fiber substrates and reduces production costs.
Smart Images
Figure CN223161472U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electronic device accessories, in particular to a composite film and an electronic device accessory. Background Art
[0002] At present, for electronic device accessories such as shells and covers, their base materials are usually composite plates. With the emergence of new materials, glass fiber has gradually been applied as a base material in electronic device accessories. However, glass fiber as a base material still has the following deficiencies: its process cost is relatively high, the yield is relatively low, and it is unable to effectively reduce production costs. Summary of the Invention
[0003] The utility model aims at the problems of the prior art and provides a composite film and an electronic device accessory, which can effectively improve the yield of electronic device accessories with glass fiber as the base material.
[0004] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0005] A composite film provided by the utility model includes a protective layer, an outer texture layer, a varnish layer, a plating layer, an inner texture layer and a pattern structure. The plating layer is arranged at one end of the inner texture layer far away from the pattern structure, the varnish layer is arranged at one end of the plating layer far away from the inner texture layer, the varnish layer is used to increase the adhesion between the outer texture layer and the plating layer, and the outer texture layer is arranged between the varnish layer and the protective layer;
[0006] The pattern structure is used to connect to an external base material and is fixed to the base material by hot pressing.
[0007] Further, the varnish layer is arranged on the outer texture layer through a screen printing process, and the thickness of the varnish layer is 2 - 5μm.
[0008] Further, the plating layer is prepared by an optical plating or magnetron plating process, and the thickness of the plating layer is 30 - 300nm.
[0009] Further, the pattern structure includes a LOGO layer and an ink layer, and the LOGO layer is arranged between one end of the inner texture layer far away from the plating layer and the ink layer.
[0010] Furthermore, the number of the ink layers is at least two, and the at least two ink layers are stacked in sequence, and the thickness of a single ink layer is 5 - 8μm.
[0011] Further, the protective layer is provided with a release layer, and the release layer is connected to the outer texture layer.
[0012] Further, the outer texture layer is arranged on the protective layer through a pad printing process, and the thickness of the outer texture layer is 6 - 12μm.
[0013] Further, the inner texture layer is disposed on the electroplated layer by pad printing process, and the thickness of the inner texture layer is 6-12 μm.
[0014] The present utility model also provides an electronic device accessory, including a glass fiber substrate and the above composite film, and the glass fiber substrate and the composite film are fixed by hot pressing process.
[0015] Further, the glass fiber substrate is a prepreg glass fiber or a thermoplastic glass fiber.
[0016] The beneficial effects of the present utility model: By fixing the composite film and the glass fiber substrate by hot pressing, the pattern structure of the composite film and the glass fiber substrate are completely bonded at high temperature, so as to ensure that the two do not separate after being fixed, effectively improving the yield. Description of the Drawings
[0017] Figure 1 It is a schematic diagram of Example 1.
[0018] Figure 2 It is a schematic diagram of Example 2.
[0019] Figure 3 It is a schematic diagram of Example 3.
[0020] Reference numerals: 1 - protective layer, 2 - outer texture layer, 3 - varnish layer, 4 - electroplated layer, 5 - inner texture layer, 6 - pattern structure, 7 - LOGO layer, 8 - ink layer, 9 - release layer, 10 - glass fiber substrate. Detailed Embodiments
[0021] For the convenience of understanding by those skilled in the art, the present utility model will be further described below in conjunction with the embodiments and the drawings. The content mentioned in the embodiments is not a limitation to the present utility model. The present utility model will be described in detail below with reference to the drawings.
[0022] Example 1
[0023] As Figure 1 shown, this embodiment provides a composite film, including a protective layer 1, an outer texture layer 2, a varnish layer 3, an electroplated layer 4, an inner texture layer 5 and a pattern structure 6. The electroplated layer 4 is disposed at one end of the inner texture layer 5 away from the pattern structure 6, and the varnish layer 3 is disposed at one end of the electroplated layer 4 away from the inner texture layer 5. The varnish layer 3 is used to increase the adhesion between the outer texture layer 2 and the electroplated layer 4. The outer texture layer 2 is disposed between the varnish layer 3 and the protective layer 1;
[0024] The pattern structure 6 is used to connect to an external substrate and is fixed to the substrate by hot pressing.
[0025] Specifically, the pattern structure 6 of the present utility model is used to adhere to an external substrate, which is preferably fiberglass. Then, the two adhered components are hot-pressed and fixed. At a relatively high temperature, the fiberglass will melt, which is equivalent to integrating the pattern structure 6 into the substrate. Then, the two are cooled and solidified, which can ensure reliable bonding between the pattern structure 6 and the substrate, effectively ensuring that the substrate and the pattern structure 6 will not separate. Moreover, the pattern structure 6 is reliably connected to the protective layer 1, the outer texture layer 2, the varnish layer 3, the electroplating layer 4, and the inner texture layer 5 in sequence and will not separate.
[0026] Therefore, through this embodiment, the yield rate of electronic device accessories can be effectively improved, achieving the purpose of reducing costs.
[0027] In this embodiment, the varnish layer 3 is disposed on the outer texture layer 2 through a screen printing process, and the thickness of the varnish layer 3 is 2 - 5μm. The varnish layer 3 plays a connecting role. As a bonding medium, it has a large adhesion to the outer texture layer 2 and the electroplating layer 4 respectively, thus effectively ensuring that the outer texture layer 2 will not deform. Specifically, the varnish layer 3 is attached to the outer texture layer 2 under the conditions of a temperature of 80 - 90°C and a time of 60 - 80min.
[0028] In this embodiment, the electroplating layer 4 is prepared by an optical electroplating or magnetron sputtering process, and the thickness of the electroplating layer 4 is 30 - 300nm. The thickness of the electroplating layer 4 is determined by the color and luster effects, rather than the thickness of the electronic device accessory. That is, the electroplating layer 4 is mainly provided to adjust the overall visual effect of the present utility model.
[0029] In this embodiment, the pattern structure 6 includes a LOGO layer 7 and an ink layer 8, and the LOGO layer 7 is disposed between the inner texture layer 5 and the ink layer 8 at the end far from the electroplating layer 4.
[0030] Specifically, the LOGO layer 7 and the ink layer 8 are printed successively, and the ink layer 8 is in contact with the external fiberglass substrate 10. During hot pressing, the ink layer 8 is reliably bonded to the fiberglass substrate 10. In addition, the ink layer 8 is also used in cooperation with the inner texture layer 5 to enable the present utility model to present the required and more complex color effects. The thickness of the ink layer 8 in this embodiment is 5 - 8μm.
[0031] In this embodiment, the protective layer 1 is provided with a release layer 9, and the release layer 9 is connected to the outer texture layer 2. That is, after hot pressing and cooling and solidifying to bond this embodiment to the fiberglass substrate 10, the protective layer 1 can be separated from this embodiment by tearing off the protective layer 1, and the release layer 9 ensures that the outer texture layer 2 will not be taken away or deformed by the protective layer 1.
[0032] In this embodiment, the outer texture layer 2 is disposed on the protective layer 1 by pad printing, and the thickness of the outer texture layer 2 is 6-12 μm.
[0033] In this embodiment, the inner texture layer 5 is disposed on the plating layer 4 by pad printing, and the thickness of the inner texture layer 5 is 6-12 μm.
[0034] Both the outer texture layer 2 and the inner texture layer 5 are made of glue, and are directly attached to the protective layer 1 / plating layer 4 according to the required patterns and shapes, and then solidified by being irradiated with an LED lamp and a mercury lamp in sequence, so as not to deform; during the hot pressing process, the formed inner texture layer 5 and outer texture layer 2 will not melt again.
[0035] Embodiment 2
[0036] As Figure 2 shown, compared with Embodiment 1, the difference in this embodiment is that: the number of the ink layers 8 is at least two, and at least two ink layers 8 are stacked in sequence, and the thickness of a single ink layer 8 is 5-8 μm.
[0037] That is, the number of the ink layers 8 can be set according to actual needs, and the thickness of each ink layer 8 must be 5-8 μm to ensure the stable state of the ink layer 8.
[0038] Embodiment 3
[0039] As Figure 3 shown, this embodiment provides an electronic device accessory, including a glass fiber substrate 10 and the composite film described in Claim Embodiment 1, and the glass fiber substrate 10 and the composite film are fixed by a hot pressing process.
[0040] That is, after the composite film is formed, the composite film and the glass fiber substrate 10 are positioned and stacked, and then placed in a mold together to be heated and pressurized, so that the glass fiber substrate 10 is melted by heat and bonded to the ink layer 8 of the composite film; then the above structure is cooled, so that the glass fiber substrate 10 is solidified and no longer separated from the ink layer 8, and then the protective film can be torn off to form the required electronic device accessory.
[0041] In this embodiment, in order to enable the glass fiber substrate 10 to be melted into the required state at a not-too-high temperature, the glass fiber substrate 10 is a prepreg glass fiber or a thermoplastic glass fiber. On this basis, the hot pressing temperature only needs to be 120-170 °C and the hot pressing time only needs to be 1-5 min to complete the fusion effect.
[0042] In addition, this embodiment can also apply the composite film described in Embodiment 2, and its structure belongs to what can be predicted by those skilled in the art through the present invention, and will not be elaborated here.
[0043] The above are only the preferred embodiments of the present utility model, and do not impose any form of limitation on the present utility model. Although the present utility model is disclosed above in the preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art, without departing from the scope of the technical solution of the present utility model, when making some changes or modifications using the above-disclosed technical content into equivalent embodiments of equivalent changes, but as long as it does not depart from the content of the technical solution of the present utility model, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the present utility model all fall within the scope of the technical solution of the present utility model.
Claims
1. A composite film, characterized in that: It includes a protective layer, an outer texture layer, a varnish layer, a plating layer, an inner texture layer and a pattern structure. The plating layer is disposed at one end of the inner texture layer away from the pattern structure. The varnish layer is disposed at one end of the plating layer away from the inner texture layer. The varnish layer is used to increase the adhesion between the outer texture layer and the plating layer. The outer texture layer is disposed between the varnish layer and the protective layer; The pattern structure is used to connect to an external substrate and is fixed to the substrate by hot pressing.
2. The composite film according to claim 1, wherein: The varnish layer is disposed on the outer texture layer by screen printing process, and the thickness of the varnish layer is 2 - 5μm.
3. The composite film according to claim 1, characterized in that: The plating layer is prepared by an optical plating or magnetron plating process, and the thickness of the plating layer is 30 - 300nm.
4. The composite film according to claim 1, characterized in that: The pattern structure includes a LOGO layer and an ink layer. The LOGO layer is disposed between one end of the inner texture layer away from the plating layer and the ink layer.
5. The composite film according to claim 4, characterized in that: The number of the ink layers is at least two, and at least two ink layers are stacked in sequence. The thickness of a single ink layer is 5 - 8μm.
6. The composite film according to claim 1, wherein: The protective layer is provided with a release layer, and the release layer is connected to the outer texture layer.
7. The composite film according to claim 1, wherein: The outer texture layer is disposed on the protective layer by pad printing process, and the thickness of the outer texture layer is 6 - 12μm.
8. The composite film according to claim 1, characterized in that: The inner texture layer is disposed on the plating layer by pad printing process, and the thickness of the inner texture layer is 6 - 12μm.
9. An electronic device accessory, characterized in that: It includes a glass fiber substrate and the composite film according to any one of claims 1 - 8. The glass fiber substrate and the composite film are fixed by hot pressing process.
10. The electronic device accessory according to claim 9, wherein: The glass fiber substrate is a prepreg glass fiber or a thermoplastic glass fiber.