Device for cleaning micropores of spinneret plate by using laser

By laser cleaning of the spinneret micropore device, the laser module and distance adjustment module are used to adjust the focal length, combined with air blowing and vacuuming devices, the problems of spinneret micropore blockage and chemical cleaning contamination are solved, and efficient and environmentally friendly cleaning effects are achieved.

CN223163532UActive Publication Date: 2025-07-29HANGZHOU RUIGUAN TECH
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Patent Information

Application Number
CN202421850297.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-01
Publication Date
2025-07-29
Estimated Expiration
2034-08-01

AI Technical Summary

Technical Problem

In the prior art, the micropores of spinnerets are easily blocked by mechanical impurities, chemical cleaning methods are inconvenient and pollute the environment, and the focal length is not easy to adjust during laser cleaning and affect the cleaning effect.

Method used

The device that uses laser to clean the micropores of the spinneret, including a laser module and a distance adjustment module, ensures that the laser focal length meets the requirements, and is equipped with side air blowing and vacuuming devices to remove smoke and dust and ash.

Benefits of technology

It realizes efficient cleaning of spinneret micropores, avoids contamination from chemical cleaning, and ensures the effect of laser cleaning and the cleaning of the equipment environment.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a device for cleaning micropores of a spinneret plate by using laser. The device comprises a laser cleaning mechanism and a laser cleaning working platform, the laser cleaning working platform is provided with a spinneret plate placing area used for placing a spinneret plate, and the laser cleaning mechanism comprises a laser module used for emitting laser to clean the spinneret plate; and the distance adjusting module is used for adjusting the distance between the laser module and the spinneret plate on the spinneret plate placing area so as to adjust the focal length required by laser cleaning of the laser module. The spinneret plate is placed on the fixed working face to be cleaned, it is guaranteed that the working focal length is required to be within the set range during laser cleaning, and it is avoided that when the floating spinneret plate is cleaned, the laser cleaning performance is reduced due to the influence of the laser focal length.
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Description

Technical Field

[0001] The utility model relates to the technical field of the chemical fiber industry, and particularly relates to a device for cleaning micropores of a spinneret by using laser. Background Art

[0002] A spinneret is an indispensable precision part in a spinning machine in the chemical fiber industry. In the high-speed spinning production process of polyester filaments, mechanical impurities, gels, carbonization, heat and other microparticles existing in the melt often block the micropores of the spinneret, resulting in uneven fineness of the spun filaments and defects such as "stub yarn", "thin yarn", "fuzz yarn", etc. Therefore, the spinneret and its micropores need to be cleaned regularly.

[0003] At present, the cleaning of spinnerets generally uses chemical reagents for cleaning, and the process is as follows: calcination (or salt bath, triethylene glycol, etc.) - or alkali boiling (or triethylene glycol boiling) - ultrasonic cleaning - microscopy. Using chemical reagents for cleaning is relatively inconvenient in operation and consumes a large amount of chemical reagents. It is not only easy to corrode the micropores of the spinneret, but also generates a large amount of pollutants, causing environmental pollution. In the prior art, there are also some ways to clean spinnerets by using laser, but usually the spinneret is clamped and suspended in the air for cleaning both the front and back sides. This method ensures work efficiency, but there are spinnerets of different thicknesses and sizes. The position of the suspended spinneret is fixed relative to the laser module, which may affect the distance between the laser module and the spinneret, making the focal length required by the laser module not meet the requirements of laser cleaning, and thus affecting the laser cleaning effect. Summary of the Invention

[0004] The purpose of the utility model is to overcome the defects of the prior art and provide a device for cleaning micropores of a spinneret by using laser, which adopts the laser cleaning method and can adjust the laser focal length.

[0005] To achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A device for cleaning micropores of a spinneret by using laser, comprising a laser cleaning mechanism and a laser cleaning working platform; a spinneret placement area for placing the spinneret is provided on the laser cleaning working platform, and the laser cleaning mechanism includes:

[0007] A laser module for emitting laser to clean the spinneret;

[0008] A distance adjustment module for adjusting the distance between the laser module and the spinneret on the spinneret placement area to adjust the focal length required for laser cleaning by the laser module.

[0009] In the present utility model, a spinneret is cleaned by means of laser cleaning. When performing laser cleaning, the spinneret is placed in the spinneret placement area, and the distance between the laser module and the spinneret placement area is adjusted by a distance adjustment module. Thus, the focal length required for laser cleaning can be adjusted according to the thickness of the spinneret, ensuring that the distance between the laser emission surface and the cleaning surface meets the requirements.

[0010] In the present utility model, the distance adjustment module can adopt various existing drive structure forms.

[0011] Preferably, the spinneret placement area is provided with through holes arranged in an array.

[0012] During laser cleaning operation, soot and ash will be generated on the surface of the spinneret, which are likely to adhere to the surface of the spinneret and block the micropores of the spinneret. The soot will also pose a hazard to the health of the operator inside the equipment. Preferably, a side blowing device for blowing air towards the spinneret is provided on the side of the laser cleaning working platform.

[0013] In the present utility model, the side blowing device can include a nozzle and a valve block. The side blowing device can be provided in two and arranged diagonally. High-pressure air passes through the nozzle and the valve block to blow high-pressure air onto the surface and micropores of the spinneret to remove impurities such as soot and ash on the surface and inside the spinneret.

[0014] Preferably, a dust suction device is provided on the laser cleaning working platform.

[0015] Preferably, the dust suction device includes a bottom dust suction device provided at the bottom of the laser cleaning working platform and a side dust suction device provided on the side of the laser cleaning working platform.

[0016] In the present utility model, the ash or blockage in the micropores of the spinneret can be absorbed by the bottom dust suction device through the through holes, and the soot, floating ash, and burned substances on the surface of the spinneret can be blown into the side dust suction device by the side blowing device. The bottom dust suction device and the side dust suction device can ensure that the equipment and the indoor environment are clean and tidy during the spinneret cleaning operation.

[0017] Preferably, a dust-proof cover is provided on the laser cleaning working platform. In the present utility model, the dust-proof cover can prevent impurities such as soot and floating ash from spreading into the equipment and the external environment.

[0018] Preferably, it further includes:

[0019] A clamping and flipping mechanism for clamping the spinneret and capable of flipping the spinneret;

[0020] A moving platform for driving the clamping and flipping mechanism to move so as to transport the spinneret clamped by the clamping and flipping mechanism to the spinneret placement area.

[0021] In the present utility model, the clamping and flipping mechanism is installed on the mobile platform. The mobile platform can be a two-axis mobile platform, and the two-axis mobile platform uses 2 motor modules to achieve horizontal movement and vertical lifting. The clamping and flipping mechanism consists of a pneumatic gripper and a hollow rotary motor, which realizes the clamping and flipping of the spinneret workpiece.

[0022] The two-axis mobile platform drives the clamping and flipping mechanism to clamp the spinneret workpiece, realizing the movement and handling of the spinneret from the conveying channel to the laser cleaning working platform.

[0023] Preferably, the laser cleaning working platform is further provided with a movable blowing device, and the movable blowing device can move relative to the clamping and flipping mechanism so that the blowing air flow direction corresponds to the micropores of the spinneret.

[0024] Preferably, it further includes:

[0025] A conveyor for conveying the spinneret to the cleaning station and conveying the spinneret after laser cleaning to the next process.

[0026] Preferably, it further includes a stop mechanism for blocking the spinneret on the conveyor to keep it at the cleaning station.

[0027] In the present utility model, the conveyor can adopt a double-row synchronous belt conveyor. When the spinneret workpiece enters the conveyor belt and the sensor senses that the spinneret reaches the position, the stop mechanism is activated to prevent the spinneret workpiece from stopping moving and the conveyor stops working. The stop mechanism of the present utility model can include a stop rod and a driving structure for driving the stop rod to extend and retract. For example, when the stop rod extends, it blocks the spinneret, and when it retracts, the spinneret can continue to be conveyed.

[0028] When the present utility model performs laser cleaning, the specific operations include:

[0029] The clamping and flipping mechanism drives the clamping of the spinneret workpiece under the drive of the mobile platform (which can adopt the two-axis mobile platform mode), transfers the spinneret workpiece to the spinneret placement area of the laser cleaning workbench, and the laser module performs laser cleaning on the spinneret workpiece. The air nozzles of the side blowing device on the laser cleaning workbench blow air on the spinneret for dust removal, and the bottom dust suction device and the side dust suction device adsorb the generated ashes, soot and the attached substances burned by the laser.

[0030] After the above-mentioned one-time laser cleaning, the clamping and flipping mechanism clamps the spinneret workpiece, lifts it to a certain height, flips the spinneret workpiece by 90 degrees, the movable blowing device on the laser cleaning workbench blows air vertically on the spinneret and its micropores, and the dust suction device on the laser cleaning fixed platform adsorbs the generated ashes and the attached substances burned by the laser.

[0031] The clamping and flipping mechanism flips the spinneret plate back to 180 degrees again. The moving platform places the spinneret plate back on the laser cleaning workbench. The laser module conducts laser cleaning on the spinneret plate workpiece again. The side air blowing device on the laser cleaning workbench blows air on the spinneret plate to remove dust. The side dust suction device and the bottom dust suction device adsorb the generated ashes, soot, and the attached substances burned by the laser.

[0032] The clamping and flipping mechanism flips the spinneret plate to 270 degrees again. The movable air blowing device on the laser cleaning workbench blows air vertically on the spinneret plate and its micropores. The dust suction device on the laser cleaning workbench adsorbs the generated ashes and the attached substances burned by the laser.

[0033] The clamping and flipping mechanism resets the spinneret plate to the 0-degree plane. The moving platform drives the clamping and flipping mechanism to place the spinneret plate workpiece back on the conveyor. The conveyor operates to transport the spinneret plate to the next process.

[0034] The beneficial effects of the present utility model compared with the prior art are:

[0035] In the present utility model, the spinneret plate is placed on a fixed working surface for cleaning, ensuring that the working focal length during laser cleaning is within the set range, and avoiding the reduction of laser cleaning performance caused by the influence of the laser focal length when cleaning the floating spinneret plate.

[0036] The following further describes the present utility model in conjunction with the attached drawings and specific embodiments. Description of the Drawings

[0037] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the attached drawings required for the description of the embodiments will be briefly introduced below. Obviously, the attached drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other attached drawings can also be obtained based on these attached drawings.

[0038] Figure 1 It is a schematic diagram of the internal structure of a device for laser cleaning of the micropores of a spinneret plate in this embodiment.

[0039] Figure 2 It is a schematic diagram of the structure of a device for laser cleaning of the micropores of a spinneret plate in this embodiment.

[0040] Figure 3 It is a schematic diagram of the structure of the conveyor in this embodiment.

[0041] Figure 4 It is a schematic diagram of the structure when the spinneret plate is cleaned to the 0-degree plane in this embodiment.

[0042] Figure 5 It is a schematic diagram of the structure when the spinneret plate is cleaned to the 90-degree plane in this embodiment.

[0043] Figure 6 This is a schematic structural diagram of the flipping and clamping mechanism and the moving platform in this embodiment.

[0044] Figure 7 This is a schematic structural diagram of the laser cleaning work platform in this embodiment.

[0045] Figure 8 This is a schematic structural diagram of the laser cleaning work platform in this embodiment.

[0046] 1. Laser cleaning mechanism; 11. Laser module; 12. Distance adjustment module;

[0047] 211. Through hole; 22. Dust-proof cover; 23. Side dust suction device; 24. Bottom dust suction device; 25. Side air blowing device;

[0048] 3. Conveyor;

[0049] 4. Flipping and clamping mechanism;

[0050] 5. Moving platform;

[0051] 6. Spinneret plate;

[0052] 7. Stopping mechanism. Specific implementation manners

[0053] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0054] As Figure 1 and Figure 2 shown, this embodiment is a device for cleaning the micro-holes of a spinneret plate using laser cleaning, including a laser cleaning mechanism 1 and a laser cleaning work platform; a spinneret plate placement area for placing the spinneret plate is provided on the laser cleaning work platform, and the laser cleaning mechanism 1 includes:

[0055] A laser module 11 for emitting laser to clean the spinneret plate;

[0056] A distance adjustment module 12 for adjusting the distance between the laser module and the spinneret plate on the spinneret plate placement area to adjust the focal length required for laser cleaning by the laser module.

[0057] In this embodiment, the spinneret is cleaned by laser cleaning. During laser cleaning, the spinneret is placed in the spinneret placement area, and the distance between the laser module and the spinneret placement area is adjusted by the distance adjustment module. Thus, the focal length required for laser cleaning can be adjusted according to the thickness of the spinneret, ensuring that the distance between the laser emission surface and the cleaning surface meets the requirements.

[0058] In this embodiment, the distance adjustment module can adopt various existing drive structure forms.

[0059] Such as Figure 7 and Figure 8 shown, in one embodiment, the spinneret placement area 11 is provided with through holes 211 arranged in an array.

[0060] During laser cleaning operation, soot and ash will be generated on the surface of the spinneret, which are likely to adhere to the surface of the spinneret and block the micropores of the spinneret. The soot will also endanger the health of the operator inside the equipment. In one embodiment, a side blowing device 25 for blowing air towards the spinneret is provided on the side of the laser cleaning working platform.

[0061] In this embodiment, the side blowing device may include a nozzle and a valve block. The side blowing device can be set to two and arranged diagonally. High-pressure air passes through the nozzle and the valve block to blow high-pressure air on the surface and micropores of the spinneret to remove impurities such as soot and ash on the surface and inside the spinneret.

[0062] In one embodiment, a dust suction device is provided on the laser cleaning working platform.

[0063] In one embodiment, the dust suction device includes a bottom dust suction device 24 provided at the bottom of the laser cleaning working platform and a side dust suction device 23 provided on the side of the laser cleaning working platform.

[0064] In this embodiment, the ash or blockage in the micropores of the spinneret can be absorbed by the bottom dust suction device through the through holes. The soot, floating ash, and burnt substances on the surface of the spinneret can be blown into the side dust suction device by the side blowing device. The bottom dust suction device and the side dust suction device can ensure that the equipment and the indoor environment are clean and tidy during the spinneret cleaning operation.

[0065] In one embodiment, a dust-proof cover is provided on the laser cleaning working platform. In this embodiment, the dust-proof cover can prevent impurities such as soot and floating ash from spreading into the equipment and the external environment.

[0066] In one embodiment, such as Figure 6 shown, it further includes:

[0067] A clamping and flipping mechanism 4 for clamping the spinneret and capable of flipping the spinneret;

[0068] The mobile platform 5 drives the clamping and flipping mechanism to move, so as to transport the spinneret clamped by the clamping and flipping mechanism to the spinneret placement area.

[0069] In this embodiment, the clamping and flipping mechanism is mounted on a mobile platform. The mobile platform can be a two-axis mobile platform that uses two motor modules to achieve horizontal movement and vertical lifting. The clamping and flipping mechanism consists of a pneumatic gripper and a hollow rotary motor to achieve the clamping and flipping of the spinneret workpiece.

[0070] The two-axis moving platform drives the clamping and flipping mechanism to clamp the spinneret workpiece, so that the spinneret can be moved from the conveyor path to the laser cleaning work platform.

[0071] In one embodiment, the laser cleaning work platform is further provided with a movable air blowing device, and the movable air blowing device can be moved relative to the clamping and flipping mechanism so that the air flow direction of the air blow corresponds to the micropores of the spinneret.

[0072] In one embodiment, if Figure 3 As shown, it also includes:

[0073] The conveyor 3 is used to convey the spinneret to the cleaning station and convey the spinneret after laser cleaning to the next process.

[0074] In one embodiment, a stopping mechanism 7 is further included to prevent the spinneret on the conveyor from being kept at the cleaning station.

[0075] In this embodiment, the conveyor can be a double-row synchronous belt conveyor. The spinneret workpiece enters the conveyor belt. When the sensor senses that the spinneret has reached its position, a stop mechanism is activated to prevent the spinneret workpiece from moving, thereby stopping the conveyor. The stop mechanism in this embodiment may include a stop rod and a drive structure for extending and retracting the stop rod. For example, when the stop rod is extended, it blocks the spinneret. When it is retracted, the spinneret can continue to be conveyed.

[0076] In this embodiment, the laser cleaning is performed, and the specific operations include:

[0077] Driven by a moving platform (a two-axis moving platform can be used), the clamping and flipping mechanism clamps the spinneret workpiece and transfers the spinneret workpiece to the spinneret placement area of the laser cleaning workbench. The laser module laser cleans the spinneret workpiece. The side air blowing device on the laser cleaning workbench blows air to remove dust from the spinneret. The bottom dust suction device and the side dust suction device absorb the generated ash, smoke and attachments caused by laser combustion.

[0078] After the above-mentioned primary laser cleaning, the clamping and flipping mechanism clamps the spinneret workpiece, raises it to a certain height, flips the spinneret workpiece by 90 degrees, and the movable air blowing device on the laser cleaning workbench blows air vertically onto the spinneret and its micropores. The dust suction device on the laser cleaning fixed platform adsorbs the generated ashes and the attached substances burned by the laser.

[0079] The clamping and flipping mechanism flips the spinneret to 180 degrees again. The moving platform places the spinneret back on the laser cleaning workbench, and the laser module performs laser cleaning on the spinneret workpiece again. The side air blowing device on the laser cleaning workbench blows air on the spinneret to remove dust, and the side dust suction device and the bottom dust suction device adsorb the generated ashes, soot, and the attached substances burned by the laser.

[0080] The clamping and flipping mechanism flips the spinneret to 270 degrees again. The movable air blowing device on the laser cleaning workbench blows air vertically onto the spinneret and its micropores. The dust suction device on the laser cleaning workbench adsorbs the generated ashes and the attached substances burned by the laser.

[0081] The clamping and flipping mechanism resets the spinneret to the 0-degree plane. The moving platform drives the clamping and flipping mechanism to place the spinneret workpiece back on the conveyor, and the conveyor operates to transport the spinneret to the next process.

[0082] As mentioned above, this is only the specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art in the technical field disclosed by the present invention can easily think of various equivalent modifications or substitutions within the technical scope disclosed by the present invention, and these modifications or substitutions should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An apparatus for cleaning the micropores of a spinneret using laser, characterized in that, It includes a laser cleaning mechanism and a laser cleaning work platform; on the laser cleaning work platform, there is a spinneret placement area for placing the spinneret, and the laser cleaning mechanism includes: A laser module for emitting laser to clean the spinneret; A distance adjustment module for adjusting the distance between the laser module and the spinneret on the spinneret placement area to adjust the focal length required for laser cleaning by the laser module.

2. The device for cleaning the micropores of a spinneret by laser according to claim 1, wherein, The spinneret placement area is provided with through holes arranged in an array.

3. The device for cleaning the micro-holes of a spinneret by using laser according to claim 2, wherein, On the side of the laser cleaning work platform, there is a side air blowing device for blowing air towards the spinneret.

4. The device for cleaning the micropores of a spinneret by laser according to claim 2, wherein, A dust suction device is provided on the laser cleaning work platform.

5. The device for cleaning the micropores of a spinneret by laser according to claim 4, wherein, The dust suction device includes a bottom dust suction device arranged at the bottom of the laser cleaning work platform and a side dust suction device arranged on the side of the laser cleaning work platform.

6. The device for cleaning the micropores of a spinneret by laser according to any one of claims 1 to 5, characterized in that A dust-proof cover is provided on the laser cleaning work platform.

7. The device for cleaning the micropores of a spinneret by laser according to claim 6, wherein, It further includes: A clamping and flipping mechanism for clamping the spinneret and capable of flipping the spinneret; A moving platform for driving the clamping and flipping mechanism to move so as to transport the spinneret clamped by the clamping and flipping mechanism to the spinneret placement area.

8. The device for cleaning the micropores of a spinneret by laser according to claim 7, characterized in that, The laser cleaning work platform is further provided with a movable air blowing device which can move relative to the clamping and flipping mechanism so that the air flow direction of the blowing air corresponds to the micropores of the spinneret.

9. The device for cleaning the micropores of a spinneret by laser according to claim 7, characterized in that, It further includes: A conveyor for transporting the spinneret to the cleaning station and transporting the spinneret after laser cleaning to the next process.

10. The device for using laser to clean the micropores of a spinneret according to claim 9, characterized in that, It further includes a stop mechanism for blocking the spinneret on the conveyor to keep it at the cleaning station.