Water purifier

Abstract

The utility model relates to a water purifier. The water purifier comprises a semiconductor refrigerator, a heat conduction assembly and a heat storage piece. The semiconductor refrigerator is arranged in the water purifier, and the semiconductor refrigerator is provided with a refrigerating surface and a heating surface; the heat conduction assembly is arranged in the water purifier, the heat conduction assembly is arranged on the heating surface, and the heat conduction assembly is used for conducting heat of the heating surface; the heat storage part is arranged in the water purifier, the heat storage part is attached to the heat conduction assembly, and the heat storage part is used for storing heat conducted by the heat conduction assembly. The water purifier can reduce energy consumption.

Description

Technical Field

[0001] The utility model relates to the field of water purifiers, and particularly relates to a water purifier. Background Art

[0002] A water purifier filters water supplied from a water source through physical and chemical methods to remove impurities, and then supplies purified water. In terms of refrigerating and heating drinking water, a large amount of heat is generated during semiconductor refrigeration on the current market. Similarly, a large amount of cold is generated during semiconductor refrigeration. Currently, electric heaters are arranged in water purifiers to heat drinking water to generate hot water, and hot water or cold water operates independently in most cases, resulting in large energy losses. Content of the Utility Model

[0003] In view of this, the utility model provides a water purifier, which can reduce energy consumption.

[0004] The utility model provides the following technical solution: a water purifier, comprising:

[0005] A semiconductor refrigerator, which is arranged in the water purifier and has a refrigerating surface and a heating surface;

[0006] A heat conduction component, which is arranged in the water purifier, is arranged on the heating surface, and is used for conducting the heat of the heating surface;

[0007] A heat storage member, which is arranged in the water purifier, is attached to the heat conduction component, and is used for storing the heat conducted by the heat conduction component.

[0008] Further, the water purifier comprises: a housing and an installation structure;

[0009] The installation structure is arranged in the housing, and the semiconductor refrigerator is arranged on the installation structure.

[0010] Further, the heat conduction component comprises: a heat collecting member, a heat transfer member, and a heat releasing structure;

[0011] The heat collecting member is connected to the heat transfer member, the heat transfer member is connected to the heat releasing structure, and the heat transfer member is used for transferring the heat of the heat collecting member to the heat releasing structure through the heat transfer member.

[0012] Further, the heat conduction component comprises: a heat pipe, a heat transfer member, and a heat conducting sheet;

[0013] The heat pipe is connected to the heat transfer member, the heat transfer member is connected to the heat conducting fin, a heat conducting medium is provided in the heat transfer member, the heat conducting medium is a fluid, and the heat conducting medium is used to conduct the heat of the heat pipe to the heat conducting fin.

[0014] Further, the heat conducting assembly includes: heat dissipation fins, a heat conducting pipe, and a heat conducting fin;

[0015] The heat conducting fin is disposed on one side of the heat dissipation fins, the heat conducting pipe has a first heat conducting portion and a second heat conducting portion, the first heat conducting portion is spaced apart and disposed in the heat dissipation fins, and the second heat conducting portion is connected to the heat conducting fin;

[0016] A heat conducting medium is provided in the heat conducting pipe, and the heat conducting medium is used to conduct the heat of the first heat conducting portion to the second heat conducting portion.

[0017] Further, a plurality of recessed portions are provided on a side of the heat conducting fin away from the heat dissipation fins, the heat conducting pipe is disposed in the recessed portions, and a side of the heat conducting pipe away from the heat dissipation fins is set to a plane flush with the heat conducting fin.

[0018] Further, the heat dissipation fins include a plurality of heat dissipation sheets, the plurality of heat dissipation sheets are spaced apart, and a flow channel is formed between two adjacent heat dissipation sheets.

[0019] Further, the heat dissipation fins have a first protruding portion, a second protruding portion, and a main body portion.

[0020] The first protruding portion and the second protruding portion both protrude from the main body portion, and the first protruding portion and the second protruding portion are located on both sides of the main body portion; wherein, the first protruding portion and the second protruding portion both abut against the mounting structure, a first groove is provided on a side of the main body portion close to the heating surface, a second groove is provided on a side of the main body portion away from the heating surface, the radiator is disposed in the first groove, the heat conducting fin is disposed in the second groove, and the heat storage member is disposed on the second heat conducting fin.

[0021] Further, the heat conducting fin includes a first connecting portion, a second connecting portion, a third connecting portion, and a fourth connecting portion;

[0022] The first connecting portion, the second connecting portion, the third connecting portion, and the fourth connecting portion all protrude from the heat dissipation fins, and the first connecting portion, the second connecting portion, the third connecting portion, and the fourth connecting portion are used to connect to the mounting structure.

[0023] Further, a first pipeline and a second pipeline are provided in the housing, the first pipeline is in contact with the cooling surface, and the second pipeline is in contact with the heat storage member.

[0024] Further, it further includes a heater;

[0025] The heater is arranged at the water outlet end of the second pipeline, and the heater is used for reheating the water flow in the second pipeline.

[0026] The heating surface of the semiconductor refrigerator in the above water purifier is connected to the heat conduction component, and the heat conduction component is connected to the heat storage component. In this way, when the cooling surface of the semiconductor refrigerator is used for refrigeration, the heat generated by its heating surface can be utilized, thereby reducing energy loss; specifically, when the cooling surface of the semiconductor refrigerator is working, heat is generated on its back surface, and the heat generated on the back surface is transferred to the heat storage component through the heat conduction component, enabling the heat storage component to absorb and store the heat on the heat conduction component. When heat is needed, the heat storage component releases the stored heat to heat the cold water so that the cold water can be heated up, thereby reducing the power consumption. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 It is a schematic structural diagram of the semiconductor refrigerator provided by the embodiment of the present invention;

[0029] Figure 2 It is one of the partial structural diagrams of the water purifier provided by the embodiment of the present invention;

[0030] Figure 3 It is one of the schematic structural diagrams of the heat conduction component provided by the embodiment of the present invention;

[0031] Figure 4 It is the second schematic structural diagram of the heat conduction component provided by the embodiment of the present invention;

[0032] Figure 5 It is a cross-sectional view of the heat conduction component provided by the embodiment of the present invention;

[0033] Figure 6 It is an exploded view of the heat conduction component provided by the embodiment of the present invention;

[0034] Figure 7 It is a schematic structural diagram of the water purifier provided by the embodiment of the present invention.

[0035] Description of the reference numerals:

[0036] 100 - Water purifier; 10 - Thermoelectric cooler; 20 - Heat conduction component; 21 - Heat dissipation fins; 211 - Heat sink; 212 - First protrusion; 213 - Second protrusion; 214 - Main body; 215 - First groove; 216 - Second groove; 22 - Heat conduction tube; 221 - First heat conduction part; 222 - Second heat conduction part; 23 - Heat conduction sheet; 231 - Concave part; 232 - First connection part; 233 - Second connection part; 234 - Third connection part; 235 - Fourth connection part; 30 - Heat storage part; 40 - Housing; 41 - Mounting structure; 42 - First cavity; 43 - Second cavity; 50 - Radiator; 60 - First pipeline; 70 - Second pipeline; 80 - Heater. Detailed implementation manner

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0038] The following disclosure provides many different implementation manners or examples for implementing different structures of the present utility model. To simplify the disclosure of the present utility model, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present utility model. In addition, the present utility model may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various implementation manners and / or settings discussed. In addition, the present utility model provides examples of various specific processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0039] The terms "first", "second", etc. in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally further includes steps or units not listed, or optionally further includes other steps or units inherent to these processes, methods, products or devices.

[0040] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0041] In the present utility model, unless otherwise clearly specified and defined, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may also include the first and second features not being in direct contact but being in contact through additional features therebetween. Moreover, the first feature being "above", "over" and "on top of" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "below", "beneath" and "underneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0042] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and defined, the terms "installation", "connection" and "coupling" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection. It may be a mechanical connection or an electrical connection. It may be directly connected, or indirectly connected through an intermediate medium. It may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0043] A water purifier filters the water supplied from a water source through physical and chemical methods to remove impurities and then supplies purified water. In terms of refrigerating and heating drinking water, a large amount of heat is generated during semiconductor refrigeration in the current market. Similarly, a relatively large amount of heat is also generated during semiconductor refrigeration. In most cases, the cold water output of the water purifier operates independently, and the heat generated by the semiconductor refrigerator generally cannot be utilized either. In this way, the heat at the hot end is wasted, resulting in energy loss. And when the water is discharged for a long time, the heat dissipation of the water inlet device also needs to be considered. When the temperature of the water purifier is too high, it will also affect the normal use of the water purifier.

[0044] In view of this, the present embodiment provides a water purifier 100. The water purifier 100 can reduce energy consumption.

[0045] Please refer to Figure 1, a water purifier 100, comprising:

[0046] A semiconductor refrigerator 10, the semiconductor refrigerator 10 is disposed in the water purifier 100, and the semiconductor refrigerator 10 has a cooling surface and a heating surface;

[0047] A heat conduction component 20, the heat conduction component 20 is disposed in the water purifier 100, the heat conduction component 20 is disposed on the heating surface, and the heat conduction component 20 is used for conducting the heat of the heating surface;

[0048] A heat storage member 30, the heat storage member 30 is disposed in the water purifier 100, the heat storage member 30 is attached to the heat conduction component 20, and the heat storage member 30 is used for storing the heat conducted by the heat conduction component 20.

[0049] The heating surface of the semiconductor refrigerator 10 in the water purifier 100 is connected to the heat conduction component 20, and the heat conduction component 20 is connected to the heat storage member 30. In this way, when the cooling surface of the semiconductor refrigerator 10 is used for refrigeration, the heat generated by its heating surface can be utilized, thereby reducing energy loss; specifically, when the cooling surface of the semiconductor refrigerator 10 is working, heat is generated on its back surface (heating surface), and the heat generated on the back surface is transferred to the heat storage member 30 through the heat conduction component 20, so that the heat storage member 30 can absorb the heat on the heat conduction component 20 for storage. When heat is needed, the heat storage member 30 releases the heat it stores to heat the water flow to raise the temperature of the water flow, so as to reduce the power consumption.

[0050] It can be understood that the above-mentioned semiconductor refrigerator 10, heat conduction component 20, and heat storage member 30 are all disposed in the water purifier 100. When cold water needs to flow out of the water purifier 100, the semiconductor refrigerator 10 starts to work, and the energy generated by its cooling surface exchanges heat with the water flow, turning the normal temperature water into cold water and discharging it from the water purifier 100 for users to use; the heat generated by its heating surface is transferred to the heat storage member 30 through the heat conduction component 20, so that the heat storage member 30 can store the heat generated by the semiconductor refrigerator 10. When hot water needs to be generated by the water purifier 100, the heat storage member 30 releases the heat stored in the heat storage member 30 to preheat the normal temperature water to reduce the temperature required for the heater 80 to heat the water flow, so as to reduce the power consumption; and during the long-term operation of the semiconductor refrigerator 10, the heat conduction component 20 and the heat storage member 30 can also play a role in cooling the semiconductor refrigerator 10, enabling the semiconductor refrigerator 10 to operate stably during a long-term refrigeration process.

[0051] The above-mentioned heat conduction component 20 can exchange heat through convection, heat conduction and other methods.

[0052] Please refer to Figure 2, in some embodiments, the water purifier 100 includes: a housing 40 and a mounting structure 41;

[0053] The mounting structure 41 is disposed within the housing 40, the semiconductor cooler 10 is disposed on the mounting structure 41, and a heat insulation layer is disposed within the housing 40.

[0054] It can be understood that by providing a mounting structure 41 within the housing 40 for fixing the semiconductor cooler 10, the mounting structure 41 is fixedly disposed within the housing 40. The mounting structure 41 can be a mounting structure 41 smaller than the cross-section of the housing 40, and its area only needs to be sufficient to mount the semiconductor cooler 10. To reduce heat loss within the housing 40, a heat insulation layer is provided on the outer periphery of the housing 40. The heat insulation layer can be provided on the inner sidewall of the housing 40, or on the outer sidewall of the housing 40, or on both the inner and outer sidewalls simultaneously to achieve a better heat insulation effect.

[0055] The above-mentioned mounting structure 41 can be any component capable of fixing the semiconductor cooler 10.

[0056] In some other embodiments, the mounting structure 41 can be a baffle. By providing a baffle within the housing 40, the housing 40 is divided into a first cavity 42 and a second cavity 43, and the cooling surface is disposed in the first cavity 42, and the heating surface is disposed in the second cavity 43 to separate cooling and heating, so as to avoid the heat generated by the heating surface from convecting with the cold generated by the cooling surface, thereby reducing the efficiency of the cooling surface when heating cold water. Similarly, a heat insulation layer is provided on the outer periphery of the housing 40. The heat insulation layer can be provided on the inner sidewall of the housing 40, or on the outer sidewall of the housing 40, or on both the inner and outer sidewalls simultaneously to achieve a better heat insulation effect.

[0057] Optionally, the above-mentioned heat insulation layer can be one of other heat insulation materials such as a vacuum insulation panel, an aerogel thermal insulation material, a foamed polyurethane, a rock wool board, a glass wool board, a graphite polystyrene board, a phenolic board, a vacuum layer, etc.

[0058] In some embodiments, the heat conduction assembly 20 includes: a heat collection member, a heat transfer member, and a heat dissipation structure;

[0059] The heat collection member is connected to the heat transfer member, the heat transfer member is connected to the heat dissipation structure, and the heat transfer member is used to transfer the heat of the heat collection member to the heat dissipation structure through the heat transfer member.

[0060] It can be understood that the above heat collector is connected to the heating surface of the semiconductor refrigerator 10, the heat transfer member is connected to the heat collector, and the heat dissipation structure is connected to the heat transfer member. In this way, the heat of the heating surface of the semiconductor refrigerator collected by the heat collector can be transferred to the heat dissipation structure through the heat transfer member, and the heat can be transferred to the heat storage member through the heat dissipation structure to achieve heat storage.

[0061] In some embodiments, the heat conduction assembly 20 includes: a heat pipe, a heat transfer member, and a heat conduction fin;

[0062] The heat pipe is connected to the heat transfer member, the heat transfer member is connected to the heat conduction fin, a heat conduction medium is provided in the heat transfer member, the heat conduction medium is a fluid, and the heat conduction medium is used to conduct the heat of the heat pipe to the heat conduction fin.

[0063] It can be understood that the above heat pipe is connected to the heating surface of the semiconductor refrigerator 10, the heat pipe is connected to the heat transfer member, and the heat transfer member is connected to the heat conduction fin. In this way, the heat collected by the heat pipe can be transferred to the heat conduction fin through the heat transfer member, and the heat can be transferred to the heat storage member 30 through the heat conduction fin to achieve heat storage.

[0064] Please refer to Figures 3 to 6 , in some embodiments, the heat conduction assembly 20 includes: a heat dissipation fin 21, a heat conduction tube 22, and a heat conduction fin 23;

[0065] The heat conduction fin 23 is disposed on one side of the heat dissipation fin 21. The heat conduction tube 22 has a first heat conduction portion 221 and a second heat conduction portion 222. The first heat conduction portion 221 is disposed at intervals in the heat dissipation fin 21, and the second heat conduction portion 222 is connected to the heat conduction fin 23.

[0066] It can be understood that the heat conduction tube 22 has a first heat conduction portion 221 and a second heat conduction portion 222. Among them, the first heat conduction portion 221 is disposed in the heat dissipation fin 21 so that the heat conduction tube 22 can better receive the heat from the heat conduction fin 23, and the second heat conduction portion 222 is disposed in the heat conduction fin 23 and connected to the heat conduction fin 23 to evenly conduct the heat of the heat conduction tube 22 to the heat conduction fin 23, so that the heat storage member 30 can store heat more efficiently.

[0067] It can be understood that the heat dissipation fin 21 is disposed on one side of the semiconductor refrigerator 10 and is not in contact with the heat conductor. It mainly receives the heat from the radiator 50. When the air flow is driven by the radiator 50, it first passes through the heat dissipation fin 21 and exchanges heat with the heat dissipation fin 21. Then, the heat conduction tube 22 disposed on the heat dissipation fin 21 transfers the heat to the heat conduction fin 23 connected to the heat conduction tube 22. A heat storage member 30 is disposed on the heat conduction fin 23, and the heat storage member 30 can store the heat on the heat conduction fin 23 in the heat storage member 30 to achieve relatively efficient heat storage.

[0068] In some embodiments, a heat-conducting medium is disposed in the heat-conducting tube 22, and the heat-conducting medium is used to conduct the heat of the first heat-conducting portion 221 to the second heat-conducting portion 222.

[0069] It can be understood that a heat-conducting medium is disposed in the heat-conducting tube 22, and the heat-conducting medium can conduct the heat on the heat-radiating fins 21 to the heat-conducting sheet 23 faster, so as to improve the efficiency of heat exchange. Optionally, the heat-conducting medium may be a liquid heat-conducting medium or a phase-change heat-conducting medium.

[0070] Optionally, the liquid heat-conducting medium may be any one of water, ethylene glycol, heat-conducting oil and other heat-conducting media.

[0071] Please refer to Figure 4 and Figure 6 In some embodiments, a plurality of recesses 231 are provided on a side of the heat-conducting sheet 23 away from the heat-radiating fins 21, the heat-conducting tube 22 is disposed in the recesses 231, and a side of the heat-conducting tube 22 away from the heat-radiating fins 21 is set as a plane flush with the heat-conducting sheet 23.

[0072] It can be understood that a plurality of recesses 231 are provided on a side of the heat-conducting sheet 23 away from the heat-radiating fins 21, and the heat-conducting tubes 22 are disposed in the plurality of recesses 231. In this way, the temperature transferred from the heat-radiating fins 21 by the heat-conducting tubes 22 can be conducted to the heat-conducting sheet 23 more uniformly, and the setting of the plurality of heat-conducting tubes 22 can also increase the heat conduction amount, so as to transfer more heat generated by the semiconductor refrigerator 10 to the heat-conducting sheet 23, so that the heat storage member 30 can store more heat generated by the heating surface of the semiconductor refrigerator 10.

[0073] It can be understood that the side of the heat-conducting tube 22 away from the heat-radiating fins 21 is set as a plane flush with the heat-conducting sheet 23 in order to enable the heat storage member 30 to have a larger contact area with the heat-conducting sheet 23, and can receive more heat from the heat-conducting sheet 23 during the heat exchange process, thereby improving the heat storage efficiency of the heat storage member 30.

[0074] Please refer to Figure 5 and Figure 6 In some embodiments, the heat-radiating fins 21 include a plurality of heat-radiating fins 211, the plurality of heat-radiating fins 211 are spaced apart, and a flow channel is formed between two adjacent heat-radiating fins 211, and the flow channel is in the same direction as the direction in which the radiator 50 drives the air flow.

[0075] It can be understood that the heat dissipation fins 21 include a plurality of heat dissipation fins 211, and the heat dissipation fins 211 are arranged at intervals in their thickness direction. A flow channel through which air can pass is formed between two adjacent heat dissipation fins 211. In order to enable the heat dissipation fins 211 to better receive heat, the radiator 50 is arranged on one side of the heat dissipation fins 21, and the direction of the air flow it drives is the same as the direction of the flow channel formed between the two heat dissipation fins 211. When the radiator 50 drives the air flow, the hot air flow first passes through the heat dissipation fins 211, so that heat loss can be reduced, and as much heat as possible can be transferred to the heat dissipation fins 211, so as to increase the heat that the heat dissipation fins 21 can conduct to the heat storage member 30.

[0076] Please refer to Figure 6 , in some embodiments, the heat dissipation fins 21 have a first protrusion 212, a second protrusion 213, and a main body 214.

[0077] Both the first protrusion 212 and the second protrusion 213 protrude from the main body 214, and the first protrusion 212 and the second protrusion 213 are located on both sides of the main body 214; wherein, both the first protrusion 212 and the second protrusion 213 are in contact with the mounting structure 41, a first groove 215 is provided on one side of the main body 214 close to the heating surface, a second groove 216 is provided on the side of the main body 214 away from the heating surface, the radiator 50 is arranged in the first groove 215, the heat conducting sheet 23 is arranged in the second groove 216, and the heat storage member 30 is arranged on the second heat conducting sheet 23.

[0078] It can be understood that the heat dissipation fins 21 have a first protrusion 212, a second protrusion 213 and a main body 214. The first protrusion 212 and the second protrusion 213 are located on both sides of the main body 214. In this way, the main body 214 forms a first groove 215. The radiator 50 arranged in the first groove 215 can enable more hot air flow to exchange heat with the heat dissipation fins 21. And a second groove 216 is provided on the side of the main body 214 away from the radiator 50, and a heat conducting sheet 23 is arranged in the second groove 216, that is, the heat conducting sheet 23 and the radiator 50 are arranged oppositely. In this way, when the radiator 50 drives the air flow, the air flow first passes through the heat dissipation fins 21 and then blows onto the heat conducting sheet 23 so that the heat conducting sheet 23 can also be directly heated by the hot air flow, thereby improving the utilization efficiency of the hot air flow. Both the first protrusion 212 and the second protrusion 213 are in contact with the mounting structure 41, so as to avoid heat accumulation on the heating surface of the semiconductor cooler 10.

[0079] In other embodiments, the heat dissipation fins 21 may not be provided with the first protrusion 212 and the second protrusion 213, and may be set as a flat plane in contact with the heating surface to improve the heat exchange efficiency.

[0080] Please refer to Figure 4 Figure 4 , in some embodiments, the heat conducting sheet 23 includes a first connecting portion 232, a second connecting portion 233, a third connecting portion 234, and a fourth connecting portion 235. The first connecting portion 232, the second connecting portion 233, the third connecting portion 234, and the fourth connecting portion 235 all protrude from the heat dissipating fins 21, and the first connecting portion 232, the second connecting portion 233, the third connecting portion 234, and the fourth connecting portion 235 are used to connect with the mounting structure 41.

[0081] It can be understood that the heat conducting sheet 23 includes a first connecting portion 232, a second connecting portion 233, a third connecting portion 234, and a fourth connecting portion 235. The first connecting portion 232, the second connecting portion 233, the third connecting portion 234, and the fourth connecting portion 235 are all used to connect with the mounting structure 41. The first connecting portion 232, the second connecting portion 233, the third connecting portion 234, and the fourth connecting portion 235 are arranged at the four corners of the heat conducting sheet 23 and protrude from the heat conducting sheet 23, and are detachably connected to the mounting structure 41 by screws or bolts.

[0082] Please refer to Figure 7 Figure 7 , in some embodiments, a first pipeline 60 and a second pipeline 70 are arranged in the housing 40. The first pipeline 60 is in contact with the refrigerating surface, and the second pipeline 70 is arranged in contact with the heat storage member 30.

[0083] It can be understood that a first pipeline 60 is arranged in the housing 40. The first pipeline 60 is in contact with the refrigerating surface for heat exchange with the refrigerating end of the semiconductor refrigerator 10. A second pipeline 70 is also arranged in the housing 40. The second pipeline 70 is arranged on one side of the heat storage member 30, and the heat storage member 30 is used to heat the normal temperature water in the second pipeline 70.

[0084] In order to improve the heat exchange efficiency of the above-mentioned first pipeline 60, the semiconductor refrigerator 10 can be set to a shape matching the first pipeline 60, or heat exchange can be carried out by means of copper pipes or the like. Similarly, in order to improve the heat exchange efficiency of the second pipeline 70, heat exchange efficiency can also be improved by using copper pipes or the like.

[0085] In some other embodiments, the mounting structure 41 divides the housing 40 into a first cavity 42 and a second cavity 43. The semiconductor refrigerator 10 is arranged on the mounting structure 41, the refrigerating surface faces the first cavity 42, the heating surface faces the second cavity 43, and the heat conducting assembly 20 and the heat storage member 30 are both arranged in the second cavity 43.

[0086] It can be understood that a first pipeline 60 is provided in the first cavity 42. The first pipeline 60 is in contact with the refrigerating surface for heat exchange with the refrigerating end of the semiconductor refrigerator 10. A second pipeline 70 is provided in the second cavity 43. The second pipeline 70 is provided on one side of the heat storage member 30, and the heat storage member 30 is used to heat the normal temperature water in the second pipeline 70. In order to improve the heat exchange efficiency of the above-mentioned first pipeline 60, the semiconductor refrigerator 10 can be set to a shape matching the first pipeline 60, or heat exchange can be carried out by means of a copper pipe or the like. Similarly, in order to improve the heat exchange efficiency of the second pipeline 70, the heat exchange efficiency can also be improved by using a copper pipe or the like.

[0087] Please refer to Figure 7 , in some embodiments, it further includes a heater 80;

[0088] The heater 80 is arranged at the water outlet end of the second pipeline 70, and the heater 80 is used to heat the water flow in the second pipeline 70 for the second time.

[0089] It can be understood that in order to make the temperature of the water flowing out of the second pipeline 70, after the heat storage member 30 heats the second pipeline 70, the heater 80 heats the water flow in the second pipeline 70 for the second time to further increase the water outlet temperature of the second pipeline 70, so that the water outlet temperature of the second pipeline 70 can reach the standard of user water use; in a general water purifier 100, it is directly heated by the heater 80, while in the present invention, using the heat storage member 30 can reduce the temperature that the heater 80 needs to heat, thus reducing the power consumption.

[0090] Optionally, the above-mentioned heat storage member 30 can adopt a phase change material, which can be sodium acetate trihydrate or paraffin. Sodium acetate trihydrate or paraffin is prepared by microencapsulation technology, that is, the phase change material is encapsulated in tiny capsules.

[0091] When absorbing heat, when the ambient temperature rises to the phase change temperature of the phase change material, the phase change material in the capsule begins to absorb heat. The heat is absorbed by the phase change material, causing it to change from a solid state to a liquid state, and this process is called melting. During this process, the temperature of the phase change material in the capsule remains relatively constant because the absorbed heat is used to overcome the intermolecular forces rather than increase the temperature.

[0092] When releasing heat, when the ambient temperature drops below the phase change temperature of the phase change material, the liquid phase change material in the capsule begins to release heat. The phase change material releases heat and changes from a liquid state to a solid state, and this process is called solidification. Similarly, the temperature remains relatively constant during this process.

[0093] In this embodiment, heat exchange is carried out in a convection manner:

[0094] Please refer to Figure 2 and Figure 3, further comprising: a radiator 50;

[0095] The radiator 50 is disposed in the second cavity 43, the radiator 50 is disposed close to the heating surface, and the radiator 50 drives the air flow circulation in the second cavity 43.

[0096] It can be understood that the radiator 50 is disposed in the second cavity 43 and the radiator 50 is disposed close to the heating surface. In this way, when the heating surface of the semiconductor cooler 10 is working, the radiator 50 also works simultaneously. When the radiator 50 is working, it drives the air flow in the second cavity 43, so that the air flow in the second cavity 43 can contact the heating surface of the semiconductor cooler 10 and take away the heat of the heating surface of the semiconductor cooler 10. This not only reduces the temperature of the heating surface of the semiconductor cooler 10, but also increases the temperature of the air flow in the second cavity 43, so that the heat storage member 30 can have a higher heat storage efficiency.

[0097] Optionally, the above-mentioned radiator 50 is a fan.

[0098] In the present utility model, the mention of "embodiment" or "implementation manner" means that the specific features, structures or characteristics described in connection with the embodiment may be included in at least one embodiment of the present utility model. The appearance of the phrase at various positions in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described in the present utility model may be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in each embodiment of the present utility model may be combined arbitrarily without contradiction to form another embodiment that does not depart from the spirit and scope of the technical solution of the present utility model.

[0099] Finally, it should be noted that the above implementation manners are only used to illustrate the technical solutions of the present utility model and not to limit them. Although the present utility model has been described in detail with reference to the above preferred implementation manners, those of ordinary skill in the art should understand that the technical solutions of the present utility model can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present utility model.

Claims

1. A water purifier, characterized in that, Comprising: A semiconductor refrigerator (10), the semiconductor refrigerator (10) is disposed in the water purifier (100), and the semiconductor refrigerator (10) has a cooling surface and a heating surface; A heat conduction component (20), the heat conduction component (20) is disposed in the water purifier (100), the heat conduction component (20) is disposed on the heating surface, and the heat conduction component (20) is used for conducting the heat of the heating surface; A heat storage member (30), the heat storage member (30) is disposed in the water purifier (100), the heat storage member (30) is in contact with the heat conduction component (20), and the heat storage member (30) is used for storing the heat conducted by the heat conduction component (20).

2. The water purifier according to claim 1, wherein, The water purifier (100) includes: a housing (40) and a mounting structure (41); The mounting structure (41) is disposed in the housing (40), and the semiconductor refrigerator (10) is disposed on the mounting structure (41).

3. The water purifier according to claim 1, wherein, The heat conduction component (20) includes: a heat collecting member, a heat transfer member, and a heat releasing structure; The heat collecting member is connected to the heat transfer member, the heat transfer member is connected to the heat releasing structure, and the heat transfer member is used for transferring the heat of the heat collecting member to the heat releasing structure through the heat transfer member.

4. The water purifier according to claim 1, characterized in that, The heat conduction component (20) includes: a heat pipe, a heat transfer member, and a heat conducting sheet; The heat pipe is connected to the heat transfer member, the heat transfer member is connected to the heat conducting sheet, a heat conducting medium is disposed in the heat transfer member, the heat conducting medium is a fluid, and the heat conducting medium is used for conducting the heat of the heat pipe to the heat conducting sheet.

5. The water purifier according to claim 2, characterized in that The heat conduction component (20) includes: heat dissipation fins (21), a heat conducting pipe (22), and a heat conducting sheet (23); The heat conducting sheet (23) is disposed on one side of the heat dissipation fins (21), the heat conducting pipe (22) has a first heat conducting portion (221) and a second heat conducting portion (222), the first heat conducting portion (221) is spaced apart and disposed in the heat dissipation fins (21), and the second heat conducting portion (222) is connected to the heat conducting sheet (23).

6. The water purifier according to claim 5, wherein A plurality of recessed portions (231) are disposed on a side of the heat conducting sheet (23) away from the heat dissipation fins (21), the heat conducting pipe (22) is disposed in the recessed portions (231), and a side of the heat conducting pipe (22) away from the heat dissipation fins (21) is disposed as a plane flush with the heat conducting sheet (23).

7. The water purifier according to claim 6, characterized in that, The heat dissipation fins (21) include a plurality of heat dissipation sheets (211), the plurality of heat dissipation sheets (211) are spaced apart, and a flow channel is formed between two adjacent heat dissipation sheets (211).

8. The water purifier according to claim 6, wherein, The heat dissipation fins (21) have a first protruding portion (212), a second protruding portion (213), and a main body portion (214); The first protrusion (212) and the second protrusion (213) both protrude from the main body portion (214), and the first protrusion (212) and the second protrusion (213) are located on both sides of the main body portion (214); wherein, the first protrusion (212) and the second protrusion both abut against the mounting structure (41), a first groove (215) is provided on one side of the main body portion (214) close to the heating surface, a second groove (216) is provided on the side of the main body portion (214) away from the heating surface, the radiator (50) is arranged in the first groove (215), the heat conducting fin (23) is arranged in the second groove (216), and the heat storage member (30) is arranged on the second heat conducting fin (23).

9. The water purifier according to claim 8, wherein, The heat conducting fin (23) includes a first connecting portion (232), a second connecting portion (233), a third connecting portion (234), and a fourth connecting portion (235); The first connecting portion (232), the second connecting portion (233), the third connecting portion (234), and the fourth connecting portion (235) all protrude from the heat dissipating fins (21), and the first connecting portion (232), the second connecting portion (233), the third connecting portion (234), and the fourth connecting portion (235) are used for connecting with the mounting structure (41).

10. The water purifier according to claim 2, wherein, Further included are: A heater (80); A first pipeline (60) and a second pipeline (70) are arranged in the housing, the first pipeline (60) is in contact with the cooling surface, and the second pipeline (70) is in contact with the heat storage member (30); The heater (80) is arranged at the water outlet end of the second pipeline (70), and the heater (80) is used for reheating the water flow in the second pipeline (70).

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