Probe station dotting device capable of dotting uniformly
By introducing limit components and magnets into the probe station docking device, the ink wire movement is driven by magnetic force, the problems of uneven docking and leakage points are solved, and a more uniform and stable docking effect is achieved.
Patent Information
- Application Number
- CN202422207744.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-09-10
AI Technical Summary
The existing probe station decoder does not have enough force in the decoding, resulting in uneven ink dots and easy to miss.
A dowl handle including a limiting assembly and a magnet is designed. The magnetic force generated by the coil drives the moving rod and the ink line to move up and down. Combined with the magnetic force of the magnet, it ensures that the ink line is more powerful and more stable, and avoids leakage.
The uniformity and stability of ink dots are achieved, the leakage point phenomenon is reduced, and the uniformity of the dot is improved.
Smart Images
Figure CN223166799U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of probe tables, and specifically relates to a probe table dotting device with uniform dotting. Background Technique
[0002] There are multiple chip grains on a semiconductor wafer. The chip grains are divided into good grains and bad grains. Bad grains cannot be used for subsequent chip production. Therefore, it is necessary to test the chip grains on the wafer to distinguish good grains and bad grains. Usually, a probe table is used to test the wafer. The probe table is mainly applied to the testing of the semiconductor industry, optoelectronic industry, integrated circuits, and packaging.
[0003] The commonly used probe tables currently include a machine body, a dotting device, and a placement table for the wafer. The wafer to be tested is placed on the placement table, and the dotting device is started. The dotting device dots the bad grains on the wafer. When the wafer completes the test, the ink dots on the wafer represent that the chip grains corresponding to the ink dots are bad grains.
[0004] For the above technical conditions, there are still defects that the dotting force of the dotting device of the current probe table is insufficient, so that the ink dots punched by the dotting device on the wafer are not uniform enough, and even missed dots occur.
[0005] Based on this, the utility model designs a probe table dotting device with uniform dotting to solve the above problems. Content of the Utility Model
[0006] The purpose of the utility model is to provide a probe table dotting device with uniform dotting to solve the above technical problems.
[0007] To achieve the above purpose, the utility model provides the following technical solution: A probe table dotting device with uniform dotting, including a dotting device, the dotting device includes a base, a mounting frame, and a needle head. The mounting frame is fixedly arranged on the base. A limiting component is arranged on the mounting frame. The mounting frame is fixedly provided with a mounting block. The mounting block is fixedly provided with a coil. A moving rod is inserted into the coil. The moving rod is fixedly connected with a fixed block. The limiting component abuts against the fixed block. A magnet is arranged on the fixed block. The moving rod is sleeved with a first spring. One end of the first spring abuts against the fixed block, and the other end of the first spring abuts against the coil. The mounting frame is fixedly provided with a connecting block. The connecting block is below the mounting block. The connecting block is fixedly provided with an ink cartridge. The connecting block is fixedly connected with a needle head. The needle head is communicated with the ink cartridge. The moving rod is fixedly connected with an ink line. The ink line sequentially passes through the coil, the ink cartridge and is located in the needle head.
[0008] Preferably, the magnet is in a semi-circular shape.
[0009] Preferably, the S pole of the magnet faces the side of the fixed block, and the N pole of the magnet faces the side away from the fixed block.
[0010] Preferably, the mounting block is fixedly connected with a mounting plate, the mounting plate is integrally formed with the mounting block, the mounting plate is provided with a limiting groove, the moving rod is fixedly connected with a limiting rod, and the limiting rod is inserted into the limiting groove.
[0011] Preferably, the limiting assembly includes a limiting block and a threaded rod. The threaded rod is fixedly connected to the mounting frame. The limiting block is threadedly connected to the threaded rod. A second spring is sleeved on the threaded rod. One end of the second spring abuts against the limiting block, and the other end of the second spring abuts against the mounting frame. The limiting block abuts against the fixed block.
[0012] Preferably, the fixed block is provided with a fixing groove, and the magnet is installed in the fixing groove.
[0013] In summary, the present application has the following beneficial technical effects: When performing dotting tests on a wafer, an alternating current is passed through the coil. The coil generates an upward or downward magnetic force as the current changes. Under the action of the magnetic force, the moving rod moves up and down. The ink line moves up and down with the moving rod. During the up and down movement of the ink line, the ink in the ink pot is brought to the needle head, thereby leaving ink dots on the defective grains of the wafer. At the same time, the magnet generates a downward magnetic force acting on the moving rod. When the moving rod drives the ink line to move downward, the moving rod and the ink line are jointly affected by the two magnetic forces generated by the magnet and the coil, making the dotting force of the ink line greater and more stable, the ink dots printed on the wafer more uniform, and it is not easy to have the phenomenon of missing dots, achieving the effect of making the dotting of the dotting device on the wafer more uniform and not easy to miss dots. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0015] Figure 1 It is a front structural schematic diagram of the dotting device of this embodiment;
[0016] Figure 2 It is an overall structural schematic diagram of the dotting device of this embodiment;
[0017] Figure 3 It is a side structural schematic diagram of the dotting device of this embodiment;
[0018] Figure 4Schematic cross-sectional structure diagram of the dotting device in this embodiment.
[0019] In the attached drawings, the list of components represented by each reference numeral is as follows:
[0020] 1. Magnet; 2. Limit rod; 3. Fixed block; 4. First spring; 5. Moving rod; 6. Mounting plate; 7. Coil; 8. Mounting block; 9. Ink line; 10. Ink fountain; 11. Connecting block; 12. Needle; 13. Limit block; 14. Second spring; 15. Threaded rod; 16. Mounting frame; 17. Base; 18. Limit groove. Specific implementation mode
[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0022] The following is a further detailed description of this application Figures 1-4 in conjunction with the attached drawings.
[0023] A dotting device for a probe station with uniform dotting, including a dotting device. The dotting device is arranged on the body of the probe station. The dotting device includes a base 17, a mounting frame 16 and a needle 12. The base 17 is fixedly arranged on the body of the probe station. The mounting frame 16 is fixedly arranged on the base 17. A limit component is arranged on the mounting frame 16. A mounting block 8 is fixedly arranged on the mounting frame 16. A coil 7 is fixedly arranged on the mounting block 8. The mounting block 8 serves to fix the coil 7.
[0024] A moving rod 5 is inserted into the coil 7. A fixed block 3 is fixedly arranged at one end of the moving rod 5 away from the coil 7. The limit component abuts against the fixed block 3. A fixing groove is opened on one side of the fixed block 3 away from the coil 7. A magnet 1 is installed in the fixing groove. The fixing groove prevents the magnet 1 from falling off the fixed block 3 easily. The magnet 1 is in a semi-circular shape. The N pole of the magnet 1 faces away from the fixed block 3, and the S pole of the magnet 1 faces the fixed block 3. The magnet 1 generates a magnetic force downward 5.
[0025] A first spring 4 is sleeved on the moving rod 5. The first spring 4 is between the fixed block 3 and the coil 7. One end of the first spring 4 abuts against the fixed block 3, and the other end of the first spring 4 abuts against the coil 7. A connecting block 11 is fixedly arranged on the mounting frame 16. The connecting block 11 is below the mounting block 8. A marking gauge 10 is fixedly arranged on the connecting block 11. The connecting block 11 serves to fix the marking gauge 10. A needle 12 is fixedly arranged on the side of the connecting block 11 away from the marking gauge 10. The needle 12 communicates with the marking gauge 10. The moving rod 5 is fixedly provided with an ink line 9. The ink line 9 sequentially passes through the coil 7, the marking gauge 10 and is located in the needle 12.
[0026] An alternating current is applied to the coil 7. The coil 7 generates upward and downward magnetic forces. Under the action of the magnetic forces, the moving rod 5 moves up and down. The ink line 9 moves up and down along with the moving rod 5. During the up and down movement of the ink line 9, the ink in the marking gauge 10 is brought towards the needle 12, and the needle 12 leaves ink dots on the wafer.
[0027] A mounting plate 6 is fixedly connected to the mounting block 8. The mounting plate 6 is integrally formed with the mounting block 8. A limiting groove 18 is provided on the side of the mounting plate 6 close to the magnet 1. The moving rod 5 is fixedly connected with a limiting rod 2. The limiting rod 2 is inserted into the limiting groove 18. When the moving rod 5 moves up and down, under the limiting action of the limiting rod 2 and the limiting groove 18, the moving rod 5 is not prone to sway left and right, improving the moving stability of the moving rod 5.
[0028] The limiting component includes a limiting block 13 and a threaded rod 15. The threaded rod 15 is fixedly arranged on the mounting frame 16. The limiting block 13 is threadedly connected to the threaded rod 15. A second spring 14 is sleeved on the threaded rod 15. The second spring 14 is between the limiting block 13 and the mounting frame 16. One end of the second spring 14 abuts against the limiting block 13, and the other end of the second spring 14 abuts against the mounting frame 16. The limiting block 13 abuts against the fixed block 3. By adjusting the position of the limiting block 13 on the threaded rod 15, the moving range of the moving rod 5 can be restricted, thereby having a certain restriction on the dotting force of the ink line 9.
[0029] The implementation principle of this embodiment is as follows: When performing a dotting test on the wafer, an alternating current is applied to the coil 7. The coil 7 generates an upward or downward magnetic force as the current changes. Under the action of the magnetic force, the moving rod 5 moves up and down. The ink line 9 moves up and down along with the moving rod 5. During the up and down movement of the ink line 9, the ink in the marking gauge 10 is brought towards the needle 12, thereby leaving ink dots on the defective grains of the wafer. At the same time, the magnet 1 generates a downward magnetic force acting on the moving rod 5. When the moving rod 5 drives the ink line 9 to move downward, the moving rod 5 and the ink line 9 are jointly affected by the two magnetic forces generated by the magnet 1 and the coil 7, making the dotting force of the ink line 9 greater and more stable, the ink dots printed on the wafer more uniform, and less prone to the phenomenon of missing dots, achieving the effect of making the dotting of the wafer by the dotting device more uniform and less prone to missing dots.
[0030] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inner", "front", "center", "both ends", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.
[0031] In the present utility model, unless otherwise clearly specified and defined, the terms "installed", "set", "connected", "fixed", "swivelly connected", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. It can be the communication inside two elements or the interaction relationship between two elements. Unless otherwise clearly defined, for those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0032] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.
Claims
1. A probe table dotting device with uniform dotting, comprising a dotting device, characterized in that: The dotting device includes a base (17), a mounting frame (16) and a needle (12). The mounting frame (16) is fixedly arranged on the base (17). A limiting component is arranged on the mounting frame (16). The mounting frame (16) is fixedly provided with a mounting block (8). The mounting block (8) is fixedly provided with a coil (7). A moving rod (5) is inserted into the coil (7). The moving rod (5) is fixedly connected with a fixed block (3). The limiting component abuts against the fixed block (3). A magnet (1) is arranged on the fixed block (3). A first spring (4) is sleeved on the moving rod (5). One end of the first spring (4) abuts against the fixed block (3), and the other end of the first spring (4) abuts against the coil (7). The mounting frame (16) is fixedly provided with a connecting block (11). The connecting block (11) is below the mounting block (8). The connecting block (11) is fixedly provided with an ink cartridge (10). The connecting block (11) is fixedly connected with the needle (12). The needle (12) communicates with the ink cartridge (10). The moving rod (5) is fixedly connected with an ink line (9). The ink line (9) sequentially passes through the coil (7), the ink cartridge (10) and is located in the needle (12).
2. The dotting device for a probe station with uniform dotting according to claim 1, characterized in that: The magnet (1) is semi-circular in shape.
3. The dotting device for a probe station with uniform dotting according to claim 1, characterized in that: The S pole of the magnet (1) faces the side of the fixed block (3), and the N pole of the magnet (1) faces the side away from the fixed block (3).
4. A dotting device for a probe station with uniform dotting according to claim 1, characterized in that: The fixed block (3) is provided with a fixed groove, and the magnet (1) is installed in the fixed groove.
5. A dotting device for a probe station with uniform dotting, according to claim 1, characterized in that: The mounting block (8) is fixedly connected with a mounting plate (6). The mounting plate (6) is integrally formed with the mounting block (8). The mounting plate (6) is provided with a limiting groove (18). The moving rod (5) is fixedly connected with a limiting rod (2). The limiting rod (2) is inserted into the limiting groove (18).
6. The dotting device for a probe station with uniform dotting according to claim 1, characterized in that: The limiting component includes a limiting block (13) and a threaded rod (15). The threaded rod (15) is fixedly connected to the mounting frame (16). The limiting block (13) is threadedly connected to the threaded rod (15). A second spring (14) is sleeved on the threaded rod (15). One end of the second spring (14) abuts against the limiting block (13), and the other end of the second spring (14) abuts against the mounting frame (16). The limiting block (13) abuts against the fixed block (3).