Integrated circuit and state detection device thereof
By setting up a state detection device in the integrated circuit, using the induction element and processing module to detect changes in electrical signals in real time, the problems of internal fragments and edge collapses in the integrated circuit are solved, the accuracy and real-time of detection are improved, and the time and cost of testing and screening are reduced.
Patent Information
- Application Number
- CN202422105610.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-08-29
AI Technical Summary
The prior art cannot accurately and in real time capture the tiny lobes or edge collapse problems inside integrated circuits, affecting chip performance and reliability.
A state detection device is provided in the integrated circuit, including a detection module and a processing module for communication connection, which detects changes in electrical signal parameters through the induction element, and the processing module analyzes actual parameter information to judge the collapse or the lobe state.
Real-time monitoring within the integrated circuit is realized, the accuracy and real-time of detection are improved, and the time and cost of subsequent testing and screening are reduced.
Smart Images
Figure CN223166871U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of integrated circuit design, and particularly to an integrated circuit and a state detection device thereof. Background Art
[0002] During the production process of integrated circuits, chipping or cracking are common quality problems, which will seriously affect the performance and reliability of the chips. In the prior art, detecting these defects mainly relies on external detection methods, such as optical detection. However, these methods often cannot accurately and real-time capture the tiny chipping or cracking inside the IC (integrated circuit). Summary of the Invention
[0003] The technical problem to be solved by the present disclosure is to overcome the defect in the prior art that the chipping or cracking inside the integrated circuit cannot be accurately and real-time captured, and to provide an integrated circuit and a state detection device thereof.
[0004] The present disclosure solves the above technical problem through the following technical solutions:
[0005] According to a first aspect of the present disclosure, there is provided a state detection device for an integrated circuit, the state detection device is disposed in the integrated circuit, and the state detection device includes a detection module and a processing module which are communicatively connected;
[0006] The detection module includes an induction element and a detection element which are electrically connected; the detection module is electrically connected to the integrated circuit through a first wire;
[0007] Wherein, when the integrated circuit is in a damaged state, a change in the target electrical signal parameter occurs in the induction element;
[0008] The detection element is configured to detect, when the integrated circuit is in a damaged state, the actual parameter information corresponding to the change in the target electrical signal in the induction element during the acquisition period, and send it to the processing module;
[0009] The processing module is configured to receive the actual parameter information to obtain the actual state of the integrated circuit, and the actual state is used to characterize the damaged state of chipping and / or cracking in the integrated circuit.
[0010] Preferably, the induction element is obtained by connecting a plurality of resistors in a first connection manner.
[0011] Preferably, the first connection manner is parallel and / or series connection between the plurality of resistors.
[0012] Preferably, the induction element is obtained by connecting a plurality of capacitors in a second connection manner.
[0013] Preferably, the second connection method is parallel and / or series connection between several of the capacitors.
[0014] Preferably, the sensing element is a second wire.
[0015] Preferably, different actual parameter information corresponds to different digital signals;
[0016] Among them, different digital signals characterize different degrees of damage of the integrated circuit.
[0017] Preferably, the state detection device further includes a signal output module electrically connected to the processing module;
[0018] The signal output module is configured to receive and output the actual parameter information.
[0019] Preferably, the state detection device further includes an abnormal reminder module electrically connected to the processing module;
[0020] The abnormal reminder module is configured to receive a driving instruction sent by the processing module to issue an abnormal reminder signal.
[0021] According to a second aspect of the present disclosure, there is provided an integrated circuit, which includes the state detection device of the integrated circuit according to the first aspect of the present disclosure.
[0022] On the basis of conforming to common knowledge in the art, the above preferred conditions can be combined arbitrarily to obtain various preferred examples of the present disclosure.
[0023] The positive and progressive effects of the present disclosure are as follows:
[0024] The state detection device of the integrated circuit provided by the present disclosure can directly sense the internal physical state changes in the integrated circuit, and then obtain whether there are problems such as chipping or cracking in the integrated circuit in real time through the output signal; this state detection device is used for real-time monitoring during the production process of the integrated circuit, thereby being able to reduce the time and cost of subsequent testing and screening of the integrated circuit; and this state detection device is provided in the integrated circuit, and by directly performing detection inside the integrated circuit, the accuracy and real-time performance of the detection are improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 is a schematic structural diagram of the state detection device of the integrated circuit provided in Embodiment 1 of the present disclosure;
[0026] Figure 2 is a schematic structural diagram of the sensing element provided in Embodiment 1 of the present disclosure;
[0027] Figure 3 is a schematic structural diagram of the sensing element arranged on the integrated circuit provided in Embodiment 1 of the present disclosure;
[0028] Figure 4 This is a connection schematic diagram of the state detection device in the integrated circuit provided in Embodiment 2 of the present disclosure. Detailed implementation manners
[0029] The present disclosure will be further described below by way of embodiments, but the present disclosure is not limited to the scope of the described embodiments.
[0030] In the embodiments of the present disclosure, prefix words such as "first" and "second" are only used to distinguish different described objects, and have no limiting effect on the position, order, priority, quantity, content, etc. of the described objects. The use of ordinal numbers and other prefix words for distinguishing described objects in the embodiments of the present disclosure does not constitute a limitation on the described objects. For the statements of the described objects, refer to the description in the claims or the context of the embodiments, and no redundant limitation should be formed due to the use of such prefix words. In addition, in the description of this embodiment, unless otherwise specified, the meaning of "a plurality" is two or more.
[0031] Embodiment 1
[0032] As Figure 1 shown, in this embodiment, a state detection device for an integrated circuit is provided. The state detection device is disposed in the integrated circuit, and the state detection device includes a detection module 100 and a processing module 200 that are communicatively connected.
[0033] The detection module 100 includes an induction element 101 and a detection element 102 that are electrically connected; the detection module 100 is electrically connected to the integrated circuit through a first wire; wherein, when the integrated circuit is in a damaged state, a change in the target electrical signal parameter occurs in the induction element 101; the detection element 102 is configured to detect the actual parameter information corresponding to the change in the target electrical signal in the induction element 101 during the acquisition period when the integrated circuit is in a damaged state, and send it to the processing module 200.
[0034] The processing module 200 is configured to receive the actual parameter information to obtain the actual state of the integrated circuit, and the actual state is used to characterize the damaged state of the chipping and / or cracking in the integrated circuit.
[0035] By designing a dedicated detection circuit inside the integrated circuit, the physical state change inside the chip can be directly sensed by the circuit, and whether there are problems of chipping or cracking can be judged in real time through the output signal, thereby realizing real-time monitoring during the production process of the integrated circuit and reducing the time and cost of subsequent testing and screening of the integrated circuit; and the state detection device is disposed in the integrated circuit, and by directly performing detection inside the integrated circuit, the accuracy and real-time performance of the detection are improved.
[0036] In one implementation, the sensing element in this embodiment is obtained by connecting a number of resistors in a first connection manner; wherein, the first connection manner is parallel and / or series connection between a number of resistors.
[0037] As Figure 2 shown, where R1 - R8 are all resistors; IN1 - IN4 are all detection interfaces.
[0038] As Figure 2 shown, in this embodiment, a number of resistors are connected in parallel through wires to form a sensing element.
[0039] In the sensing element of this embodiment, the number of parallel resistors is at least 1. Among them, the more parallel resistors, the finer the detection.
[0040] As Figure 3 shown, the sensing element composed of a number of parallel resistors forms a number of loops with a certain preset distance around the integrated circuit through wires to detect the damage degree in the integrated circuit.
[0041] When there are chipping or cracking in the integrated circuit, the circuit between two corresponding resistors is damaged, the resistance changes accordingly, and a corresponding sensing signal is generated. At this time, the detection element will detect the sensing signal corresponding to the change of the sensing element and determine the chipping or cracking situation in the integrated circuit according to the sensing signal; among them, when there is only one sensing signal, only the specific location of the damage in the integrated circuit can be detected. When there are more damaged parts in the integrated circuit, the change amount of the corresponding sensing signal is larger, and the damage degree in the integrated circuit is determined accordingly.
[0042] As Figure 2 shown, when there are chipping or cracking in the integrated circuit, the circuit between R1 and R2 (the cross - marked place in the figure) is damaged. At this time, the detection element detects the chipping or cracking situation in the integrated circuit through interface IN4; when there are more damaged parts in the integrated circuit, such as the circuit between R3 and R4 is damaged and the circuit between R5 and R6 is damaged, the detection element determines different damaged places in the integrated circuit through interfaces IN3 and IN2. And the more damaged parts there are, the larger the change amount of the corresponding sensing signal, and then the damage degree in the integrated circuit is determined and informed to the operator.
[0043] In another implementation, the sensing element is obtained by connecting a number of capacitors in a second connection manner; wherein, the second connection manner is parallel and / or series connection between a number of capacitors.
[0044] The sensing element in this embodiment can also be a second wire.
[0045] When there is an edge break or crack in the integrated circuit, the detection element detects that the actual parameter information corresponding to the change in the target electrical signal in the sensing element during the acquisition period changes, such as changes in current, resistance, voltage, etc., thereby determining that there is an edge break or crack in the integrated circuit.
[0046] In this embodiment, different actual parameter information corresponds to different digital signals; among them, different digital signals represent different degrees of damage to the integrated circuit.
[0047] When the sensing element is based on the parallel and / or series connection of several resistors, the detection element detects its resistance value by detecting the voltage division of the integrated circuit. When one or more resistors are damaged due to cracks or chips, the detection element detects that the voltage changes. Among them, different numbers of resistor changes correspond to different voltage changes. Through different voltage division ratios, and then through the processing unit, it decodes them into multi-bit digital signals. For example: the total number of bits of the digital signal is 16 bits. When there is no damage, the corresponding digital signal is binary 1111. When the digital signal is 0111, it means that half of the circuit in the integrated circuit is damaged due to edge break or crack.
[0048] In the present disclosure, by determining different degrees of damage in the integrated circuit, corresponding processing can be performed on integrated circuits with different degrees of damage, reducing the maintenance cost. And the state detection device provided in the present disclosure is applicable to various types and sizes of integrated circuits and has a wide market application prospect.
[0049] The state detection device in this embodiment further includes a signal output module 300 electrically connected to the processing module; the signal output module 300 is used to receive and output the actual parameter information.
[0050] The state detection device in this embodiment further includes an abnormal reminder module 400 electrically connected to the processing module; the abnormal reminder module 400 is used to receive the driving instruction sent by the processing module to send out an abnormal reminder signal.
[0051] In one implementation manner, an abnormal situation in the integrated circuit is reminded by voice broadcast.
[0052] Through the setting of the abnormal reminder module, an alarm can be sent out in time when the integrated circuit has an abnormality or a fault, thereby reminding the user to take corresponding measures to deal with the abnormality and improving the user experience.
[0053] The state detection device of the integrated circuit provided by the present disclosure can directly sense the internal physical state changes in the integrated circuit, and then obtain whether there are problems such as chipping or cracking in the integrated circuit in real time through the output signal; this state detection device is used for real-time monitoring during the production process of the integrated circuit, thereby reducing the time and cost of subsequent testing and screening of the integrated circuit; and this state detection device is arranged in the integrated circuit, and by directly detecting inside the integrated circuit, the accuracy and real-time performance of the detection are improved.
[0054] The following combines examples to specifically illustrate the implementation principle of the state detection device of the integrated circuit in this embodiment:
[0055] The state detection device provided by the present disclosure is built into the IC (integrated circuit), and includes a sensing element and a processing unit. The sensing element is responsible for monitoring physical changes related to chipping or cracking, such as changes in capacitance or resistance. The processing unit then analyzes these changes, determines whether damage has occurred, and evaluates the severity of the damage.
[0056] When the integrated circuit is working, the built-in detection circuit continuously monitors the state of a specific signal. When an abnormal signal is detected, such as a sudden increase in resistance or a sudden decrease in capacitance, the processing unit determines that the IC may have suffered chipping or cracking damage. Then, an alarm signal is output through a preset communication interface to prompt the operator or system to conduct further inspections or take corresponding measures.
[0057] By designing a dedicated detection circuit inside the IC, it is possible to directly sense the internal physical state changes of the chip, and determine whether there are problems such as chipping or cracking in real time through the output signal, thereby realizing real-time monitoring during the production process of the integrated circuit and reducing the time and cost of subsequent testing and screening of the integrated circuit.
[0058] Embodiment 2
[0059] In this embodiment, an integrated circuit is provided, and the integrated circuit includes the state detection device of the integrated circuit in Embodiment 1.
[0060] As Figure 4 shown, the state detection device 3 in this embodiment is arranged inside the integrated circuit 1 through the wire 2. Among them, the state detection device 3 is electrically connected to the wire 2, and the wire 2 is arranged around the outer frame edge of the integrated circuit.
[0061] The integrated circuit provided in this embodiment includes a state detection device. The state detection device can directly sense the internal physical state changes in the integrated circuit, and then obtain whether there are problems such as chipping or cracking in the integrated circuit in real time through the output signal. This state detection device is used for real-time monitoring during the production process of the integrated circuit, and thus can reduce the time and cost of subsequent testing and screening of the integrated circuit. And this state detection device is arranged in the integrated circuit, and by directly detecting inside the integrated circuit, the accuracy and real-time performance of the detection are improved.
[0062] Although the specific implementation manners of the present disclosure have been described above, those skilled in the art should understand that this is only an example, and the protection scope of the present disclosure is defined by the appended claims. Without departing from the principle and essence of the present disclosure, those skilled in the art can make various changes or modifications to these implementation manners, but these changes and modifications all fall within the protection scope of the present disclosure.
Claims
1. A state detection device for an integrated circuit, characterized in that The state detection device is disposed in the integrated circuit, and the state detection device includes a detection module and a processing module that are communicatively connected; The detection module includes an induction element and a detection element that are electrically connected; the detection module is electrically connected to the integrated circuit through a first wire; Wherein, when the integrated circuit is in a damaged state, a change in the target electrical signal parameter occurs in the induction element; The detection element is configured to detect, when the integrated circuit is in a damaged state, the actual parameter information corresponding to the change in the target electrical signal in the induction element during the acquisition period, and send it to the processing module; The processing module is configured to receive the actual parameter information to obtain the actual state of the integrated circuit, and the actual state is used to characterize the damaged state of the chipping and / or cracking in the integrated circuit.
2. The state detection device of the integrated circuit according to claim 1, wherein, The induction element is obtained by connecting a plurality of resistors in a first connection manner.
3. The state detection device for an integrated circuit according to claim 2, characterized in that, The first connection manner is parallel and / or series connection between the plurality of resistors.
4. The state detection device for an integrated circuit according to claim 1, wherein, The induction element is obtained by connecting a plurality of capacitors in a second connection manner.
5. The state detection device for an integrated circuit according to claim 4, characterized in that, The second connection manner is parallel and / or series connection between the plurality of capacitors.
6. The state detection device for an integrated circuit according to claim 1, characterized in that, The induction element is a second wire.
7. The state detection device for an integrated circuit according to any one of claims 1-6, wherein Different actual parameter information corresponds to different digital signals; Wherein, different digital signals characterize different degrees of damage of the integrated circuit.
8. The state detection device for an integrated circuit according to claim 1, characterized in that, The state detection device further includes a signal output module electrically connected to the processing module; The signal output module is configured to receive and output the actual parameter information.
9. The state detection device for an integrated circuit according to claim 8, characterized in that The state detection device further includes an abnormal reminder module electrically connected to the processing module; The abnormal reminder module is configured to receive a driving instruction sent by the processing module to issue an abnormal reminder signal.
10. An integrated circuit, characterized in that, The integrated circuit includes the state detection device for an integrated circuit according to any one of claims 1-9.