Active chip temperature control device based on semiconductor refrigeration technology

Abstract

The utility model relates to the technical field of temperature control, and discloses an active chip temperature control device based on a semiconductor refrigeration technology, which comprises a semiconductor voltage controller, a semiconductor connector and a semiconductor refrigeration module, and is characterized in that the semiconductor voltage controller is electrically connected with the semiconductor connector and the semiconductor refrigeration module; the bottom of the semiconductor refrigeration module is provided with an SoC chip, the top of the semiconductor refrigeration module is provided with heat dissipation fins and a host middle frame, and the hot end and the cold end of the semiconductor refrigeration module are fixedly connected with a hot end sensor and a cold end sensor respectively. The hot end sensor and the cold end sensor are connected with the semiconductor connector through connecting wires. A sensor is arranged to monitor the working state of the SoC chip and the temperature change of the surrounding environment in real time, the refrigerating power is analyzed and dynamically adjusted through a semiconductor voltage controller algorithm, the optimal working temperature of the SoC chip is kept, overheating is avoided, and the problem that condensate water is generated in the refrigerating process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, in particular to an active chip temperature control device based on semiconductor refrigeration technology. Background Technique

[0002] The central control of the intelligent cockpit is the main audio-visual entertainment source for the driver and co-driver. As people's requirements for the intelligence level of the car cockpit are getting higher and higher, the tasks that the central control of the intelligent cockpit needs to undertake are also getting heavier and heavier. This requires that the computing power of the SoC (System On Chip) chip used in the central control reach a very high level, so that the software can be updated by OTA without being restricted by the computing power of the chip.

[0003] However, the existing automotive central control SoC uses passive or active heat dissipation methods. Although it can alleviate the problem of excessive chip heat dissipation, when facing a sharp rise in temperature, it is difficult to effectively dissipate heat to the surrounding environment in a timely manner, and it is even more unable to solve the dilemma that the ambient temperature exceeds the maximum operating temperature of the chip. In addition, the existing semiconductor heat dissipation module, as a combination of a semiconductor refrigeration component and a radiator, integrates components such as N and P type semiconductors, ceramic plates, and flow guide strips. After the thermocouple pair is energized, the cold end absorbs heat and the hot end dissipates heat. Its working performance is limited by the temperature difference range: if the temperature difference is too small, the heat dissipation efficiency is low, which is likely to cause the chip to overheat; if the temperature difference is too large, it is easy to cause a large temperature difference between the cold end and the environment, inducing the formation of condensed water, which will threaten the working stability of the circuit board components, resulting in function damage and even permanent damage to the central control host.

[0004] Based on this, the utility model designs an active chip temperature control device based on semiconductor refrigeration technology to solve the above problems. Content of the Utility Model

[0005] The purpose of the utility model is to provide an active chip temperature control device based on semiconductor refrigeration technology to solve the problems raised in the above background technique.

[0006] To solve the above technical problems, the utility model provides the following technical solution: An active chip temperature control device based on semiconductor refrigeration technology, including a semiconductor voltage controller, a semiconductor connector, and a semiconductor refrigeration module. The semiconductor voltage controller is electrically connected to the semiconductor connector and the semiconductor refrigeration module. The bottom of the semiconductor refrigeration module is provided with an SoC chip, and the top of the semiconductor refrigeration module is provided with heat dissipation fins and a mainframe middle frame. The hot end and the cold end of the semiconductor refrigeration module are respectively fixedly connected with a hot end sensor and a cold end sensor. The hot end sensor and the cold end sensor are connected to the semiconductor connector through connection lines. An environment sensor is arranged on the right side of the semiconductor voltage controller. The hot end sensor, the cold end sensor, and the environment sensor are all electrically connected to the semiconductor voltage controller.

[0007] Preferably, the semiconductor refrigeration module is connected to the semiconductor connector through a power supply line, and the supply voltage of the semiconductor connector is controlled by a semiconductor voltage controller.

[0008] Preferably, heat dissipation silicone grease is coated on both the upper and lower sides of the semiconductor refrigeration module. The cold end of the semiconductor refrigeration module is fixedly connected to the SoC chip through the heat dissipation silicone grease, and the hot end of the SoC chip is fixedly connected to the heat dissipation fins and the mainframe middle frame through the heat dissipation silicone grease.

[0009] Preferably, a mainframe circuit board is fixedly connected to the bottom of the SoC chip, and an environmental sensor is fixedly connected to the top of the mainframe circuit board.

[0010] Preferably, the hot end sensor, the cold end sensor and the environmental sensor all adopt temperature and humidity sensors.

[0011] Preferably, a temperature and humidity control algorithm is set in the semiconductor voltage controller. The temperature and humidity control algorithm judges and outputs the voltage to the semiconductor refrigeration module by collecting the data of the hot end sensor, the cold end sensor and the environmental sensor.

[0012] Compared with the prior art, the beneficial effects achieved by the present utility model are as follows:

[0013] First, the present utility model monitors the working state of the SoC chip and the temperature change of its surrounding environment in real time by setting three sensors, calculates and analyzes through the temperature and humidity control algorithm built in the semiconductor voltage controller, and then dynamically adjusts the refrigeration power of the semiconductor refrigeration module, thereby ensuring that the SoC chip always operates within its optimal working temperature range, effectively avoiding overheating, and at the same time avoiding the problem of condensed water generated during the refrigeration process. At the same time, the heat dissipation fins are used for efficient heat dissipation to ensure the rapid transfer and dissipation of heat, and the semiconductor refrigeration module is closely attached to the SoC chip, the heat dissipation fins and the mainframe middle frame through the high thermal conductivity heat dissipation silicone grease, forming an efficient heat conduction path, thereby improving the heat dissipation efficiency.

[0014] Second, the present utility model dynamically receives the temperatures of the cold end and the hot end of the semiconductor refrigeration module through the hot end sensor and the cold end sensor fixed on the cold end and the hot end of the semiconductor refrigeration module, and according to the preset table and algorithm, checks the voltage to be output, and strictly controls the input power of the semiconductor refrigeration module to control the temperature and humidity of the cold end, thereby ensuring that the SoC chip can work within a suitable temperature range without generating condensed water. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0016] Figure 2 The front view structural schematic diagram of the present utility model;

[0017] Figure 3 The structural schematic diagram of the temperature and humidity control algorithm in the present utility model.

[0018] Wherein: 1. Semiconductor voltage controller; 2. Semiconductor connector; 3. Semiconductor refrigeration module; 4. SoC chip; 5. Heat dissipation fin; 6. Mainframe middle frame; 7. Hot end sensor; 8. Cold end sensor; 9. Environment sensor; 10. Thermal grease; 11. Mainframe circuit board. Specific implementation manners

[0019] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0020] Embodiment 1

[0021] Please refer to FIG. * - FIG. * to illustrate Embodiment 1. In the illustration, an active chip temperature control device based on semiconductor refrigeration technology includes a semiconductor voltage controller 1, a semiconductor connector 2, and a semiconductor refrigeration module 3. The semiconductor voltage controller 1 is electrically connected to the semiconductor connector 2 and the semiconductor refrigeration module 3. The bottom of the semiconductor refrigeration module 3 is provided with a SoC chip 4. The top of the semiconductor refrigeration module 3 is provided with a heat dissipation fin 5 and a mainframe middle frame 6. The hot end and the cold end of the semiconductor refrigeration module 3 are respectively fixedly connected with a hot end sensor 7 and a cold end sensor 8. The hot end sensor 7 and the cold end sensor 8 are connected to the semiconductor connector 2 through connecting wires. An environment sensor 9 is provided on the right side of the semiconductor voltage controller 1. The hot end sensor 7, the cold end sensor 8, and the environment sensor 9 are all electrically connected to the semiconductor voltage controller 1;

[0022] Please refer to Figure 1 and Figure 2 , in the illustration, the semiconductor refrigeration module 3 is connected to the semiconductor connector 2 through a power supply wire, and the supply voltage of the semiconductor connector 2 is controlled by the semiconductor voltage controller 1;

[0023] Furthermore, thermal grease 10 is coated on both the upper and lower sides of the semiconductor refrigeration module 3. The cold end of the semiconductor refrigeration module 3 is fixedly connected to the SoC chip 4 through thermal grease 10. The hot end of the SoC chip 4 is fixedly connected to the heat dissipation fin 5 and the mainframe middle frame 6 through thermal grease 10;

[0024] In this embodiment, the hot-end sensor 7 and the cold-end sensor 8 fixedly connected to the hot end and the cold end of the thermoelectric cooling module 3 are used to dynamically receive the temperatures of the cold end and the hot end of the thermoelectric cooling module 3. The real-time feedback of these two data points enables the semiconductor voltage controller 1 to accurately grasp the working state and efficiency of the thermoelectric cooling module 3. When the cold-end temperature rises, it indicates that the heat generated by the SoC chip 4 is being effectively transferred through the thermoelectric cooling module 3; while when the hot-end temperature is too high, it may mean insufficient heat dissipation efficiency. At this time, the semiconductor voltage controller 1 will correspondingly increase the supply voltage to enhance the refrigeration capacity of the thermoelectric cooling module 3. The SoC chip 4 is in contact with the cold end of the thermoelectric cooling module 3 through the heat-conducting silicone grease 10, and can exchange heat with the cold end when generating heat. The hot end of the thermoelectric cooling module 3 is connected to the middle frame 6 of the central control host, and can exchange heat with the middle frame 6 of the central control host when generating heat. During the exchange process, efficient heat dissipation can be achieved through the heat dissipation fins 5 to ensure the rapid transfer and dissipation of heat.

[0025] It should be noted that the semiconductor voltage controller 1 dynamically adjusts the voltage supplied to the thermoelectric cooling module 3 according to the real-time data received from the hot-end sensor 7, the cold-end sensor 8, and the ambient sensor 9, so as to achieve precise control of the temperature of the SoC chip 4. The ambient sensor 9 is responsible for monitoring the temperature of the surrounding environment. When the ambient temperature rises, the semiconductor voltage controller 1 will predict the possible heat dissipation pressure faced by the SoC chip 4 and adjust the working state of the thermoelectric cooling module 3 in advance to cope with the upcoming heat load.

[0026] Embodiment 2

[0027] Please refer to Figure 1 and Figure 2 To illustrate Embodiment 2, this embodiment further illustrates Embodiment 1. As shown in the figure, the bottom of the SoC chip 4 is fixedly connected to the main circuit board 11, and the ambient sensor 9 is fixedly connected to the top of the main circuit board 11;

[0028] Furthermore, the hot-end sensor 7, the cold-end sensor 8, and the ambient sensor 9 all adopt temperature and humidity sensors;

[0029] In this embodiment, the hot-end sensor 7, the cold-end sensor 8, and the ambient sensor 9 record the necessary temperature and humidity data. The positions of the three sensors are installed according to the algorithm requirements. The hot-end sensor 7 is installed at the hot end of the thermoelectric cooling module 3, the cold-end sensor 8 is installed at the cold end of the thermoelectric cooling module 3, and the ambient sensor 9 is installed on the main circuit board 11 and needs to be at a position far from the heat-generating components. Among them, the sensor data of the hot-end sensor 7 and the cold-end sensor 8 are connected to the semiconductor connector 2 through connecting wires, and the data of the three sensors are finally connected to the semiconductor voltage controller 1.

[0030] It should be noted that the semiconductor voltage controller 1 dynamically adjusts the operating parameters of the thermoelectric cooling module 3 by analyzing the data from the hot-end sensor 7, the cold-end sensor 8, and the ambient sensor 9 in real time, so as to achieve precise control of the temperature of the SoC chip 4. The semiconductor voltage controller 1 first sets a target temperature range for the SoC chip 4, as well as temperature thresholds for the hot end and the cold end. When the temperature detected by the cold-end sensor 8 exceeds the set threshold, the semiconductor voltage controller 1 increases the voltage supplied to the thermoelectric cooling module 3, thereby enhancing its refrigeration capacity and pulling the temperature of the SoC chip 4 back into the target range.

[0031] Embodiment 3

[0032] Please refer to Figure 1 and Figure 3 Referring to Embodiment 3, this embodiment further describes Embodiment 2. A temperature and humidity control algorithm is provided in the semiconductor voltage controller 1 shown in the figure. The temperature and humidity control algorithm determines the voltage output to the thermoelectric cooling module 3 by collecting the data of the hot-end sensor 7, the cold-end sensor 8, and the ambient sensor 9.

[0033] In this embodiment, the semiconductor voltage controller 1 incorporates a temperature and humidity control algorithm. This algorithm can collect the data of the hot-end sensor 7, the cold-end sensor 8, and the ambient sensor 9 in real time. According to the preset table and algorithm logic, it can find out the voltage that needs to be output to the thermoelectric cooling module 3, and strictly control the input power of the thermoelectric cooling module 3 to ensure that the temperature and humidity at the cold end do not exceed its limit operating range, thereby ensuring that the SoC chip 4 can operate in a suitable temperature range without generating condensate.

[0034] Specifically, when starting up, the semiconductor voltage controller 1 first detects the current ambient temperature. If it is confirmed that the current ambient temperature allows for startup, then the SoC chip 4 is started. Otherwise, the thermoelectric cooling module 3 is started first until the temperature is suitable and then the SoC chip 4 is started. After the SoC is started, the semiconductor voltage controller 1 continuously detects the current environment and starts the thermoelectric cooling module 3 at any time when needed to control the temperature of the SoC chip 4 within a suitable range.

[0035] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An active chip temperature control device based on semiconductor refrigeration technology, comprising a semiconductor voltage controller (1), a semiconductor connector (2) and a semiconductor refrigeration module (3), characterized in that: The semiconductor voltage controller (1) is electrically connected to the semiconductor connector (2) and the semiconductor refrigeration module (3). A SoC chip (4) is provided at the bottom of the semiconductor refrigeration module (3). A heat sink fin (5) and a mainframe middle frame (6) are provided at the top of the semiconductor refrigeration module (3). A hot-end sensor (7) and a cold-end sensor (8) are respectively fixedly connected to the hot end and the cold end of the semiconductor refrigeration module (3). The hot-end sensor (7) and the cold-end sensor (8) are connected to the semiconductor connector (2) through connection lines. An environmental sensor (9) is provided on the right side of the semiconductor voltage controller (1). The hot-end sensor (7), the cold-end sensor (8), and the environmental sensor (9) are all electrically connected to the semiconductor voltage controller (1).

2. The active chip temperature control device based on semiconductor refrigeration technology according to claim 1, characterized in that: The semiconductor refrigeration module (3) is connected to the semiconductor connector (2) through a power supply line. The supply voltage of the semiconductor connector (2) is controlled by the semiconductor voltage controller (1).

3. The active chip temperature control device based on semiconductor refrigeration technology according to claim 1, characterized in that: Thermal grease (10) is coated on both the upper and lower sides of the semiconductor refrigeration module (3). The cold end of the semiconductor refrigeration module (3) is fixedly connected to the SoC chip (4) through the thermal grease (10). The hot end of the SoC chip (4) is fixedly connected to the heat sink fin (5) and the mainframe middle frame (6) through the thermal grease (10).

4. The active chip temperature control device based on semiconductor refrigeration technology according to claim 1, characterized in that: A mainframe circuit board (11) is fixedly connected to the bottom of the SoC chip (4). An environmental sensor (9) is fixedly connected to the top of the mainframe circuit board (11).

5. The active chip temperature control device based on semiconductor refrigeration technology according to claim 1, characterized in that: The hot-end sensor (7), the cold-end sensor (8), and the environmental sensor (9) all adopt temperature and humidity sensors.

6. The active chip temperature control device based on semiconductor refrigeration technology according to claim 1, wherein: A temperature and humidity control algorithm is provided in the semiconductor voltage controller (1). The temperature and humidity control algorithm determines the voltage output to the semiconductor refrigeration module (3) by collecting data from the hot-end sensor (7), the cold-end sensor (8), and the environmental sensor (9).

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