Thermal hinge structure

Abstract

The utility model provides a hot hinge structure. The thermal hinge structure comprises a heat conduction unit, a first heat pipe and a second heat pipe. The heat conduction unit is provided with a first heat conduction part and a second heat conduction part, the first heat conduction part is provided with a first hollow part, the first hollow part is arranged along the first axis, and the second heat conduction part rotates relative to the first hollow part with the first axis as the center. The first heat pipe is provided with a horizontal section, a bent section and an extending section, the horizontal section is embedded in the first hollow part along the first axis, the bent section is connected between the horizontal section and the extending section, and the extending section is thermally coupled to a heat source. The second heat pipe is arranged on the second heat conduction part and is thermally coupled to the heat source through the heat conduction unit and the first heat pipe.

Description

Technical Field

[0001] The present invention relates to a hinge structure, and more particularly to a thermal hinge structure for enhancing passive heat dissipation. By combining at least one hinge with a heat pipe, the structure reduces thermal resistance and temperature difference between the keyboard base and the screen, thereby forming an optimized heat dissipation path and significantly improving the product's heat dissipation performance. Background Art

[0002] Traditional laptops and mobile phones primarily utilize a hinge to connect the keyboard and screen, enabling foldable applications. One end of the hinge is fixed to the keyboard base, while the other end is fixed to the screen. A pivot connects the two, allowing the screen to open and close relative to the base. To maintain the screen's opening and closing motion, the hinge must be constructed of a strong material to provide sufficient support.

[0003] However, in addition to the keyboard, the base plate connected by the hinge structure also houses heat-generating components such as the central processing unit (CPU) and motherboard. The heat generated by these components needs to be dissipated promptly to keep the temperature of a traditional laptop or mobile phone within a relatively stable range and ensure the normal operation of the device. Because traditional hinge structures are limited by the material's support strength, it is not easy to make them with high thermal conductivity materials or combine them with passive heat dissipation. Therefore, the heat generated by the heat-generating components cannot be effectively transferred through the hinge structure to the outer casing where the screen is located for dissipation, resulting in a limited overall heat dissipation area and poor heat dissipation effect.

[0004] In view of this, it is necessary to provide a thermal hinge structure that improves the passive heat dissipation effect. By combining a heat pipe with at least one pivot, the thermal resistance and temperature difference between the base plate where the keyboard is located and the screen end can be reduced to form an optimized heat dissipation path, thereby significantly improving the heat dissipation performance of the product and solving the defects of the conventional technology. Utility Model Content

[0005] The purpose of the present invention is to provide a thermal hinge structure that improves the passive heat dissipation effect. By combining a heat pipe with at least one pivot, the thermal resistance and temperature difference between the bottom plate end where the keyboard is located and the screen end can be reduced, thereby significantly improving the heat dissipation performance of the product. The thermal hinge structure of the present invention can be combined with a general hinge that provides structural support. The general hinge is set on the left and right sides of the laptop or mobile phone to provide strength support for the opening and closing rotation of the screen, and the thermal hinge structure can be set on the inside of the general hinge to provide a high heat conduction path between the bottom plate (heat source) and the screen. Furthermore, the thermal hinge structure of the present invention can also be set independently to provide a high heat conduction path between the bottom plate (heat source) and the screen.

[0006] Another object of the present utility model is to provide a thermal hinge structure for enhancing the passive heat dissipation effect. The thermal hinge structure can adopt a single pivot or a double pivot combined with a heat pipe to form a heat conduction unit. One end of the fixing part is bent and fixed to the bottom plate in cooperation with the heat pipe and is assembled and thermally coupled to the heat source, while the fixing part at the other end is fixed to the screen in cooperation with the heat pipe and is assembled and thermally coupled to the heat sink. The middle parts of the two fixing parts are connected by the heat conduction unit to form a high heat conduction path with a heat transfer coefficient K > 200 W / m·K, which can ensure effective conduction from the heat source on the bottom plate through the heat pipe, the heat conduction unit, the heat pipe at the screen end or other heat equalizing components, evenly distribute the heat on the screen, and make the screen reach an even temperature effect. On the other hand, the thermal hinge structure is separately designed from the traditional support hinge, which can improve the feasibility and reliability of the thermal hinge structure. The heat conduction unit composed of a heat pipe and a high heat transfer material can effectively conduct and distribute the "heat source" to the hinge application products, further increasing the power consumption of the passive heat dissipation system (from 12 W to 18 - 30 W). Moreover, the thermal hinge structure of the present utility model can effectively disperse the heat source of the bottom plate system to the screen end, utilize the large area advantage of the screen as a heat sink, and further improve the overall power of the system. It can be applied to products such as mobile phones, notebooks, tablets, and foldable screens.

[0007] Yet another object of the present utility model is to provide a thermal hinge structure for enhancing the passive heat dissipation effect. The thermal hinge structure can adopt a double pivot combined with a heat pipe to form two parallel heat conduction parts, and the distance between them is maintained within 15 mm. The fixing part connecting the first heat conduction part is bent and fixed to the bottom plate in cooperation with the first heat pipe and is assembled and thermally coupled to the heat source, while the fixing part connecting the second heat conduction part is fixed to the screen in cooperation with the second heat pipe and is assembled and thermally coupled to the heat sink. The first heat conduction part and the second heat conduction part are connected by a rotating unit and can perform a flipping movement from 0° to 360°. In addition, the thermal hinge structure is made of high thermal conductivity materials such as copper, copper alloy, aluminum, and aluminum alloy. Thus, a high heat conduction path can be formed from the heat source through the first heat pipe, the heat conduction unit, the second heat pipe, and the screen, and the temperature difference between any two components can be maintained at less than 10°C, effectively enhancing the overall passive heat dissipation effect of the system.

[0008] To achieve the foregoing object, the present utility model provides a thermal hinge structure, including a heat conduction unit, a first heat pipe, and a second heat pipe. The heat conduction unit has a first heat conduction part and a second heat conduction part. The first heat conduction part has a first hollow part, and the first hollow part is arranged along a first axis. The second heat conduction part is assembled to rotate relative to the first hollow part with the first axis as the center. The first heat pipe has a horizontal section, a bent section, and an extended section. The horizontal section is embedded in the hollow part along the first axis, the bent section is connected between the hollow part and the extended section, and the extended section is thermally coupled to the heat source. The second heat pipe is arranged on the second heat conduction part and is thermally coupled to the heat source through the heat conduction unit and the first heat pipe.

[0009] In one embodiment, the heat conduction unit further includes a protective layer disposed between the first hollow portion and the first heat pipe.

[0010] In one embodiment, the first heat conduction portion is disposed at a side edge of a bottom plate. The extended section of the first heat pipe and the heat source are fixed on the bottom plate. The second heat conduction portion is connected to a screen, and the second heat conduction portion and the second heat pipe are fixed on the screen.

[0011] In one embodiment, the second heat conduction portion has a second hollow portion. The second heat pipe further includes a horizontal section, a bent section, and an extended section. The horizontal section is embedded in the second hollow portion. The bent section is connected between the rotating portion and the extended section. The extended section is thermally coupled to a heat sink, and the heat sink is disposed on the screen.

[0012] In one embodiment, the first heat pipe and the second heat pipe respectively include a capillary structure disposed on the inner wall surface of the first heat pipe and the inner wall surface of the second heat pipe.

[0013] In one embodiment, the bent section of the first heat pipe has an outer bent region and an inner bent region, and the capillary structure density of the inner bent region is greater than that of the outer bent region.

[0014] In one embodiment, the capillary structure density of the inner bent region decreases linearly towards the outer bent region.

[0015] In one embodiment, the thermal hinge structure further includes a first fixing portion. The first fixing portion is connected to the first heat conduction portion and is embedded in a bottom plate. The first heat conduction portion is adjacent to the side edge of the bottom plate. The first fixing portion, the first extended section of the first heat pipe, and the heat source are fixed on the bottom plate.

[0016] In one embodiment, the thermal hinge structure further includes a second fixing portion. The second fixing portion is connected to the second heat conduction portion and is embedded in a screen. The second fixing portion is adjacent to the side edge of the screen. The second heat conduction portion has a second hollow portion. The second heat pipe further includes a horizontal section, a bent section, and an extended section. The horizontal section is embedded in the second hollow portion. The bent section is connected between the rotating portion and the extended section. The extended section is thermally coupled to a heat sink, and the heat sink is fixed on the screen.

[0017] To achieve the foregoing objectives, the present utility model further provides a thermal hinge structure, including a heat conduction unit, a first heat pipe, and a second heat pipe. The heat conduction unit has a first heat conduction portion, a rotation unit, and a second heat conduction portion. The first heat conduction portion has a first hollow portion, and the first hollow portion is arranged along a first axis. The second heat conduction portion is arranged along a second axis, and the first axis and the second axis are parallel to each other. The rotation unit is connected between the first heat conduction portion and the second heat conduction portion. The first heat pipe has a horizontal section, a bent section, and an extension section. The horizontal section is embedded in the first hollow portion along the first axis, the bent section is connected between the hollow portion and the extension section, and the extension section is thermally coupled to a heat source. The second heat pipe is arranged on the second heat conduction portion, and the second heat pipe is thermally coupled to the heat source through the second heat conduction portion, the rotation unit, the first heat conduction portion, and the first heat pipe.

[0018] In one embodiment, the first heat pipe and the second heat pipe form a spacing distance, and the spacing distance is less than 15 mm.

[0019] In one embodiment, the heat conduction unit further includes a protective layer, and the protective layer is arranged between the first hollow portion and the first heat pipe.

[0020] In one embodiment, the thermal hinge structure further includes a first fixing portion. The first fixing portion is connected to the first heat conduction portion and is embedded in a bottom plate. The first heat conduction portion is adjacent to the side edge of the bottom plate. The first fixing portion, the extension section of the first heat pipe, and the heat source are fixed on the bottom plate.

[0021] In one embodiment, the thermal hinge structure further includes a second fixing portion. The second fixing portion is connected to the second heat conduction portion and is embedded in a screen. The second heat conduction portion is adjacent to the side edge of the screen. The second heat conduction portion has a second hollow portion. The second heat pipe further includes a horizontal section, a bent section, and an extension section. The horizontal section is embedded in the second hollow portion along the second axis, the bent section is connected between the rotation portion and the extension section, and the extension section is thermally coupled to a heat sink. The second fixing portion, the extension portion of the second heat pipe, and the heat sink are fixed on the screen.

[0022] In one embodiment, the rotation unit is a gear set, and the second heat conduction portion is allowed to rotate relative to the first heat conduction portion by an angle through the gear set. The angle range is between 0° and 360°.

[0023] In one embodiment, the heat conduction unit is made of a high thermal conductivity material, and the thermal conductivity coefficient range of the high thermal conductivity material is between 200 W / m·K and 400 W / m·K.

[0024] In one embodiment, the high thermal conductivity material includes copper, copper alloy, aluminum, or aluminum alloy.

[0025] In one embodiment, the thermal hinge structure further includes a structural support hinge structure, and the structural support hinge structure is arranged outside two opposite ends of the thermal hinge structure.

[0026] In one embodiment, the first heat pipe and the second heat pipe each include a capillary structure, and the capillary structure is disposed on an inner wall surface of the first heat pipe and an inner wall surface of the second heat pipe.

[0027] In one embodiment, the curved section of the first heat pipe has an outer bending area and an inner bending area. The outer bending area faces away from the heat source, while the inner bending area is close to the heat source. The capillary structure density of the inner bending area is greater than that of the outer bending area.

[0028] In one embodiment, the density of the capillary structure in the inner bending region decreases linearly toward the outer bending region.

[0029] In one embodiment, the temperature difference between the heat source and the first heat pipe, the temperature difference between the first heat pipe and the first heat conducting portion, and the temperature difference between the second heat conducting portion and the second heat pipe are less than 5°C.

[0030] In one embodiment, the cross-section of the first heat pipe and the second heat pipe is circular or a flattened oblong, and includes an internal microstructure composed of a grid, fiber, grooves, or sintered powder.

[0031] The beneficial effect of the present invention is that the present invention provides a thermal hinge structure that improves the passive heat dissipation effect. By combining at least one pivot with a heat pipe, the thermal resistance and temperature difference between the keyboard base and the screen can be reduced, thereby significantly improving the heat dissipation performance of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The following detailed description of the present invention and the schematic diagrams of the embodiments are intended to enable those skilled in the art to more fully understand the above contents, and are not intended to limit the present invention.

[0033] Figure 1 This is a schematic structural diagram of the thermal hinge structure of the first embodiment of the present utility model.

[0034] Figure 2 This invention discloses an exemplary structure in which the first hollow portion is connected to the first heat pipe.

[0035] Figure 3 This is a schematic structural diagram of the thermal hinge structure of the second embodiment of the present utility model.

[0036] Figures 4A to 4F This invention discloses an example of the internal microstructure of the heat pipe.

[0037] Figures 5A to 5D This is to disclose an example of the capillary structure density of the heat pipe of the present invention.

[0038] The reference numerals are as follows:

[0039] 1.1a: Thermal hinge structure

[0040] 10, 10a: Heat conduction unit

[0041] 11: First heat conduction part

[0042] 111: First hollow part

[0043] 12: Second heat conduction part

[0044] 13: First fixing part

[0045] 14: Second fixing part

[0046] 15, 16: Protective layer

[0047] 17: Rotating unit

[0048] 20: First heat pipe

[0049] 200: Capillary structure

[0050] 21: First horizontal section

[0051] 22: First bending section

[0052] 22a: Outer bending area

[0053] 22b: Inner bending area

[0054] 23: First extension section

[0055] 24: Evaporation end

[0056] 241: Mesh

[0057] 242: Fiber

[0058] 243: Groove

[0059] 244: Sintered powder

[0060] 25: Condensation end

[0061] 251: Fiber

[0062] 252: Groove

[0063] 253: Sintered powder

[0064] 30: Heat source

[0065] 31: Heat sink

[0066] 40: Second heat pipe

[0067] 400: Capillary structure

[0068] 41: Second horizontal section

[0069] 42: Second bending section

[0070] 42a: Outer bending region

[0071] 42b: Inner bending region

[0072] 43: Second extension segment

[0073] 44: Evaporation end

[0074] 45: Condensation end

[0075] 70: Bottom plate

[0076] 71: Side edge

[0077] 80: Screen

[0078] 81: Side edge

[0079] 9: Structural support hinge structure

[0080] C1: First axis

[0081] C2: Second axis Detailed implementation mode

[0082] Some exemplary embodiments embodying the features and advantages of the present utility model will be described in detail in the following description. It should be understood that the present utility model can have various variations in different ways, all of which do not depart from the scope of the present utility model, and the descriptions and drawings therein are for illustrative purposes in nature and not for limiting the present utility model. For example, different embodiments in the present disclosure may use repeated reference symbols and / or markings. These repetitions are for the purpose of simplification and clarity and are not used to define the relationship between each embodiment and / or the described appearance structure. Furthermore, for the convenience of describing the relationship between a component or feature component in the drawings and another (plural) component or (plural) feature component, spatial relative terms may be used, such as "upper", "lower", "right", "left", "inner", "outer" and similar terms. Except for the orientation shown in the drawings, the spatial relative terms are used to cover different orientations of the device during use or operation. The device may also be positioned otherwise (for example, rotated 90 degrees or in other orientations), and the descriptions of the spatial relative terms used are interpreted accordingly. In addition, when a component is referred to as being "connected to" or "coupled to" another component, it may be directly connected to or coupled to the other component, or there may be intervening components. Although the numerical ranges and parameters of the broad scope of the present disclosure are approximate values, the numerical values are stated as precisely as possible in the specific examples. Additionally, it can be understood that although terms such as "first", "second", "third", etc. may be used in the claims to describe different components, these components should not be limited by these terms, and the corresponding components described in the embodiments are represented by different component symbols. These terms are used to distinguish different components. For example: the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component without departing from the scope of the embodiment. The term "and / or" used in this way includes any or all combinations of one or more of the related listed items.

[0083] Figure 1To disclose a structural schematic diagram of the thermal hinge structure of the first embodiment of the present utility model. In this embodiment, the present utility model provides a thermal hinge structure 1, which includes a heat conduction unit 10, a first heat pipe 20, and a second heat pipe 40. The heat conduction unit 10 has a first heat conduction part 11 and a second heat conduction part 12. The first heat conduction part has a first hollow part 111. The first hollow part 111 is arranged along a first axis C1. The second heat conduction part 12 is configured to rotate relative to the first hollow part 111 with the first axis C1 as the center. The first heat pipe 20 is embedded in the first hollow part 111 along the first axis C1. In this embodiment, the first heat pipe 20 further has a first horizontal section 21, a first bending section 22, and a first extension section 23. The first horizontal section 21 is embedded in the first hollow part 111 along the first axis C1. The first bending section 22 is connected between the first horizontal section 21 and the first extension section 23. The first extension section 23 is thermally coupled to a heat source 30. The second heat pipe 40 is spatially corresponding to the first heat pipe 20, is arranged on the second heat conduction part 12, and is coupled to the heat source 30 through the heat conduction unit 10 and the first heat pipe 20.

[0084] Figure 2 To disclose an exemplary structure of the connection between the first hollow part and the first heat pipe of the present utility model. In this embodiment, the heat conduction unit 10 further includes a protective layer 15, and the protective layer 15 is arranged between the first hollow part 111 and the first horizontal section 21 of the first heat pipe 20. The protective layer 15 is formed of a heat-conducting material, for example, and its thickness can be adjusted according to actual application requirements. The first horizontal section 21 of the first heat pipe 20 can be tightly fitted in the first hollow part 111 through the protective layer 15. Of course, the cross-sectional shapes of the first hollow part 111, the protective layer 15, and the first heat pipe 20 can be adjusted according to actual application requirements, and the present utility model is not limited thereto.

[0085] Reference Figure 1 And Figure 2In this embodiment, the first heat conduction part 11 of the heat conduction unit 10 is disposed at the side edge 71 of the bottom plate 70 of, for example, a laptop or a mobile phone. The first extension section 23, the first bending section 22 and the heat source 30 of the first heat pipe 20 are fixed to the bottom plate 70. In this embodiment, the thermal hinge structure 1 further includes a first fixing part 13. The first fixing part 13 is connected to the first heat conduction part 11 and is embedded in the bottom plate 70, so that the first heat conduction part 11 can be adjacent to the side edge 71 of the bottom plate 70. In other words, the first fixing part 13, the first extension section 23 and the first bending section 22 of the first heat pipe 20 and the heat source 30 are fixed to the bottom plate 70. The first heat conduction part 11, the first fixing part 13, the first heat pipe 20 (including the first horizontal section 21, the first bending section 22 and the first extension section 23) and the heat source 30 do not rotate relative to the bottom plate 70. In addition, in this embodiment, the second heat conduction part 12 is connected to the screen 80 of, for example, a laptop or a mobile phone, and the second heat conduction part 12 and the second heat pipe 40 are fixed to the screen 80. The thermal hinge structure 1 further includes a second fixing part 14. The second fixing part 14 is connected to the second heat conduction part 12 and is embedded in the screen 80, and the second fixing part 14 is adjacent to the side edge 81 of the screen 80. In this embodiment, the second heat pipe 40 further includes a second horizontal section 41, a second extension section 43 and a second bending section 42. The second horizontal section 41 is arranged parallel to the first axis C1. The second bending section 42 is connected between the second heat conduction part 12 and the second extension section 43. The second extension section 43 is thermally coupled to a heat sink 31. The second heat conduction part 12, the second fixing part 14, the second heat pipe 40 and the heat sink 31 are fixed to the screen 80. Thus, the second heat conduction part 12, the second fixing part 14, the second heat pipe 40 and the heat sink 31 on the screen 80 are allowed to rotate relative to the first heat conduction part 11, the first fixing part 13, the first heat pipe 20 (including the first horizontal section 21, the first bending section 22 and the first extension section 23) and the heat source 30 on the bottom plate 70 with the first axis C1 as the center. On the other hand, the heat sink 31 is thermally coupled to the heat source 30 through the second heat pipe 40, the heat conduction unit 10 and the first heat pipe 20, which can reduce the thermal resistance and temperature difference from the bottom plate 70 to the screen 80, and further greatly improve the heat dissipation efficiency of the product. Among them, the heat sink 31 can be a heat sink fin, a copper sheet or a graphite sheet.

[0086] In this embodiment, the thermal hinge structure 1 further includes a structural support hinge structure 9, and the structural support hinge structure 9 is disposed outside the two opposite ends of the thermal hinge structure 1. In other words, the thermal hinge structure 1 of the present invention can be combined with a hinge providing general structural support. The structural support hinge structure 9 is provided on the left and right sides of a laptop or a mobile phone to provide strength support for the opening and closing rotation of the screen 80 relative to the bottom plate 70, and the thermal hinge structure 1 of the present invention can be disposed inside the structural support hinge structure 9 to provide a high heat conduction path between the bottom plate 70 (heat source 30) and the screen 80. By separately designing the thermal hinge structure 1 and the structural support hinge structure 9, the feasibility and reliability of the thermal hinge structure 1 can be improved. Of course, the thermal hinge structure 1 of the present invention can also be independently provided, omitting the structural support hinge structure 9, to provide a high heat conduction path between the bottom plate 70 (heat source 30) and the screen 80. The present invention is not limited thereto.

[0087] In this embodiment, the heat conduction unit 10 is composed of a high thermal conductivity material, and the high thermal conductivity material includes copper, copper alloy, aluminum or aluminum alloy. The thermal conductivity coefficient range of the high thermal conductivity material is between 200 W / m·K and 400 W / m·K. In this embodiment, the first heat pipe 20 includes a capillary structure 200 disposed on the inner wall surface of the first heat pipe 20, and the second heat pipe 40 includes a capillary structure 400 disposed on the inner wall surface of the second heat pipe 40. In this embodiment, the first heat pipe 20 further has an outer bending region 22a and an inner bending region 22b at the first bending section 22. The outer bending region 22a faces away from the heat source 30, the inner bending region 22b is close to the heat source 30, and the capillary structure density of the inner bending region 22b is greater than that of the outer bending region 22a. Similarly, the second heat pipe 40 further has an outer bending region 42a and an inner bending region 42b at the second bending section 42. The outer bending region 42a faces away from the heat sink 31, the inner bending region 42b is close to the heat sink 31, and the capillary structure density of the inner bending region 42b is greater than that of the outer bending region 42a. Thus, the thermal hinge structure 1 of the present invention adopts a single pivot heat conduction unit 10 combined with the first heat pipe 20 and the second heat pipe 40 to form an optimized heat conduction path. The first fixing portion 13 connecting the first heat conduction portion 11 is bent and fixed to the bottom plate 70 in cooperation with the first heat pipe 20 and is assembled and thermally coupled to the heat source 30, and the second fixing portion 14 connecting the second heat conduction portion 12 is fixed to the screen 80 in cooperation with the second heat pipe 40 and is assembled and thermally coupled to the heat sink 31. A high heat conduction path is formed between the first fixing portion 13 and the second fixing portion 14 by means of the connection of the heat conduction unit 10, and the thermal conductivity coefficient K>200 W / m·K, which can ensure that the heat from the heat source 30 of the bottom plate 70 is effectively conducted to the heat sink 31 through the first heat pipe 20, the heat conduction unit 10, and the second heat pipe 40, and the heat is evenly distributed on the screen 80 to make the screen 80 reach an even temperature effect.

[0088] In this embodiment, in the heat conduction path from the heat source 30 to the heat sink 31, the portion where the first heat pipe 20 contacts the heat source 30 can be defined as the evaporation end 24, and the portion where it contacts the first hollow portion 111 of the first heat conduction portion 11 can be defined as the condensation end 25. Additionally, the portion where the second heat pipe 40 contacts the second fixing portion 14 can be defined as the evaporation end 44, and the portion where it contacts the heat sink 31 can be defined as the condensation end 45. It should be noted that in the optimized heat conduction path formed by the thermal hinge structure 1 of the present utility model, the temperature difference between the heat source 30 and the evaporation end 24 of the first heat pipe 20 is less than 5 °C, the temperature difference between the evaporation end 24 and the condensation end 25 of the first heat pipe 20 is less than 3 °C, and the temperature difference between the condensation end 25 of the first heat pipe 20 and the heat conduction unit 10 is less than 3 °C. The temperature difference between the heat conduction unit 10 and the second fixing portion 14 is less than 8 °C, the temperature difference between the second fixing portion 14 and the evaporation end 44 of the second heat pipe 40 is less than 3 °C, the temperature difference between the evaporation end 44 and the condensation end 45 of the second heat pipe 40 is less than 3 °C, and the temperature difference between the condensation end 45 of the second heat pipe 40 and the heat sink 31 is less than 5 °C. Thus, the heat conduction unit 10 composed of the first heat pipe 20, the second heat pipe 40, and the high heat transfer material can effectively conduct and distribute the heat source 30 to the hinge application products, further improving the power consumption of the passive cooling system (from 12 W to 18 - 30 W). Furthermore, the thermal hinge structure 1 of the present utility model can effectively disperse the system heat source 30 of the bottom plate 70 to the screen 80, and utilize the large area advantage of the screen 80 as a heat sink, further improving the overall power of the system. It can be applied to products such as mobile phones, notebooks, tablets, and foldable screens. Of course, the present utility model is not limited thereto.

[0089] Figure 3To disclose a schematic structural diagram of the thermal hinge structure according to the second embodiment of the present utility model. In this embodiment, the present utility model provides a thermal hinge structure 1a, which includes a heat conduction unit 10a, a first heat pipe 20, and a second heat pipe 40. The heat conduction unit 10a has a first heat conduction portion 11, a rotation unit 17, and a second heat conduction portion 12. The first heat conduction portion 11 has a first hollow portion 111, and the first hollow portion 111 is arranged along a first axis C1. The second heat conduction portion 12 is arranged along a second axis C2, and the first axis C1 and the second axis C2 are parallel to each other. The rotation unit 17 is, for example, a gear set, and is connected between the first heat conduction portion 11 and the second heat conduction portion 12. The first heat pipe 20 is embedded in the first hollow portion 111 along the first axis C1. In this embodiment, the first heat pipe 20 further has a first horizontal section 21, a first bending section 22, and a first extension section 23. The first horizontal section 21 is embedded in the first hollow portion 111 along the first axis C1. The first bending section 22 is connected between the first horizontal section 21 and the first extension section 23, and the first extension section 23 is thermally coupled to a heat source 30. The rotation unit 17 is connected between the first heat conduction portion 11 and the second heat conduction portion 12, and the second heat conduction portion 12 is allowed to rotate relative to the first heat conduction portion 11 by an angle through the rotation unit 17. The angle range is between 0° and 360°. In addition, the second heat conduction portion 12 has a second hollow portion 121, and the second heat pipe 40 is spatially corresponding to the first heat pipe 20 and is embedded in the second hollow portion 121 of the second heat conduction portion 12 along the second axis C2. In this embodiment, the heat conduction unit 10a further includes protective layers 15 and 16. The protective layer 15 is arranged between the first hollow portion 111 and the first heat pipe 20, and the protective layer 16 is arranged between the second hollow portion 121 and the second heat pipe 40. In this embodiment, the second heat pipe 40 is thermally coupled to the heat source 30 through the second heat conduction portion 12, the rotation unit 17, the first heat conduction portion 11, and the first heat pipe 20.

[0090] In this embodiment, the thermal hinge structure 1a further includes a first fixing portion 13. The first fixing portion 13 is connected to the first heat conduction portion 11 and is embedded in a bottom plate 70 of, for example, a laptop or a mobile phone, such that the first heat conduction portion 11 is adjacent to a side edge 71 of the bottom plate 70. The first heat conduction portion 11, the first fixing portion 13, the first heat pipe 20 (including a first horizontal section 21, a first bending section 22, and a first extension section 23), and the heat source 30 are fixed on the bottom plate 70 and will not rotate relative to the bottom plate 70. In this embodiment, the thermal hinge structure 1a further includes a second fixing portion 14. The second fixing portion 14 is connected to the second heat conduction portion 12 and is embedded in a screen 80 of, for example, a laptop or a mobile phone, such that the second heat conduction portion 12 is adjacent to a side edge 81 of the screen 80. In this embodiment, the second heat pipe (40) further includes a second horizontal section 41, a second bending section 42, and a second extension section 43. The second horizontal section 41 is embedded in the second hollow portion 121 along a second axis C2. The second bending section 42 is connected between the second horizontal section 41 and the second extension section 43. The second extension section 43 is thermally coupled to the heat sink 31. The second heat conduction portion 12, the second fixing portion 14, the second heat pipe 40, and the heat sink 31 are fixed on the screen 80 and are allowed to rotate relative to the bottom plate 70 by an angle from 0° to 360°.

[0091] In this embodiment, the rotating unit 17 is allowed to rotate relative to the first heat conduction portion 11 centered on a first axis C1. The second heat conduction portion 12 is allowed to rotate centered on a second axis C2. The first axis C1 and the second axis C2 are parallel to each other. Thus, the second heat conduction portion 12 can rotate relative to the first heat conduction portion 11, and the rotating unit 17 provides the connection and mutual rotation between the first heat conduction portion 11 and the second heat conduction portion 12, realizing the rotation of the screen 80 relative to the bottom plate 70 by an angle from 0° to 360°. In one embodiment, the screen 80 acts through the first heat conduction portion 11, the rotating unit 17, and the second heat conduction portion 12 and is allowed to rotate relative to the bottom plate 70 by an angle to 0°, such that the screen 80 and the bottom plate 70 are closed face to face. In another embodiment, the screen 80 acts through the first heat conduction portion 11, the rotating unit 17, and the second heat conduction portion 12 and is allowed to rotate relative to the bottom plate 70 by an angle to 360°, such that the screen 80 and the bottom plate 70 are completely unfolded and attached back to back. In other embodiments, the angle by which the screen 80 rotates relative to the bottom plate 70 can be adjusted according to actual application requirements without affecting the heat transfer effect between the second heat conduction portion 12 and the first heat conduction portion 11. In this embodiment, the first heat conduction portion 11 and the second heat conduction portion 12 are allowed to rotate relative to each other through the setting of the rotating unit 17 and can perform a flipping motion from 0° to 360°. Of course, the manner in which the first heat conduction portion 11 and the second heat conduction portion 12 rotate relative to each other through the rotating unit 17 can also be adjusted according to actual application requirements, and the present invention is not limited thereto.

[0092] In this embodiment, the thermal hinge structure 1a also includes a structural support hinge structure 9, which is disposed outside the two opposite ends of the thermal hinge structure 1a to provide strength support for the opening and closing rotation of the screen 80 relative to the bottom plate 70. The thermal hinge structure 1a of the present invention can be disposed inside the structural support hinge structure 9 to provide a high heat conduction path between the bottom plate 70 (heat source 30) and the screen 80. By separately designing the thermal hinge structure 1a and the structural support hinge structure 9, the feasibility and reliability of the thermal hinge structure 1a can be improved. Of course, the present invention is not limited thereto.

[0093] In this embodiment, the heat conduction units 10a are all composed of high thermal conductivity materials such as copper, copper alloy, aluminum or aluminum alloy, and the thermal conductivity coefficient ranges between 200 W / m·K and 400 W / m·K. In this embodiment, the first heat pipe 20 includes a capillary structure 200 disposed on the inner wall surface of the first heat pipe 20, and the second heat pipe 40 includes a capillary structure 400 disposed on the inner wall surface of the second heat pipe 40. In this embodiment, the first heat pipe 20 further has an outer bending region 22a and an inner bending region 22b at the first bending section 22. The outer bending region 22a faces away from the heat source 30, and the inner bending region 22b is close to the heat source 30. The capillary structure density of the inner bending region 22b is greater than that of the outer bending region 22a. Similarly, the second heat pipe 40 further has an outer bending region 42a and an inner bending region 42b at the second bending section 42. The outer bending region 42a faces away from the heat sink 31, and the inner bending region 42b is close to the heat sink 31. The capillary structure density of the inner bending region 42b is greater than that of the outer bending region 42a. Thus, the thermal hinge structure 1a of the present invention adopts a double pivot and double heat pipe to form an optimized heat conduction path, and the thermal conductivity coefficient K>200 W / m·K, which can ensure that the heat source 30 from the bottom plate 70 is effectively conducted to the heat sink 31 through the first heat pipe 20, the first heat conduction part 11, the rotating unit 17, the second heat conduction 12, and the second heat pipe 40, and the heat is evenly distributed on the screen 80 to make the screen 80 reach an isothermal effect.

[0094] In this embodiment, the capillary structure 200 in the first heat pipe 20 and the capillary structure 400 in the second heat pipe 40 can be further adjusted according to the position of the heat transfer path. In this embodiment, the contact portion of the first extension section 23 of the first heat pipe 20 with the heat source 30 can be defined as the evaporation end 24, and the contact portion of the first horizontal section 21 with the first hollow portion 111 can be defined as the condensation end 25. In an embodiment, the cross-section of the first heat pipe 20 at the evaporation end 24 is, for example, a flat long oval, and the internal microstructure is composed of a grid 241 and fibers 242, which are disposed in the middle, as Figure 4A shown. In addition, the cross-section of the first heat pipe 20 at the condensation end 25 is also, for example, a flat long oval, and the internal microstructure is composed of fibers 251, which are disposed in the middle, as Figure 4BAs shown. In another embodiment, the cross-section of the first heat pipe 20 at the evaporation end 24 is, for example, a flat oval, and the internal microstructure is composed of grooves 243 and sintered powder 244, as Figure 4C shown. In addition, the cross-section of the first heat pipe 20 at the condensation end 25 is circular, and the internal microstructure is composed of grooves 252 and sintered powder 253, as Figure 4D shown. In yet another embodiment, the cross-section of the first heat pipe 20 at the evaporation end 24 is, for example, slightly flat, and the internal microstructure is composed of sintered powder 244, as Figure 4E shown. In addition, the cross-section of the first heat pipe 20 at the condensation end 25 is circular, and the internal microstructure is composed of sintered powder 253, as Figure 4F shown. In this embodiment, the evaporation end 44 and the condensation end 45 of the second heat pipe 40 can also change the internal microstructure as described above for the first heat pipe 20.

[0095] In addition, the capillary structure 200 in the first heat pipe 20 and the capillary structure 400 in the second heat pipe 40 can also adjust the capillary structure density according to the position. Figures 5A to 5D To disclose an exemplary capillary structure density of the heat pipe of the present invention. Refer to Figure 1 and Figures 5A to 5D . In this embodiment, taking the first heat pipe 20 as an example, both the first horizontal section 21 and the first extension section 23 are straight pipes, and the capillary structure 200 is uniformly distributed. The uniformly distributed capillary structure 200 can be arranged in the middle (as Figure 5A shown), or arranged throughout the pipe (as Figure 5B shown). In this embodiment, in the first bending section 22 of the first heat pipe 20, the capillary structure density in the inner bending area 22b is greater than that in the outer bending area 22a. The capillary structure 200 can be arranged in the middle (as Figure 5C shown), or arranged throughout the pipe (as Figure 5DAs shown). The capillary structure 200 within the first bending section 22 can be formed, for example, by bending a straight tube. After bending the tube, the density of the capillary structure in the inner bending region 22b will be denser than before bending, which can provide a greater capillary force than that of the straight tube. Also, the inner path within the inner bending region 22b of the bent tube is squeezed and shortened, while the density of the capillary structure in the outer bending region 22a of the bent tube will be sparser than before bending, and the capillary force is also smaller than that of the straight tube capillary force. The path of the outer bending region 22a will also be stretched and become longer. In this embodiment, bending the first heat pipe 20 to form the first bending section 22 will cause differences in capillary density and path compared to the first horizontal section 21 or the first extension section 23 of the straight tube structure, indirectly affecting the capillary performance. Of course, as the connection between the condensation end 25 and the evaporation end 24, the lengths, quantities, and capillary structure densities of the first extension section 23 and the first bending section 22 can be adjusted according to actual application requirements. In this embodiment, the density change of the capillary structure 200 within the first bending section 22 can also decrease linearly from the inner bending region 22b to the outer bending region 22a to control the overall performance of the capillary structure 200. In other embodiments, the first heat pipe 20 or the second heat pipe 40 can reduce the bending of the tube or avoid large-angle bending of the tube to reduce the change in capillary performance.

[0096] The present utility model is not limited thereto.

[0097] In addition, it should be noted that in this embodiment, the thermal hinge structure 1a adopts a double pivot combined with a heat pipe design. The first heat conduction part 11 is combined with the first heat pipe 20, and the second heat conduction part 12 is combined with the second heat pipe 40 to form two parallel heat conduction pivots. The first heat pipe 20 and the second heat pipe 40 form a spacing distance D from each other, and the spacing distance D is maintained to be less than 15 mm. The best heat dissipation path can be provided between the first heat conduction part 11 and the second heat conduction part 12, for example, through the rotation unit 17 of an integral gear set. When the spacing distance D between the first heat pipe 20 and the second heat pipe 40 is less than 15 mm, the temperature difference between the first heat conduction part 11 and the second heat conduction part 12 can be controlled to be less than 10 °C. In this embodiment, the first fixing part 13 is bent and fixed on the bottom plate 70 in cooperation with the first heat pipe 20 and is assembled and thermally coupled to the heat source 30, and the second fixing part 14 is fixed to the screen 80 in cooperation with the second heat pipe 40 and is assembled and thermally coupled to the heat sink 31. In addition, the thermal hinge structure 1a is made of a high thermal conductivity material, such as copper, copper alloy, aluminum, or aluminum alloy. Thus, a high thermal conductivity path can be formed from the heat source 30 through the first heat pipe 20, the first heat conduction part 11, the rotation unit 17, the second heat conduction part 12, the second heat pipe 40, and the screen 80. The temperature difference between the heat source 30 and the evaporation end 24 of the first heat pipe 20 is less than 5 °C, the temperature difference between the evaporation end 24 and the condensation end 25 of the first heat pipe 20 is less than 3 °C, and the temperature difference between the condensation end 25 of the first heat pipe 20 and the heat conduction unit 10a is less than 3 °C. The temperature difference between the hollow part 11 and the rotation part 12 is less than 10 °C, the temperature difference between the rotation part 12 and the evaporation end 44 of the second heat pipe 40 is less than 3 °C, the temperature difference between the evaporation end 44 and the condensation end 45 of the second heat pipe 40 is less than 3 °C, and the temperature difference between the condensation end 45 of the second heat pipe 40 and the heat sink 31 is less than 5 °C. Thus, the temperature difference between any two components can be maintained to be less than 10 °C, effectively improving the overall passive heat dissipation efficiency of the system. Of course, the present utility model is not limited thereto, and details are not described herein again.

[0098] In summary, the present utility model provides a thermal hinge structure for enhancing passive heat dissipation efficiency. By combining at least one pivot with a heat pipe, the thermal resistance and temperature difference from the bottom plate end where the keyboard is located to the screen end can be reduced, thereby significantly improving the heat dissipation efficiency of the product. The thermal hinge structure of the present utility model can be combined with a general hinge that provides structural support. The general hinge is arranged on the left and right sides of a laptop or mobile phone to provide strong support for the opening and closing rotation of the screen, while the thermal hinge structure can be arranged inside the general hinge to provide a high heat conduction path between the bottom plate (heat source) and the screen. Furthermore, the thermal hinge structure of the present utility model can also be independently arranged to provide a high heat conduction path between the bottom plate (heat source) and the screen. The thermal hinge structure can adopt a single pivot or a double pivot combined with a heat pipe to form a heat conduction unit. The fixing part at one end is bent and fixed on the bottom plate in cooperation with the heat pipe and assembled and thermally coupled to the heat source, while the fixing part at the other end is fixed to the screen in cooperation with the heat pipe and assembled and thermally coupled to the heat sink. The middle of the two fixing parts is connected by a heat conduction unit to form a high heat conduction path, and the heat conduction coefficient K>200W / m·K, which can ensure effective conduction from the heat source at the bottom plate through the heat pipe, heat conduction unit, screen end heat pipe or other heat equalizing components, and evenly distribute the heat on the screen to make the screen reach an isothermal effect. On the other hand, the separate design of the thermal hinge structure from the traditional support hinge can improve the feasibility and reliability of the thermal hinge structure. The heat conduction unit composed of a heat pipe and a high heat transfer material can effectively conduct and distribute the "heat source" to the hinge application product, further improving the power consumption of the passive heat dissipation system (from 12W to 18 - 30W). Furthermore, the thermal hinge structure of the present utility model can effectively disperse the heat source of the bottom plate system to the screen end, and utilize the large area advantage of the screen as a heat sink, further improving the overall power of the system. It can be applied to products such as mobile phones, NB, tablets, and foldable screens. The thermal hinge structure can adopt a double pivot combined with a heat pipe to form two parallel heat conduction parts, and the distance between them is maintained within 15mm. The fixing part connecting the hollow part is bent and fixed on the bottom plate in cooperation with the first heat pipe and assembled and thermally coupled to the heat source, while the fixing part connecting the rotating part is fixed to the screen in cooperation with the second heat pipe and assembled and thermally coupled to the heat sink. The first heat conduction part and the second heat conduction part are connected by a rotating unit and can perform a 0° to 360° flipping motion. In addition, the thermal hinge structure is made of high thermal conductivity materials such as copper, copper alloy, aluminum, and aluminum alloy. Thus, a high heat conduction path can be formed from the heat source through the first heat pipe, heat conduction unit, second heat pipe, and screen, and the temperature difference between any two components can be maintained at less than 10°C, effectively improving the overall passive heat dissipation efficiency of the system.

[0099] The present utility model can be variously modified by those skilled in the art, but all such modifications do not depart from the scope of protection as defined by the appended claims.

Claims

1. A thermal hinge structure, characterized in that, Comprising: A heat conduction unit having a first heat conduction part and a second heat conduction part, wherein the first heat conduction part has a first hollow part which is arranged along a first axis, and the second heat conduction part is assembled to rotate relative to the first hollow part with the first axis as the center; A first heat pipe having a horizontal section, a bent section and an extension section, wherein the horizontal section is embedded in the first hollow part along the first axis, the bent section is connected between the horizontal section and the extension section, and the extension section is thermally coupled to a heat source; and A second heat pipe which is arranged on the second heat conduction part and is thermally coupled to the heat source through the heat conduction unit and the first heat pipe.

2. The thermal hinge structure according to claim 1, wherein The heat conduction unit further includes a protective layer which is arranged between the first hollow part and the first heat pipe.

3. The thermal hinge structure according to claim 1, wherein The first heat conduction part is arranged on the side edge of a bottom plate, the extension section of the first heat pipe and the heat source are fixed on the bottom plate, the second heat conduction part is connected to a screen, and the second heat conduction part and the second heat pipe are fixed on the screen.

4. The thermal hinge structure according to claim 3, characterized in that, The second heat conduction part has a second hollow part, the second heat pipe further includes a horizontal section, a bent section and an extension section, the bent section is connected between the horizontal section and the extension section, the horizontal section is embedded in the second hollow part, and the extension section is thermally coupled to a heat sink which is arranged on the screen.

5. The thermal hinge structure according to claim 1, wherein The first heat pipe and the second heat pipe respectively include a capillary structure which is arranged on the inner wall surface of the first heat pipe and the inner wall surface of the second heat pipe.

6. The thermal hinge structure according to claim 5, wherein The bent section of the first heat pipe has an outer bending area and an inner bending area, and the capillary structure density of the inner bending area is greater than that of the outer bending area.

7. The thermal hinge structure according to claim 6, wherein, The capillary structure density of the inner bending area decreases linearly towards the outer bending area.

8. The thermal hinge structure according to claim 1, wherein Further included is a first fixing part which connects the first heat conduction part and is embedded in a bottom plate, the first heat conduction part is adjacent to the side edge of the bottom plate, and the first fixing part, the extension section of the first heat pipe and the heat source are fixed on the bottom plate.

9. The thermal hinge structure according to claim 8, characterized in that Further included is a second fixing part which connects the second heat conduction part and is embedded in a screen, the second fixing part is adjacent to the side edge of the screen, wherein the second heat conduction part has a second hollow part, the second heat pipe further includes a horizontal section, a bent section and an extension section, the bent section is connected between the horizontal section and the extension section, the horizontal section is embedded in the second hollow part, and the extension section is thermally coupled to a heat sink which is arranged on the screen.

10. A thermal hinge structure, characterized in that, Comprising: A heat conduction unit having a first heat conduction part, a rotating unit and a second heat conduction part, wherein the first heat conduction part has a first hollow part which is arranged along a first axis, the second heat conduction part is arranged along a second axis, the first axis and the second axis are parallel to each other, and the rotating unit is connected between the first heat conduction part and the second heat conduction part; A first heat pipe having a horizontal section, a bent section and an extension section, wherein the horizontal section is embedded in the first hollow part along the first axis, the bent section is connected between the horizontal section and the extension section, and the extension section is thermally coupled to a heat source; and A second heat pipe is disposed on the second heat conduction part, wherein the second heat pipe is thermally coupled to the heat source through the second heat conduction part, the rotation unit, the first heat conduction part, and the first heat pipe.

11. The thermal hinge structure according to claim 10, wherein, The first heat pipe and the second heat pipe form a spacing distance, and the spacing distance is less than 15 mm.

12. The thermal hinge structure according to claim 10, characterized in that, The heat conduction unit further includes a protective layer, and the protective layer is disposed between the first hollow part and the first heat pipe.

13. The thermal hinge structure according to claim 10, wherein, It further includes a first fixing part, the first fixing part connects the first heat conduction part and is embedded in a bottom plate, the first heat conduction part is adjacent to the side edge of the bottom plate, and the first fixing part, the extending section of the first heat pipe, and the heat source are fixed on the bottom plate.

14. The thermal hinge structure according to claim 10, characterized in that, It further includes a second fixing part, the second fixing part connects the second heat conduction part and is embedded in a screen, the second heat conduction part is adjacent to the side edge of the screen, wherein the second heat conduction part has a second hollow part, the second heat pipe further includes a horizontal section, a bending section, and an extending section, the horizontal section is embedded in the second hollow part along the second axis, the bending section is connected between the horizontal section and the extending section, the extending section is thermally coupled to a heat sink, and the horizontal section, the extending section of the second heat pipe, and the heat sink are fixed on the screen.

15. The thermal hinge structure according to claim 10, characterized in that, The rotation unit is a gear set, and the second heat conduction part is allowed to rotate relative to the first heat conduction part by an angle through the gear set, and the angle range is between 0° and 360°.

16. The thermal hinge structure according to claim 10, characterized in that, The heat conduction unit is made of a high thermal conductivity material, and the thermal conductivity coefficient range of the high thermal conductivity material is between 200 W / m·K and 400 W / m·K.

17. The thermal hinge structure according to claim 10, wherein It further includes a structural support hinge structure, and the structural support hinge structure is disposed outside two opposite ends of the thermal hinge structure.

18. The thermal hinge structure according to claim 10, wherein, The first heat pipe and the second heat pipe respectively include a capillary structure, and the capillary structure is disposed on the inner wall surface of the first heat pipe and the inner wall surface of the second heat pipe.

19. The thermal hinge structure according to claim 18, characterized in that, The bending section of the first heat pipe has an outer bending area and an inner bending area, and the capillary structure density of the inner bending area is greater than that of the outer bending area.

20. The thermal hinge structure according to claim 19, wherein The capillary structure density of the inner bending area decreases linearly towards the outer bending area.

21. The thermal hinge structure according to claim 11, wherein, The temperature difference between the heat source and the first heat pipe, the temperature difference between the first heat pipe and the first heat conduction part, and the temperature difference between the second heat conduction part and the second heat pipe are less than 5 °C.

22. The thermal hinge structure according to claim 11, wherein, The cross sections of the first heat pipe and the second heat pipe are circular or flat oval, and include internal microstructures composed of grids, fibers, grooves, or sintered powders.

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