High-temperature-resistant capacitor

Abstract

The high-temperature-resistant capacitor comprises a shell, a core package, a top cover and a heat conduction assembly, a containing cavity is defined in the shell, and an opening communicated with the containing cavity is formed in the top of the shell; the core package is mounted in the accommodating cavity, and the end part, facing the opening, of the core package is provided with a first terminal and a second terminal; the top cover is fixedly installed at the top of the shell, a positive terminal and a negative terminal are arranged on the top cover, and the positive terminal and the negative terminal are used for being connected with the first terminal and the second terminal respectively; the heat conduction assembly comprises a heat conduction shell and heat conduction liquid, the heat conduction shell surrounds the core cladding, the surface, facing the core cladding, of the heat conduction shell makes contact with the two side faces and the bottom face of the core cladding, the surface, deviating from the core cladding, of the heat conduction shell makes contact with the outer shell, and the heat conduction liquid is arranged in the heat conduction shell. According to the technical scheme of the embodiment, the heat generated by the core package is transferred to the shell through the heat conduction liquid, compared with a traditional capacitor, the heat dissipation effect is better, and the service life of the capacitor can be effectively prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a high-temperature resistant capacitor. Background Art

[0002] Capacitors are often referred to as "capacitance," representing their ability to hold charge, and are represented by the letter "C." As the name suggests, a capacitor is a container for electricity, a device that holds charge. Capacitors are one of the most widely used electronic components in electronic devices, and are widely used in circuits for DC isolation, AC passing, coupling, bypassing, filtering, tuning circuits, energy conversion, and control.

[0003] Capacitors are widely used as components in equipment across various industries. With the continuous advancement of technology, equipment technology continues to improve, especially with the large-scale use of power electronic devices, which places increasingly stringent requirements on the operating environment of capacitors. The charging and discharging process of capacitors can cause the core temperature to rise. However, existing capacitors have poor heat dissipation, which not only affects the performance of the capacitors but also shortens their service life. Utility Model Content

[0004] In order to solve the above technical problems or at least partially solve the above technical problems, the present application provides a high-temperature resistant capacitor.

[0005] The present application provides a high-temperature resistant capacitor, comprising:

[0006] A housing defines an accommodating cavity therein, and an opening communicating with the accommodating cavity is formed at the top of the housing;

[0007] A core pack is installed in the accommodating cavity, and a first terminal and a second terminal are provided at an end of the core pack facing the opening;

[0008] a top cover fixedly mounted on the top of the housing, the top cover being provided with a positive electrode terminal and a negative electrode terminal, the positive electrode terminal and the negative electrode terminal being respectively used to be connected to the first terminal and the second terminal;

[0009] a heat-conducting assembly comprising a heat-conducting shell and a heat-conducting fluid, wherein the heat-conducting shell is disposed outside the core package, and a surface of the heat-conducting shell facing the core package contacts the two side surfaces and the bottom surface of the core package, and a surface of the heat-conducting shell facing away from the core package contacts the outer shell, and the heat-conducting fluid is disposed inside the heat-conducting shell;

[0010] Wherein, when the core package generates heat, the heat is conducted to the heat-conducting shell, and then conducted to the outer shell via the heat-conducting liquid for rapid heat dissipation.

[0011] In a possible implementation, a plurality of elastic heat-conducting protrusions are distributed at intervals on the outer surface of the heat-conducting shell, and the heat-conducting protrusions are in contact with the inner surface of the shell.

[0012] In a possible implementation, the shell is made of aluminum alloy.

[0013] In a possible implementation, a connecting ring is provided at the lower part of the top cover. An external thread is provided on the outer surface of the connecting ring, and an internal thread connected to the external thread is provided on the inner wall of the top of the shell.

[0014] In a possible implementation, a first mounting position and a second mounting position are respectively provided on the upper surface of the top cover. A first mounting block is integrally connected to the lower end of the negative terminal. The negative terminal is fixed in the first mounting position through the first mounting block, so that the negative terminal is fixed on the top cover. A second mounting block is integrally connected to the lower end of the positive terminal. The positive terminal is fixed in the second mounting position through the second mounting block, so that the positive terminal is fixed on the top cover.

[0015] In a possible implementation, a first limiting block, a second limiting block and a third limiting block are sequentially arranged at intervals on the upper surface of the top cover. A first mounting position is defined between the first limiting block and the second limiting block, and a second mounting position is defined between the second limiting block and the third limiting block.

[0016] In a possible implementation, a first fixing column and a second fixing column with conductivity are further included. A first mounting hole and a second mounting hole are respectively provided on the top cover;

[0017] A third mounting hole adapted to the first mounting hole is provided on the first mounting block. The negative terminal is fixed on the top cover through the first fixing column sequentially passing through the first mounting hole and the third mounting hole, and the first fixing column is in contact with the first terminal;

[0018] A fourth mounting hole adapted to the second mounting hole is provided on the second mounting block. The positive terminal is fixed on the top cover through the second fixing column sequentially passing through the second mounting hole and the fourth mounting hole, and the second fixing column is in contact with the second terminal.

[0019] In a possible implementation, an anti-slip pad is provided on the bottom surface of the shell.

[0020] The above technical solution provided by the embodiments of the present application has the following advantages compared with the prior art:

[0021] By arranging a heat-conducting shell outside the core package and filling a heat-conducting liquid inside the heat-conducting shell, since the surface of the heat-conducting shell facing the core package is in contact with the two side surfaces and the bottom surface of the core package, and at the same time the outer surface of the heat-conducting shell is in contact with the outer shell, so that the heat generated by the core package can be sequentially transferred to the outer shell through the conduction of the heat-conducting shell and the heat-conducting liquid, and finally the heat is dissipated from the outer shell. Compared with traditional capacitors, it has a better heat dissipation effect and can effectively extend the service life of the capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings herein are incorporated into and constitute a part of this specification, showing embodiments consistent with the present invention and, together with the specification, are used to explain the principles of the present invention.

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] In the accompanying drawings:

[0025] Figure 1 is a schematic structural diagram of a high-temperature resistant capacitor of the present application;

[0026] Figure 2 is a schematic cross-sectional view of a high-temperature resistant capacitor of the present application;

[0027] Figure 3 is a schematic connection diagram of the outer shell and the top cover of a high-temperature resistant capacitor of the present application;

[0028] Figure 4 is a schematic structural diagram of the top cover of a high-temperature resistant capacitor of the present application.

[0029] Reference numerals in the drawings:

[0030] 10. Outer shell; 10a. Accommodation cavity; 20. Top cover; 30. Negative terminal; 40. Positive terminal; 50. Core package; 50a. First terminal; 60. Heat-conducting component; 61. Heat-conducting shell; 62. Heat-conducting liquid; 70. Heat-conducting protrusion; 80. Anti-slip pad; 90. Connection ring; 100. First fixing column; 200. Second fixing column; 300. First limiting block; 400. Second limiting block; 500. Third limiting block; 600. First mounting block; 700. Second mounting block. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0031] In order to have a clearer understanding of the technical features, objectives, and effects of the present utility model, the specific embodiments of the present utility model will now be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientation or positional relationships indicated by terms such as "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are based on the orientation or positional relationships shown in the drawings and are constructed and operated in a specific orientation, and are only for the convenience of describing the present technical solution, rather than indicating that the indicated devices or elements must have a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0032] It should also be noted that, unless otherwise clearly specified and limited, terms such as "installation", "connection", "attachment", "fixation", "setting" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located above the other element, or there may also be one or more intermediate elements. Terms such as "first", "second", "third", etc. are only for the convenience of describing the present technical solution and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", "third", etc. can explicitly or implicitly include one or more of such features. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0033] In the following description, for the purpose of illustration rather than limitation, specific details such as specific system structures, technologies, etc. are presented in order to thoroughly understand the embodiments of the present utility model. However, those skilled in the art should clearly understand that the present utility model can also be implemented in other embodiments without these specific details. In other cases, the detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present utility model.

[0034] Please refer to Figures 1 to 4 , this application provides a high-temperature resistant capacitor including a housing 10, a core package 50, a top cover 20, and a heat conduction component 60.

[0035] Specifically, an accommodating cavity 10a is defined inside the outer shell 10, and an opening communicating with the accommodating cavity 10a is formed at the top of the outer shell 10; the core package 50 is installed in the accommodating cavity 10a, and the end of the core package 50 facing the opening is provided with a first terminal 50a and a second terminal; the top cover 20 is fixedly installed on the top of the outer shell 10, and a positive terminal 40 and a negative terminal 30 are provided on the top cover 20, and the positive terminal 40 and the negative terminal 30 are respectively used to be connected to the first terminal 50a and the second terminal; the heat-conducting component 60 includes a heat-conducting shell 61 and a heat-conducting liquid 62, the heat-conducting shell 61 is arranged around the outside of the core package 50, and the surface of the heat-conducting shell 61 facing the core package 50 is in contact with the two side surfaces and the bottom surface of the core package 50, and the surface of the heat-conducting shell 61 facing away from the core package 50 is in contact with the outer shell 10, and the heat-conducting liquid 62 is provided inside the heat-conducting shell 61. When the core package 50 generates heat, the heat is transferred to the heat-conducting shell 61 and then transferred to the outer shell 10 via the heat-conducting fluid 62 for rapid heat dissipation.

[0036] For example, the housing 10 needs to have a certain degree of pressure resistance to withstand a certain degree of external compression, to avoid deformation of the housing 10 after being subjected to external compression, which may damage the core package 50. Furthermore, the housing 10 is required to have good thermal conductivity so that heat can be quickly dissipated after being transferred to the housing 10. To this end, the housing 10 can be made of metal. Specifically, in this embodiment, the housing 10 is made of aluminum alloy.

[0037] For example, the heat transfer fluid 62 is used to quickly transfer the heat transferred to the heat transfer housing 61 to the outer shell 10, thereby accelerating the heat dissipation in the accommodating cavity 10a. Specifically, the heat transfer fluid 62 can be water or a liquid used for heat dissipation in the prior art, without limitation.

[0038] The high-temperature capacitor based on the above technical features is configured with a heat-conducting shell 61 on the outside of the core package 50 and a heat-conducting liquid 62 filled inside the heat-conducting shell 61. Since the surface of the heat-conducting shell 61 facing the core package 50 is in contact with the two side surfaces and the bottom surface of the core package 50, and the outer surface of the heat-conducting shell 61 is in contact with the outer shell 10, the heat generated by the core package 50 can be transferred to the outer shell 10 through the conduction of the heat-conducting shell 61 and the heat-conducting liquid 62 in turn, and finally the heat is dissipated from the outer shell 10. Compared with traditional capacitors, the high-temperature capacitor has a better heat dissipation effect and can effectively extend the service life of the capacitor.

[0039] In a possible embodiment, a plurality of elastic heat-conducting protrusions 70 are spaced apart on the outer surface of the heat-conducting shell 61 , and the heat-conducting protrusions 70 abut against the inner surface of the outer shell 10 .

[0040] Exemplarily, due to excessive heat during the use of the core package 50, it is prone to expansion and continuously squeeze the heat conduction shell 61, which is likely to cause the heat conduction shell 61 and the outer shell 10 to squeeze each other. Therefore, by providing a plurality of elastic heat conduction protrusions 70 on the outer surface of the heat conduction shell 61, a certain buffering effect can be given to avoid damage to the core package 50 due to extrusion. At the same time, the heat conduction protrusions 70 can also be used to quickly conduct the heat on the heat conduction shell 61 to the outer shell 10 to achieve rapid heat dissipation.

[0041] In a possible implementation manner, a connection ring 90 is provided at the lower part of the top cover 20, and an external thread is provided on the outer surface of the connection ring 90. An internal thread connected to the external thread is provided on the inner wall of the top of the outer shell 10. In this way, the top cover 20 is detachably connected to the outer shell 10 by means of a threaded connection, with a simple structure and convenient disassembly and assembly.

[0042] In a possible implementation manner, a first mounting position and a second mounting position are respectively provided on the upper surface of the top cover 20. A first mounting block 600 is integrally connected to the lower end of the negative terminal 30 and is fixed in the first mounting position through the first mounting block 600 to fix the negative terminal 30 on the top cover 20. A second mounting block 700 is integrally connected to the lower end of the positive terminal 40 and is fixed in the second mounting position through the second mounting block 700 to fix the positive terminal 40 on the top cover 20. In this way, the negative terminal 30 and the positive terminal 40 are respectively fixed in the first mounting position and the second mounting position by using the first mounting block 600 and the second mounting block 700 to fix the negative terminal 30 and the positive terminal 40 on the top cover 20. Thus, when the top cover 20 is installed on the top of the outer shell 10, the negative terminal 30 and the positive terminal 40 can be connected to the first terminal 50a and the second terminal, with a simple structure and convenient connection.

[0043] In a possible implementation manner, a first limiting block 300, a second limiting block 400, and a third limiting block 500 are sequentially and spacedly provided on the upper surface of the top cover 20. A first mounting position is defined between the first limiting block 300 and the second limiting block 400, and a second mounting position is defined between the second limiting block 400 and the third limiting block 500.

[0044] In a possible implementation manner, it further includes a first fixing post 100 and a second fixing post 200 with electrical conductivity. The top cover 20 is respectively provided with a first mounting hole and a second mounting hole; the first mounting block 600 is provided with a third mounting hole adapted to the first mounting hole. The negative terminal post 30 is fixed on the top cover 20 by the first fixing post 100 passing through the first mounting hole and the third mounting hole in sequence, and the first fixing post 100 abuts against the first terminal 50a; the second mounting block 700 is provided with a fourth mounting hole adapted to the second mounting hole. The positive terminal post 40 is fixed on the top cover 20 by the second fixing post 200 passing through the second mounting hole and the fourth mounting hole in sequence, and the second fixing post 200 abuts against the second terminal.

[0045] In a possible implementation manner, the bottom surface of the housing 10 is provided with an anti-slip pad 80. In this way, it can effectively avoid the capacitor from tipping over due to sliding.

[0046] It can be understood that the above embodiments only represent the preferred implementation manners of the present utility model, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation to the patent scope of the present utility model; it should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, the above technical features can be freely combined, and several deformations and improvements can also be made, all of which belong to the protection scope of the present utility model; therefore, all equivalent transformations and modifications made to the scope of the claims of the present utility model shall fall within the scope covered by the claims of the present utility model.

Claims

1. A high-temperature resistant capacitor, characterized in that, include: A housing defines an accommodating cavity therein, and an opening communicating with the accommodating cavity is formed at the top of the housing; A core pack is installed in the accommodating cavity, and a first terminal and a second terminal are provided at an end of the core pack facing the opening; a top cover fixedly mounted on the top of the housing, the top cover being provided with a positive electrode terminal and a negative electrode terminal, the positive electrode terminal and the negative electrode terminal being respectively used to be connected to the first terminal and the second terminal; a heat-conducting assembly comprising a heat-conducting shell and a heat-conducting fluid, wherein the heat-conducting shell is disposed outside the core package, and a surface of the heat-conducting shell facing the core package contacts the two side surfaces and the bottom surface of the core package, and a surface of the heat-conducting shell facing away from the core package contacts the outer shell, and the heat-conducting fluid is disposed inside the heat-conducting shell; Wherein, when the core package generates heat, the heat is conducted to the heat-conducting shell, and then conducted to the outer shell via the heat-conducting liquid for rapid heat dissipation.

2. The high-temperature resistant capacitor according to claim 1, characterized in that, A plurality of elastic heat-conducting protrusions are distributed at intervals on the outer surface of the heat-conducting shell, and the heat-conducting protrusions are in contact with the inner surface of the outer shell.

3. The high-temperature resistant capacitor according to claim 1 or 2, characterized in that, The shell is made of aluminum alloy.

4. The high-temperature resistant capacitor according to claim 1, wherein, A connecting ring is provided at the lower portion of the top cover, an outer surface of the connecting ring is provided with an external thread, and an inner wall of the top of the shell is provided with an internal thread connected to the external thread.

5. The high-temperature resistant capacitor according to claim 4, wherein The upper surface of the top cover is respectively provided with a first mounting position and a second mounting position. The lower end of the negative electrode terminal is integrally connected with a first mounting block, and the first mounting block is fixed in the first mounting position so that the negative electrode terminal is fixed on the top cover. The lower end of the positive electrode terminal is integrally connected with a second mounting block, and the second mounting block is fixed in the second mounting position so that the positive electrode terminal is fixed on the top cover.

6. The high-temperature resistant capacitor according to claim 5, wherein, It also includes a first limit block, a second limit block and a third limit block which are sequentially spaced apart on the upper surface of the top cover, wherein the first limit block and the second limit block define a first installation position, and the second limit block and the third limit block define a second installation position.

7. The high-temperature resistant capacitor according to claim 5, characterized in that, It also includes a first fixing post and a second fixing post having conductivity, and the top cover is provided with a first mounting hole and a second mounting hole respectively; The first mounting block is provided with a third mounting hole adapted to the first mounting hole, the negative electrode terminal is fixed to the top cover via the first fixing post passing through the first mounting hole and the third mounting hole in sequence, and the first fixing post abuts against the first terminal; The second mounting block is provided with a fourth mounting hole adapted to the second mounting hole, the positive electrode terminal is fixed to the top cover through the second fixing post passing through the second mounting hole and the fourth mounting hole in sequence, and the second fixing post abuts against the second terminal.

8. The high-temperature resistant capacitor according to claim 1, wherein, The bottom surface of the shell is provided with an anti-slip pad.

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