Substrate processing apparatus

Abstract

The utility model provides a substrate processing device. The substrate processing apparatus includes a stage; a frame structure disposed on the stage and including a variable frame; a first pad disposed on a lower side of the frame structure; a second pad disposed on one side of the first pad; a fastening unit connecting the variable frame and the second pad between the variable frame and the second pad; and a transporter module disposed on one side of the second pad, in which the transporter module is configured to change a coupling position of the variable frame and the fastening unit.

Description

Technical Field

[0001] The utility model relates to a substrate processing device. Background Art

[0002] With the development of the information society, the demand for display devices for displaying images is increasing in various forms. The display device may be a flat panel display device such as a liquid crystal display device (Liquid Crystal Display), a field emission display device (Field Emission Display), a light emitting display device (Light Emitting Display), etc. The light emitting display device may include an organic light emitting display device including an organic light emitting diode element as a light emitting element, or a light emitting diode display device including an inorganic light emitting diode element such as an LED (Light Emitting Diode) as a light emitting element.

[0003] The display device can be manufactured by mounting light emitting elements on a substrate and connecting various electronic components for driving the light emitting elements through a printed circuit board. The shape and size of the display device may vary according to the types of products such as mobile phones, notebook computers, monitors, televisions, etc. The shape and size of the printed circuit board connected to the display device can also be variously deformed according to the shape and size of the display device.

[0004] Research related to a substrate processing device capable of transferring and processing a substrate according to the shapes and sizes of various display devices and printed circuit boards is being actively carried out. Summary of the Utility Model

[0005] Technical Problem

[0006] The technical problem to be solved by the utility model is to provide a substrate processing device that improves engineering efficiency and engineering yield by including an automatic variable device.

[0007] Another technical problem to be solved by the utility model is to provide a substrate processing device that minimizes equipment failures.

[0008] The technical problems of the utility model are not limited to the above-mentioned technical problems, and those skilled in the technical field to which the utility model belongs can clearly understand other technical problems not mentioned through the following description.

[0009] Technical Solution

[0010] A substrate processing apparatus according to an embodiment for solving the above technical problem includes: a stage; a frame structure disposed on the stage and including a variable frame; a first pad disposed on the lower side of the frame structure; a second pad disposed on one side of the first pad; a fastening unit connecting the variable frame and the second pad between the variable frame and the second pad; and a transporter module disposed on one side of the second pad, configured to change the coupling position of the fastening unit from one position of the variable frame to another position in a first direction, and the transporter module is configured to change the coupling position between the variable frame and the fastening unit.

[0011] The transporter module may include a fixing part configured to be coupled to the fastening unit, and the fixing part may be configured to be coupled to the fastening unit to separate the fastening unit from the variable frame.

[0012] The transporter module may include a first horizontal driving part connected to the fixing part, and the first horizontal driving part may be configured to move the fixing part in the first direction.

[0013] The fixing part may include a first clamp and a second clamp spaced apart in the first direction, the first horizontal driving part may drive the first clamp and the second clamp in the first direction, and the first clamp and the second clamp may be configured to be coupled to the fastening unit.

[0014] The transporter module may further include a second horizontal driving part connected to the first horizontal driving part, and the second horizontal driving part may be configured to move the first horizontal driving part in a second direction different from the first direction.

[0015] The transporter module may further include a third horizontal driving part connected to the second horizontal driving part, and the third horizontal driving part may be configured to move the second horizontal driving part in the first direction.

[0016] The frame structure may include a fourth horizontal driving part for moving the variable frame in a second direction different from the first direction.

[0017] The substrate processing apparatus may further include: a vertical driving part connected to the frame structure and providing a driving force in the vertical direction to the frame structure.

[0018] The transporter module may be disposed to be separated from the stage, the frame structure, and the fastening unit.

[0019] The substrate processing apparatus may further include a control part disposed on the frame structure, and the control part may be configured to control the driving of the transporter module.

[0020] The control unit includes: a data processing unit that processes first external data and second external data; and a data storage unit that stores the first external data, wherein the first external data may include information related to the type of the target object and information related to the position of the fastening unit.

[0021] The second external data may include information related to the type of the target object, and the data processing unit may derive information related to the position of the fastening unit by comparing the first external data and the second external data.

[0022] The control unit may further include: a signal generation unit that generates a signal for driving the transporter module based on the information related to the derived position of the fastening unit.

[0023] The first pad may adsorb the display panel, and the second pad may adsorb the printed circuit board.

[0024] The substrate processing apparatus may further include: a vacuum regulator disposed on the frame structure and configured to provide a vacuum pressure to the first pad and the second pad.

[0025] The fastening unit may include a coupling member coupled to the variable frame, and the coupling member may include an air clamp.

[0026] The fastening unit includes a coupling member coupled to the variable frame, the variable frame includes a coupling portion coupled to the coupling member, the coupling portion and the coupling member each include a serrated shape, and the serrations of the coupling portion and the serrations of the coupling member may be engaged with each other.

[0027] The coupling member includes a hinge portion, and the fastening unit may be configured to rotate about the hinge portion by a force applied by the transporter module.

[0028] The fastening unit may be configured to be separated from the variable frame by the rotation.

[0029] Technical effects

[0030] The substrate processing apparatus according to an embodiment of the present invention improves the engineering efficiency and engineering yield by including an automatic variable device.

[0031] The substrate processing apparatus according to an embodiment of the present invention can minimize equipment failures.

[0032] The effects according to the embodiments are not limited to the above-exemplified contents, and more various effects are included in the present specification. Description of the drawings

[0033] Figure 1 is a plan view showing a display device according to an embodiment.

[0034] Figure 2 is a plan view showing a display device according to another embodiment.

[0035] Figure 3 and Figure 4 is a perspective view showing a substrate processing apparatus according to an embodiment.

[0036] Figure 5 and Figure 6 is a side view of the substrate processing apparatus according to an embodiment as viewed from the side.

[0037] Figure 7 and Figure 8 is a front view of the substrate processing apparatus according to an embodiment as viewed from the front.

[0038] Figure 9 is an enlarged Figure 3 and Figure 4 enlarged view of area A.

[0039] Figure 10 and Figure 11 is a side view showing a printed circuit board adsorption pad, a variable frame, a fastening unit, and a transporter module according to an embodiment.

[0040] Figures 12 to 15 is a plan view showing an operation mode of the transporter module according to an embodiment.

[0041] Figure 16 is a block diagram showing a control unit according to an embodiment.

[0042] Figure 17 is a side view showing a printed circuit board adsorption pad, a variable frame, and a fastening unit according to another embodiment.

[0043] Figure 18 is a side view showing an operation mode of the fastening unit according to another embodiment.

[0044] Figure 19 is a plan view showing an operation mode of the fastening unit according to another embodiment.

[0045] Description of Reference Numerals

[0046] Detailed Description

[0047] Refer to the accompanying Figure OneReferring to the embodiments described in detail hereinafter, the advantages and features of the present utility model and the methods for achieving these advantages and features will be clarified. However, the present utility model is not limited to the embodiments disclosed below, and it can be implemented in various different forms. The present utility model is only intended to make the disclosure of the present utility model complete and to fully inform those with ordinary knowledge in the technical field to which the present utility model pertains of the scope of the present utility model. The present utility model is only defined by the scope of the claims.

[0048] When an element or layer is referred to as being "on" another element or layer, it includes all cases where it is immediately above or there is another layer or other element sandwiched in between the other element or layer. Similarly, when an element or layer is referred to as being "under", "left", and "right" of another element or layer, it includes all cases where it is directly adjacent to the other element or layer or there is another layer or other material sandwiched in between. Throughout the specification, the same reference numerals refer to the same components.

[0049] Hereinafter, specific embodiments will be described with reference to the drawings.

[0050] Figure 1 is a plan view showing a display device according to an embodiment. Figure 2 is a plan view showing a display device according to another embodiment.

[0051] Referring to Figure 1 and Figure 2 , the display device DD can be applied to smart phones, mobile phones, tablet personal computers (PCs), personal digital assistants (PDAs), portable multimedia players (PMPs), televisions, game consoles, watch-type electronic devices, head-mounted displays, monitors of personal computers, notebook computers, car navigation systems, car dashboards, digital cameras, video cameras, external billboards, electronic screens, medical devices, inspection devices, various household appliances such as refrigerators and washing machines, or Internet of Things devices.

[0052] The display device DD can be classified into various types according to the display method. For example, the classification of the display device can include organic light-emitting diode (OLED) display devices, inorganic electroluminescent (inorganic EL) display devices, quantum dot light-emitting diode (QLED) display devices, micro-LED (micro-LED) display devices, nano-LED (nano-LED) display devices, plasma display panels (PDPs), field emission display devices (FEDs), cathode ray tube (CRT) display devices, liquid crystal display devices (LCDs), electrophoretic display devices (EPDs), etc.

[0053] The display device DD may include a display panel PNL, a connection film COF, and a printed circuit board PCB.

[0054] The display panel PNL may be a self-emitting display panel. As a self-emitting display panel, the display panel PNL may be an organic light-emitting display panel. However, it is not limited thereto, and other types of display panels such as a liquid crystal display panel, a quantum dot organic light-emitting display panel, a quantum dot display panel, a quantum nano-light-emitting display panel, and a micro LED display panel may also be applied.

[0055] The display panel PNL may include a substrate, a thin film transistor layer disposed on the substrate, a light-emitting element layer disposed on the thin film transistor layer, and a thin film encapsulation layer disposed on the light-emitting element layer. In some embodiments, the display panel PNL may further include a touch sensor layer disposed on the thin film encapsulation layer.

[0056] The connection film COF may be mounted on one side of the display panel PNL. The connection film COF may be a film on which wirings are mounted, and an integrated circuit (IC: Integrated Circuit) such as a driving chip for driving the display panel PNL may be mounted on the above film. In one embodiment, the connection film COF may be a flexible film.

[0057] In some embodiments, the connection film COF may be omitted. In this case, the printed circuit board PCB may be directly mounted on the display panel PNL. For example, the printed circuit board PCB may be directly mounted on the pad portion of the display panel PNL.

[0058] The printed circuit board PCB may be mounted on the connection film COF. Various integrated circuits and external devices may be mounted on the printed circuit board PCB. The leads of the printed circuit board PCB may be electrically connected to the pad portion of the display panel PNL through the connection film COF.

[0059] The printed circuit board PCB may be a flexible printed circuit board, a rigid printed circuit board, or a flexible film such as a chip on film.

[0060] As Figure 1 and Figure 2 Each shows, the size and shape of the display device DD may be variously deformed according to the type of product. The number and size of the connection film COF, the number and size of the printed circuit board PCB, etc. may be different according to the size and shape of the display panel PNL.

[0061] The vacuum adsorption pad can adsorb the display device DD to transfer or process such a display device DD. For example, as shown in the figure, the adsorption points VPS of the vacuum adsorption pad can be located on the display device DD. For example, the adsorption points VPS of the vacuum adsorption pad can be located on the display panel PNL and the printed circuit board PCB.

[0062] As Figure 1 and Figure 2 shown, the number and position of the adsorption points VPS of the vacuum adsorption pad can vary according to the type of the display device DD.

[0063] Hereinafter, a variable substrate processing device capable of automatically changing the adsorption points VPS of the vacuum adsorption pad according to the change of the display device DD will be described.

[0064] Figure 3 and Figure 4 are perspective views showing a substrate processing device according to an embodiment. Figure 5 and Figure 6 are side views of the substrate processing device according to an embodiment as viewed from the side. Figure 7 and Figure 8 are front views of the substrate processing device according to an embodiment as viewed from the front.

[0065] Figure 4 is a view in which the support plate 640, the vacuum regulator 300, and the control unit 900 are omitted from the Figure 3 perspective view for ease of explanation.

[0066] Plus Figure 1 and Figure 2 , referring to Figures 3 to 8 , the substrate processing device 1 can adsorb and transfer a substrate or a display device DD. For example, the substrate processing device 1 can transfer the display device DD by adsorbing the display panel PNL and the printed circuit board PCB. In some embodiments, the substrate processing device 1 can adsorb the display device DD in a vacuum adsorption manner.

[0067] The substrate processing device 1 may include a stage 100, a vertical driving unit 200, a vacuum regulator 300, a panel adsorption pad 400, a printed circuit board adsorption pad 500, a frame structure 600, a fastening unit 700, a transporter module 800, and a control unit 900.

[0068] The stage 100 can provide a space capable of placing an object. For example, the object can be a display device DD. The stage 100 can provide a space capable of placing the display device DD. The stage 100 can be located at the lowermost side of the substrate processing apparatus 1. The vertical driving unit 200, the vacuum regulator 300, the panel adsorption pad 400, the printed circuit board adsorption pad 500, the frame structure 600, the fastening unit 700, and the control unit 900 can be located on the stage 100.

[0069] The vertical driving unit 200 can move the frame structure 600 and other components connected to the frame structure 600 in the vertical direction (e.g., the third direction DR3). For example, as Figures 5 to 8 shown, the vertical driving unit 200 can move the frame structure 600, the vacuum regulator 300, the panel adsorption pad 400, the printed circuit board adsorption pad 500, the fastening unit 700, and the control unit 900 connected to the frame structure 600 in the third direction DR3. In one embodiment, the vertical driving unit 200 can be arranged outside in the second direction DR2 of the substrate processing apparatus 1. The vertical driving unit 200 can be located on the stage 100, but is not limited thereto.

[0070] In the illustrated drawings, the third direction DR3 can be the height direction of the substrate processing apparatus 1. For example, the third direction DR3 can be the vertical direction. The first direction DR1 and the second direction DR2 intersect the third direction DR3 respectively. For example, the first direction DR1 and the second direction DR2 can be horizontal directions perpendicular to the third direction DR3. The first direction DR1 and the second direction DR2 can intersect each other (e.g., can be perpendicular to each other).

[0071] In this specification, the direction indicated by the arrows in the first direction DR1 to the third direction DR3 can be referred to as one side, and the opposite direction can be referred to as the other side. In this specification, the surface observed in the first direction DR1 can be referred to as the side surface, the surface observed in the second direction DR2 can be referred to as the front surface, and the surface observed in the third direction DR3 can be referred to as the flat surface.

[0072] In some embodiments, the vertical driving unit 200 can move the frame structure 600 and other components connected to the frame structure 600 together in the third direction DR3. For example, the panel adsorption pad 400 and the printed circuit board adsorption pad 500 can move together in the third direction DR3 by the driving of the vertical driving unit 200. Accordingly, the pads of the panel adsorption pad 400 and the printed circuit board adsorption pad 500 can contact the display device DD simultaneously.

[0073] The vertical driving unit 200 may include a first vertical driving unit 210 and a second vertical driving unit 220. In the drawings, a case where the vertical driving unit 200 is configured as two vertical driving units is shown, but it is not limited thereto. The number of the vertical driving units 200 may be variously deformed.

[0074] The vacuum regulator 300 may generate a vacuum pressure. The vacuum regulator 300 may adjust the intensity of the vacuum pressure and the generation of the vacuum pressure. For example, the vacuum regulator 300 may adjust the on / off of the vacuum pressure, and may decrease or increase the pressure intensity of the vacuum pressure. In some embodiments, the vacuum regulator 300 may include a suction device or a vacuum pump. The vacuum regulator 300 may be located on the frame structure 600. For example, the vacuum regulator 300 may be located on the support plate 640.

[0075] Although not shown, the substrate processing apparatus 1 may further include vacuum tubes connecting between the vacuum regulator 300 and the panel adsorption pad 400 and between the vacuum regulator 300 and the printed circuit board adsorption pad 500. The vacuum regulator 300 may provide a vacuum pressure to the panel adsorption pad 400 and the printed circuit board adsorption pad 500 through the vacuum tubes.

[0076] The panel adsorption pad 400 and the printed circuit board adsorption pad 500 may be vacuum adsorption pads. The panel adsorption pad 400 and the printed circuit board adsorption pad 500 may receive a vacuum pressure from the vacuum regulator 300 to adsorb the display device DD.

[0077] The panel adsorption pad 400 may adsorb the display panel PNL. The panel adsorption pad 400 may adsorb the adsorption point VPS located on the display panel PNL. The printed circuit board adsorption pad 500 may adsorb the printed circuit board PCB. The printed circuit board adsorption pad 500 may adsorb the adsorption point VPS located on the printed circuit board PCB.

[0078] The panel adsorption pad 400 may be arranged closer to the vertical driving unit 200 than the printed circuit board adsorption pad 500 in the second direction DR2. When the display device DD as an object is arranged on the stage 100, the panel adsorption pad 400 may be located on the display panel PNL, and the printed circuit board adsorption pad 500 may be located on the printed circuit board PCB.

[0079] The panel adsorption pad 400 and the printed circuit board adsorption pad 500 may be attached or coupled to the frame structure 600. For example, the panel adsorption pad 400 may be coupled to the first support frame 610, and the printed circuit board adsorption pad 500 may be coupled to the variable frame 650 through the fastening unit 700.

[0080] The frame structure 600 can support other components included in the substrate processing apparatus 1. For example, the frame structure 600 can support the vacuum regulator 300, the panel adsorption pad 400, the printed circuit board adsorption pad 500, the fastening unit 700, and the control unit 900.

[0081] The frame structure 600 can be connected to the vertical driving unit 200 and move in the third direction DR3. As Figure 3 and Figure 4 shown, the second support frame 620 of the frame structure 600 can be connected to the vertical driving unit 200. As Figure 5 and Figure 6 shown, the first support frame 610 of the frame structure 600 can also be connected to the vertical driving unit 200.

[0082] The frame structure 600 can include a first support frame 610, a second support frame 620, a third support frame 630, a support plate 640, a variable frame 650, and a first horizontal driving unit 660.

[0083] The first support frame 610 can be disposed at the lowermost part of the frame structure 600. The panel adsorption pad 400 can be coupled to the first support frame 610. The first support frame 610 can extend in the second direction DR2.

[0084] The first support frame 610 can include a plurality of support frames. For example, the first support frame 610 can include a 1-1 support frame 611, a 1-2 support frame 612, a 1-3 support frame 613, a 1-4 support frame 614, and a 1-5 support frame 615. The 1-1 support frame 611, the 1-2 support frame 612, the 1-3 support frame 613, the 1-4 support frame 614, and the 1-5 support frame 615 can be arranged to be spaced apart from each other in the first direction DR1.

[0085] The second support frame 620 can be disposed on the first support frame 610. The second support frame 620 can support the first support frame 610. The second support frame 620 can connect the plurality of support frames included in the first support frame 610. For example, the second support frame 620 can be coupled to the 1-1 support frame 611, the 1-2 support frame 612, the 1-3 support frame 613, the 1-4 support frame 614, and the 1-5 support frame 615 to connect them. The second support frame 620 can extend in the first direction DR1.

[0086] The second support frame 620 may include a plurality of support frames. For example, the second support frame 620 may include a 2-1 support frame 621, a 2-2 support frame 622, and a 2-3 support frame 623. The 2-1 support frame 621, the 2-2 support frame 622, and the 2-3 support frame 623 may be arranged to be spaced apart from each other in the second direction DR2.

[0087] The third support frame 630 may be disposed on one side of the first support frame 610 and the second support frame 620. For example, the third support frame 630 may be disposed on the other side of the first support frame 610 and the second support frame 620 in the second direction DR2. The third support frame 630 may extend along the third direction DR3.

[0088] In one embodiment, as Figure 5 and Figure 6 shown, the third support frame 630 may connect the variable frame 650 and the first support frame 610 between the variable frame 650 and the first support frame 610. In this case, the third support frame 630 may be coupled to at least one of the 1-1 support frame 611, the 1-2 support frame 612, the 1-3 support frame 613, the 1-4 support frame 614, and the 1-5 support frame 615.

[0089] In another embodiment, the third support frame 630 may also connect the variable frame 650 and the second support frame 620 between the variable frame 650 and the second support frame 620. In this case, the third support frame 630 may be coupled to the 2-3 support frame 623.

[0090] The third support frame 630 may include a plurality of support frames. For example, the third support frame 630 may include a 3-1 support frame 631, a 3-2 support frame 632, and a 3-3 support frame 633. The 3-1 support frame 631, the 3-2 support frame 632, and the 3-3 support frame 633 may be arranged to be spaced apart from each other in the first direction DR1.

[0091] In the drawings, a case is shown in which the first support frame 610 includes five support frames, the second support frame 620 includes three support frames, and the third support frame 630 includes three support frames, but is not limited thereto. The number of the first support frame 610 to the third support frame 630 may be variously deformed.

[0092] The support plate 640 may be disposed on the second support frame 620. The support plate 640 may be in a plate shape extending along the first direction DR1 and the second direction DR2. The support plate 640 may provide a space capable of placing the vacuum regulator 300 and / or the control unit 900.

[0093] The variable frame 650 may be disposed on one side of the third support frame 630. For example, the variable frame 650 may be disposed on the other side in the second direction DR2 of the third support frame 630. The variable frame 650 may be coupled to the third support frame 630. The variable frame 650 may extend along the first direction DR1.

[0094] The variable frame 650 may include a coupling portion 651 (refer to Figure 9 ) capable of coupling to the fastening unit 700. The content related to the variable frame 650 will be described later with reference to Figure 9 .

[0095] The first horizontal driving unit 660 may be disposed between the third support frame 630 and the variable frame 650. The first horizontal driving unit 660 may move other components disposed on one side of the first horizontal driving unit 660 in the second direction DR2. For example, the first horizontal driving unit 660 may move the variable frame 650, the fastening unit 700, and the printed circuit board adsorption pad 500 located on the other side of the first horizontal driving unit 660 in the second direction DR2 and in the direction opposite to the second direction DR2. In some embodiments, the length of the first horizontal driving unit 660 in the second direction DR2 may be telescopic in order to provide driving force to the other components.

[0096] The fastening unit 700 may be disposed on one side of the variable frame 650. For example, the fastening unit 700 may be disposed on the other side in the second direction DR2 of the variable frame 650. The fastening unit 700 may be a connecting component for coupling the printed circuit board adsorption pad 500 to the variable frame 650. The fastening unit 700 may be coupled to the variable frame 650 and the printed circuit board adsorption pad 500. The fastening unit 700 may extend along the third direction DR3. The printed circuit board adsorption pad 500 may be disposed below the fastening unit 700.

[0097] The fastening unit 700 may include a coupling component 710 coupled to the variable frame 650. For example, the fastening unit 700 may include an air jig. The coupling manner of the air jig and the fastening unit 700 will be described later with reference to Figure 9 and so on.

[0098] The transporter module 800 may be disposed on one side of the fastening unit 700. For example, the transporter module 800 may be disposed on the other side in the second direction DR2 of the fastening unit 700. The transporter module 800 may adjust the positions of the fastening unit 700 and the printed circuit board adsorption pad 500 in the first direction DR1. For example, the transporter module 800 may move the positions where the fastening unit 700 and the printed circuit board adsorption pad 500 are coupled to the variable frame 650 from one position to another position of the variable frame 650 along the first direction DR1.

[0099] The transporter module 800 can be an independent component separated from other components. For example, the transporter module 800 can be arranged to be separated from the stage 100 or the frame structure 600. The transporter module 800 may not be located on the stage 100 and may not be combined with the frame structure 600.

[0100] The substrate processing apparatus 1 according to the present embodiment includes a transporter module 800 as a separated independent component for adjusting the positions of the fastening unit 700 and the printed circuit board suction pad 500 in the first direction DR1, so as to be able to disperse the load of the device. Moreover, since there is no need to provide a separate motor for each of the fastening unit 700 and the printed circuit board suction pad 500, the load of the device can be further reduced. Through the effects of load dispersion and reduction, equipment failures can be minimized.

[0101] The transporter module 800 may include a second horizontal driving unit 810, a third horizontal driving unit 820, a fourth horizontal driving unit 830, and a fixing unit 840. The detailed configuration and operation mode related to the transporter module 800 will be described later with reference to Figure 9 etc.

[0102] The control unit 900 can control the driving of the driving units, the vacuum regulator 300, and the transporter module 800 included in the substrate processing apparatus 1. For example, the control unit 900 can provide a driving control signal to the driving unit to control the driving of the driving unit, can provide a vacuum pressure control signal to the vacuum regulator 300 to control the driving of the vacuum regulator 300, and can provide a transporter control signal to the transporter module 800 to control the driving of the transporter module 800.

[0103] The control mode of the transporter module 800 related to the control unit 900 will be described later with reference to Figure 16 etc.

[0104] In the substrate processing apparatus 1 according to the present embodiment, the vacuum regulator 300 can separately adjust the vacuum pressures supplied to the panel suction pad 400 and the printed circuit board suction pad 500. As an example, when adsorbing Figure 1 the display device DD shown, the vacuum pressure can be supplied to the suction pads at all the suction points VPS. As another example, when adsorbing Figure 2 the display device DD shown, the vacuum pressure can be supplied only to the suction pads at a part of the suction points VPS according to the size of the display device DD.

[0105] In the case of the panel suction pad 400, by generating a vacuum pressure only in a part of the panel suction pads 400 that match the size and shape of the display panel PNL among the plurality of panel suction pads 400, the adsorption points VPS can be changed and adjusted. Therefore, the substrate processing apparatus 1 according to the present embodiment can change and adjust the adsorption points VPS that match the size and shape of the display panel PNL by individually adjusting the vacuum pressure of the panel suction pad 400.

[0106] In the case of the printed circuit board suction pad 500, according to the length of the connection film COF in the second direction DR2, the position of the adsorption point VPS on the printed circuit board PCB in the second direction DR2 can be different, and the position of the adsorption point VPS on the printed circuit board PCB in the first direction DR1 can vary according to the length of the printed circuit board PCB in the first direction DR1.

[0107] The substrate processing apparatus 1 according to the present embodiment may include a first horizontal driving unit 660, so as to be able to adjust the position of the adsorption point VPS on the printed circuit board PCB in the second direction DR2.

[0108] For example, as Figure 5 and Figure 6 shown, as the first horizontal driving unit 660 expands and contracts in the second direction DR2 or the opposite direction of the second direction DR2, the positions of the variable frame 650, the fastening unit 700, and the printed circuit board suction pad 500 in the second direction DR2 can be changed. The plurality of printed circuit board suction pads 500 arranged at intervals in the first direction DR1 can move simultaneously in the second direction DR2 as the variable frame 650 driven by the first horizontal driving unit 660 moves.

[0109] The substrate processing apparatus 1 according to the present embodiment may include a transporter module 800, so as to be able to adjust the position of the adsorption point VPS on the printed circuit board PCB in the first direction DR1.

[0110] Regarding the method of adjusting the position of the adsorption point VPS on the printed circuit board PCB of the substrate processing apparatus 1 in the first direction DR1, it will be described below with reference to Figures 9 to 15 as follows.

[0111] Figure 9 is an enlarged Figure 3 and Figure 4 enlarged view of area A. Figure 10 and Figure 11 are side views showing a printed circuit board suction pad, a variable frame, a fastening unit, and a transporter module according to an embodiment. Figures 12 to 15 is a plan view showing the operation mode of the transporter module according to an embodiment.

[0112] Reference Figures 9 to 15 The variable frame 650 may include a coupling part 651 to which the fastening unit 700 can be coupled. The variable frame 650 and the coupling part 651 of the variable frame 650 may extend along the first direction DR1.

[0113] The fastening unit 700 may include a coupling member 710 that can be coupled to the coupling part 651 of the variable frame 650. For example, the fastening unit 700 may include an air jig. The coupling member 710 of the fastening unit 700 may be coupled to a position on the coupling part 651 of the variable frame 650 in the first direction DR1. The substrate processing apparatus 1 according to the present embodiment may adjust the position of the adsorption point VPS on the printed circuit board PCB in the first direction DR1 according to the coupling position of the fastening unit 700 with respect to the coupling part 651 in the first direction DR1. The coupling position of the fastening unit 700 with respect to the coupling part 651 in the first direction DR1 may be adjusted by the transporter module 800.

[0114] The transporter module 800 may include a second horizontal driving part 810, a third horizontal driving part 820, a fourth horizontal driving part 830, and a fixing part 840.

[0115] The second horizontal driving part 810 may extend along the first direction DR1. The second horizontal driving part 810 may move the third horizontal driving part 820, the fourth horizontal driving part 830, and the fixing part 840 along the first direction DR1. For example, the second horizontal driving part 810 may include a first rail 811. The third horizontal driving part 820 may reciprocate along the first direction DR1 on the first rail 811 of the second horizontal driving part 810.

[0116] The third horizontal driving part 820 may be disposed on the second horizontal driving part 810. For example, one end (e.g., the other end in the second direction DR2) of the third horizontal driving part 820 may be coupled to the second horizontal driving part 810. The third horizontal driving part 820 may extend along the second direction DR2. The third horizontal driving part 820 may move the fourth horizontal driving part 830 and the fixing part 840 along the second direction DR2.

[0117] For example, the third horizontal driving part 820 may include a first arm 821, a second arm 822, and a second track 823. The second track 823 may be disposed on the first arm 821. The second arm 822 may be disposed on the second track 823. The second arm 822 may reciprocate along a second direction DR2 on the second track 823 located on the first arm 821. On one side of the second arm 822 (e.g., one end on the side in the second direction DR2), a fourth horizontal driving part 830 may be disposed. According to the reciprocating movement of the second arm 822 in the second direction DR2, the fourth horizontal driving part 830 and the fixing part 840 may reciprocate in the second direction DR2.

[0118] The fourth horizontal driving part 830 may be disposed on one side of the third horizontal driving part 820 (e.g., one end on the side in the second direction DR2). The fourth horizontal driving part 830 may be coupled to one end on the second direction DR2 side of the third horizontal driving part 820. The fourth horizontal driving part 830 may extend along a first direction DR1. The fourth horizontal driving part 830 may move the fixing part 840 along the first direction DR1.

[0119] For example, the fourth horizontal driving part 830 may include a third track 831 and a fourth track 832. The fixing part 840 may reciprocate along the first direction DR1 on the third track 831 and the fourth track 832 of the fourth horizontal driving part 830.

[0120] The fixing part 840 may be disposed on one side of the fourth horizontal driving part 830 (e.g., one side in the second direction DR2). The fixing part 840 may be located on the third track 831 and the fourth track 832 of the fourth horizontal driving part 830. The fixing part 840 may extend along the second direction DR2. In some embodiments, the fixing part 840 may include a first clamp 841 and a second clamp 842. The first clamp 841 and the second clamp 842 may respectively extend along the second direction DR2 and may be arranged to be spaced apart from each other in the first direction DR1.

[0121] The fixing part 840 may be moved along the first direction DR1 by the driving of the second horizontal driving part 810. The fixing part 840 may be moved along the second direction DR2 by the driving of the third horizontal driving part 820. The first clamp 841 and the second clamp 842 of the fixing part 840 may be moved along the first direction DR1 by the driving of the fourth horizontal driving part 830.

[0122] Hereinafter, a method of adjusting the position of the adsorption point VPS on the printed circuit board PCB in the first direction DR1 according to the bonding position of the fastening unit 700 for the bonding part 651 in the first direction DR1 will be described.

[0123] As Figure 12As shown, the fixing part 840 can be aligned with the fastening unit 700 at a position in the first direction DR1 of the joint part 651 of the variable frame 650 driven by the second horizontal driving part 810 in the second direction DR2.

[0124] As Figure 13 shown, the fixing part 840 can be disposed adjacent to the joint part 710 of the fastening unit 700 in the second direction DR2 driven by the third horizontal driving part 820. The first clamp 841 and the second clamp 842 can move along the first direction DR1 driven by the fourth horizontal driving part 830 and fasten to the joint part 710.

[0125] As Figure 14 shown, the fixing part 840 can move in the direction opposite to the second direction DR2 in a state of being fastened to the joint part 710 driven by the third horizontal driving part 820. Accordingly, the screw 711 of the joint part 710 can be separated from the joint part 651 of the variable frame 650, so that the fastening unit 700 can be separated from the variable frame 650.

[0126] As Figure 15 shown, the fastening unit 700 separated from the fixing part 840 and the variable frame 650 can move to another position in the first direction DR1 of the joint part 651 of the variable frame 650 driven by the second horizontal driving part 810. The screw 711 of the joint part 710 can be fastened to the joint part 651 of the variable frame 650 again driven by the third horizontal driving part 820.

[0127] Then, the first clamp 841 and the second clamp 842 can be separated from the joint part 710 driven by the fourth horizontal driving part 830. The transporter module 800 can return to the Figure 12 state shown.

[0128] The substrate processing apparatus 1 according to the present embodiment can adjust the position of the adsorption point VPS on the printed circuit board PCB in the first direction DR1 by using the transporter module 800 in the foregoing manner.

[0129] Figure 16 is a block diagram showing a control unit according to an embodiment.

[0130] Plus Figures 9 to 15 , referring to Figure 16 , the control unit 900 may include a data processing unit 910, a position data storage unit 920, and a transporter drive signal generation unit 930.

[0131] The data processing unit 910 can calculate and process external data. The data processing unit 910 can calculate and process transporter drive data.

[0132] The external data may include first external data EXD1 and second external data EXD2. The first external data EXD1 may include information related to the bonding position of the fastening unit 700 for the bonding portion 651 according to the type of the display device DD. The second external data EXD2 may include information related to the type of the display device DD.

[0133] The transporter drive data may include information related to the drive of the transporter module 800.

[0134] The position data storage unit 920 may store the information included in the first external data EXD1. For example, the position data storage unit 920 may store information related to the bonding position of the fastening unit 700 for the bonding portion 651 according to the type of the display device DD.

[0135] The transporter drive signal generation unit 930 may generate a transporter drive signal. The transporter drive signal may include transporter drive data including information related to the drive of the transporter module 800.

[0136] In the storage step, the user may provide the first external data EXD1 to the control unit 900. The data processing unit 910 may provide the information included in the first external data EXD1 to the position data storage unit 920 through the first signal S1. For example, the data processing unit 910 may provide the position data storage unit 920 with information related to the bonding position of the fastening unit 700 for the bonding portion 651 according to the type of the display device DD. The position data storage unit 920 may store the information related to the bonding position of the fastening unit 700 for the bonding portion 651 according to the type of the display device DD.

[0137] In the output step, the user may provide the second external data EXD2 including information related to the type of the display device DD to the control unit 900. The data processing unit 910 may receive, through the second signal S2, from the position data storage unit 920 the information related to the bonding position of the fastening unit 700 for the bonding portion 651 according to the type of the display device DD.

[0138] The data processing unit 910 may compare the information related to the type of the display device DD input by the user with the information related to the bonding position of the fastening unit 700 for the bonding portion 651 according to the type of the display device DD received from the position data storage unit 920. The data processing unit 910 may derive the information related to the bonding position of the fastening unit 700 for the bonding portion 651 based on the information related to the type of the display device DD input by the user.

[0139] The data processing unit 910 can provide information related to the bonding position of the fastening unit 700 with respect to the bonding portion 651 to the transporter drive signal generation unit 930 through the third signal S3. The transporter drive signal generation unit 930 can generate a fourth signal S4 (e.g., a transporter drive signal) including information related to the drive of the transporter module 800 based on the information related to the bonding position of the fastening unit 700. The transporter drive signal generation unit 930 can provide the fourth signal S4 to the transporter module 800.

[0140] The substrate processing apparatus 1 according to the present embodiment can be an automatic variable apparatus as follows: The user prestores the bonding position of the fastening unit 700 according to the type of the display device DD, and if the user inputs the type of the display device DD to be processed, the transporter module 800 can be automatically driven by comparing with the stored information. Accordingly, the engineering efficiency and the engineering yield can be improved.

[0141] Hereinafter, other embodiments of the substrate processing apparatus according to an embodiment will be described. In the following embodiments, the same components as those in the previously described embodiments are denoted by the same reference numerals, redundant descriptions are omitted or simplified, and the differences will be mainly described.

[0142] Figure 17 FIG. is a side view showing a printed circuit board adsorption pad, a variable frame, and a fastening unit according to another embodiment. Figure 18 FIG. is a side view showing an operation mode of a fastening unit according to another embodiment. Figure 19 FIG. is a plan view showing an operation mode of a fastening unit according to another embodiment.

[0143] Refer to Figures 17 to 19 , the substrate processing apparatus 1 according to the present embodiment is different from the substrate processing apparatus 1 according to an embodiment described with reference to Figure 9 etc. in that the bonding manner between the variable frame 650 and the fastening unit 700 is different.

[0144] More specifically, the variable frame 650 can include a bonding portion 651 having a sawtooth shape. For example, the bonding portion 651 can be a rack gear, but is not limited thereto.

[0145] The bonding member 710 of the fastening unit 700 can include a fastening portion 712 and a hinge portion 713. The main body of the bonding member 710 of the fastening unit 700 can be in the shape of a bracket, but is not limited thereto.

[0146] The fastening portion 712 can be engaged with the bonding portion 651. The shape of the fastening portion 712 can correspond to the sawtooth shape of the bonding portion 651.

[0147] As an example, asFigure 17 and Figure 18 As shown, when the fastening portion 712 is coupled to the recessed portion of the serrated shape of the joint portion 651, the fastening portion 712 may be a protruding shape. As another example, as Figure 19 shown, when the fastening portion 712 is coupled to the protruding portion of the serrated shape of the joint portion 651, the fastening portion 712 may be a recessed shape.

[0148] The hinge portion 713 may be a rotating shaft located in the main body of the coupling member 710. The hinge portion 713 may provide a restoring force to the main body of the coupling member 710.

[0149] For example, as Figure 18 shown, if the transporter module 800 applies a force to the main body of the coupling member 710 located below the hinge portion 713 in the second direction DR2, the main body of the coupling member 710 may rotate clockwise with the hinge portion 713 as the rotation axis. Accordingly, the fastening portion 712 may be separated from the joint portion 651. As Figure 19 shown, the fastening unit 700 separated from the variable frame 650 may be moved in the first direction DR1 by the transporter module 800 and may be coupled to another position of the joint portion 651.

[0150] As described above, embodiments of the present invention have been described with reference to the accompanying drawings. However, those of ordinary skill in the art to which the present invention pertains will understand that the present invention may be implemented in other specific forms without changing the technical concept or essential features of the present invention. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive.

Claims

1. A substrate processing apparatus, characterized in that, Comprising: A stage; A frame structure disposed on the stage and including a variable frame; A first pad disposed on the lower side of the frame structure; A second pad disposed on one side of the first pad; A fastening unit connecting the variable frame and the second pad between the variable frame and the second pad; And A transporter module disposed on one side of the second pad and configured to change the coupling position of the fastening unit from one position of the variable frame to another position in a first direction, The transporter module is configured to change the coupling position of the variable frame and the fastening unit.

2. The substrate processing apparatus according to claim 1, wherein The transporter module includes a fixing portion configured to be coupled to the fastening unit, The fixing portion is configured to be coupled to the fastening unit to separate the fastening unit from the variable frame.

3. The substrate processing apparatus according to claim 2, wherein The transporter module includes a first horizontal driving portion connected to the fixing portion, The first horizontal driving portion is configured to move the fixing portion in the first direction.

4. The substrate processing apparatus according to claim 3, wherein The fixing portion includes a first clamp and a second clamp spaced apart in the first direction, The first horizontal driving portion drives the first clamp and the second clamp in the first direction, The first clamp and the second clamp are configured to be coupled to the fastening unit.

5. The substrate processing apparatus according to claim 1, wherein The transporter module is disposed spaced apart from the stage, the frame structure, and the fastening unit.

6. The substrate processing apparatus according to claim 1, wherein Further comprising: A control unit disposed on the frame structure and configured to control the driving of the transporter module, The control unit includes: A data processing unit that processes first external data and second external data; and A data storage unit that stores the first external data, Wherein the first external data includes information related to the type of the target object and information related to the position of the fastening unit, The second external data includes information related to the type of the target object, The data processing unit derives information related to the position of the fastening unit by comparing the first external data and the second external data.

7. The substrate processing apparatus according to claim 1, wherein The first pad adsorbs a display panel, and the second pad adsorbs a printed circuit board.

8. The substrate processing apparatus according to claim 1, wherein The fastening unit includes a coupling member coupled to the variable frame, The coupling member includes an air jig.

9. The substrate processing apparatus according to claim 1, wherein The fastening unit includes a coupling member coupled to the variable frame, The variable frame includes a coupling portion coupled to the coupling member, The coupling portion and the coupling member each include a serrated shape, The serrations of the coupling portion and the serrations of the coupling member are engaged with each other.

10. The substrate processing apparatus according to claim 9, wherein The coupling member includes a hinge portion, The fastening unit is configured to rotate about the hinge portion by the force applied by the transporter module.

Images