Combined aluminum substrate

Abstract

The utility model relates to the technical field of aluminum substrates, in particular to a combined aluminum substrate which comprises a mounting plate, a mounting groove is formed in the top end of the mounting plate, a first connecting hole is formed in the side face of the mounting groove, an aluminum substrate is mounted at the top end of the mounting plate, a plug board is fixed at the bottom end of the aluminum substrate, and a positioning groove is formed in the side face of the plug board. The aluminum substrate has the beneficial effects that the aluminum substrate can be conveniently disassembled, combined and mounted, the aluminum substrate is conveniently maintained, and the aluminum substrate is stably mounted and protected in a combined manner; high-temperature heat generated when the circuit layer is used can be dissipated outwards through the heat dissipation holes, the heat removal grooves and the through holes, cooling and heat removal are carried out on the interior of the aluminum substrate, safe use of the interior of the circuit layer is kept, and the top end of the circuit layer provides insulation and compression resistance protection for the top end of the aluminum substrate through the insulation layer, the buffer layer and the protection layer.

Description

Technical Field

[0001] The utility model relates to the technical field of aluminum substrates, in particular to a combined aluminum substrate. Background Art

[0002] An aluminum substrate is a metal-based copper clad laminate with good heat dissipation function. Generally, a single-sided board consists of three layers, namely a circuit layer, an insulating layer, and a metal base layer. For high-end applications, a double-sided board is also designed, with a structure of circuit layer, insulating layer, aluminum base, insulating layer, and circuit layer.

[0003] The uses of aluminum substrates are also very extensive. Moreover, aluminum substrates can reduce the operating temperature of products, improve the power density and reliability of products, and extend the service life of products.

[0004] For example, the Chinese patent publication number "CN210550231U" in the prior art provides a combined aluminum substrate, including an aluminum substrate body, which is arranged in a curved shape in the top view direction. A concave chute is opened on the lower end face of the aluminum substrate body, and an aluminum substrate mounting block is arranged outside the lower end of the aluminum substrate body; a threaded mounting hole is opened on the end face of the aluminum substrate mounting block, and a connecting support block is arranged outside one end face of the aluminum substrate body.

[0005] Through the arranged concave chute, limit slider, and connecting support block, the device can effectively facilitate the installation and fixation of multiple aluminum substrate bodies, and at the same time increase the stability of the installation and connection of the aluminum substrate body. Meanwhile, in the corresponding setting state of the first connecting block, the second connecting block, the third connecting block, and the fourth connecting block, the convenience and stability of the connection and installation of multiple aluminum substrate bodies can be effectively increased.

[0006] For the existing combined aluminum substrate, the combined installation is relatively troublesome, inconvenient for disassembly and combined installation, affecting maintenance when it fails or for other reasons, unable to stably combine and install the aluminum substrate. At the same time, at the circuit layer on the top of the aluminum substrate, a large amount of heat will be generated during use, the heat dissipation is slow, heat accumulation will occur, affecting the safe use of the circuit layer and the chip, and effective heat dissipation, heat removal, and temperature reduction cannot be carried out. Summary of the Utility Model

[0007] The purpose of the utility model is to solve the disadvantages in the prior art that the combined installation is relatively troublesome, inconvenient for disassembly and combined installation, affecting maintenance when it fails or for other reasons, and unable to stably combine and install the aluminum substrate, and to propose a combined aluminum substrate.

[0008] To achieve the above purpose, the utility model provides the following technical solutions:

[0009] Design a combined aluminum substrate, including a mounting plate. An installation groove is opened at the top end of the mounting plate. A first connection hole is opened on the side of the installation groove. An aluminum substrate is installed at the top end of the mounting plate. A plug-in board is fixed at the bottom end of the aluminum substrate. A positioning groove is opened on the side of the plug-in board. Reinforcing rings are installed on both the inner and outer sides of the aluminum substrate and the mounting plate. A second connection hole is opened on the side of the reinforcing ring. A fastening bolt passes through the inside of the first connection hole and the second connection hole, and the inner end of the fastening bolt presses against the positioning groove. A heat dissipation groove is opened inside the aluminum substrate. A heat dissipation hole is opened at the top end of the heat dissipation groove. Through holes are opened at positions on both ends of the heat dissipation groove on the side of the reinforcing ring.

[0010] Further, bonding pads are arranged at intervals on the top end of the aluminum substrate. A circuit layer is connected to the top end of the bonding pad. A chip is connected to the top end of the circuit layer. An encapsulation glue layer is arranged outside the circuit layer and the chip. Limiting rings are arranged on both sides of the encapsulation glue layer. An insulating layer is arranged at the top end of the encapsulation glue layer. A buffer layer is bonded to the top end of the insulating layer. A protective layer is bonded to the top end of the buffer layer.

[0011] Further, the mounting plate is of a circular ring plate structure and is horizontally arranged. The installation groove is of a rectangular groove structure and is vertically arranged, and its depth is less than the thickness of the mounting plate.

[0012] Further, the reinforcing ring adopts a circular ring structure. The first connection hole is of a threaded hole structure and is horizontally arranged. The aluminum substrate is of a circular ring structure and is horizontally arranged.

[0013] Further, the plug-in board is of a rectangular plate structure and is vertically arranged, and is slidably inserted into the inside of the installation groove. The plug-in boards are evenly distributed at the bottom end of the aluminum substrate. The installation grooves are evenly distributed at the top end of the mounting plate.

[0014] Further, the depth of the positioning groove is less than the thickness of the plug-in board, and is horizontally aligned with the first connection hole and the second connection hole. The fastening bolt is horizontally arranged and is in threaded fit connection with the first connection hole.

[0015] Further, the heat dissipation groove is of an oblong groove structure and is horizontally arranged, and is evenly distributed inside the aluminum substrate. The heat dissipation holes are vertically arranged and are communicated with the heat dissipation groove, and are evenly distributed at the top end of the aluminum substrate.

[0016] Further, the bonding pads are evenly arranged at the top end of the aluminum substrate and are offset from the heat dissipation holes. A gap is provided between the circuit layer and the top end of the aluminum substrate. The limiting ring is of a circular ring structure and is made of heat-conducting silica gel material. The buffer layer is made of latex material. The protective layer is made of silicon nitride material.

[0017] A combined aluminum substrate proposed by the present utility model has the beneficial effects as follows:

[0018] 1. The present utility model provides an installation groove at the top of the mounting plate, and a plug-in plate is fixedly provided at the bottom of the aluminum substrate. The plug-in plate is slidably inserted into the installation groove and tightened by a fastening bolt. In addition, reinforcing rings are respectively provided on the inner and outer sides of the aluminum substrate and the mounting plate, and are connected by fastening bolts. Therefore, the aluminum substrate can be conveniently disassembled and assembled, which is convenient for maintaining the aluminum substrate and keeps the combined installation of the aluminum substrate stable and protected.

[0019] 2. The present utility model provides a heat dissipation groove inside the aluminum substrate, and a heat dissipation hole is provided at its top and communicated with a through hole. At the same time, a gap connection is formed between the circuit layer and the top of the aluminum substrate through an adhesive pad. Therefore, the high-temperature heat generated by the circuit layer during use can be dissipated outward through the heat dissipation hole, the heat dissipation groove and the through hole, so as to cool and dissipate heat inside the aluminum substrate and keep the inside of the circuit layer safe for use. Moreover, the top of the circuit layer is provided with an insulating layer, a buffer layer and a protective layer to provide insulation and compressive protection for the top of the aluminum substrate. Description of the Drawings

[0020] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0021] Figure 2 is of the present utility model Figure 1 schematic diagram of the overall structure;

[0022] Figure 3 is of the present utility model Figure 1 schematic diagram of the partial structure of the mounting plate;

[0023] Figure 4 is of the present utility model Figure 1 cross-sectional view;

[0024] Figure 5 is of the present utility model Figure 4 enlarged view of part A;

[0025] Figure 6 is of the present utility model Figure 1 schematic diagram of the partial structure of the aluminum substrate.

[0026] In the figure: 1, mounting plate; 2, aluminum substrate; 3, heat dissipation groove; 4, fastening bolt; 5, plug-in plate; 6, reinforcing ring; 7, limiting ring; 8, protective layer; 9, buffer layer; 10, insulating layer; 11, chip; 12, encapsulation glue layer; 13, circuit layer; 14, installation groove; 15, adhesive pad; 16, heat dissipation hole; 17, through hole; 18, second connection hole; 19, first connection hole; 20, positioning groove. Detailed Embodiments

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Embodiment

[0028] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , a combined aluminum substrate shown in the figure, including a mounting plate 1, an installation groove 14 is opened at the top end of the mounting plate 1, a first connection hole 19 is opened on the side of the installation groove 14, an aluminum substrate 2 is installed at the top end of the mounting plate 1, a plug-in board 5 is fixed at the bottom end of the aluminum substrate 2, a positioning groove 20 is opened on the side of the plug-in board 5, reinforcing rings 6 are installed on both the inner and outer sides of the aluminum substrate 2 and the mounting plate 1, a second connection hole 18 is opened on the side of the reinforcing ring 6, a fastening bolt 4 passes through the inside of the first connection hole 19 and the second connection hole 18, the inner end of the fastening bolt 4 presses against the positioning groove 20, a heat dissipation groove 3 is opened inside the aluminum substrate 2, a heat dissipation hole 16 is opened at the top end of the heat dissipation groove 3, and through holes 17 are opened at both ends of the heat dissipation groove 3 on the side of the reinforcing ring 6.

[0029] An installation groove 14 is provided at the top end of the mounting plate 1, a plug-in board 5 is fixed at the bottom end of the aluminum substrate 2, and the plug-in board 5 is slidably inserted into the installation groove 14 and pressed tightly by a fastening bolt 4. In addition, reinforcing rings 6 are respectively provided on the inner and outer sides of the aluminum substrate 2 and the mounting plate 1 and are connected by a fastening bolt 4. Therefore, the aluminum substrate 2 can be conveniently disassembled and assembled, facilitating the maintenance of the aluminum substrate 2 and keeping the combined installation of the aluminum substrate 2 stable and protected.

[0030] The mounting plate 1 is a circular ring plate structure and is horizontally arranged. The installation groove 14 is a rectangular groove structure and is vertically arranged, and the depth is less than the thickness of the mounting plate 1.

[0031] The reinforcing ring 6 adopts a circular ring structure. The first connection hole 19 is a threaded hole structure and is horizontally arranged. The aluminum substrate 2 is a circular ring structure and is horizontally arranged.

[0032] The plug-in board 5 is a rectangular plate structure and is vertically arranged and is slidably inserted into the inside of the installation groove 14. The plug-in boards 5 are evenly distributed at the bottom end of the aluminum substrate 2, and the installation grooves 14 are evenly distributed at the top end of the mounting plate 1.

[0033] The depth of the positioning groove 20 is less than the thickness of the plug-in board 5, and it is horizontally aligned with the first connection hole 19 and the second connection hole 18. The fastening bolt 4 is horizontally arranged and is in threaded fit connection with the first connection hole 19.

[0034] The heat dissipation groove 3 is of an oblong groove structure, is horizontally arranged, and is evenly distributed inside the aluminum substrate 2. The heat dissipation holes 16 are vertically arranged and communicate with the heat dissipation groove 3, and are evenly distributed at the top end of the aluminum substrate 2. Embodiment

[0035] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 As shown in, a combined aluminum substrate includes a mounting plate 1. An installation groove 14 is formed at the top end of the mounting plate 1. A first connection hole 19 is formed on the side of the installation groove 14. An aluminum substrate 2 is mounted at the top end of the mounting plate 1. A plug-in board 5 is fixed to the bottom end of the aluminum substrate 2. A positioning groove 20 is formed on the side of the plug-in board 5. Reinforcing rings 6 are mounted on both the inner and outer sides of the aluminum substrate 2 and the mounting plate 1. A second connection hole 18 is formed on the side of the reinforcing ring 6. A fastening bolt 4 passes through the inside of the first connection hole 19 and the second connection hole 18, and the inner end of the fastening bolt 4 abuts against the positioning groove 20. A heat dissipation groove 3 is formed inside the aluminum substrate 2. A heat dissipation hole 16 is formed at the top end of the heat dissipation groove 3. Through holes 17 are formed at positions on the side of the reinforcing ring 6 and at both ends of the heat dissipation groove 3.

[0036] An installation groove 14 is provided at the top end of the mounting plate 1. A plug-in board 5 is fixed to the bottom end of the aluminum substrate 2. The plug-in board 5 is slidably inserted into the installation groove 14 and is tightened by a fastening bolt 4. In addition, reinforcing rings 6 are respectively provided on the inner and outer sides of the aluminum substrate 2 and the mounting plate 1 and are connected by the fastening bolt 4. Therefore, the aluminum substrate 2 can be conveniently disassembled and assembled, which is convenient for maintaining the aluminum substrate 2 and keeps the combined installation of the aluminum substrate 2 stable and protected.

[0037] Bonding pads 15 are arranged at intervals at the top end of the aluminum substrate 2. A circuit layer 13 is connected to the top end of the bonding pad 15. A chip 11 is connected to the top end of the circuit layer 13. A packaging glue layer 12 is provided outside the circuit layer 13 and the chip 11. Limiting rings 7 are provided on both sides of the packaging glue layer 12. An insulating layer 10 is provided at the top end of the packaging glue layer 12. A buffer layer 9 is bonded to the top end of the insulating layer 10. A protective layer 8 is bonded to the top end of the buffer layer 9.

[0038] A heat dissipation groove 3 is provided inside the aluminum substrate 2, and a heat dissipation hole 16 is provided at its top end and communicated with the through hole 17. At the same time, a gap connection is formed between the circuit layer 13 and the top end of the aluminum substrate 2 through the bonding pad 15. Therefore, the high-temperature heat generated by the circuit layer 13 during use can be dissipated outward through the heat dissipation hole 16, the heat dissipation groove 3 and the through hole 17, cooling and exhausting heat inside the aluminum substrate 2 to maintain the safe use inside the circuit layer 13. Moreover, the top end of the circuit layer 13 provides insulation and compression resistance protection for the top end of the aluminum substrate 2 through the insulation layer 10, the buffer layer 9 and the protective layer 8.

[0039] The bonding pads 15 are uniformly arranged at the top end of the aluminum substrate 2 and are arranged offset from the heat dissipation holes 16. A gap is provided between the circuit layer 13 and the top end of the aluminum substrate 2. The limiting ring 7 is of a circular ring structure and is made of heat-conducting silica gel material. The buffer layer 9 is made of latex material, and the protective layer 8 is made of silicon nitride material.

[0040] Working mode: An installation groove 14 is provided at the top end of the mounting plate 1. A plug-in plate 5 is fixedly provided at the bottom end of the aluminum substrate 2. The plug-in plate 5 is slidably inserted into the installation groove 14 and tightened by a fastening bolt 4. In addition, reinforcing rings 6 are respectively provided on the inner and outer sides of the aluminum substrate 2 and the mounting plate 1 and are connected by the fastening bolt 4. Therefore, the aluminum substrate 2 can be conveniently disassembled and assembled, facilitating the maintenance of the aluminum substrate 2 and keeping the combined installation of the aluminum substrate 2 stable and protected.

[0041] A heat dissipation groove 3 is provided inside the aluminum substrate 2, and a heat dissipation hole 16 is provided at its top end and communicated with the through hole 17. At the same time, a gap connection is formed between the circuit layer 13 and the top end of the aluminum substrate 2 through the bonding pad 15. Therefore, the high-temperature heat generated by the circuit layer 13 during use can be dissipated outward through the heat dissipation hole 16, the heat dissipation groove 3 and the through hole 17, cooling and exhausting heat inside the aluminum substrate 2 to maintain the safe use inside the circuit layer 13. Moreover, the top end of the circuit layer 13 provides insulation and compression resistance protection for the top end of the aluminum substrate 2 through the insulation layer 10, the buffer layer 9 and the protective layer 8.

[0042] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A combined aluminum substrate, comprising a mounting plate (1), characterized in that: The top of the mounting plate (1) is provided with a mounting groove (14), the side of the mounting groove (14) is provided with a first connection hole (19), the top of the mounting plate (1) is mounted with an aluminum substrate (2), the bottom end of the aluminum substrate (2) is fixed with a plug-in plate (5), the side of the plug-in plate (5) is provided with a positioning groove (20), reinforcing rings (6) are mounted on both the inner and outer sides of the aluminum substrate (2) and the mounting plate (1), the side of the reinforcing ring (6) is provided with a second connection hole (18), a fastening bolt (4) passes through the interiors of the first connection hole (19) and the second connection hole (18), the inner end of the fastening bolt (4) abuts against the positioning groove (20), a heat dissipation groove (3) is formed inside the aluminum substrate (2), a heat dissipation hole (16) is formed at the top of the heat dissipation groove (3), and through holes (17) are formed at the positions of both ends of the heat dissipation groove (3) on the side of the reinforcing ring (6).

2. The combined aluminum substrate according to claim 1, characterized in that: Bonding pads (15) are arranged at intervals on the top of the aluminum substrate (2), a circuit layer (13) is connected to the top of the bonding pad (15), a chip (11) is connected to the top of the circuit layer (13), a packaging glue layer (12) is arranged outside the circuit layer (13) and the chip (11), limiting rings (7) are arranged on both sides of the packaging glue layer (12), an insulating layer (10) is arranged at the top of the packaging glue layer (12), a buffer layer (9) is bonded to the top of the insulating layer (10), and a protective layer (8) is bonded to the top of the buffer layer (9).

3. The combined aluminum substrate according to claim 1, wherein: The mounting plate (1) is a circular ring plate structure and is horizontally arranged, the mounting groove (14) is a rectangular groove structure and is vertically arranged, and its depth is less than the thickness of the mounting plate (1).

4. A combined aluminum substrate according to claim 1, characterized in that: The reinforcing ring (6) adopts a circular ring structure, the first connection hole (19) is a threaded hole structure and is horizontally arranged, and the aluminum substrate (2) is a circular ring structure and is horizontally arranged.

5. The combined aluminum substrate according to claim 1, characterized in that: The plug-in plate (5) is a rectangular plate structure and is vertically arranged, and is slidably inserted into the interior of the mounting groove (14), the plug-in plates (5) are evenly distributed at the bottom end of the aluminum substrate (2), and the mounting grooves (14) are evenly distributed at the top of the mounting plate (1).

6. A combined aluminum substrate according to claim 1, characterized in that: The depth of the positioning groove (20) is less than the thickness of the plug-in plate (5), and is horizontally aligned with the first connection hole (19) and the second connection hole (18), the fastening bolt (4) is horizontally arranged and is in threaded fit connection with the first connection hole (19).

7. A combined aluminum substrate according to claim 1, characterized in that: The heat dissipation groove (3) is an oblong groove structure and is horizontally arranged, and is evenly distributed inside the aluminum substrate (2), the heat dissipation hole (16) is vertically arranged and is communicated with the heat dissipation groove (3), and is evenly distributed at the top of the aluminum substrate (2).

8. The combined aluminum substrate according to claim 2, wherein: The bonding pad (15) is uniformly arranged at the top of the aluminum substrate (2) and is arranged offset from the heat dissipation holes (16). A gap is provided between the circuit layer (13) and the top of the aluminum substrate (2). The limiting ring (7) is of an annular structure and is made of heat-conducting silica gel material. The buffer layer (9) is made of latex material, and the protective layer (8) is made of silicon nitride material.

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