Circuit board structure for 0201 device welding optimization

Abstract

The utility model discloses a 0201 device welding optimized circuit board structure, comprising a 0201 device applied to a circuit board, the periphery of the 0201 device is provided with a silk-screen cloth-forbidding area, the distance between the edge of the silk-screen cloth-forbidding area and the 0201 device in the vertical direction is not less than 2mm, and the distance between the edge of the silk-screen cloth-forbidding area and the 0201 device in the transverse direction is not less than 2mm. According to the utility model, the screen printing cloth forbidding area is arranged around the 0201 device, the distance between the screen printing line, the screen printing position number, the screen printing corner mark and the like and the 0201 device is enlarged, so that the distance is more than 2mm, the situation that the soldering tin printing quantity of a bonding pad is not uniform due to the influence of the screen printing height during soldering tin printing, and consequently the welding is unstable is reduced, and the product quality is improved. Therefore, the position precision of solder paste printing and the uniformity of the amount of the solder paste are guaranteed, meanwhile, the consistency of the amount of the solder paste at the two ends of the 0201 device is effectively guaranteed, and the welding problem of the 0201 device is greatly solved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, and more specifically, to a circuit board structure with optimized soldering of 0201 components. Background Art

[0002] With the rapid development of technology, electronic products are evolving towards high integration, diverse functionality, and portability. This trend is particularly evident in smartphones and various intelligent terminals. These devices not only require powerful computing and communication capabilities but also need to maintain a thin and light form factor to meet users' pursuit of portability and aesthetics.

[0003] To achieve this goal, the internal components of electronic products are constantly undergoing miniaturization and high-density integration. Based on traditional packaging technologies such as BGA (Ball Grid Array), CSP (Chip Scale Package), QFP (Quad Flat Package), etc., smaller-sized micro-packaged components, such as 0402, 0201, and even 01005, have gradually become the market mainstream. These micro-components, with their extremely small size and highly integrated characteristics, have significantly improved the utilization rate of the internal space of electronic products, promoting the miniaturization and lightening of products. However, this development trend also poses more stringent requirements for the electronic assembly process.

[0004] With the widespread application of micro-packaged components and the sharp increase in layout density, the accuracy and stability in the electronic assembly process have become technical problems that urgently need to be solved. Specifically, the pad size of micro-chip components is extremely small, and there are usually silk-screen lines printed around them for identification or positioning. However, the thickness generated after silk-screen printing (generally between 5 microns and 50 microns) has a significant impact on the subsequent solder printing process.

[0005] The machine for brushing solder paste is called a solder paste printer. As a key device in the electronic assembly process, the solder paste printer is mainly responsible for precisely printing the solder paste onto the corresponding pads of the circuit board. Its working principle is to first fix the circuit board on the printing positioning table, and then use the left and right scrapers of the solder paste printer to screen-print the solder paste through the stencil onto the corresponding pads.

[0006] For components with extremely small sizes such as 0201, their pad area is limited, and the openings of the stencil are correspondingly reduced, resulting in a very limited amount of solder printed each time. The thickness of the silk-screen line will affect the thickness of the solder printed onto the corresponding pads by the left and right scrapers of the solder paste printer through the stencil, making the solder content on the pads of the original 0201 device less, leading to unstable soldering. Summary of the Utility Model

[0007] In order to overcome the problem that the thickness of the existing silk-screen line affects the thickness of the solder paste printed by the left and right squeegees of the solder paste printer through the stencil onto the corresponding pads, and the silk-screen line reduces the solder paste content on the pads of the original 0201 device, resulting in unstable soldering, the present utility model provides a circuit board structure for optimizing the soldering of 0201 devices.

[0008] The technical solution of the present utility model is described as follows:

[0009] A circuit board structure for optimizing the soldering of 0201 devices, including 0201 devices applied to the circuit board, a silk-screen prohibited area is provided around the 0201 devices, the distance between the edge of the silk-screen prohibited area and the 0201 devices in the vertical direction is not less than 2 mm, and the distance between the edge of the silk-screen prohibited area and the 0201 devices in the horizontal direction is not less than 2 mm.

[0010] According to the present utility model of the above solution, the size of the 0201 device is 0.6 mm × 0.3 mm.

[0011] According to the present utility model of the above solution, the number of pads of the 0201 device is two, and the distance between the two pads is 0.2 - 0.3 mm.

[0012] According to the present utility model of the above solution, the size of the pad is 0.3 mm × 0.25 mm.

[0013] According to the present utility model of the above solution, a solder mask opening is provided outside the pad, and the distance between the solder mask opening and the pad is greater than 0.05 mm.

[0014] According to the present utility model of the above solution, a silk-screen reference number is provided outside the silk-screen prohibited area of the 0201 device.

[0015] According to the present utility model of the above solution, the font height of the silk-screen reference number is greater than 0.70 mm, and the font width of the silk-screen reference number is greater than 0.45 mm.

[0016] According to the present utility model of the above solution, a silk-screen corner mark is provided outside the silk-screen prohibited area of the 0201 device.

[0017] According to the present utility model of the above solution, the font height of the silk-screen corner mark is greater than 0.70 mm, and the font width of the silk-screen corner mark is greater than 0.45 mm.

[0018] The utility model according to the above solution has the beneficial effect that by setting a screen printing prohibited area around the 0201 device, the distances between the screen printing line, the screen printing reference number, the screen printing corner mark, etc. and the 0201 device are increased to more than 2 mm, so as to reduce the situation that during solder printing, the screen printing height affects the uneven solder printing amount on the pads, resulting in unstable soldering. This not only ensures the position accuracy of solder paste printing and the uniformity of solder paste amount, but also effectively ensures the consistency of solder paste amounts at both ends of the 0201 device, greatly reducing the soldering problems of the 0201 device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0020] Figure 1 is a structural schematic diagram of the present utility model;

[0021] Figure 2 is Figure 1 an enlarged structural schematic diagram of part A in

[0022] In the figure, the respective reference numerals are as follows:

[0023] 100, circuit board; 10, 0201 device; 11, pad; 12, solder mask opening; 20, screen printing prohibited area; 30, screen printing reference number; 40, screen printing corner mark. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present utility model more clearly understood, the following further details the present utility model in conjunction with the drawings and embodiments.

[0025] It should be noted that the terms "comprising" and "having" and any variations thereof in the description and claims of the present utility model are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include steps or units not listed, or may optionally further include other steps or units inherent to these processes, methods, products or devices. Terms such as "arranged" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. The orientations or positions indicated by terms such as "upper", "lower", "left", "right", "front", "rear", "bottom", etc. are based on the orientations or positions shown in the drawings, and are only for convenience of description and should not be construed as a limitation to the technical solution of the present invention.

[0026] It should be noted that with the wide application of micro-packaged components and the sharp increase in layout density, the accuracy and stability in the electronic assembly process have become technical problems that need to be solved urgently. Specifically, the pad size of micro-chip components is extremely small, and there are usually silk screen lines printed around them for identification or positioning. However, the thickness generated after silk screen printing (generally between 5 microns and 50 microns) has a significant impact on the subsequent solder printing process.

[0027] For components with extremely small sizes such as 0201, their pad areas are already limited, and the openings of the stencil are correspondingly reduced, and the amount of solder printed each time is very limited. The thickness of the silk screen line will affect the thickness of the solder paste printed on the corresponding pads through the stencil by the left and right squeegees of the solder paste printer. The silk screen line makes the solder paste content on the pads of the 0201 device less, resulting in unstable welding.

[0028] As Figure 1 - Figure 2 shown, the present embodiment provides a circuit board structure for optimizing the welding of 0201 devices. By setting a silk screen prohibited area 20 around the 0201 device 10, the distances between the silk screen line, the silk screen reference number 30, the silk screen corner mark 40, etc. and the 0201 device 10 are increased, and the spacing is more than 2 mm. When reducing solder printing, the situation that the uneven solder printing amount on the pads 11 is affected by the silk screen height and causes unstable welding is reduced. This not only ensures the position accuracy of solder paste printing and the uniformity of the solder paste amount, but also effectively ensures the consistency of the solder paste amounts at both ends of the 0201 device 10, and greatly reduces the welding problems of the 0201 device 10.

[0029] Specifically, it includes the 0201 device 10 applied on the circuit board 100. There is a silk screen prohibited layout area 20 around the 0201 device 10. The distance between the edge of the silk screen prohibited layout area 20 and the 0201 device 10 in the vertical direction is not less than 2 mm, and the distance between the edge of the silk screen prohibited layout area 20 and the 0201 device 10 in the horizontal direction is not less than 2 mm.

[0030] The silk screen prohibited layout area 20 restricts the layout of elements such as silk screen lines, silk screen reference numbers 30, and silk screen corner marks 40. The distance between the edge of the silk screen prohibited layout area 20 and the 0201 device 10 in the vertical direction is set to be not less than 2 mm, and also not less than 2 mm in the horizontal direction to ensure sufficient spatial separation. By increasing the distance between the silk screen elements and the pads 11 of the 0201 device 10, the interference of the silk screen thickness on the solder printing process can be effectively reduced. During the solder paste printing process, the solder paste printer precisely coats the solder paste on the pads 11 through the method of stencil printing. The setting of the silk screen prohibited layout area 20 ensures that there is no silk screen interference around the pads 11, thus guaranteeing the position accuracy of the solder paste printing and the uniformity of the solder paste amount.

[0031] It should be noted that this embodiment is not limited to the 0201 device 10, and other devices with smaller sizes also fall within the protection scope of this embodiment.

[0032] In one embodiment, the size of the 0201 device 10 is 0.6 mm × 0.3 mm. The number of pads 11 of the 0201 device 10 is two, and the two pads 11 are respectively located on both sides of the 0201 device 10 for welding with the 0201 device 10 on the circuit board 100, and the distance between the two pads 11 is 0.2 - 0.3 mm.

[0033] The size of the pad 11 is 0.3 mm ×  0.25 mm. The size of the pad 11 is based on a deep understanding of the welding process requirements and precise control of the solder fluidity. The size of the pad 11 of 0.3 mm × 0.25 mm can ensure the uniform distribution of the solder during the welding process and form a stable and reliable electrical connection.

[0034] There is a solder mask opening 12 outside the pad 11. The solder mask opening 12 is a specific window opened on the solder mask layer of the circuit board 100 for exposing the pad 11 for welding. In this embodiment, the distance between the solder mask opening 12 and the pad 11 is designed to be greater than 0.05 mm. This distance setting aims to provide sufficient electrical insulation space and avoid the overflow or bridging of the solder during the welding process, ensuring the accuracy and reliability of the welding.

[0035] In one embodiment, the 0201 device 10 is provided with a silk screen position number 30 outside the silk screen prohibited area 20. The font height of the silk screen position number 30 is greater than 0.70mm, the font width of the silk screen position number 30 is greater than 0.45mm, and the font line width is greater than 0.125mm. The silk screen position number 30 serves as the unique identification mark of the 0201 device 10 on the circuit board 100. The font height of the silk screen position number 30 is set to be greater than 0.70mm to ensure that it can be clearly identified under different lighting conditions; at the same time, the font width is set to be greater than 0.45mm to enhance the overall visual recognition. In addition, the font line width is set to be greater than 0.125mm, which helps to improve the clarity and durability of the silk screen and prevent information from being blurred due to wear during the production process.

[0036] The 0201 device 10 is provided with a silk screen corner mark 40 outside the silk screen prohibited area 20. The font height of the silk screen corner mark 40 is greater than 0.70mm, the font width of the silk screen corner mark 40 is greater than 0.45mm, and the font line width is greater than 0.125mm. The silk screen corner mark 40 serves as an important reference for the position and direction of the device. The silk screen corner mark 40 has the same font specification requirements as the silk screen position number 30, that is, the font height is greater than 0.70mm, the font width is greater than 0.45mm, and the font line width is greater than 0.125mm. Such a design ensures the high recognition of the silk screen corner mark 40 on the circuit board 100, helps the operator to quickly and accurately confirm the installation position and direction of the device, and reduces assembly errors.

[0037] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

[0038] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A circuit board structure for optimizing the soldering of 0201 devices, characterized in that, It includes 0201 devices applied on a circuit board. There are silk screen non - layout areas around the 0201 devices. The distance between the edge of the silk screen non - layout area and the 0201 device in the vertical direction is not less than 2 mm, and the distance between the edge of the silk screen non - layout area and the 0201 device in the horizontal direction is not less than 2 mm.

2. The circuit board structure for optimizing the soldering of 0201 devices according to claim 1, characterized in that, The size of the 0201 device is 0.6 mm × 0.3 mm.

3. A circuit board structure for optimizing the soldering of 0201 devices according to claim 1 or 2, characterized in that, The number of pads of the 0201 device is two, and the distance between the two pads is 0.2 - 0.3 mm.

4. The circuit board structure for optimizing the soldering of 0201 devices according to claim 3, characterized in that, The size of the pad is 0.3 mm × 0.25 mm.

5. The circuit board structure for optimizing the soldering of 0201 devices according to claim 4, characterized in that, There is a solder mask opening outside the pad, and the distance between the solder mask opening and the pad is greater than 0.05 mm.

6. The circuit board structure for optimizing the soldering of 0201 devices according to claim 1, characterized in that, The 0201 device has a silk screen reference designator outside the silk screen non - layout area.

7. The circuit board structure for optimizing the soldering of 0201 devices according to claim 6, characterized in that, The font height of the silk screen reference designator is greater than 0.70 mm, and the font width of the silk screen reference designator is greater than 0.45 mm.

8. A circuit board structure for optimizing the soldering of 0201 devices according to claim 1, characterized in that, The 0201 device has a silk screen corner mark outside the silk screen non - layout area.

9. The circuit board structure for optimizing the soldering of 0201 devices according to claim 8, characterized in that, The font height of the silk screen corner mark is greater than 0.70 mm, and the font width of the silk screen corner mark is greater than 0.45 mm.

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