Continuous packaging equipment for FPC (Flexible Printed Circuit)

Abstract

The utility model relates to continuous packaging equipment for an FPC (Flexible Printed Circuit), which comprises a bearing bottom plate, and a rotary feeding assembly which is supported on the bearing bottom plate through a first lifting support column and can continuously convey workpieces to a packaging station and a packaging assembly continuously carries out packaging processing, a second lifting supporting assembly which is supported on the bearing bottom plate and can suspend the packaging assembly above the rotary feeding assembly is further arranged on one side of the rotary feeding assembly. A cooling assembly capable of conducting condensation treatment on the workpieces subjected to injection molding packaging is further arranged on the installation face limited by the second lifting supporting assembly. According to the utility model, the rotating disc type transmission structure is arranged to construct a plurality of different stations in a partitioned manner, and packaging, condensation and dismounting operation are synchronously completed at the different stations, so that continuous packaging processing of FPC workpieces is realized, and packaging convenience, packaging quality and packaging efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC packaging tooling, and particularly relates to a continuous packaging device for FPC. Background Art

[0002] A flexible printed circuit (FPC) is a printed circuit made of a flexible insulating substrate and has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, can be arranged arbitrarily according to the requirements of the spatial layout, and can move and stretch arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. By using FPC, the volume of electronic FPC can be greatly reduced, which meets the needs of the development of electronic FPC towards high density, miniaturization, and high reliability. Therefore, FPC has been widely used in the fields of aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital camera, etc. or on FPC.

[0003] For example, the patent document with the application number CN115635644A discloses a packaging mold and a packaging process for FPC, which includes a lower mold base and an upper mold base. The lower mold base is located below the upper mold base, and the outer surface of the upper end of the lower mold base is provided with a lower mold body. The outer surface of one end of the lower mold body is provided with a docking guide groove, a ventilation hole, and a glue groove. This mold can perform the packaging process of multiple workpieces at one time by opening a plurality of cavities arranged in an array on the mold surface to improve the packaging efficiency. However, after completing a batch of injection molding packaging, this mold needs to stop the machine to remove the workpieces and load another batch of workpieces, and does not effectively reduce the downtime interval. During the continuous packaging process, a large amount of downtime is still required for independent workpiece disassembly and replacement operations, which greatly limits the comprehensive packaging efficiency during large-scale processing. In addition, since the packaging material needs a certain time to cool and solidify, and the existing mold does not have a condensation auxiliary structure, it is necessary to extend the downtime to naturally cool the packaging material on the surface of the workpiece to ensure packaging stability, which further increases the packaging time and reduces the packaging efficiency. Finally, the existing packaging mold does not have an auxiliary material taking structure, which is not convenient to quickly take out the packaged workpieces from the mold, increases the difficulty of workpiece removal, and reduces the comprehensive efficiency of packaging processing. Summary of the Utility Model

[0004] The purpose of the present utility model is to provide a continuous encapsulation device for FPC, which can partition and construct multiple different workstations by setting a rotary transmission structure, and synchronously complete encapsulation, condensation, disassembly and assembly operations at different workstations, so as to realize the continuous encapsulation processing of FPC workpieces, improve the encapsulation convenience, encapsulation quality and encapsulation efficiency, and solve the problems that the existing FPC encapsulation molds cannot continuously perform workpiece encapsulation operations, need to consume a large amount of downtime for the condensation of encapsulation substances and the disassembly, assembly and replacement of workpieces, which greatly reduces the encapsulation efficiency, and the existing encapsulation molds do not have an auxiliary material taking structure, the difficulty of workpiece removal is large, which increases the disassembly and assembly time and reduces the comprehensive efficiency of encapsulation processing.

[0005] The technical solution adopted by the present utility model is as follows: A continuous encapsulation device for FPC, including a bearing bottom plate, on which a rotary feeding component supported by a first lifting pillar is provided, which can continuously transport workpieces to the encapsulation station and the encapsulation component continuously performs encapsulation processing. On one side of the rotary feeding component, a second lifting support component supported on the bearing bottom plate and capable of suspending the encapsulation component above the rotary feeding component is also provided. On the installation surface defined by the second lifting support component, a cooling component capable of condensing the workpieces after injection molding encapsulation is also provided.

[0006] According to a preferred implementation manner, the rotary feeding component includes a rotary disk body, a rotary driving motor, a pushing module and a negative pressure module. Among them, the rotary disk body is connected to the rotary shaft of the rotary driving motor supported on the first lifting pillar, and a plurality of encapsulation grooves capable of accommodating workpieces are circumferentially and spaced apart on the upper surface of the rotary disk body; a pushing module capable of adjustably pushing the workpieces in the encapsulation grooves out of the cavity is movably inserted on the lower surface of the rotary disk body; and a negative pressure module capable of communicating with the encapsulation grooves is also provided on the upper surface of the rotary disk body.

[0007] According to a preferred implementation manner, a through hole capable of accommodating at least part of the pushing module is provided on the bottom surface of the encapsulation groove, and an air guide pipe radially coinciding with the disk body of the rotary disk body is also connected to the side wall of the through hole cavity; the radially inner ends of a plurality of air guide pipes communicating with the through hole meet at the central axis of the disk body of the rotary disk body, and the air guide pipe is communicated with the negative pressure module through a central axis insertion pipe coinciding with the central axis of the disk body of the rotary disk body.

[0008] According to a preferred embodiment, the upper push rod of the material pushing module is inserted into the through hole, and an upper top net plate is arranged at the upper axial end of the upper push rod; a piston column is also sleeved on the rod body of the upper push rod, which can adjustably block the port where the air guide pipe penetrates through the side wall of the through hole. A sliding ball head is also arranged at the lower axial end of the upper push rod, and a limiting spring for limiting the length of its insertion into the through hole is sleeved on the rod body of the upper push rod below the piston column.

[0009] According to a preferred embodiment, an adjustment and position control mechanism for adjusting the working position of the material pushing module is further arranged on the bearing bottom plate. The adjustment and position control mechanism includes a curved arc plate and a third lifting support rod. Among them, the curved arc plate is supported below the material pushing module by the third lifting support rod installed on the bearing bottom plate.

[0010] According to a preferred embodiment, a plurality of second lifting support rods of the second lifting support assembly are spaced around the rotating disk body and supported on the bearing bottom plate, and the upper axial ends of the plurality of second lifting support rods are all connected to the top flat plate defining the installation surface.

[0011] According to a preferred embodiment, the encapsulation assembly includes an upper die body, a lifting array and an injection molding module. Among them, the upper die body is installed on the lower plate surface of the top flat plate through the lifting array, and the upper die body can be adjustably covered on the upper slot opening surface of the encapsulation groove under the drive of the lifting array to define an encapsulation chamber with the encapsulation groove; the upper die body is also connected with the injection molding module capable of injecting encapsulation materials into the encapsulation chamber.

[0012] According to a preferred embodiment, a convex platform capable of being embedded into the encapsulation groove is arranged on the lower surface of the upper die body, and a sealing gasket is also arranged on the lower surface of the upper die body in a manner surrounding the convex platform; a through injection port is also arranged on the upper die body, and the upper axial port of the through injection port is communicated with the injection molding module.

[0013] According to a preferred embodiment, the condensation plate of the cooling assembly is connected to the top flat plate by a lifting connecting rod, so that the condensation plate can be lifted and lowered synchronously with the upper die body to cover the encapsulation groove to perform condensation treatment on the workpiece after injection molding encapsulation; heat exchange fins capable of partially being stuck into the encapsulation groove are inlaid on the condensation plate; a heat dissipation fan is arranged on the upper surface of the condensation plate.

[0014] According to a preferred embodiment, an anti-adhesion film layer capable of preventing the encapsulation materials from sticking is also coated on the lower surface of the heat exchange fins.

[0015] The beneficial effects of the present utility model are:

[0016] The rotating feeding component provided in this application can continuously drive the workpieces arranged at annular intervals to rotate in a circle, so that several workpieces can sequentially pass through the encapsulation station and the condensation station in an orderly manner. The workpieces at different stations can be synchronously encapsulated and condensed under the action of the encapsulation component and the cooling component that move down synchronously, and the material taking and loading can be completed during the further transfer movement interval. This enables the processing operation and the workpiece disassembly and assembly operation to be carried out synchronously, and the equipment can continuously process the workpiece encapsulation without stopping, allowing different workpieces to be encapsulated, condensed, disassembled, and assembled simultaneously, thereby eliminating the additional processing time consumed by the existing separate downtime disassembly and assembly process for encapsulating workpieces, shortening the processing cycle, and also being able to condense and solidify the encapsulated workpieces, accelerating the solidification of the encapsulation material, greatly enhancing the solidification speed of the encapsulation layer, and reducing the additional time required for the solidification of the encapsulation material. By synchronously performing different processes, the continuous and uninterrupted encapsulation processing is realized, thereby effectively improving the encapsulation efficiency. Description of the Drawings

[0017] Figure 1 It is a schematic structural diagram of a preferred continuous encapsulation device for FPC proposed by the present utility model;

[0018] Figure 2 It is a schematic plan view of the rotating disk body of a preferred continuous encapsulation device for FPC proposed by the present utility model;

[0019] Figure 3 It is a schematic plan view of the second lifting and supporting component of a preferred continuous encapsulation device for FPC proposed by the present utility model;

[0020] Figure 4 It is a schematic side view of the adjustment and positioning mechanism of a preferred continuous encapsulation device for FPC proposed by the present utility model.

[0021] List of Reference Numerals

[0022] 1: Bearing bottom plate; 2: First lifting strut; 3: Rotary feeding assembly; 4: Second lifting support assembly; 5: Encapsulation assembly; 6: Cooling assembly; 31: Rotary disk body; 32: Rotary drive motor; 33: Pushing module; 34: Negative pressure module; 35: Adjusting and positioning mechanism; 41: Second lifting support rod; 42: Top flat plate; 51: Upper die body; 52: Lifting array; 53: Injection molding module; 61: Condensing plate; 62: Lifting connecting rod; 63: Heat exchange fin; 64: Cooling fan; 311: Encapsulation groove; 312: Through hole; 313: Air duct; 314: Central axis insertion tube; 331: Upper push rod; 332: Upper top net plate; 333: Piston column; 334: Sliding ball head; 335: Limiting spring; 351: Curved arc plate; 352: Third lifting support rod; 511: Boss; 512: Sealing washer; 513: Through injection port; 631: Anti-adhesive layer. Detailed implementation mode

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the present invention in combination with the drawings and the descriptions of the embodiments or the prior art. Obviously, the following descriptions of the structures of the drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0024] The following will refer to the drawings and describe in detail the technical solutions provided by the present invention through embodiment modes. It should be noted here that the descriptions of these embodiment modes are used to help understand the present invention, but do not constitute a limitation to the present invention. In some examples, since some embodiment modes belong to the prior art or conventional technology, they are not described or not described in detail.

[0025] In addition, the technical features described herein, or the steps in all the methods or processes disclosed, except for mutually exclusive features and / or steps, can also be combined in any suitable manner in one or more embodiments. For those skilled in the art, it is easy to understand that the steps or operation sequences of the methods related to the embodiments provided herein can also be changed. Any sequence in the drawings and the embodiments is only for illustrative purposes and does not imply a requirement to follow a certain sequence, unless clearly stated to follow a certain sequence.

[0026] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meanings. And the "connection" and "coupling" mentioned in this application, under reasonable circumstances (without self-contradiction), both include direct and indirect connections (couplings).

[0027] The following will be described in detail with reference to the drawings.

[0028] Embodiment 1

[0029] The present application provides a continuous encapsulation device for an FPC, which includes a bearing bottom plate 1, a first lifting support column 2, a rotary feeding component 3, a second lifting support component 4, an encapsulation component 5, and a cooling component 6.

[0030] According to Figures 1-4 A specific implementation manner shown, a rotary feeding component 3 capable of continuously transporting workpieces to the encapsulation station for continuous encapsulation processing by the encapsulation component 5 is supported on the bearing bottom plate 1 through the first lifting support column 2. On one side of the rotary feeding component 3, a second lifting support component 4 is further provided, which is supported on the bearing bottom plate 1 and can suspend the encapsulation component 5 above the rotary feeding component 3. A cooling component 6 capable of condensing the workpieces that have completed injection molding encapsulation is further provided on the installation surface defined by the second lifting support component 4. When two adjacent workpieces among the circumferentially spaced workpieces transported by the rotary feeding component 3 move to the encapsulation station and the condensation station respectively, the encapsulation component 5 and the cooling component 6 synchronously descend and come into contact with the rotary feeding component 3, so as to respectively complete injection molding encapsulation on the two adjacent and spaced workpieces and then perform condensation treatment on the encapsulation material. Among them, the workpiece processed by the cooling component 6 is the workpiece that has completed injection molding encapsulation through the encapsulation station in one processing process, that is, the encapsulation component 5 and the cooling component 6 are arranged at double stations at intervals along the movement path of the circumferentially spaced workpieces on the rotary feeding component 3, and the cooling component 6 is downstream of the encapsulation component 5 to condense the workpieces that have been completed injection molding encapsulation by the encapsulation component 5. The double station means that the relative arrangement positions of the encapsulation component 5 and the cooling component 6 correspond to the placement positions between two adjacent workpieces, so as to be able to synchronously perform different processing operations on two adjacent workpieces on the rotary feeding component 3. The rotary feeding component 3 provided in the present application can continuously drive the circumferentially spaced workpieces to rotate in a circle, so that a plurality of workpieces sequentially pass through the encapsulation station and the condensation station in an orderly manner. The workpieces at different stations can be synchronously encapsulated and condensed under the action of the encapsulation component 5 and the cooling component 6 that descend synchronously, and the material taking and loading operations can be completed during the further transfer movement gap, so that the processing operation and the workpiece disassembly and assembly operation can be carried out synchronously, and the device can continuously perform workpiece encapsulation processing without stopping, so that different workpieces can be simultaneously encapsulated, condensed, disassembled and assembled respectively, thereby eliminating the additional processing time consumed by the existing separate downtime disassembly and assembly process for encapsulating workpieces, shortening the processing cycle, and being able to condense and solidify the completed encapsulated workpieces, accelerating the solidification of the encapsulation material, greatly improving the solidification speed of the encapsulation layer, and reducing the additional time required for the solidification of the encapsulation material. By synchronously performing different processes, the continuous and uninterrupted encapsulation processing is realized, thereby effectively improving the encapsulation efficiency.

[0031] Preferably, the rotary feeding assembly 3 includes a rotary disk body 31, a rotary driving motor 32, a material pushing module 33, a negative pressure module 34, and an adjusting and positioning mechanism 35. Preferably, the center of the lower circular surface of the rotary disk body 31 is connected to the rotary shaft of the rotary driving motor 32 supported on the first lifting strut 2, so that the rotary disk body 31 can rotate around its own disk axis under the drive of the rotary driving motor 32. Further preferably, a plurality of encapsulation grooves 311 capable of accommodating workpieces are circumferentially and spaced apart on the upper surface of the rotary disk body 31. Preferably, a material pushing module 33 that can adjustably push the workpieces in the encapsulation grooves 311 out of the cavity is movably inserted into the lower surface of the rotary disk body 31. Preferably, a negative pressure module 34 that can communicate with the encapsulation grooves 311 and adjustably adsorb the workpieces on the inner bottom surface of the encapsulation grooves 311 is also provided on the upper surface of the rotary disk body 31. Preferably, an adjusting and positioning mechanism 35 for adjusting the working position of the material pushing module 33 is also provided on the bearing bottom plate 1. The rotary disk body 31 can perform intermittent step rotation under the drive of the rotary driving motor 32. The material pushing module 33 can adjustably position the workpieces to facilitate the removal and extraction of the workpieces. The negative pressure module 34 can controllably position the workpieces in the encapsulation grooves 311 to ensure the stability of their processing positions. Through the mutual cooperation of the above modules, the workpieces placed at intervals are driven to sequentially complete encapsulation, condensation, and discharging, thereby improving the encapsulation efficiency and quality while also enhancing the convenience of removal and extraction.

[0032] Preferably, a through hole 312 capable of accommodating at least a part of the material pushing module 33 is provided on the bottom surface of the encapsulation groove 311. Further preferably, an air guide pipe 313 that coincides with the radial direction of the disk body of the rotary disk body 31 is also connected to the side wall of the hole cavity of the through hole 312. Preferably, the radially inner ends of a plurality of air guide pipes 313 communicating with the through hole 312 meet at the central axis of the disk body of the rotary disk body 31. Further preferably, the air guide pipe 313 is communicated with the negative pressure module 34 through a central axis insertion pipe 314 that coincides with the central axis of the rotary disk body 31.

[0033] Preferably, the upper push rod 331 of the material pushing module 33 is inserted into the through hole 312. Further preferably, an upper top net plate 332 capable of jacking up the workpiece during the upward movement of the upper push rod 331 is provided at the upper end of the axial direction of the upper push rod 331. Preferably, a piston column 333 that can adjustably block the port of the air guide pipe 313 passing through the side wall of the through hole 312 is also sleeved on the rod body of the upper push rod 331. Preferably, a sliding ball head 334 is also provided at the lower end of the axial direction of the upper push rod 331. Further preferably, a limiting spring 335 that limits the length of its insertion into the through hole 312 is sleeved on the rod body of the upper push rod 331 below the piston column 333. Preferably, the upper end of the axial direction of the limiting spring 335 abuts against the lower surface of the rotary disk body 31, and its lower end of the axial direction abuts against the top end of the sliding ball head 334.

[0034] Preferably, the position control mechanism 35 includes a curved-edge arc plate 351 and a third lifting support rod 352. Preferably, the curved-edge arc plate 351 is supported below the pushing module 33 by the third lifting support rod 352 installed on the bearing bottom plate 1. Further preferably, the curved-edge arc plate 351 constructs the arc of its plate body in a manner that fits the movement path of the sliding ball head 334. Specifically, the upper edge of the plate body of the curved-edge arc plate 351 is set to have a curved shape with undulating contours, so that the sliding ball head 334 contacts the upper edge of the curved-edge arc plate 351 during rotation and is limited by the plate surface contour, and moves up and down along the curved contour during rotation, causing the upper push rod 331 to move up and partially insert into the encapsulation groove 311, thereby jacking up the workpiece.

[0035] Preferably, the second lifting support assembly 4 includes a second lifting support rod 41 and a top flat plate 42. Preferably, a plurality of second lifting support rods 41 are spaced around the rotating disk body 31 and supported on the bearing bottom plate 1. Further preferably, the upper axial ends of the plurality of second lifting support rods 41 are all connected to the top flat plate 42 that defines the mounting surface.

[0036] Preferably, the encapsulation assembly 5 includes an upper die body 51, a lifting array 52, and an injection molding module 53. Preferably, the upper die body 51 is installed on the lower plate surface of the top flat plate 42 through the lifting array 52. Specifically, the upper die body 51 can be adjustably covered on the upper end slot surface of the encapsulation groove 311 under the drive of the lifting array 52 and defines an encapsulation chamber with the encapsulation groove 311. Preferably, the upper die body 51 is further connected with an injection molding module 53 capable of injecting encapsulation material into the encapsulation chamber. Preferably, a boss 511 capable of being embedded in the encapsulation groove 311 is provided on the lower surface of the upper die body 51. Further preferably, a sealing gasket 512 is provided on the lower surface of the upper die body 51 in a manner surrounding the boss 511. Preferably, a through injection port 513 is further provided on the upper die body 51, and the upper axial port of the through injection port 513 is communicated with the injection molding module 53. Preferably, the through injection port 513 can communicate the encapsulation chamber and the injection molding module 53.

[0037] Preferably, the condensation plate 61 of the cooling assembly 6 is connected to the top flat plate 42 by a lifting connecting rod 62, so that the condensation plate 61 can be lifted and lowered synchronously with the upper die body 51 to cover the encapsulation groove 311, so as to condense the workpiece that has completed injection molding and encapsulation. Specifically, the condensation plate 61 and the upper die body 51 are arranged in the same distribution as two adjacent encapsulation grooves 311, so as to synchronously perform injection molding and encapsulation and condensation treatment on the workpieces in the two adjacent encapsulation grooves 311. Preferably, heat exchange fins 63 that can be partially inserted into the encapsulation groove 311 are embedded in the condensation plate 61, and the side of the heat exchange fin 63 facing the encapsulation groove 311 is the heat absorption end. Preferably, a cooling fan 64 is arranged on the upper surface of the condensation plate 61 to quickly dissipate the heat transferred by the heat exchange fins 63 for cooling. Preferably, the lower surface of the heat exchange fin 63 is further coated with an anti-adhesion film layer 631 that can prevent the encapsulation material from sticking.

[0038] The working principle of the present application is as follows:

[0039] During the packaging process, the rotary drive motor 32 drives the rotating disc 31 to perform intermittent stepping rotation in a clockwise direction, so that the packaging slots 311 sequentially pass through the disassembly and assembly stations away from the packaging assembly 5, and the workpieces are placed into the packaging slots 311 one by one through manual loading by the staff or by the robotic arm. The rotary drive motor 32 further drives the rotating disc 31 to rotate, so that the packaging slots 311 with the workpieces placed therein move to the packaging station, and the lifting array 52 drives the upper mold body 51 to descend and cover the packaging slots 311, thereby constructing a packaging space. Then, the injection molding module 53 injects the packaging material under slight pressure to encapsulate the surface of the workpiece. Then, the lifting array 52 drives the upper mold body 51 to rise and separate from the rotating disk body 31. Driven by the rotating drive motor 32, the rotating disk body 31 further deflects and moves the workpiece that has been completed by injection molding to the condensation station, so that the condensation plate 61 or the heat exchange plate 63 that rises and falls synchronously with the upper mold body 51 is used to condense and solidify the encapsulated material, thereby improving the stability of the encapsulation layer. During this process, the upper mold body 51 is synchronously performing the injection molding and encapsulation processing on the workpiece in another adjacent encapsulation groove 311. After the condensation and solidification are completed, the further deflection of the rotating disk body 31 drives the workpiece that has completed the encapsulation and condensation treatment to move to the disassembly and assembly station, and the workpiece is pushed out of the encapsulation groove 311 by the rising pushing module 33, so that the staff or the robot can quickly and non-destructively remove the workpiece that has been completed by the encapsulation, thereby reducing the difficulty of disassembly while increasing the disassembly speed, thereby improving the disassembly efficiency and improving the overall encapsulation efficiency. Furthermore, this continuous conveying process allows for the simultaneous encapsulation, solidification, and assembly / disassembly of different workpieces, eliminating the additional processing time associated with separate downtime for assembly / disassembly processes. This shortens the processing cycle and allows for the solidification of the encapsulated workpieces, accelerating the solidification of the encapsulating material and significantly increasing the solidification rate of the encapsulating layer while reducing the additional time required for the encapsulating material to solidify. By synchronizing these different processes, the encapsulation process remains continuous and uninterrupted, effectively improving encapsulation efficiency.

[0040] During the above continuous conveying process, the upper push rod 331 and the sliding ball head 334 rotate with the rotating disk body 31. Thus, when approaching the disassembly and assembly station, the sliding ball head 334 contacts the upper edge of the curved arc plate 351 and is limited. Furthermore, during further deflection, the sliding ball head 334 rises along the path defined by the upper edge contour of the curved arc plate 351, so that the upper push rod 331 rises through the through hole 312 and partially inserts into the encapsulation groove 311, in order to use the upper top net plate 332 to push the workpiece out of the encapsulation groove 311, thereby facilitating the removal of the encapsulated workpiece. And during the rising process of the upper push rod 331, the piston rod 333 located below the port where the air duct 313 penetrates the side wall of the through hole 312 moves upward synchronously to block the port of the air duct 313, thereby releasing the negative pressure adsorption force on the workpiece. After the removal is completed, the further rotation of the rotating disk body 31 drives the sliding ball head 334 to further move and descend along the path defined by the upper edge contour of the curved arc plate 351, so that the piston rod 333 descends synchronously with the upper push rod 331 to release the blocking of the port of the air duct 313, so that the air duct 313 assists the negative pressure module 34 to pump air to adsorb and press the newly placed workpiece on the inner bottom surface of the encapsulation groove 311, thereby realizing the positioning of the workpiece. The above process can perform negative pressure positioning and upper top discharging of the workpiece in zones, thereby improving the accuracy and quality of encapsulation while facilitating the removal of the workpiece.

[0041] The present utility model is not limited to the above optional embodiments. Anyone can obtain other various forms of products under the inspiration of the present utility model. However, no matter what changes are made in its shape or structure, as long as the technical solutions fall within the scope defined by the claims of the present utility model, they all fall within the protection scope of the present utility model. Those skilled in the art should understand that the description and drawings of the present utility model are illustrative and do not constitute a limitation to the claims. The protection scope of the present utility model is defined by the claims and their equivalents. Throughout the text, the features guided by "preferably" are only an optional manner and should not be understood as must be provided. Therefore, the applicant reserves the right to abandon or delete the relevant preferred features at any time.

Claims

1. A continuous encapsulation device for an FPC, comprising a carrying base plate (1), characterized in that, on the carrying base plate (1), a rotary feeding component (3) is supported by a first lifting support column (2), and the rotary feeding component (3) can continuously transport workpieces to an encapsulation station while an encapsulation component (5) continuously performs encapsulation processing; on one side of the rotary feeding component (3), a second lifting support component (4) is also arranged on the carrying base plate (1), and the second lifting support component (4) can suspend the encapsulation component (5) above the rotary feeding component (3); on the installation surface defined by the second lifting support component (4), a cooling component (6) is also arranged, which can perform condensation treatment on the workpieces that have completed injection molding encapsulation.

2. The continuous encapsulation device for FPC according to claim 1, wherein, The rotary feeding component (3) includes a rotary disk body (31), a rotary drive motor (32), a material pushing module (33) and a negative pressure module (34), wherein, the rotary disk body (31) is connected to the rotary shaft of the rotary drive motor (32) supported on the first lifting support column (2), and a plurality of encapsulation grooves (311) capable of accommodating workpieces are circumferentially and spaced apart on the upper surface of the rotary disk body (31); a material pushing module (33) that can adjustably push the workpieces in the encapsulation grooves (311) out of the groove cavity is movably inserted into the lower surface of the rotary disk body (31); on the upper surface of the rotary disk body (31), a negative pressure module (34) that can communicate with the encapsulation grooves (311) is also arranged.

3. The continuous encapsulation device for FPC according to claim 2, characterized in that, The bottom surface of the encapsulation groove (311) is provided with a through hole (312) capable of accommodating at least part of the material pushing module (33), and on the side wall of the hole cavity of the through hole (312), a gas guide pipe (313) that coincides with the radial direction of the disk body of the rotary disk body (31) is also connected; the radially inner ends of a plurality of gas guide pipes (313) communicating with the through hole (312) meet at the central axis of the disk body of the rotary disk body (31), and the gas guide pipe (313) is communicated with the negative pressure module (34) through a central axis insertion pipe (314) that coincides with the central axis of the disk body of the rotary disk body (31).

4. The continuous encapsulation device for FPC according to claim 3, characterized in that, The upper push rod (331) of the material pushing module (33) is inserted into the through hole (312), and an upper top net plate (332) is arranged at the upper end of the axial direction of the upper push rod (331); a piston column (333) that can adjustably block the port of the gas guide pipe (313) penetrating through the side wall of the through hole (312) is also sleeved on the rod body of the upper push rod (331); a sliding ball head (334) is also arranged at the lower end of the axial direction of the upper push rod (331), and a limiting spring (335) that limits the length of the upper push rod (331) inserted into the through hole (312) is sleeved on the rod body of the upper push rod (331) below the piston column (333).

5. The continuous encapsulation device for FPC according to claim 4, characterized in that, On the carrying base plate (1), an adjustment control mechanism (35) for adjusting the working position of the material pushing module (33) is also arranged. The adjustment and positioning mechanism (35) includes a curved-edge arc plate (351) and a third lifting support rod (352). Among them, the curved-edge arc plate (351) is supported below the pushing module (33) by the third lifting support rod (352) installed on the bearing bottom plate (1).

6. The continuous encapsulation device for the FPC according to claim 5, characterized in that, A plurality of second lifting support rods (41) of the second lifting support assembly (4) are spaced around the rotating disk body (31) and supported on the bearing bottom plate (1), and the upper ends of the plurality of second lifting support rods (41) in the axial direction are all connected to the top flat plate (42) that defines the installation surface.

7. The continuous encapsulation device for FPC according to claim 6, characterized in that, The encapsulation assembly (5) includes an upper die body (51), a lifting array (52), and an injection molding module (53). Among them, The upper die body (51) is installed on the lower plate surface of the top flat plate (42) through the lifting array (52), and the upper die body (51) can be adjustably covered on the upper notch surface of the encapsulation groove (311) under the drive of the lifting array (52) to define an encapsulation chamber with the encapsulation groove (311); The upper die body (51) is further connected with the injection molding module (53) capable of injecting encapsulation material into the encapsulation chamber.

8. The continuous encapsulation device for FPC according to claim 7, characterized in that, A boss (511) capable of being embedded in the encapsulation groove (311) is provided on the lower surface of the upper die body (51), and a sealing gasket (512) is also provided on the lower surface of the upper die body (51) in a manner surrounding the boss (511); A through injection port (513) is further provided on the upper die body (51), and the upper port in the axial direction of the through injection port (513) is communicated with the injection molding module (53).

9. The continuous encapsulation device for FPC according to claim 8, characterized in that, The condensation plate (61) of the cooling assembly (6) is connected to the top flat plate (42) by a lifting connecting rod (62) so that the condensation plate (61) can be lifted and lowered synchronously with the upper die body (51) and cover and be arranged on the encapsulation groove (311) to perform condensation treatment on the workpiece that has completed injection molding encapsulation; A heat exchange fin (63) capable of partially being stuck into the encapsulation groove (311) is inlaid on the condensation plate (61); A heat dissipation fan (64) is provided on the upper surface of the condensation plate (61).

10. The continuous encapsulation device for FPC according to claim 9, characterized in that, The lower surface of the heat exchange fin (63) is further coated with an anti-adhesion film layer (631) capable of preventing the encapsulation material from sticking.

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