Electronic device
By setting an annular gap between the light-transmitting cover plate and the shell and sealing it with colloidal parts, the problem of insufficient waterproofing performance of electronic equipment is solved, and the long-term waterproofing and normal operation of the optical module is achieved.
Patent Information
- Application Number
- CN202421816083.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-29
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-07-29
AI Technical Summary
In existing electronic equipment, the sealing performance between the translucent lens and the shell is poor and cannot meet the long-term waterproofing needs.
An annular gap is provided between the light-transmissive cover plate and the shell, and a colloidal member is used to seal the gap to increase the waterproof width. A receiving cavity is formed by the colloidal member and the adhesive member of the light-transmissive cover plate and the shell. The first surface of the colloidal member is bonded to the inner wall of the through-hole, and the second surface is bonded to the light-transmissive cover plate to achieve sealing the annular gap.
It improves the waterproof performance of electronic equipment, meets long-term waterproofing needs, and ensures the normal operation of the optical module, reducing the invasion of external sweat and sebum.
Smart Images
Figure CN223168547U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the technical field of electronic devices, and particularly to an electronic device. Background Art
[0002] Currently, electronic devices (such as smart watches or smart bracelets) are integrated with a heart rate detection function, and can collect the heart rate of users in daily life, work and other scenarios for health monitoring.
[0003] In related technologies, an electronic device includes a housing, a light-transmitting lens and a heart rate detection module. The heart rate detection module is located inside the housing. The light-transmitting lens is adhesively bonded to the housing by means of dispensing and covers a through-hole penetrating the housing. The light-transmitting lens is used to transmit or receive light beams emitted by the heart rate detection module to achieve heart rate detection.
[0004] However, in related technologies, the sealing performance between the light-transmitting lens and the housing is poor and cannot meet the long-term waterproofing requirements. Utility Model Content
[0005] The embodiments of the present application provide an electronic device, which can improve the sealing performance between the light-transmitting cover plate and the housing, thereby improving the waterproof performance of the electronic device, and further meeting the long-term waterproofing requirements.
[0006] The embodiments of the present application provide an electronic device, which includes a housing, a light-transmitting cover plate, an adhesive, a circuit board and a colloid member. The housing has a through-hole. The light-transmitting cover plate is arranged on the outer side of the housing and covers the through-hole along the thickness direction of the electronic device. The circuit board is connected to the inner side of the housing and covers the through-hole along the thickness direction of the electronic device. An annular gap is formed between the housing and the light-transmitting cover plate. At least part of the adhesive is located inside the annular gap and is adhesively bonded to the housing and the light-transmitting cover plate respectively. The circuit board, the housing, the light-transmitting cover plate and the adhesive jointly form a receiving cavity. The colloid member is located inside the receiving cavity. The colloid member has a first surface and a second surface connected to each other. The orthographic projection of the first surface on the light-transmitting cover plate is annular and fits with the inner wall of the through-hole. The second surface fits with the light-transmitting cover plate.
[0007] The first surface is connected to the second surface. The first surface fits with the inner wall of the through-hole and the second surface fits with the light-transmitting cover plate, so that the colloid member seals the annular gap, realizing the sealing between the housing and the light-transmitting cover plate. In addition, the colloid member is located inside the receiving cavity, which can increase the volume of the colloid member, so that the width of the second surface in the direction perpendicular to the thickness direction of the electronic device increases, increasing the waterproof width, improving the sealing performance between the light-transmitting cover plate and the housing, thereby improving the waterproof performance of the electronic device, and further meeting the long-term waterproofing requirements.
[0008] In some possible implementation manners, the electronic device further includes an optical module. The optical module is connected to the circuit board and is located inside the accommodation cavity. The orthographic projection of the optical module on the light-transmitting cover plate is located inside the orthographic projection of the colloidal part on the light-transmitting cover plate.
[0009] In this way, by further increasing the waterproof width of the colloidal part, the waterproof performance of the electronic device can be further improved, and the performance of the electronic device can be ensured. In addition, the normal operation of the optical module can also be ensured.
[0010] In some possible implementation manners, the optical module and the colloidal part are arranged at intervals along the thickness direction of the electronic device, or at least part of the optical module is located inside the colloidal part.
[0011] In this way, the colloidal part can block sweat, sebum, etc. outside the electronic device outside the electronic device, achieving waterproofing and ensuring the normal operation of the optical module. In addition, by wrapping at least part of the optical module with the colloidal part, the waterproof performance of the electronic device can be further improved.
[0012] In some possible implementation manners, the light transmittance of the colloidal part is greater than or equal to 90%, which can reduce the influence of the colloidal part on the optical module and improve the optical performance of the optical module.
[0013] In some possible implementation manners, the refractive index of the colloidal part is less than or equal to 1.5, which can reduce the influence of the colloidal part on the optical module and improve the optical performance of the optical module.
[0014] In some possible implementation manners, the electronic device further includes an optical module and an annular blocking member. The annular blocking member is located inside the accommodation cavity. The annular blocking member divides the accommodation cavity into a first cavity and a second cavity that are separated from each other. The colloidal part is located inside the first cavity, and the optical module is located inside the second cavity and is connected to the circuit board.
[0015] In this way, by using the first cavity and the second cavity to accommodate the colloidal part and the optical module respectively, the colloidal part and the optical module are separated, avoiding the influence of the colloidal part on the optical module and enabling the optical performance of the optical module to meet the requirements. In addition, the colloidal part can also seal the light-transmitting cover plate and the housing, meeting the long-term waterproof requirement.
[0016] In some possible implementation manners, the optical module is a heart rate detection module. The heart rate detection module includes a light-emitting element and a light receiver, and the light-emitting element and the light receiver are respectively electrically connected to the circuit board.
[0017] In this way, the electronic device has a heart rate detection function and can detect the heart rate of the user.
[0018] In some possible implementation manners, the material of the colloid member is glue with a viscosity less than or equal to 10,000 cps, so that the glue forming the colloid member can flow better, reducing the difficulty of the glue flowing to various regions of the accommodation cavity and reducing the manufacturing difficulty of the colloid member.
[0019] In some possible implementation manners, the orthographic projection of the bonding member on the light-transmitting cover plate is annular, and the material of the bonding member is sealant.
[0020] In this way, while fixing the light-transmitting cover plate to the housing, the bonding member plays a waterproof role, further improving the sealing performance between the light-transmitting cover plate and the housing, and contributing to further improving the waterproof performance of the electronic device.
[0021] In some possible implementation manners, the electronic device further includes at least one glue injection hole communicating with the accommodation cavity, so that the glue enters the accommodation cavity and forms a colloid member.
[0022] In some possible implementation manners, at least one glue injection hole penetrates through the circuit board, which can reduce the difficulty of injecting the glue while allowing the glue to enter the interior of the accommodation cavity.
[0023] In some possible implementation manners, at least one glue injection hole is formed between the circuit board and the housing, which can also allow the glue to enter the interior of the accommodation cavity while reducing the area occupied by the circuit board. Description of the Drawings
[0024] Figure 1 It is a schematic cross-sectional view of an electronic device in the related art;
[0025] Figure 2 It is a schematic cross-sectional view of the first electronic device provided by the embodiment of the present application;
[0026] Figure 3 It is a schematic cross-sectional view of the second electronic device provided by the embodiment of the present application;
[0027] Figure 4 It is a schematic cross-sectional view of the third electronic device provided by the embodiment of the present application;
[0028] Figure 5 It is a schematic process view of a preparation method of a colloid member provided by the embodiment of the present application;
[0029] Figure 6 It is a schematic cross-sectional view of the fourth electronic device provided by the embodiment of the present application;
[0030] Figure 7 For Figure 6 the orthographic projection schematic view of the optical module, the colloid member and the annular stopper on the light-transmitting cover plate in
[0031] Figure 8Another front view schematic diagram of the annular stopper provided by the embodiment of the present application.
[0032] Explanation of reference numerals:
[0033] 100, housing; 110, through hole; 120, receiving groove;
[0034] 200, light-transmitting cover plate;
[0035] 300, circuit board;
[0036] 400, bonding member;
[0037] 500, colloid member; 510, first surface; 520, second surface;
[0038] 600, optical module; 610, light-emitting element; 620, light receiver;
[0039] 700, potting hole;
[0040] 800, annular stopper; 810, rigid body; 820, flexible body;
[0041] X, length direction; Y, width direction; Z, thickness direction. Detailed implementation manners
[0042] Figure 1 It is a cross-sectional schematic diagram of an electronic device in the related art.
[0043] In the related art, as shown in Figure 1 The electronic device includes a housing 10, a light-transmitting lens 20, and a heart rate detection module 30. The heart rate detection module 30 is located inside the housing 10. The light-transmitting lens 20 is bonded to the housing 10 by dotting and covers the through hole 40 penetrating the housing 10. The light-transmitting lens 20 is used to transmit the light beam emitted or received by the heart rate detection module 30 to realize heart rate detection. During the use of the electronic device, the light-transmitting lens 20 contacts the user's skin to realize heart rate detection.
[0044] However, during the long-term use of the electronic device, the bonding glue 50 between the housing 10 and the light-transmitting lens 20 is easily eroded by sweat, sebum, etc., which will cause the bonding of the bonding glue 50 with at least one of the housing 10 and the light-transmitting lens 20 to fail, and the sweat, sebum, etc. outside the electronic device will enter the inside and affect the normal operation of the electronic device. Therefore, how to ensure that the electronic device meets the long-term waterproof requirement has become an urgent problem to be solved.
[0045] In view of this, an embodiment of the present application provides an electronic device. The electronic device is provided with a colloid member 500 inside for sealing the annular gap between the light-transmitting cover plate 200 and the housing 100, which can increase the waterproof width, improve the waterproof performance, and meet the long-term waterproof requirements.
[0046] An embodiment of the present application provides an electronic device, which may include, but is not limited to, wearable devices, virtual reality devices, heart rate monitors, etc. Among them, the wearable device may be a smart watch, a smart bracelet, a helmet, smart clothing, or other accessories. Hereinafter, the electronic device is taken as a smart watch as an example for illustration.
[0047] The following will specifically describe the electronic device provided by the embodiment of the present application in detail.
[0048] Embodiment 1
[0049] Figure 2 It is a schematic cross-sectional view of the first electronic device provided by the embodiment of the present application.
[0050] The electronic device may include a display screen (not shown in the figure), a housing 100, a light-transmitting cover plate 200, a circuit board 300, an adhesive member 400, an optical module 600, and a colloid member 500. Of course, the electronic device may also include other devices that make the functions of the electronic device complete, such as a battery.
[0051] Among them, the display screen is connected to the housing 100 and is used to display information such as text and images. The display screen, the housing 100, and the light-transmitting cover plate 200 together form a cavity for accommodating devices such as the circuit board 300, the optical module 600, and the colloid member 500.
[0052] See Figure 2 As shown, the housing 100 has a through hole 110. The through hole 110 may be a round hole. Of course, the through hole 110 may also be other shapes, for example, the through hole 110 may be a square hole.
[0053] In the embodiment of the present application, the side of the housing 100 facing the display screen along the thickness direction of the electronic device is the inner side, and the side of the housing 100 facing away from the display screen along the thickness direction of the electronic device is the outer side.
[0054] The light-transmitting cover plate 200 is disposed on the outer side of the housing 100 and covers the through hole 110 along the thickness direction Z of the electronic device. That is to say, the orthographic projection of the through hole 110 on the reference plane is located inside the orthographic projection of the light-transmitting cover plate 200 on the reference plane. The reference plane is the plane where the length direction X and the width direction Y of the electronic device are located. The circuit board 300 is connected to the inner side of the housing 100 and covers the through hole 110 along the thickness direction Z of the electronic device. That is to say, the orthographic projection of the through hole 110 on the reference plane is located inside the orthographic projection of the circuit board 300 on the reference plane.
[0055] As Figure 2 shown, the light-transmitting cover plate 200 faces the optical module 600. The light-transmitting cover plate 200 can transmit the light emitted by the optical module 600 to the outside of the electronic device, and can also transmit the light outside the electronic device to the optical module 600. The light-transmitting cover plate 200 is made of a light-transmitting material, such as glass, sapphire, etc.
[0056] As Figure 2 shown, the bonding member 400 is bonded to the housing 100 and the light-transmitting cover plate 200 respectively, so that the light-transmitting cover plate 200 is fixed to the housing 100 through the bonding member 400. An annular gap is formed between the housing 100 and the light-transmitting cover plate 200, and at least part of the bonding member 400 is located inside the annular gap. For example Figure 2 shown, the bonding member 400 is located inside the annular gap. Of course, part of the bonding member 400 can also be located inside the annular gap.
[0057] The circuit board 300, the housing 100, the light-transmitting cover plate 200 and the bonding member 400 together form a receiving cavity. The colloid member 500 is located inside the receiving cavity. The optical module 600 is connected to the circuit board 300 and is located inside the receiving cavity. The orthographic projection of the optical module 600 on the light-transmitting cover plate 200 is located inside the orthographic projection of the colloid member 500 on the light-transmitting cover plate 200.
[0058] Among them, the material of the colloid member 500 is a glue with light-transmitting properties, and the type of glue can be hot-melt glue, silicone glue, epoxy glue, etc.
[0059] The colloid member 500 has a connected first surface 510 and a second surface 520. The orthographic projection of the first surface 510 on the light-transmitting cover plate 200 is annular and fits the inner wall of the through hole 110. The second surface 520 fits the light-transmitting cover plate 200, so that the colloid member 500 seals the annular gap, realizing waterproofing between the housing 100 and the light-transmitting cover plate 200. That is to say, the electronic device blocks the annular gap through the colloid member 500 to play a waterproofing role. In addition, the colloid member 500 covers the area of the light-transmitting cover plate 200 opposite to the through hole 110 in the Z direction of the thickness of the electronic device, so that the width of the second surface 520 in the direction perpendicular to the Z direction of the thickness of the electronic device (such as Figure 2 the Y direction in
[0060] See Figure 2 shown, the colloid member 500 is located outside the annular gap. However, in some embodiments, part of the colloid member 500 can also be filled inside the annular gap and the other part is located outside the annular gap.
[0061] See Figure 2As shown, a part of the colloidal member 500 is located inside the through hole 110. The cross-sectional shape of the part of the colloidal member 500 located in the through hole 110 is a circle with the same diameter as that of the through hole 110. The cross-section of the colloidal member 500 is perpendicular to the axial direction of the through hole 110.
[0062] Exemplarily, the optical module 600 can be a heart rate detection module, enabling the electronic device to have the heart rate detection function. Of course, the optical module 600 can also be other types of detection modules. In some embodiments, in addition to enabling the electronic device to have the heart rate detection function, the optical module 600 can also enable the electronic device to have other detection functions, such as blood oxygen saturation detection function.
[0063] See Figure 2 As shown, the heart rate detection module can include a light emitting element 610 and a light receiver 620. The light emitting element 610 and the light receiver 620 are respectively electrically connected to the circuit board 300. The number of the light emitting elements 610 can be one or two, for example Figure 2 As shown, the number of the light emitting elements 610 is two. The number of the light receivers 620 can be one or two, for example Figure 2 As shown, the number of the light receivers 620 is two. The light emitting elements 610 and the light receivers 620 are arranged alternately in a direction perpendicular to the thickness direction Z of the electronic device.
[0064] Among them, the light emitting element 610 can be an LED (light emitting diode), to emit detection light. Of course, the light emitting element 610 can also be other devices that emit light.
[0065] Among them, the light receiver 620 can be a PD (photodiode), to convert the optical signal into an electrical signal. Of course, the light receiver 620 can also be other devices that convert the optical signal into an electrical signal.
[0066] In order to improve the aesthetics of the electronic device, in some possible implementation manners, see Figure 2 As shown, the housing 100 has a receiving groove 120. The through hole 110 penetrates the bottom of the receiving groove 120 and communicates the inside of the receiving groove 120 with the inside of the housing 100. The light-transmitting cover plate 200 is located inside the receiving groove 120 and forms an annular gap with the bottom of the receiving groove 120.
[0067] In order to further improve the waterproof performance of the electronic device, in some possible implementation manners, the orthographic projection of the bonding member 400 on the light-transmitting cover plate 200 is annular, and the material of the bonding member 400 is a sealant. The bonding member 400 plays a waterproof role while fixing the light-transmitting cover plate 200 to the housing 100, further improving the sealing performance between the light-transmitting cover plate 200 and the housing 100, and contributing to further improving the waterproof performance of the electronic device.
[0068] Among them, the material of the sealant can be hot-melt adhesive, silicone, epoxy adhesive, back adhesive, etc.
[0069] It should be noted that in addition to being a sealant, the bonding member 400 can also be a double-sided adhesive, which can also fix the light-transmitting cover plate 200 to the housing 100.
[0070] Exemplarily, the width of the bonding member 400 in the direction perpendicular to the thickness direction Z of the electronic device (such as Figure 2 the Y direction) can be 1.0 mm to 2.0 mm, which helps to further improve the waterproof effect of the bonding member 400.
[0071] Figure 3 This is a schematic cross-sectional view of the second electronic device provided by the embodiment of the present application. Figure 4 This is a schematic cross-sectional view of the third electronic device provided by the embodiment of the present application.
[0072] Next, the relative positional relationship between the colloid member 500 and the optical module 600 will be described.
[0073] In some implementation manners, at least a part of the optical module 600 can be located inside the colloid member 500. For example, Figure 2 as shown, the colloid member 500 is filled in the accommodation cavity, so that the optical module 600 is located inside the colloid member 500. That is to say, the colloid member 500 wraps the optical module 600. Of course, as Figure 3 shown, a part of the optical module 600 can also be located outside the colloid member 500 and another part can be located inside the colloid member 500. That is to say, the colloid member 500 wraps a part of the optical module 600.
[0074] In some other implementation manners, as Figure 4 shown, the optical module 600 and the colloid member 500 can also be arranged at intervals along the thickness direction Z of the electronic device. That is to say, the optical module 600 is located outside the colloid member 500, and along the direction perpendicular to the thickness direction Z of the electronic device (such as Figure 4 the Y direction), the projection of the optical module 600 does not overlap with the projection of the colloid member 500.
[0075] In summary, the colloid member 500 can wrap at least part of the optical module 600 or can be arranged at an interval from the optical module 600 in the thickness direction Z of the electronic device, both of which can seal the gap between the light-transmitting cover plate 200 and the housing 100, block sweat, sebum, etc. outside the electronic device outside the electronic device, achieve waterproofing and ensure the normal operation of the optical module 600. In addition, when the colloid member 500 wraps at least part of the optical module 600, the waterproof performance of the electronic device can be further improved.
[0076] See Figure 2 As shown, since the colloid member 500 is arranged in the area of the light-transmitting cover plate 200 opposite to the through hole 110, the colloid member 500 will affect the light emitted or received by the optical module 600. By optimizing the light transmittance and / or refractive index of the colloid member 500, the influence of the colloid member 500 on the optical module 600 can be reduced, and the optical performance of the optical module 600 can be improved.
[0077] In some possible implementation manners, the light transmittance of the colloid member 500 can be greater than or equal to 90%, which can further improve the optical effect of the optical module 600.
[0078] There is no limitation on the specific value of the light transmittance of the colloid member 500 here. For example, the light transmittance of the colloid member 500 can be 90%, 93%, 95.6% or 97%, etc.
[0079] In some possible implementation manners, the refractive index of the colloid member 500 can be less than or equal to 1.5, which can further improve the optical effect of the optical module 600.
[0080] There is no limitation on the specific value of the refractive index of the colloid member 500 here. For example, the refractive index of the colloid member 500 can be 1.3, 1.35, 1.4 or 1.5, etc.
[0081] Since the colloid member 500 is a structural member formed after the glue is cured, in some possible implementation manners, the material of the colloid member 500 can be glue with a viscosity less than or equal to 10000 cps, so that the glue forming the colloid member 500 can flow better, reduce the difficulty of the glue flowing to various regions of the accommodation cavity, and reduce the manufacturing difficulty of the colloid member 500.
[0082] Specifically, the viscosity of the glue is less than or equal to 10000 cps, which makes the glue thinner. During the process of pouring the glue into the accommodation cavity, the glue can flow more easily to various regions of the accommodation cavity to cover the area of the light-transmitting cover plate 200 opposite to the through hole 110.
[0083] It should be noted that the material of the colloid member 500 can be formed by using glue with a viscosity greater than 10,000 cps in addition to glue with a viscosity less than or equal to 10,000 cps.
[0084] To allow the glue to be poured into the accommodating cavity to form the colloid member 500, refer to Figure 2 As shown, the electronic device further includes at least one glue injection hole 730 communicating with the accommodating cavity. For example, the electronic device may include three glue injection holes 730. Of course, the number of glue injection holes 730 may also be less than or more than three. Through the glue injection hole 730, the glue can enter the accommodating cavity and form the colloid member 500.
[0085] In some embodiments, at least one glue injection hole 730 penetrates through the circuit board 300, that is, at least one glue injection hole 730 is provided on the circuit board 300. For example, two glue injection holes 730 are provided on the circuit board 300. Of course, the number of glue injection holes 730 provided on the circuit board 300 may also be more than or less than two.
[0086] In some other embodiments, the circuit board 300 and the housing 100 form at least one glue injection hole 730. For example, the circuit board 300 and the housing 100 form two glue injection holes 730. Of course, the number of glue injection holes 730 formed by the circuit board 300 and the housing 100 may also be more than or more than two.
[0087] In still some other embodiments, the housing 100 has at least one glue injection hole 730. For example, the housing 100 may have two glue injection holes 730. Of course, the number of glue injection holes 730 of the housing 100 may also be more than or less than two.
[0088] In summary, the glue injection hole 730 can be provided on the circuit board 300 (as Figure 2 shown) or the housing 100, or the circuit board 300 and the housing 100 form the glue injection hole 730, and there is no specific limitation on the position of the glue injection hole 730. In addition, the glue injection hole 730 provided on the circuit board 300, the glue injection hole 730 provided on the housing 100, and the circuit board 300 and the housing 100 forming the glue injection hole 730 can be freely combined. For example, when the circuit board 300 is provided with a glue injection hole 730 and forms a glue injection hole 730 with the housing 100, it can allow the glue to enter the inside of the accommodating colloid and can also reduce the area occupied by the circuit board 300.
[0089] Figure 5 It is a process schematic diagram of a method for preparing a colloid member 500 provided by an embodiment of the present application.
[0090] Refer to Figure 5 As shown, Embodiment 1 of the present application also provides a method for preparing a colloid member 500. The preparation method includes the following steps:
[0091] S101. Form a receiving cavity.
[0092] Specifically, as shown in S1 in Figure 5 , connect the circuit board 300 to the inner side of the housing 100, and bond the light-transmitting cover plate 200 to the inner side of the housing 100 through the bonding member 400, so that the circuit board 300, the bonding member 400, the housing 100, and the light-transmitting cover plate 200 enclose a receiving cavity.
[0093] Among them, the bonding member 400 for bonding the light-transmitting cover plate 200 and the housing 100 can be formed by dispensing glue. Of course, the bonding member 400 can also be double-sided tape or back glue, etc.
[0094] S102. Pour glue into the receiving cavity through the glue filling hole 730.
[0095] Specifically, as shown in S2 in Figure 5 , pour glue into the receiving cavity through the glue filling hole 730 provided on the circuit board 300 (as shown at A in Figure 5 ). Of course, in addition to the circuit board 300 being provided with the glue filling hole 730, the housing 100 can also have a glue filling hole 730, and / or the housing 100 and the circuit board 300 can also form a glue filling hole 730.
[0096] S103. Perform vacuum degassing on the glue in the receiving cavity.
[0097] Specifically, as shown in S3 in Figure 5 , perform a vacuum degassing operation on the glue in the receiving cavity through the glue filling hole 730 to remove the air bubbles inside the glue (as shown at B in Figure 5 ), avoid the remaining air bubbles inside the glue, prevent the appearance of holes inside the colloidal part 500, and improve the appearance of the electronic device and / or the optical performance of the optical module 600.
[0098] S104. Cure the glue.
[0099] Specifically, as shown in S3 in Figure 5 , select the corresponding glue curing process according to the type of glue, and perform a curing operation on the glue after vacuum degassing to form the colloidal part 500.
[0100] Embodiment 2
[0101] Figure 6 This is a schematic cross-sectional view of the fourth electronic device provided by the embodiment of the present application. Figure 7 It is Figure 6 a schematic front projection view of the optical module, the colloidal part, and the annular blocking part on the light-transmitting cover plate in Figure 8 This is a schematic front view of another annular blocking part provided by the embodiment of the present application.
[0102] The electronic device may include a display screen (not shown in the figure), a housing 100, a light-transmitting cover plate 200, a circuit board 300, an adhesive member 400, an optical module 600, and a colloid member 500. Of course, the electronic device may also include other devices that make the functions of the electronic device complete, such as a battery.
[0103] Among them, the display screen is connected to the housing 100 and is used to display information such as text and images. The display screen, the housing 100, and the light-transmitting cover plate 200 together form a cavity for accommodating devices such as the circuit board 300, the optical module 600, and the colloid member 500.
[0104] As Figure 6 shown, the housing 100 has a through hole 110. The through hole 110 may be a round hole. Of course, the through hole 110 may also be other shapes. For example, the through hole 110 may be a square hole.
[0105] In the embodiment of the present application, the side of the housing 100 facing the display screen along the thickness direction of the electronic device is the inner side, and the side of the housing 100 facing away from the display screen along the thickness direction of the electronic device is the outer side.
[0106] The light-transmitting cover plate 200 is disposed on the outer side of the housing 100 and covers the through hole 110 along the thickness direction Z of the electronic device. That is to say, the orthographic projection of the through hole 110 on the reference plane is located inside the orthographic projection of the light-transmitting cover plate 200 on the reference plane. The reference plane is the plane where the length direction X and the width direction Y of the electronic device are located. The circuit board 300 is connected to the inner side of the housing 100 and covers the through hole 110 along the thickness direction Z of the electronic device. That is to say, the orthographic projection of the through hole 110 on the reference plane is located inside the orthographic projection of the circuit board 300 on the reference plane.
[0107] As Figure 6 shown, the light-transmitting cover plate 200 faces the optical module 600. The light-transmitting cover plate 200 can transmit the light emitted by the optical module 600 to the outside of the electronic device, and can also transmit the light outside the electronic device to the optical module 600. The light-transmitting cover plate 200 is made of a light-transmitting material, such as glass, sapphire, etc.
[0108] As Figure 6 shown, the adhesive member 400 is bonded to the housing 100 and the light-transmitting cover plate 200 respectively, so that the light-transmitting cover plate 200 is fixed to the housing 100 through the adhesive member 400. An annular gap is formed between the housing 100 and the light-transmitting cover plate 200, and at least a part of the adhesive member 400 is located inside the annular gap. For example Figure 6 shown, the adhesive member 400 is located inside the annular gap. Of course, a part of the adhesive member 400 may also be located inside the annular gap.
[0109] The circuit board 300, the housing 100, the light-transmitting cover plate 200, and the bonding member 400 together form a receiving cavity. The colloid member 500 is located inside the receiving cavity, and the optical module 600 is connected to the circuit board 300 and is located inside the receiving cavity. As Figure 7 shown, the orthographic projection of the optical module 600 on the light-transmitting cover plate 200 does not overlap with the orthographic projection of the colloid member 500 on the light-transmitting cover plate 200, avoiding the influence of the colloid member 500 on the optical performance of the optical module 600, so that it is not necessary to optimize the light transmittance and refractive index of the colloid member 500.
[0110] Among them, the material of the colloid member 500 can be a light-transmitting or opaque glue such as hot melt adhesive, silicone glue, epoxy glue, etc.
[0111] The colloid member 500 has a connected first surface 510 and a second surface 520. The orthographic projection of the first surface 510 on the light-transmitting cover plate 200 is annular and fits the inner wall of the through hole 110, and the second surface 520 fits the light-transmitting cover plate 200, so that the colloid member 500 seals the annular gap, realizing waterproofing between the housing 100 and the light-transmitting cover plate 200. That is to say, the electronic device blocks the annular gap through the colloid member 500 to play a waterproofing role. In addition, the colloid member 500 covers a part of the area of the light-transmitting cover plate 200 opposite to the through hole 110 in the Z direction of the thickness of the electronic device, which can increase the width of the second surface 520 in the direction perpendicular to the Z direction of the thickness of the electronic device (for example Figure 6 the Y direction in
[0112] See Figure 6 shown, the electronic device further includes an annular blocking member 800. Among them, the orthographic projection of the annular blocking member 800 on the light-transmitting cover plate 200 is annular. For example Figure 7 shown, the orthographic projection of the annular blocking member 800 on the light-transmitting cover plate 200 can be a circular ring. The annular blocking member 800 is located inside the receiving cavity. The annular blocking member 800 divides the receiving cavity into a first cavity and a second cavity that are separated from each other. The colloid member 500 is located inside the first cavity, and the optical module 600 is located inside the second cavity and is connected to the circuit board 300, so that the orthographic projection of the optical module 600 on the light-transmitting cover plate 200 does not overlap with the orthographic projection of the colloid member 500 on the light-transmitting cover plate 200.
[0113] In this way, the first cavity and the second cavity are used to accommodate the colloid member 500 and the optical module 600 respectively, so that the colloid member 500 and the optical module 600 are separated, avoiding the influence of the colloid member 500 on the optical module 600, and making the optical performance of the optical module 600 meet the requirements. In addition, the colloid member 500 can also seal the light-transmitting cover plate 200 and the housing 100 to meet the long-term waterproofing requirements.
[0114] Exemplarily, the colloid member 500 is located outside the annular gap and inside the first cavity. However, in some embodiments, a part of the colloid member 500 may also be filled inside the annular gap and another part is located inside the first cavity.
[0115] See Figure 6 As shown, a part of the colloid member 500 is located inside the through hole 110. The cross-sectional shape of the part of the colloid member 500 located in the through hole 110 is a ring with an outer diameter the same as the diameter of the through hole 110. The cross-section of the colloid member 500 is perpendicular to the axial direction of the through hole 110.
[0116] See Figure 6 As shown, the colloid member 500 fills the first cavity completely. However, the colloid member 500 may also fill a part of the first cavity.
[0117] See Figure 6 As shown, along the thickness direction Z of the electronic device, the circuit board 300 and the light-transmitting cover plate 200 are respectively located at opposite ends of the annular stopper 800 and are respectively attached to the annular stopper 800, so that the accommodating cavity is divided into a separated first cavity and a second cavity.
[0118] In order to improve the sealing performance between the circuit board 300 and the annular stopper 800 and the sealing performance between the light-transmitting cover plate 200 and the annular stopper 800, in some embodiments, the annular stopper 800 may be made of an elastic material. For example, the material of the annular stopper 800 may be foam, silicone pad, etc.
[0119] In other embodiments, see Figure 8 As shown, the annular stopper 800 may also include a rigid body 810 and two flexible bodies 820. Along the thickness direction Z of the electronic device, the rigid body 810 is located between the two flexible bodies 820 and is respectively connected to the two flexible bodies 820. One flexible body 820 abuts against the circuit board 300, and the other flexible body 820 abuts against the light-transmitting cover plate 200, so that the light-transmitting cover plate 200 and the circuit board 300 are respectively in close contact with the two flexible bodies 820.
[0120] Among them, the flexible body 820 may be made of an elastic material such as foam, silicone pad, etc. In addition, the orthographic projections of the flexible body 820 and the rigid body 810 on the light-transmitting cover plate 200 are both annular.
[0121] In some embodiments, the annular stopper 800 may be fixed to the light-transmitting cover plate 200. For example, the annular stopper 800 may be connected to the light-transmitting cover plate 200 by an adhesive method for easy assembly. In other embodiments, the annular stopper 800 may also be fixed to the circuit board 300. For example, the annular stopper 800 may be connected to the circuit board 300 by an adhesive method, which is also convenient for assembly.
[0122] Exemplarily, the optical module 600 can be a heart rate detection module, enabling the electronic device to have a heart rate detection function. Of course, the optical module 600 can also be other types of detection modules. In some embodiments, in addition to enabling the electronic device to have a heart rate detection function, the optical module 600 can also enable the electronic device to have other detection functions, such as a blood oxygen saturation detection function.
[0123] As Figure 6 shown, the heart rate detection module can include a light emitting element 610 and a light receiver 620, and the light emitting element 610 and the light receiver 620 are respectively electrically connected to the circuit board 300. The number of the light emitting elements 610 can be one or two. For example, Figure 6 shown, the number of the light emitting elements 610 is two. The number of the light receivers 620 can be one or two. For example, Figure 6 shown, the number of the light receivers 620 is two. The light emitting elements 610 and the light receivers 620 are alternately arranged in a direction perpendicular to the thickness direction Z of the electronic device.
[0124] Among them, the light emitting element 610 can be an LED (light emitting diode) to emit detection light. Of course, the light emitting element 610 can also be other devices that emit light.
[0125] Among them, the light receiver 620 can be a PD (photodiode) to convert an optical signal into an electrical signal. Of course, the light receiver 620 can also be other devices that convert an optical signal into an electrical signal.
[0126] To improve the aesthetics of the electronic device, in some possible implementation manners, as shown in FIG. 6, the housing 100 has a receiving groove 120, a through hole 110 penetrates the bottom of the receiving groove 120 and communicates the inside of the receiving groove 120 with the inside of the housing 100, and the light-transmitting cover plate 200 is located inside the receiving groove 120 and forms an annular gap with the bottom of the receiving groove 120.
[0127] To further improve the waterproof performance of the electronic device, in some possible implementation manners, the orthographic projection of the bonding member 400 on the light-transmitting cover plate 200 is annular, and the material of the bonding member 400 is a sealant. The bonding member 400 plays a waterproof role while fixing the light-transmitting cover plate 200 to the housing 100, further improving the sealing performance between the light-transmitting cover plate 200 and the housing 100, which helps to further improve the waterproof performance of the electronic device.
[0128] Among them, the material of the sealant can be hot melt adhesive, silicone, epoxy adhesive, back adhesive, etc.
[0129] It should be noted that, in addition to being a sealant, the bonding member 400 can also be a double-sided adhesive, which can also fix the light-transmitting cover plate 200 to the housing 100.
[0130] Exemplarily, the width of the bonding member 400 in a direction perpendicular to the thickness direction Z of the electronic device can be 1.0 mm to 2.0 mm, which helps to further improve the waterproof effect of the bonding member 400.
[0131] Since the colloid member 500 is a structural member formed after the glue is cured, in some possible implementation manners, the material of the colloid member 500 can be a glue with a viscosity less than or equal to 10,000 cps, so that the glue for forming the colloid member 500 can flow better, reducing the difficulty of the glue flowing to various regions of the first cavity and reducing the manufacturing difficulty of the colloid member 500.
[0132] Specifically, the viscosity of the glue is less than or equal to 10,000 cps, making the glue thinner. During the process of pouring the glue into the first cavity, the glue can more easily flow to various regions of the first cavity and cover the cavity bottom opposite to the through hole 110 in the first cavity.
[0133] It should be noted that, in addition to being a glue with a viscosity less than or equal to 10,000 cps, the material of the colloid member 500 can also be formed by using a glue with a viscosity greater than 10,000 cps.
[0134] To pour the glue into the first cavity to form the colloid member 500, the electronic device further includes at least one glue injection hole 730 communicating with the accommodating cavity. For example, the electronic device can include three glue injection holes 730. Of course, the number of the glue injection holes 730 can also be less than or more than three. Through the glue injection hole 730, the glue can enter the accommodating cavity and form the colloid member 500. Among them, as Figure 6 shown, the colloid member 500 is located in the first cavity. Therefore, each glue injection hole 730 communicates with the first cavity.
[0135] In some embodiments, at least one glue injection hole 730 penetrates through the circuit board 300, that is, at least one glue injection hole 730 is provided on the circuit board 300. For example, two glue injection holes 730 are provided on the circuit board 300. Of course, the number of the glue injection holes 730 provided on the circuit board 300 can also be more than or less than two.
[0136] In some other embodiments, the circuit board 300 and the housing 100 form at least one glue injection hole 730. For example, the circuit board 300 and the housing 100 form two glue injection holes 730. Of course, the number of the glue injection holes 730 formed by the circuit board 300 and the housing 100 can also be more than or more than two.
[0137] In still other embodiments, the housing 100 has at least one potting hole 730. For example, the housing 100 may have two potting holes 730. Of course, the number of potting holes 730 in the housing 100 may also be more or less than two.
[0138] In summary, the potting hole 730 may be provided in the circuit board 300 (as Figure 6 shown), or in the housing 100, or the circuit board 300 and the housing 100 may form the potting hole 730. There is no specific limitation on the position of the potting hole 730. Additionally, the potting hole 730 being provided in the circuit board 300, the potting hole 730 being provided in the housing 100, and the circuit board 300 and the housing 100 forming the potting hole 730 can be freely combined. For example, when the circuit board 300 is provided with the potting hole 730 and forms the potting hole 730 with the housing 100, it can allow the glue to enter the inside of the accommodating colloid while also reducing the area occupied by the circuit board 300.
[0139] Embodiment II of the present application also provides a method for preparing a colloid member 500, which includes the following steps:
[0140] S101. Attach the annular stopper 800 to the light-transmitting cover plate 200 or the circuit board 300.
[0141] Specifically, the annular stopper 800 can be bonded to the light-transmitting cover plate 200, or the annular stopper 800 can also be bonded to the circuit board 300.
[0142] S102. Form an accommodating cavity.
[0143] Specifically, connect the circuit board 300 to the inner side of the housing 100, and bond the light-transmitting cover plate 200 to the inner side of the housing 100 through the bonding member 400, so that the circuit board 300, the bonding member 400, the housing 100, and the light-transmitting cover plate 200 enclose the accommodating cavity.
[0144] Among them, the bonding member 400 for bonding the light-transmitting cover plate 200 and the housing 100 can be formed by dispensing glue. Of course, the bonding member 400 can also be double-sided tape or back glue, etc.
[0145] S103. Pour glue into the accommodating cavity through the potting hole 730.
[0146] Specifically, pour glue into the first cavity through the potting hole 730 provided on the circuit board 300. Of course, in addition to the circuit board 300 being provided with the potting hole 730, the housing 100 may also have the potting hole 730, and / or the housing 100 and the circuit board 300 may also form the potting hole 730.
[0147] S104. Perform vacuum degassing on the glue in the accommodating cavity.
[0148] Specifically, a vacuum degassing operation is performed on the glue in the first cavity through the glue injection hole 730 to remove the air bubbles inside the glue, avoid the residual air bubbles inside the glue, prevent holes from appearing inside the colloidal part 500, and improve the appearance of the electronic device and / or the optical performance of the optical module 600.
[0149] S105. Cure the glue.
[0150] Specifically, select the corresponding glue curing process according to the type of the glue, and perform a curing operation on the glue after vacuum degassing to form the colloidal part 500.
[0151] In the description of the embodiments of the present application, it should be noted that unless otherwise clearly specified and limited, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, or an indirect connection through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific situations.
[0152] The device or element referred to in the embodiments of the present application or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically and precisely defined.
[0153] The terms "first", "second", "third", "fourth", etc. (if any) in the specification, claims and drawings of the embodiments of the present application are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprise" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.
[0154] The term "a plurality of" herein refers to two or more. The term "and / or" herein is merely a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after; in a formula, the character " / " represents a "division" relationship between the associated objects before and after.
[0155] It should be understood that the various numerical numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application.
[0156] It should be understood that in the embodiments of the present application, the magnitudes of the sequence numbers of the above processes do not mean the sequence of execution. The execution sequence of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present application.
Claims
1. An electronic device, characterized in that, It includes a housing, a light-transmitting cover plate, an adhesive, a circuit board, and a colloid member; The housing has a through hole, the light-transmitting cover plate is disposed outside the housing and covers the through hole along the thickness direction of the electronic device, and the circuit board is connected to the inner side of the housing and covers the through hole along the thickness direction of the electronic device; An annular gap is formed between the housing and the light-transmitting cover plate, and at least a part of the adhesive is located inside the annular gap and is adhered to the housing and the light-transmitting cover plate respectively; The circuit board, the housing, the light-transmitting cover plate, and the adhesive jointly form a receiving cavity. The colloid member is located inside the receiving cavity. The colloid member has a first surface and a second surface connected to each other. The orthographic projection of the first surface on the light-transmitting cover plate is annular and fits with the inner wall of the through hole, and the second surface fits with the light-transmitting cover plate.
2. The electronic device according to claim 1, wherein The electronic device further includes an optical module. The optical module is connected to the circuit board and is located inside the receiving cavity. The orthographic projection of the optical module on the light-transmitting cover plate is located inside the orthographic projection of the colloid member on the light-transmitting cover plate.
3. The electronic device according to claim 2, wherein The optical module and the colloid member are arranged at intervals along the thickness direction of the electronic device, or at least a part of the optical module is located inside the colloid member.
4. The electronic device according to claim 2, characterized in that, The light transmittance of the colloid member is greater than or equal to 90%; and / or, The refractive index of the colloid member is less than or equal to 1.
5.
5. The electronic device according to claim 1, wherein The electronic device further includes an optical module and an annular blocking member. The annular blocking member is located inside the receiving cavity. The annular blocking member divides the receiving cavity into a first cavity and a second cavity separated from each other. The colloid member is located inside the first cavity, and the optical module is located inside the second cavity and is connected to the circuit board.
6. The electronic device according to any one of claims 2 to 5, characterized in that, The optical module is a heart rate detection module. The heart rate detection module includes a light-emitting element and a light receiver, and the light-emitting element and the light receiver are respectively electrically connected to the circuit board.
7. The electronic device according to any one of claims 1 to 5, characterized in that, The material of the colloid member is a glue with a viscosity less than or equal to 10000 cps.
8. The electronic device according to any one of claims 1 to 5, characterized in that, The orthographic projection of the adhesive on the light-transmitting cover plate is annular, and the material of the adhesive is a sealant.
9. The electronic device according to any one of claims 1 to 5, characterized in that, The electronic device further includes at least one glue filling hole communicating with the receiving cavity.
10. The electronic device according to claim 9, wherein At least one of the glue filling holes penetrates through the circuit board; and / or, The circuit board and the housing form at least one of the glue filling holes.