Power amplifier device heat dissipation structure and electronic equipment

Abstract

The utility model discloses a power amplifier device heat dissipation structure and electronic equipment, and relates to the technical field of electronic equipment, the power amplifier device heat dissipation structure comprises a substrate, a device body arranged on the first surface of the substrate, and a heat dissipation element arranged on the first surface of the substrate, the substrate is provided with a first surface and a second surface which are arranged back to back, the device interface is arranged on the second surface of the substrate, and at least part of the device interface corresponds to the position of the device body and the position of the heat dissipation element on the substrate, so that heat emitted by the device body can be transmitted to the heat dissipation element through the substrate and the device interface; according to the electronic equipment, the heat exchange with the external environment can be realized through an effective way, the purpose of radiating the device body is achieved, more choices are provided for the layout of a PCB (Printed Circuit Board), and the layout space of the electronic equipment is further expanded.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic devices, in particular to a heat dissipation structure for power amplifier devices, i.e., an electronic device. Background Art

[0002] A power amplifier device, i.e., a Power Amplifier, abbreviated as "PA", is a device with power amplification function. During the process of power amplification by the power amplifier device, a certain amount of energy is consumed and this part of energy is converted into heat and released. The traditional method for dissipating heat from the power amplifier device is generally to place the power amplifier device on the upper surface layer of the PCB (Printed Circuit Board), and let the heat conduct through the bottom of the power amplifier device to the box body with heat dissipation teeth for heat dissipation.

[0003] With the development of miniaturized electronic devices, restricted by aspects such as the size of the internal space of the device, circuit requirements, and cost control, the power amplifier device can only be transferred from the upper surface layer of the PCB to the lower surface layer of the PCB. Although this setting method improves the space utilization rate of the device and helps in the miniaturized design of the module and the device, however, due to the increase in the heat transfer path between the power amplifier device and the heat dissipation teeth, the heat transfer efficiency between the two will drop significantly, resulting in the inability to meet the heat dissipation requirements of the power amplifier device in some application scenarios, thus affecting the normal use of the electronic device. Summary of the Utility Model

[0004] The purpose of the embodiments of the utility model is to provide a heat dissipation structure for power amplifier devices, which can solve the above problems existing in the prior art.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] In a first aspect, a heat dissipation structure for power amplifier devices is provided, including:

[0007] A substrate, having a first surface and a second surface disposed opposite to each other;

[0008] A device body, disposed on the first surface of the substrate;

[0009] A heat dissipation element, mounted on the first surface of the substrate, the heat dissipation element is provided with a receiving groove with an opening facing the first surface, the device body is located in the receiving groove and is spaced apart from the groove wall of the receiving groove;

[0010] A device interface, disposed on the second surface of the substrate, at least part of the device interface corresponds to the positions of the device body and the heat dissipation element on the substrate.

[0011] As an alternative embodiment, a first heat conduction area is formed in the area where the heat dissipation element is connected to the substrate, a second heat conduction area is formed in the area where the device interface is connected to the substrate, and at least a part of the projections of the first heat conduction area and the second heat conduction area formed on the substrate overlap;

[0012] A first heat conduction medium is provided between the first heat conduction area and the second heat conduction area on the substrate.

[0013] As an alternative embodiment, a third heat conduction area is formed in the area where the heat dissipation element is connected to the substrate, and at least a part of the projections of the second heat conduction area and the third heat conduction area formed on the substrate overlap;

[0014] A second heat conduction medium is provided between the second heat conduction area and the third heat conduction area on the substrate.

[0015] As an alternative embodiment, both the first heat conduction medium and the second heat conduction medium penetrate through the substrate, so that opposite sides of the first heat conduction medium are respectively in contact with the device body and the device interface, and opposite sides of the second heat conduction medium are respectively in contact with the device interface and the heat dissipation element;

[0016] There are a plurality of the first heat conduction media, and the plurality of first heat conduction media are spaced apart and surround the second heat conduction medium.

[0017] As an alternative embodiment, the projection of the second heat conduction area on the substrate is located within the first heat conduction area.

[0018] As an alternative embodiment, the heat dissipation element covers the first surface.

[0019] As an alternative embodiment, a plurality of spaced-apart heat dissipation teeth are provided on the side of the heat dissipation element facing away from the first surface.

[0020] As an alternative embodiment, an avoidance groove with an opening facing the first surface is formed on the side of the heat dissipation element close to the first surface, the avoidance groove is disposed around the outer periphery of the receiving groove, and a heat conduction structure is provided between the avoidance groove and the receiving groove of the heat dissipation element, and the heat conduction structure is connected to the substrate; and

[0021] Inner and outer sides of the heat conduction structure respectively form an inner side wall of the avoidance groove and a wall of the receiving groove.

[0022] As an alternative embodiment, a support structure surrounding the outer periphery of the avoidance groove is further provided on the side of the heat dissipation element close to the first surface, and at least a part of the support structure is disposed on the substrate; and

[0023] The support structure forms the outer groove wall of the clearance groove.

[0024] In a second aspect, an electronic device is provided, including:

[0025] The power amplifier device heat dissipation structure as described in the first aspect;

[0026] A box cover is provided on the second surface of the substrate, and at least part of the device interface extends out of the box cover from within the box cover.

[0027] The beneficial effects of the present utility model are as follows: Based on the fact that the device body and the heat dissipation element are both arranged on the first surface of the substrate, by arranging the device interface on the second surface of the substrate and making at least part of the device interface relative to the device body and the heat dissipation element, the heat generated by the device body can be transferred to the heat dissipation element through the substrate and the device interface, enabling the heat to be exchanged with the external environment through an effective path, achieving the purpose of dissipating heat for the device body, providing more choices for the layout of the PCB board, and further expanding the layout space of the electronic device;

[0028] The first surface of the substrate can also provide corresponding installation positions for other related devices, enabling the power amplifier module to omit the original shielding cover structure. The device body and related devices can shield signals through the heat dissipation element, thereby reducing the material cost of the product. Moreover, the overall size and weight of the product are also reduced synchronously, which is beneficial to the miniaturization and lightweight design of the electronic device. Description of the Drawings

[0029] The present utility model will be further described in detail below with reference to the drawings and embodiments.

[0030] Figure 1 It is a schematic structural diagram of the power amplifier device heat dissipation structure according to the embodiment of the present utility model.

[0031] In the figure: 10. Substrate; 11. First surface; 12. Second surface; 13. First heat conduction medium; 14. Second heat conduction medium; 20. Device body; 30. Heat dissipation element; 31. Receiving groove; 32. Heat dissipation teeth; 33. Clearance groove; 34. Heat conduction structure; 35. Support structure; 40. Device interface; 50. Box cover. Detailed Embodiments

[0032] To make the technical problems solved, the technical solutions adopted, and the technical effects achieved by the present utility model clearer, the following further describes in detail the technical solutions of the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0033] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0034] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features therebetween. Moreover, the first feature being "above", "over", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "below", "under", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0035] The power amplifier device, namely the power amplifier, abbreviated as "PA", is a device with power amplification function. During the process of power amplification by the power amplifier device, a certain amount of energy will be consumed and this part of energy will be converted into heat and released. The traditional method of dissipating heat from the power amplifier device is generally to place the power amplifier device on the upper surface layer of the PCB (Printed Circuit Board), and let the heat conduct from the bottom of the power amplifier device to the box body with heat dissipation teeth for heat dissipation.

[0036] As can be seen from the background art, with the development of miniaturized electronic devices, due to limitations such as the internal space size of the device, wiring requirements, and cost control, the power amplifier device can only be transferred from the upper surface layer of the PCB board to the lower surface layer of the PCB board. Although this setting method improves the space utilization rate of the device and helps with the miniaturized design of the module and the device, however, because the heat transfer path between the power amplifier device and the heat dissipation teeth has increased, the heat transfer efficiency between the two will drop significantly, resulting in the inability to meet the heat dissipation requirements of the power amplifier device in some application scenarios.

[0037] If the heat dissipation of the power amplifier device is poor, excessive heating may cause its performance to decline, such as a decrease in power, etc. Moreover, working in a high-temperature environment for a long time will accelerate the aging of the internal components of the power amplifier device, thereby shortening its service life, and may also cause safety hazards such as fires.

[0038] In view of this, the present embodiment provides a heat dissipation structure for a power amplifier device. Based on the technical solution of arranging the device body of the power amplifier device on the first surface (the aforementioned lower surface layer) of the substrate, the heat dissipation path between the device body and the heat dissipation element is optimized to solve a series of problems caused by the low heat dissipation efficiency of the power amplifier device.

[0039] Please refer to the attached Figure 1 , the heat dissipation structure of the power amplifier device includes:

[0040] A substrate 10, which serves as a carrier for the installation and fixing device of electronic components. In addition to playing a supporting and connecting role in electronic devices, it can also provide conductive routes.

[0041] Specifically, the substrate 10 can be a composite of various materials, such as metal, ceramic, or composite materials, etc., which depends on the specific application scenarios and requirements. For example, in the application scenario of the power amplifier device in the present embodiment, the substrate 10 needs to have good thermal conductivity to ensure that heat can be dissipated in a timely manner. While avoiding overheating and damage to the device, the substrate 10 also needs to have certain mechanical strength and stability to withstand the vibrations and impacts generated during the operation of the device.

[0042] It can be understood from the background art that in some embodiments, the substrate 10 can be set as a PCB board, so that the connectors, wires, and other circuits of the power amplifier device can form the required patterns by printing on the substrate 10 in advance, thereby reducing the installation difficulty of the power amplifier device and other related devices, and also improving the space utilization rate of the substrate 10, making the power amplifier module structure more compact and more integrated.

[0043] As can be understood from the above background art, the substrate 10 has two opposite surfaces for providing corresponding mounting positions for related devices, namely the upper surface layer and the lower surface layer. For a clearer and more comprehensive understanding of this embodiment, the surfaces of the lower surface layer and the upper surface layer of the substrate 10 are respectively defined as the first surface 11 and the second surface 12 formed on the front and back sides (i.e., opposite to each other) of the substrate 10.

[0044] In this example, the first surface 11 is located on the lower surface of the substrate 10, and the second surface 12 is located on the upper surface of the substrate 10.

[0045] The device body 20 is configured as the power amplifier device described in this embodiment. The device body 20 is disposed on the first surface 11 of the substrate 10, that is, on the lower surface layer of the substrate 10 in the actual application scenario.

[0046] In this example, the device body 20 and the substrate 10 are preferably mounted by a chip mounting method, so that the device body 20 can be as close as possible to the first surface 11 of the substrate 10, increasing the contact surface between the device body 20 and the substrate 10, and increasing the channels and area for heat transfer. Under the same temperature difference, more heat can be transferred to the substrate 10 through the contact surface, thereby improving the efficiency of heat conduction. Moreover, the device body 20 and the substrate 10 are connected through pads, realizing the mechanical fixation of the device body 20 and the substrate 10, preventing the displacement and detachment of the device body 20, and at the same time realizing the electrical connection between the two, ensuring the smooth transmission of current and signals.

[0047] The heat dissipation element 30 is also mounted on the first surface 11 of the substrate 10 together with the device body 20. Since the heat dissipation element 30 and the device body 20 are both mounted on the same side of the substrate 10, in order to avoid interference between the heat dissipation element 30 and the device body 20, a receiving groove 31 with a notch facing the first surface 11 is formed on the side of the heat dissipation element 30 close to the substrate 10. In this way, when the heat dissipation element 30 is mounted on the substrate 10, the receiving groove 31 formed by the heat dissipation element 30 and the first surface 11 of the substrate 10 will enclose a relatively closed chamber, providing a certain protection function for the device body 20 when the device body 20 is disposed in the receiving groove 31.

[0048] In theory, the heat emitted by the device body 20 should be transferred to the heat dissipation element 30 as quickly as possible so that the heat can be quickly exchanged with the external environment through the heat dissipation element 30, avoiding the problem of poor heat dissipation effect of the device body 20 due to heat accumulation. However, since the device body 20 may generate higher voltage and current during operation, if the device body 20 is set to be in direct contact with the heat dissipation element 30, it may cause a short circuit due to poor insulation or unexpected circumstances, thereby damaging the device body 20 and possibly affecting the normal operation of the entire electronic device. In addition, the device body 20 may generate electromagnetic radiation during operation, which may interfere with related devices or equipment around it. Therefore, setting the receiving groove 31 in the heat dissipation element 30 to be spaced apart from the device body 20 allows the heat dissipation element 30 to have a shielding function, reduce the leakage of electromagnetic radiation, protect related electronic devices from interference, and ensure that the device body 20 will not have a negative impact on signal quality while operating stably.

[0049] In view of the foregoing, it can be seen that, because the device body 20 and the heat dissipation element 30 need to be spaced apart, direct contact and heat transfer between the device body 20 and the heat dissipation element 30 is impossible. Therefore, the device body 20 must first transfer its heat to the substrate 10, and then transfer it to the heat dissipation element 30 through the substrate 10 or related components. Therefore, in order to ensure that the heat transfer efficiency between the substrate 10 and the heat dissipation element 30 can meet the heat dissipation requirements of the device body 20, the heat dissipation element 30 and the first surface 11 of the substrate 10 are preferably in surface contact, thereby maximizing the channel and area for heat transfer between the heat dissipation element 30 and the substrate 10.

[0050] In this example, the heat dissipation element 30 can serve as a partial outer shell of the power amplifier module, and its side facing away from the substrate 10 can be directly exposed to the external environment of the module, so that when the heat dissipation element 30 receives heat from the device body 20, it can immediately exchange heat with the air in the external environment, thereby achieving the purpose of dissipating its heat to the surrounding environment.

[0051] The device interface 40 , which is a device structure, is disposed on the second surface 12 of the substrate 10 , ie, is disposed on two opposite sides of the substrate 10 together with the device body 20 and the heat dissipation element 30 .

[0052] It can be understood that the device interface 40 and the substrate 10 are preferably installed by means of surface mounting, so that the device interface 40 can be as close as possible to the second surface 12 of the substrate 10, increasing the contact surface between the device interface 40 and the substrate 10 and increasing the channels and area for heat transfer. Moreover, the device interface 40 and the substrate 10 can also be connected through pads to achieve mechanical fixation of the device interface 40 and the substrate 10. While preventing displacement and detachment of the device body 20, electrical connection between the two is also achieved, ensuring that current and signals can be transmitted smoothly.

[0053] In one embodiment, the device interface 40 can be set as a signal output waveguide port. Of course, this embodiment is not limited thereto. The device interface 40 can also adaptively adopt different interface types according to the actual application scenarios of the power amplifier module, such as optical fiber interfaces, coaxial interfaces, USB interfaces, etc. This embodiment has no strict requirements or limitations in this regard.

[0054] Specifically, at least part of the device interface 40 corresponds to the positions of the device body 20 and the heat dissipation element 30 on the substrate 10. In this way, the heat dissipation paths from the device body 20 through the substrate 10 to the device interface 40 and from the device interface 40 through the substrate 10 to the heat dissipation element 30 can be effectively shortened. Since the device interface 40 has parts corresponding to the positions of the device body 20 and the heat dissipation element 30 respectively, the heat transferred from the device body 20 to the substrate 10 can be quickly transferred to the device interface 40. After the device interface 40 receives the heat from the device body 20, the heat will be evenly distributed throughout the device interface 40. Therefore, the device interface 40 will also transfer the heat through the substrate 10 to the heat dissipation element 30, and finally, heat exchange with the external environment is completed through the heat dissipation element 30 to complete heat dissipation.

[0055] Of course, since the heat dissipation element 30 is set close enough to the device body 20 in this embodiment, the heat dissipated by the device body 20 in the receiving groove 31 can also be directly transferred to the heat dissipation element 30 for heat dissipation, thereby further improving the heat dissipation efficiency of the device body 20.

[0056] In summary, based on the fact that the device body 20 and the heat dissipation element 30 of the power amplifier device heat dissipation structure are also arranged on the first surface 11 of the substrate 10, by arranging the device interface 40 on the second surface 12 of the substrate 10 and making the device interface 40 at least partially relative to the device body 20 and the heat dissipation element 30, the heat generated by the device body 20 can be transferred to the heat dissipation element 30 through the substrate 10 and the device interface 40, enabling the heat to exchange heat with the external environment through an effective path, achieving the purpose of dissipating heat for the device body 20, keeping the device body 20 within a suitable operating temperature range, not only improving the operating efficiency of the power amplifier module, but also extending its service life, reducing damage and failures caused by overheating. At the same time, due to the device body 20 being arranged on the first surface 11 (lower surface layer) of the substrate 10, this solution also provides more choices for the layout of the PCB board and further expands the layout space of the electronic device.

[0057] The first surface 11 of the substrate 10 can also provide corresponding installation positions for other related devices, enabling the power amplifier module to omit the original shielding cover structure. The device body 20 and related devices can shield signals through the heat dissipation element 30, thereby reducing the material cost of the product. Moreover, the overall size and weight of the product are also reduced synchronously, which is beneficial to the miniaturization and lightweight design of the electronic device.

[0058] As a specific implementation manner, please continue to refer to the appendix Figure 1 , for the convenience of understanding, in this embodiment, the area where the heat dissipation element 30 is connected to the substrate 10 is defined as the first heat conduction area, and the area where the device interface 40 is connected to the substrate 10 is defined as the second heat conduction area. The projections of the first heat conduction area and the second heat conduction area on the substrate 10 at least partially overlap. Specifically, reference can be made to the overlapping area A between the two in the appendix Figure 1 . In this way, the heat transfer channel between the heat dissipation element 30 and the device interface 40 is generally in a form substantially perpendicular to the substrate 10, thereby improving the heat transfer efficiency between the heat dissipation element 30 and the device interface 40.

[0059] In this embodiment, a first heat-conducting medium 13 is provided between the first heat-conducting region and the second heat-conducting region of the substrate 10. The heat-dissipating medium can adopt a material with a higher heat transfer efficiency than that of the substrate 10. For example, the first heat-conducting medium 13 can adopt copper, which can be a copper heat sink or copper foil provided on the substrate 10, or even a copper heat-dissipating pad penetrating through the first surface 11 and the second surface 12 of the substrate 10. The heat of the device body 20 is rapidly transferred from the first surface 11 of the substrate 10 to its second surface 12 through heat conduction and absorbed by the device interface 40. Of course, in other embodiments, the first heat-conducting medium 13 can also but is not limited to adopt aluminum, or other non-metallic materials or phase change materials such as silica gel, graphene, and thermal paste.

[0060] Further, in this embodiment, the region where the device body 20 is connected to the substrate 10 is defined as the third heat-conducting region. The projection of the second heat-conducting region and the third heat-conducting region on the substrate 10 at least partially overlaps. Specifically, reference can be made to the overlapping region B between the two in the appendix. Figure 1 In this way, the heat transfer channel between the device body 20 and the device interface 40 is generally in a form substantially perpendicular to the substrate 10, thereby improving the heat transfer efficiency between the device body 20 and the device interface 40.

[0061] In the embodiment combining the cooperation mode of the above first heat-conducting region and the second heat-conducting region, a part of the second heat-conducting region corresponds to the first heat-conducting region and is used to receive the heat from the device body 20, while another part of the second heat-conducting region corresponds to the third heat-conducting region and is used to transfer the received heat to the heat-dissipating element 30, realizing the rapid transfer of the heat of the device body 20 from the device body 20 to the heat-dissipating element 30 and ensuring the heat dissipation efficiency of the device body 20.

[0062] It can be understood that since the size of the device body 20 is smaller than that of the device interface 40, and in addition to the need for the device interface 40 to be positionally corresponding to the device body 20, it also needs to have a part corresponding to the position of the heat-dissipating element 30. The second heat-conducting region formed by the device interface 40 on the substrate 10 is larger than the third heat-conducting region formed by the device body 20 on the substrate 10. Therefore, in order to further improve the heat transfer efficiency between the device body 20 and the device interface 40, in this example, the projection of the second heat-conducting region from the second surface 12 of the substrate 10 towards the first surface 11 completely covers the third heat-conducting region, so that the heat dissipated by the device body 20 can be transferred to the device interface 40 through the substrate 10 to the greatest extent.

[0063] Consistent with the above embodiment, a second heat-conducting medium 14 is provided between the second heat-conducting region and the third heat-conducting region of the substrate 10. The second heat-conducting medium 14 can adopt the same technical means as the first heat-conducting medium 13, and this embodiment will not be further elaborated here.

[0064] As can be understood from the above, in order to improve the heat transfer efficiency between components, the first heat conductive medium 13 and the second heat conductive medium 14 can be arranged to penetrate through the substrate 10, so that the opposite sides of the first heat conductive medium 13 are in contact with the device body 20 and the device interface 40 respectively, and the opposite sides of the second heat conductive medium 14 are in contact with the device interface 40 and the heat dissipation element 30 respectively.

[0065] The projection of the second heat conductive medium 14 on the substrate 10 can be arranged to match the shape of the device body 20. Since the first heat conductive region surrounds the third heat conductive region, the first heat conductive medium 13 can also be arranged to surround the second heat conductive medium 14 along the first heat conductive region to increase the contact area between the heat dissipation element 30 and the device interface 40 and the first heat conductive medium 13 as much as possible. However, considering the process difficulty of the substrate 10, if the first heat conductive medium 13 is arranged to surround the second heat conductive medium 14, the processing difficulty on the basis of the heat conductive medium penetrating the substrate 10 is relatively large. Therefore, in this embodiment, the first heat conductive medium 13 is arranged in multiple pieces, and the multiple first heat conductive media 13 are spaced around the second heat conductive medium 14 along the overlapping part of the first heat conductive region and the second heat conductive region, so as to control the processing cost of the substrate 10 while increasing the contact area between the second heat conductive medium 14 and the heat dissipation element 30 and the device interface 40.

[0066] Similar to the principle of the above-mentioned second heat conductive region and the third heat conductive region, due to the existence of the receiving groove 31, the part of the heat dissipation element 30 with the receiving groove 31 cannot achieve heat transfer with the device interface 40 through the substrate 10. Therefore, in an embodiment, the projection of the second heat conductive region on the substrate 10 is arranged to be located within the first heat conductive region, so as to ensure that the heat of the device interface 40 can be quickly transferred to the heat dissipation element 30 to the greatest extent through the periphery of the first heat conductive region and the second heat conductive region.

[0067] Please continue to refer to the appendix Figure 1 Optionally, the heat dissipation element 30 can be arranged to cover the first surface 11 to increase the contact surface of the heat dissipation element 30 with the external environment and improve the heat dissipation performance of the heat dissipation element 30. In addition, through this arrangement, the heat dissipation element 30 can also be used as part of the housing of the power amplifier module, so that the substrate 10 and the devices arranged on the substrate 10 can be covered and protected by the heat dissipation element 30.

[0068] In some embodiments, the area covered by the heat dissipation element 30 on the first surface 11 is larger than the area of the first surface 11. While further increasing the heat conduction area, the part of the heat dissipation element 30 extending from the periphery of the first surface 11 can also provide corresponding installation positions for related components. The part of the periphery of the heat dissipation element 30 corresponding to the first surface 11 can be supported on the substrate 10 through the first surface 11 to ensure the installation stability of the heat dissipation element 30 and the substrate 10.

[0069] Optionally, a plurality of spaced-apart heat dissipation teeth 32 are provided on the side of the heat dissipation element 30 facing away from the first surface 11, so as to increase the heat dissipation area of the heat dissipation element 30 and improve the contact efficiency between heat and air through the heat dissipation teeth 32 to accelerate heat dissipation, achieving the purpose of improving the heat dissipation efficiency of the heat dissipation element 30.

[0070] Please continue to refer to the attached Figure 1 Based on any of the above embodiments, an avoidance groove 33 with an opening facing the first surface 11 is formed on the side of the heat dissipation element 30 close to the first surface 11. The avoidance groove 33 can provide corresponding avoidance positions for other related devices in the power amplifier module, or to a certain extent reduce the weight of the heat dissipation element 30.

[0071] In the actual application scenario of the power amplifier module, related devices can be located in the avoidance groove 33 on the basis of being arranged on the first surface 11 of the substrate 10. Similarly, the groove wall of the avoidance groove 33 is spaced from the outer wall of the related device. In addition to being able to play a shielding role, it also prevents the heat of the heat dissipation element 30 from being transferred to the related device and causing it to be damaged.

[0072] In one embodiment, the avoidance groove 33 is disposed around the outer periphery of the receiving groove 31. A heat conduction structure 34 is provided between the heat dissipation element 30 located in the avoidance groove 33 and the receiving groove 31. The heat conduction structure 34 of the heat dissipation element 30 is connected to the substrate 10. In the above embodiment where the heat dissipation element 30 forms a first heat conduction area on the substrate 10, the size of the first heat conduction area is determined by the connection area between the heat conduction structure 34 and the substrate 10. The inner and outer sides of the heat conduction structure 34 respectively form the inner groove wall of the avoidance groove 33 and the groove wall of the receiving groove 31 to ensure the compact and simple structure of the heat dissipation element 30.

[0073] Further, on one side of the heat dissipation element 30 close to the first surface 11, a support structure 35 surrounding the outer periphery of the clearance groove 33 is further provided. The support structure 35 is at least partially disposed on the substrate 10. The support structure 35 can be understood as the part where the peripheral structure of the heat dissipation element 30 protrudes beyond the outer edge of the first surface 11. On the basis of improving the heat dissipation performance of the heat dissipation element 30 and providing a support position for related components, the heat dissipation element 30 can be supported on the substrate 10 through the support structure 35, avoiding the problem of poor installation stability caused by the heat dissipation element 30 forming a cantilever structure on the substrate 10 due to the existence of the clearance groove 33.

[0074] On the basis of the above structure, the support structure 35 forms the outer side wall of the clearance groove 33 to ensure the structural compactness and integrity of the heat dissipation element 30.

[0075] This embodiment also provides an electronic device, which further includes a box cover 50 on the basis of adopting the power amplifier device heat dissipation structure described in any of the above embodiments. The box cover 50 is disposed on the second surface 12 of the substrate 10, and at least part of the device interfaces 40 extend out of the box cover 50 to the outside, so that in some embodiments, it can cooperate with the heat dissipation element 30 to cover the substrate 10 and related devices as a whole.

[0076] It can be understood that since the device interface 40 is used to transfer the heat from the device body 20 in this embodiment, and the device interface 40 is partially exposed outside the box cover 50, the device interface 40 has a certain contact area with the air in the external environment. Therefore, while the device interface 40 transfers the heat to the heat dissipation element 30 through the substrate 10, the device interface 40 can also perform heat exchange with the air through the part in contact with the air in the external environment, thereby reducing the heat transferred to the heat dissipation element 30 by the device interface 40 and further improving the heat dissipation efficiency of the device body 20.

[0077] In the description herein, it should be understood that the orientation or positional relationships such as "upper", "lower", "left", "right", etc. are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive distinction and have no special meaning.

[0078] In the description of this specification, the descriptions referring to the terms "an embodiment", "an example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0079] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0080] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present invention without inventive effort, and such implementations will fall within the scope of protection of the present invention.

Claims

1. A heat dissipation structure for a power amplifier device, characterized in that Comprising: A substrate (10) having a first surface (11) and a second surface (12) disposed opposite to each other; A device body (20) disposed on the first surface (11) of the substrate (10); A heat dissipation element (30) mounted on the first surface (11) of the substrate (10), the heat dissipation element (30) having a receiving groove (31) with an opening facing the first surface (11), the device body (20) being located in the receiving groove (31) and being spaced apart from the groove wall of the receiving groove (31); A device interface (40) disposed on the second surface (12) of the substrate (10), at least a part of the device interface (40) corresponding to the positions of the device body (20) and the heat dissipation element (30) on the substrate (10).

2. The heat dissipation structure of the power amplifier device according to claim 1, characterized in that A first heat conduction region is formed in the region where the heat dissipation element (30) is connected to the substrate (10), a second heat conduction region is formed in the region where the device interface (40) is connected to the substrate (10), and at least a part of the projections of the first heat conduction region and the second heat conduction region on the substrate (10) overlap; A first heat conduction medium (13) is provided between the first heat conduction region and the second heat conduction region on the substrate (10).

3. The heat dissipation structure of the power amplifier device according to claim 2, characterized in that, A third heat conduction region is formed in the region where the device body (20) is connected to the substrate (10), and at least a part of the projections of the second heat conduction region and the third heat conduction region on the substrate (10) overlap; A second heat conduction medium (14) is provided between the second heat conduction region and the third heat conduction region on the substrate (10).

4. The heat dissipation structure of the power amplifier device according to claim 3, wherein Both the first heat conduction medium (13) and the second heat conduction medium (14) penetrate through the substrate (10) so that opposite sides of the first heat conduction medium (13) are in contact with the device body (20) and the device interface (40) respectively, and opposite sides of the second heat conduction medium (14) are in contact with the device interface (40) and the heat dissipation element (30) respectively; There are a plurality of the first heat conduction media (13), and the plurality of first heat conduction media (13) are spaced around the second heat conduction medium (14).

5. The heat dissipation structure of the power amplifier device according to claim 3, characterized in that, The projection of the second heat conduction region on the substrate (10) is located within the first heat conduction region.

6. The heat dissipation structure of the power amplifier device according to any one of claims 1-5, characterized in that, The heat dissipation element (30) covers the first surface (11).

7. The heat dissipation structure of the power amplifier device according to any one of claims 1-5, characterized in that, A plurality of spaced heat dissipation teeth (32) are provided on the side of the heat dissipation element (30) facing away from the first surface (11).

8. The heat dissipation structure of the power amplifier device according to claim 1, characterized in that, An avoidance groove (33) with an opening facing the first surface (11) is formed on the side of the heat dissipation element (30) close to the first surface (11), the avoidance groove (33) is disposed around the outer periphery of the receiving groove (31), and a heat conduction structure (34) is provided between the heat dissipation element (30) in the avoidance groove (33) and the receiving groove (31), and the heat conduction structure (34) is connected to the substrate (10); and The inner and outer sides of the heat conduction structure (34) respectively form the inner side wall of the clearance groove (33) and the groove wall of the accommodation groove (31).

9. The heat dissipation structure of the power amplifier device according to claim 8, wherein, On one side of the heat dissipation element (30) close to the first surface (11), a support structure (35) surrounding the outer periphery of the clearance groove (33) is further provided, and at least part of the support structure (35) is disposed on the substrate (10); and The support structure (35) forms the outer side wall of the clearance groove (33).

10. An electronic device, characterized in that, Comprising: The power amplifier device heat dissipation structure according to any one of claims 1-9; A box cover (50) is covered on the second surface (12) of the substrate (10), and at least part of the device interface (40) extends out of the box cover (50) from inside the box cover (50).

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