Packaging structure for improving brightness of chip
By introducing a white glue layer and white wall glue into the LED packaging structure, the light is reflected to improve the brightness of the chip, which solves the problem of limited brightness improvement in the prior art, and achieves a low-cost and efficient brightness enhancement effect.
Patent Information
- Application Number
- CN202422237401.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2025-07-29
- Estimated Expiration
- 2034-09-12
AI Technical Summary
In the prior art, the brightness improvement of the planar substrate chip is limited by the chip size and power, and the LENS mold compatibility is poor, resulting in high cost and limited effect of brightness improvement.
The design of white glue layer and white wall glue is adopted to improve the brightness of the chip by reflecting light. The packaging structure includes substrate, LED chip, conductive wire, white glue layer and white wall glue. The LED chip and conductive wire are wrapped with transparent epoxy or silicone packaging glue.
It improves the product's luminous brightness by about 30%, is low in cost and does not affect the product's optical characteristics. It is suitable for existing terminal applications.
Smart Images
Figure CN223168626U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of LED products, and particularly relates to a packaging structure for improving the brightness of a chip. Background Art
[0002] For the existing traditional planar substrate (FR4 / BT / plane bracket) CHIP products on the market, the improvement of the product brightness depends on the size of the chip and the improvement of the chip power. On the other hand, it is to change the structural design of the product, and the light-emitting angle of the product is changed by designing a LENS on the surface of the planar product substrate so as to improve the brightness of the product; the former design is limited by the size and luminous intensity of the wafer, and the latter requires opening a LENS mold, the investment cost of which is very high, and the compatibility of the LENS mold is poor. Content of the Utility Model
[0003] The purpose of the utility model is to solve the defects and deficiencies existing in the prior art, and design a packaging structure for improving the brightness of a chip, which can further meet the brightness improvement requirements of customers.
[0004] To achieve the above purpose, the technical solution adopted by the utility model is: a packaging structure for improving the brightness of a chip, including a substrate, an LED wafer arranged above the substrate, and a conductive wire for conducting between the surface electrodes of the LED wafer and the substrate. A white glue layer is arranged on the outer periphery of the LED wafer, a packaging glue is arranged above the white glue layer and the LED wafer, and a white wall glue is also arranged on the substrate above the outer periphery of the packaging glue.
[0005] Preferably, the LED wafer is fixed on the pad on the surface of the substrate through a conductive glue or an adhesive glue, and a conductive layer with a coating is arranged on one side of the substrate connected to the LED wafer.
[0006] Preferably, the substrate is selected from BT, FR4, PCT, EMC or SMC.
[0007] Preferably, the conductive wire is selected from a gold wire, an alloy wire, a silver wire or a copper wire.
[0008] Preferably, the packaging glue wraps the LED wafer, the conductive wire and the white glue layer.
[0009] Preferably, the white glue layer is coated on the substrate, and the height of the white glue layer is kept consistent with the height of the LED wafer.
[0010] Preferably, the packaging glue is a transparent epoxy or silicone packaging glue.
[0011] Preferably, the height of the packaging glue is less than or equal to the height of the white wall glue.
[0012] After adopting the above technical solution, a packaging structure for improving the brightness of a chip provided by the present utility model has the following beneficial effects:
[0013] (1) Through the design of the white glue layer and the white wall glue, the present utility model can improve the luminous brightness of the product by about 30% or more through the reflection of the white glue layer at the bottom and the white wall glue on the surrounding walls of the energized and luminous wafer, and the cost investment is relatively low;
[0014] (2) The present utility model will not have any adverse effects on the application of the product at the terminal. Instead of changing the optical characteristics of the product, it makes the light output brightness of the product stronger and the effect better, and can further meet the customer's brightness improvement requirements. When the terminal product is applied, it can be directly replaced without any design modification. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a plan view of a packaging structure for improving the brightness of a chip according to the present utility model;
[0016] Figure 2 It is a side view of a packaging structure for improving the brightness of a chip according to the present utility model;
[0017] Figure 3 It is a structural schematic diagram of the white glue layer and the white wall glue in the present utility model.
[0018] Among them: substrate 1, LED wafer 2, conductive wire 3, white glue layer 4, encapsulation glue 5, white wall glue 6. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0019] The present utility model will be further clearly and completely described below in conjunction with the drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of them. The description of at least one exemplary embodiment is actually only illustrative and in no way limits the present utility model and its application or use. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts belong to the scope of protection of the present utility model.
[0020] It should be noted that the terms used here are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used here, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0021] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present utility model. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0022] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom", etc. are usually based on the orientation or positional relationships shown in the drawings. These are only for the convenience of describing the present utility model and simplifying the description. Without contrary statements, these orientation words do not indicate or imply that the devices or elements referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the protection scope of the present utility model; the orientation words "inside, outside" refer to the inside and outside relative to the contours of the respective components.
[0023] For the convenience of description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "upper...", etc. can be used here to describe the spatial positional relationships of one device or feature shown in the drawings with other devices or features. It should be understood that the spatial relative terms are intended to encompass different orientations in use or operation in addition to the orientations described in the drawings for the devices. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.
[0024] In addition, it should be noted that the use of words such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above words have no special meanings. Therefore, they should not be construed as limiting the protection scope of the present utility model.
[0025] The present utility model provides a packaging structure for enhancing the brightness of a chip, as Figures 1 - 3 shown, which includes a substrate 1, an LED chip 2 disposed above the substrate 1, and a conductive wire 3 for conducting between the surface electrodes of the LED chip 2 and the substrate 1. The substrate 1 is selected from BT, FR4, PCT, EMC or SMC. The LED chip 2 is fixedly connected to a pad above the substrate 1. The surface of the substrate 1 connected to the LED chip 2 has a plated conductive layer. The LED chip 2 is fixed on the substrate 1 by a conductive adhesive or a bonding adhesive. The conductive wire 3 can be selected from gold wire, alloy wire, silver wire or copper wire, etc.
[0026] A white glue layer 4 is disposed on the outer periphery of the LED chip 2. The white glue layer 4 is coated on the substrate 1, and the height of the white glue layer 4 is kept consistent with the height of the LED chip 2. An encapsulating glue 5 is disposed above the white glue layer 4 and the LED chip 2. The encapsulating glue 5 is used to wrap the LED chip 2, the conductive wire 3 and the white glue layer 4, and the encapsulating glue 5 is a transparent epoxy or silicone encapsulating glue. A white wall glue 6 is further disposed on the substrate 1 above the outer periphery of the encapsulating glue 5. The height of the encapsulating glue 5 is less than or equal to the height of the white wall glue 6.
[0027] The packaging process of the packaging structure for enhancing the brightness of a chip according to the present utility model includes the following steps:
[0028] S1. Fix the LED chip 2 on the substrate 1 by a conductive adhesive or other bonding adhesives and cure it;
[0029] S2. Connect the electrodes of the LED chip 2 to the bottom substrate 1 through the conductive wire 3 to form conduction;
[0030] S3. Use a spraying or dispensing device to coat the white glue layer 4 on the substrate 1 around the LED chip 2 so that the entire periphery of the LED chip 2 is covered by the white glue layer 4, and then cure it;
[0031] S4. Fill the encapsulating glue 5 by processes such as process pressing or injection molding and bake and cure it;
[0032] S5. Surround the white wall glue 6 on the substrate 1 around the encapsulating glue 5 and cure it;
[0033] S6. Cut the product into single LED products, and after testing and sorting, package them in a carrier tape.
[0034] In summary, the packaging structure for enhancing the brightness of a chip provided by the present utility model, through the design of the white glue layer and the white wall glue, can enable the product to be powered on and the light-emitting chip to be reflected by the bottom white glue layer and the white wall glue on the surrounding walls, enhancing the luminous brightness of the product by more than about 30%. Moreover, the cost investment is relatively low, and it has the characteristics of stronger brightness and better effects, and has great market value and is worthy of wide promotion and application.
[0035] The above are only the preferred specific embodiments of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, making equivalent substitutions or changes should be covered within the protection scope of the present utility model.
Claims
1. A packaging structure for enhancing the brightness of a chip, characterized in that: It includes a substrate (1), an LED chip (2) disposed above the substrate (1), and a conductive wire (3) for conducting between the surface electrodes of the LED chip (2) and the substrate (1). A white glue layer (4) is provided on the outer periphery of the LED chip (2), and an encapsulation glue (5) is provided above the white glue layer (4) and the LED chip (2). A white wall glue (6) is also provided on the substrate (1) above and outside the encapsulation glue (5).
2. The packaging structure for enhancing the brightness of a chip according to claim 1, wherein: The LED chip (2) is fixed on the pads on the surface of the substrate (1) by a conductive glue or an adhesive glue, and the side of the substrate (1) connected to the LED chip (2) has a plated conductive layer.
3. The encapsulation structure for enhancing the brightness of a chip according to claim 1, wherein: The substrate (1) is selected from BT, FR4, PCT, EMC or SMC.
4. The encapsulation structure for enhancing the brightness of a chip according to claim 1, wherein: The conductive wire (3) is selected from a gold wire, an alloy wire, a silver wire or a copper wire.
5. The packaging structure for enhancing the brightness of a chip according to claim 1, characterized in that: The encapsulation glue (5) wraps the LED chip (2), the conductive wire (3) and the white glue layer (4).
6. The encapsulation structure for enhancing the brightness of a chip according to claim 1, wherein: The white glue layer (4) is coated on the substrate (1), and the height of the white glue layer (4) is kept consistent with the height of the LED chip (2).
7. The encapsulation structure for enhancing the brightness of a chip according to claim 1, characterized in that: The encapsulation glue (5) is a transparent epoxy or silicone encapsulation glue.
8. The encapsulation structure for enhancing the brightness of a chip according to claim 1, wherein: The height of the encapsulation glue (5) is less than or equal to the height of the white wall glue (6).