Cleaning disc and cleaning equipment

Abstract

The embodiment of the utility model provides a cleaning disc and cleaning equipment. The cleaning disc comprises a disc body and a buffer part. The buffer part comprises a mounting part, a buffer part and a contact part, the mounting part is arranged on the peripheral edge of the disc body, the contact part is arranged on the side, away from the disc body, of the mounting part, the contact part and the mounting part are spaced to form a buffer space, and the buffer part is located in the buffer space and connected with the mounting part and the contact part; the buffer space comprises a first buffer subspace and a second buffer subspace, the first buffer subspace is defined by the buffer part, the second buffer subspace is located on the side, in the circumferential direction of the disc body, of the buffer part and communicates with the first buffer subspace, and the buffer part can generate elastic deformation in the opposite direction of the installation part and the contact part. According to the cleaning disc provided by the embodiment of the invention, the first buffer subspace is arranged in the buffer part, so that the buffer part can absorb a part of collision energy in a self-deformation manner when the contact part is collided and extruded.

Description

Technical Field

[0001] The present application relates to the technical field of cleaning equipment, and in particular to a cleaning disc and cleaning equipment. Background Art

[0002] With the continuous improvement of living conditions and technological levels, cleaning equipment represented by sweeping robots has gradually begun to replace manual cleaning and widely appear in life and work.

[0003] The cleaning device is provided with a cleaning disc and a cleaning member, wherein the cleaning member is detachably arranged on the cleaning disc. When the cleaning device moves, the cleaning member is used to contact the surface of the working area to absorb dirt such as oil stains and sewage on the working area to achieve a cleaning effect.

[0004] In order to improve the cleaning efficiency of the cleaning device during movement, a portion of the cleaning disc and the cleaning member protrudes from the outside of the body of the cleaning device, so as to expand the area that can be cleaned by the cleaning disc per unit time.

[0005] In the related art, since a portion of the cleaning disc protrudes from the outside of the cleaning device body, the cleaning disc is prone to collide with objects such as wall corners, table legs, and cabinets during movement, which can easily cause damage to the cleaning disc and the cleaning device. Utility Model Content

[0006] In view of this, embodiments of the present application hope to provide a cleaning disk and a cleaning device that can buffer collisions.

[0007] To achieve the above objectives, the technical solution of the embodiment of the present application is implemented as follows:

[0008] An embodiment of the present application provides a cleaning tray, comprising:

[0009] disc body;

[0010] The buffer part includes a mounting portion, a buffer portion and a contact portion, wherein the mounting portion is arranged on the peripheral edge of the disk body, the contact portion is arranged on the side of the mounting portion away from the disk body, the contact portion and the mounting portion are spaced apart to form a buffer space, the buffer portion is located in the buffer space and connects the mounting portion and the contact portion, the buffer space includes a first buffer sub-space and a second buffer sub-space, the buffer portion is provided with a first buffer sub-space, the second buffer sub-space is located on one side of the buffer portion along the circumference of the disk body and is connected to the first buffer sub-space, and the buffer portion can produce elastic deformation along the relative direction of the mounting portion and the contact portion.

[0011] In some embodiments, the first buffer subspace is open on at least one of two axial sides of the disk body.

[0012] In some embodiments, in a projection perpendicular to the relative direction between the mounting portion and the contact portion, the projection of the connection region between the buffer portion and the mounting portion is within the projection range of the first buffer subspace;

[0013] and / or, the projection of the connection region between the buffer portion and the contact portion is within the projection range of the first buffer subspace.

[0014] In some embodiments, the buffer portion includes a first connection sub-portion and a second connection sub-portion. The first connection sub-portion and the second connection sub-portion are connected to each other along the relative direction between the mounting portion and the contact portion, and their extending directions are both inclined to the relative direction between the mounting portion and the contact portion. A first buffer subspace is formed at an interval between the first connection sub-portion and the second connection sub-portion along the relative direction between the mounting portion and the contact portion.

[0015] In some embodiments, in a projection perpendicular to the relative direction between the mounting portion and the contact portion, the projection of the end of the first connection sub-portion away from the second connection sub-portion is outside the projection range of the connection region between the first connection sub-portion and the second connection sub-portion;

[0016] and / or, the projection of the end of the second connection sub-portion away from the first connection sub-portion is outside the projection range of the connection region between the first connection sub-portion and the second connection sub-portion.

[0017] In some embodiments, in a projection perpendicular to the relative direction between the mounting portion and the contact portion, the projection of the end of the first connection sub-portion away from the second connection sub-portion and the projection of the end of the second connection sub-portion away from the first connection sub-portion at least partially overlap.

[0018] In some embodiments, the number of at least one of the first connection sub-portion and the second connection sub-portion is multiple, and the first connection sub-portion and the second connection sub-portion are alternately arranged along the relative direction between the mounting portion and the contact portion;

[0019] Alternatively, the number of both the first connection sub-portion and the second connection sub-portion is one. The first connection sub-portion is connected to the mounting portion, and the first connection sub-portion is connected to the contact portion.

[0020] In some embodiments, both the mounting portion and the contact portion are annular structures, and the number of the buffer portions is multiple. The multiple buffer portions are evenly spaced along the circumferential direction of the disc body.

[0021] In some embodiments, one side of each of the first buffer sub-spaces of the buffer parts along the circumferential direction of the disc body is open, and for any two adjacent first buffer sub-spaces along the circumferential direction of the disc body, the opening direction of one is opposite to that of the other.

[0022] An embodiment of the present application further provides a cleaning device, which includes a device body, a cleaning member, and the cleaning disc in any one of the foregoing embodiments. The device body is drivingly connected to the disc body to drive the disc body to rotate. The connection position between the device body and the disc body is located on one side of the disc body along its axial direction, and the cleaning member is located on the other side.

[0023] In the cleaning disc in the embodiment of the present application, by providing the first buffer sub-space in the buffer part, when the contact part is being collided and squeezed, the buffer part can absorb part of the collision energy through its own deformation, thereby reducing the collision energy transmitted to the installation part and the disc body, which is beneficial to reducing the probability of damage to the disc body caused by collision, and also reducing the risk of abnormality at the connection position between the disc body and the device body of the cleaning device due to collision, which is beneficial to extending the service life of the cleaning disc, and also beneficial to reducing the probability of foreign objects entering the first buffer sub-space during the operation of the cleaning device. Description of the Drawings

[0024] Figure 1 Schematic diagram of the cleaning disc in the first embodiment of the present utility model;

[0025] Figure 2 is Figure 1 Schematic diagram of the cleaning disc in another perspective in the embodiment;

[0026] Figure 3 is Figure 2 Partial enlarged schematic diagram of position A in the embodiment;

[0027] Figure 4 Partial enlarged schematic diagram in the second embodiment of the present utility model, and the enlarged area is the same as the Figure 2 position A therein;

[0028] Figure 5 Partial enlarged schematic diagram in the third embodiment of the present utility model, and the enlarged area is the same as the Figure 2 position A therein;

[0029] Figure 6 Schematic diagram of the cleaning device in an embodiment of the present utility model;

[0030] Figure 7 is Figure 6 Schematic diagram of the embodiment in another perspective.

[0031] Description of the Reference Numerals

[0032] 10. Cleaning disk; 11. Disk body; 12. Buffer member; 12a. Buffer space; 12b. Interface; 12c. Second buffer subspace; 121. Mounting portion; 122. Buffer portion; 122a. First buffer subspace; 1221. First connecting sub-portion; 1222. Second connecting sub-portion; 123. Contact portion; 20. Cleaning member; 30. Equipment body. Detailed implementation manners

[0033] It should be noted that, without conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other. The detailed description in the specific implementation manners should be understood as an explanatory illustration of the gist of the present application and should not be regarded as an improper limitation to the present application.

[0034] In the description of the embodiments of the application, for the convenience of description, as Figure 1 and Figure 2 shown, the direction where the arrow X is located is the "circumferential direction of the disk body"; as Figure 1 and Figure 7 shown, the direction where the arrow Y is located is the "axial direction of the disk body" and the "vertical direction". Referring to Figures 3 to 5 , the direction where the arrow Z is located is the "relative direction between the contact portion and the mounting portion". It should be understood that these orientation terms are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0035] An embodiment of the present application provides a cleaning disk 10 for cleaning equipment. A cleaning member 20 can be mounted on the cleaning disk 10. The cleaning member 20 is used to contact the surfaces of objects to be cleaned such as the floor and the tabletop to achieve functions such as sweeping and mopping.

[0036] Referring to Figure 1 and Figure 2 , the cleaning disk 10 includes a disk body 11 and a buffer member 12.

[0037] The disk body 11 is used to connect with the cleaning member 20 and can be connected to the equipment body 30 of the cleaning equipment so that the cleaning member 20 and the cleaning disk 10 move with the equipment body 30.

[0038] The buffer member 12 includes a mounting portion 121, a buffer portion 122, and a contact portion 123. The mounting portion 121 is provided at the circumferential edge of the disk body 11. The contact portion 123 is provided on the side of the mounting portion 121 away from the disk body 11. A buffer space 12a is formed by the interval between the contact portion 123 and the mounting portion 121. The buffer portion 122 is located within the buffer space 12a and connects the mounting portion 121 and the contact portion 123. The buffer space 12a includes a first buffer sub-space 122a and a second buffer sub-space 12c. The buffer portion 122 surrounds and forms the first buffer sub-space 122a. The second buffer sub-space 12c is located on one side of the circumferential direction of the disk body 11 and communicates with the first buffer sub-space 122a. The buffer portion 122 can elastically deform along the relative direction of the mounting portion 121 and the contact portion 123.

[0039] The circumferential edge of the disk body 11, refer to Figure 2 , which means that in the state where the disk body 11 is connected to the cleaning member 20, the side of the disk body 11 perpendicular to the direction opposite to the cleaning member 20.

[0040] The mounting portion 121 realizes the connection between the buffer member 12 and the disk body 11.

[0041] A buffer space 12a is formed by the interval between the contact portion 123 and the mounting portion 121. During the process of the side of the contact portion 123 away from the mounting portion 121 colliding with an external object, such as a table leg, a wall, etc., along the relative direction of the contact portion 123 and the mounting portion 121, at least part of the contact portion 123 can be deformed to compress the buffer space 12a. Thus, the effect of absorbing the collision energy is achieved through the deformation of the contact portion 123.

[0042] Refer to Figures 3 to 5 , for the sake of easy understanding, with the dividing interface 12b shown by the auxiliary line as the dividing boundary, the internal space surrounded by the buffer portion 122 is shown as the first buffer sub-space 122a and the second buffer sub-space 12c communicating with it.

[0043] It can be understood that in the state where the contact portion 123 is subjected to a collision force along the relative direction of the contact portion 123 and the mounting portion 121, a force transmission path is formed between the mounting portion 121 and the contact portion 123 through the buffer portion 122, so that the collision force is transmitted to the mounting portion 121 through the buffer portion 122, and then transmitted to the disk body 11.

[0044] The first buffer subspace 122a communicates with the second buffer subspace 12c on one side along the circumferential direction of the disk body 11, so that the buffer portion 122 forms a structure lacking support on both sides of the open edge of the first buffer subspace 122a along the relative direction of the mounting portion 121 and the contact portion 123, making the structural stiffness of the area where the buffer portion 122 is provided with the first buffer subspace 122a lower than that of other areas. Under the action of a collision force, this area is more likely to deform, and the buffer portion 122 can elastically deform along the relative direction of the mounting portion 121 and the contact portion 123.

[0045] It can be understood that under the action of a collision force, part of the collision energy is converted into elastic potential energy generated by the deformation of the buffer portion 122 itself; after the collision force is removed, the elastic potential energy of the buffer portion 122 is released, and the shape of the buffer portion 122 is restored so that the buffer portion 122 can continue to play a role in the next collision.

[0046] In the embodiment of the present application, by providing the first buffer subspace 122a in the buffer portion 122 of the cleaning disk 10, when the contact portion 123 is collided and squeezed, the buffer portion 122 can absorb part of the collision energy by deforming itself, thereby reducing the collision energy transmitted to the mounting portion 121 and the disk body 11. This is beneficial to reducing the probability of damage to the disk body 11 caused by collision, and also reduces the risk of abnormal connection positions between the disk body 11 and the equipment body 30 of the cleaning equipment due to collision, which is beneficial to extending the service life of the cleaning disk 10 and also beneficial to reducing the probability of foreign objects entering the first buffer subspace 122a during the operation of the cleaning equipment.

[0047] It can be understood that the buffer portion 122 is made of an elastic material so that the buffer portion 122 can elastically deform when the contact portion 123 is collided.

[0048] The type of elastic material used for the buffer portion 122 can be rubber, silica gel, etc.

[0049] In some embodiments, the buffer member 12 is made of an elastic material, that is, the mounting portion 121, the buffer portion 122, and the contact portion 123 are all made of an elastic material, so that when the contact portion 123 is collided, the mounting portion 121, the buffer portion 122, and the contact portion 123 can each elastically deform, which is beneficial to absorbing more collision energy.

[0050] For the specific number of the first buffer subspaces 122a provided in one buffer portion 122, refer to Figure 3 and Figure 4 , it can be one; refer to Figure 5 , and it can also be multiple.

[0051] In some embodiments, referring to Figure 1 and Figure 2 , at least one side of the two sides of the first buffer subspace 122a along the axial direction of the disk body 11 is open.

[0052] The axial direction of the disk body 11 is perpendicular to the relative direction between the mounting portion 121 and the contact portion 123.

[0053] In this way, it is beneficial to reduce the structural stiffness of the buffer portion 122 in the relative direction between the mounting portion 121 and the contact portion 123, and it is more beneficial for the buffer portion 122 to generate elastic deformation in the relative direction between the mounting portion 121 and the contact portion 123 during the collision process.

[0054] In some embodiments, referring to Figure 1 and Figure 2 , both sides of the first buffer subspace 122a along the axial direction of the disk body 11 are open, that is to say, the first buffer subspace 122a penetrates through the buffer portion 122 along the axial direction of the disk body 11.

[0055] In this way, it is more beneficial to reduce the structural stiffness of the buffer portion 122 in the relative direction between the mounting portion 121 and the contact portion 123; at the same time, it is also convenient to clean the foreign objects that enter the first buffer subspace 122a after the cleaning disk 10 has been used for a long time, and reduce the inhibitory effect of the foreign objects on the elastic deformation of the buffer portion 122.

[0056] In some embodiments, referring to Figure 3 , in the projection perpendicular to the relative direction between the mounting portion 121 and the contact portion 123, the projection of the connection area between the buffer portion 122 and the mounting portion 121 is within the projection range of the first buffer subspace 122a.

[0057] In this way, there is no area in the buffer portion 122 that extends linearly in the relative direction between the mounting portion 121 and the contact portion 123 to connect the mounting portion 121 and the contact portion 123, which is further beneficial for the buffer portion 122 to generate deformation in the relative direction between the mounting portion 121 and the contact portion 123.

[0058] In some embodiments, referring to Figure 3 , in the projection perpendicular to the relative direction between the mounting portion 121 and the contact portion 123, the projection of the connection area between the buffer portion 122 and the contact portion 123 is within the projection range of the first buffer subspace 122a.

[0059] In this way, there is no area in the buffer portion 122 that extends linearly in the relative direction between the mounting portion 121 and the contact portion 123 to connect the mounting portion 121 and the contact portion 123, which is further beneficial for the buffer portion 122 to generate deformation in the relative direction between the mounting portion 121 and the contact portion 123.

[0060] In some embodiments, referring toFigure 4 In a projection perpendicular to the relative direction of the mounting portion 121 and the contact portion 123, the projection of the connection region between the buffer portion 122 and the mounting portion 121 and the projection of the connection region between the buffer portion 122 and the contact portion 123 partially overlap, and a part of the projection of the overlapping portion is outside the projection range of the first buffer subspace 122a.

[0061] In this way, a part of the buffer portion 122 extends linearly in the relative direction of the mounting portion 121 and the contact portion 123 to connect the mounting portion 121 and the contact portion 123, which is beneficial to reducing the probability that the direct contact between the deformation of the contact portion 123 and the mounting portion 121 during the collision due to the structural stiffness of the buffer portion 122.

[0062] The specific structural form of the first buffer subspace 122a is not limited.

[0063] Exemplarily, refer to Figure 3 , the buffer portion 122 includes a first connecting sub-portion 1221 and a second connecting sub-portion 1222. The first connecting sub-portion 1221 and the second connecting sub-portion 1222 are connected to each other in the relative direction of the mounting portion 121 and the contact portion 123, and their extending directions are both inclined to the relative direction of the mounting portion 121 and the contact portion 123. A first buffer subspace 122a is formed at intervals between the first connecting sub-portion 1221 and the second connecting sub-portion 1222 in the relative direction of the mounting portion 121 and the contact portion 123.

[0064] That is to say, an included angle is formed between the first connecting sub-portion 1221 and the second connecting sub-portion 1222 to jointly form a bending structure, and the concave side of the bending structure forms the first buffer subspace 122a.

[0065] During the collision, the inclination amplitudes of the first connecting sub-portion 1221 and the second connecting sub-portion 1222 relative to the relative direction of the mounting portion 121 and the contact portion 123 increase, and the first connecting sub-portion 1221 and the second connecting sub-portion 1222 approach each other in the relative direction of the mounting portion 121 and the contact portion 123, causing the buffer portion 122 to deform in the relative direction of the mounting portion 121 and the contact portion 123.

[0066] In a projection plane perpendicular to the axial direction of the disk body 11, the projection of the bending structure formed by the first connecting sub-portion 1221 and the second connecting sub-portion 1222 can be V-shaped or arc-shaped.

[0067] In some embodiments, refer to Figures 1 to 3 , the extending directions of both the first connecting sub-portion 1221 and the second connecting sub-portion 1222 are perpendicular to the axial direction of the disk body 11, so that the first buffer subspace 122a is open on both sides in the axial direction of the disk body 11 and open on one side in the circumferential direction of the disk body 11.

[0068] In some embodiments, referring to Figure 3 , in the projection perpendicular to the relative direction of the mounting portion 121 and the contact portion 123, the projection of the end of the first connecting sub-portion 1221 away from the second connecting sub-portion 1222 is located outside the projection range of the connecting region of the first connecting sub-portion 1221 and the second connecting sub-portion 1222.

[0069] Thus, there is no structure extending linearly in the relative direction of the mounting portion 121 and the contact portion 123 between the end of the first connecting sub-portion 1221 away from the second connecting sub-portion 1222 and the connecting region of the first connecting sub-portion 1221 and the second connecting sub-portion 1222, which is conducive to the change in the inclination angle of the extending direction of the first connecting sub-portion 1221 relative to the relative direction of the mounting portion 121 and the contact portion 123 during a collision, so as to achieve the elastic deformation of the buffer portion 122.

[0070] In some embodiments, referring to Figure 3 , in the projection perpendicular to the relative direction of the mounting portion 121 and the contact portion 123, the projection of the end of the second connecting sub-portion 1222 away from the first connecting sub-portion 1221 is located outside the projection range of the connecting region of the first connecting sub-portion 1221 and the second connecting sub-portion 1222.

[0071] Thus, there is no structure extending linearly in the relative direction of the mounting portion 121 and the contact portion 123 between the end of the second connecting sub-portion 1222 away from the first connecting sub-portion 1221 and the connecting region of the first connecting sub-portion 1221 and the second connecting sub-portion 1222, which is conducive to the change in the inclination angle of the extending direction of the second connecting sub-portion 1222 relative to the relative direction of the mounting portion 121 and the contact portion 123 during a collision, so as to achieve the elastic deformation of the buffer portion 122.

[0072] In some embodiments, referring to Figure 3 , in the projection perpendicular to the relative direction of the mounting portion 121 and the contact portion 123, the projection of the end of the first connecting sub-portion 1221 away from the second connecting sub-portion 1222 at least partially coincides with the projection of the end of the second connecting sub-portion 1222 away from the first connecting sub-portion 1221.

[0073] Thus, it is beneficial to make the overall contour formed by the first connecting sub-portion 1221 and the second connecting sub-portion 1222 smaller in the circumferential dimension along the disk body 11, making the structure of the buffer portion 122 more compact.

[0074] The specific number of the first connecting sub-portion 1221 and the second connecting sub-portion 1222 is not limited.

[0075] In some embodiments, referring to Figure 5, the number of at least one of the first connecting sub - part 1221 and the second connecting sub - part 1222 is plural, and the first connecting sub - part 1221 and the second connecting sub - part 1222 are alternately arranged along the relative direction of the mounting part 121 and the contact part 123.

[0076] That is to say, the buffer part 122 extends in a reciprocally bent manner to connect the mounting part 121 and the contact part 123, and the buffer part 122 is provided with a plurality of first buffer sub - spaces 122a, and the opening directions of two adjacent first buffer sub - spaces 122a along the relative direction of the mounting part 121 and the contact part 123 are different.

[0077] In this way, it is beneficial to enable the buffer part 122 to swing, and it is beneficial that under impacts in different directions, the buffer part 122 can generate a large - amplitude elastic deformation to absorb part of the collision energy.

[0078] It can be understood that the total number of the first connecting sub - part 1221 and the second connecting sub - part 1222 can be odd; it can also be even. The first connecting sub - part 1221 and the second connecting sub - part 1222 are arranged in pairs in sequence along the relative direction of the mounting part 121 and the contact part 123. One of the first connecting sub - part 1221 and the second connecting sub - part 1222 is connected to the mounting part 121, and the other is connected to the contact part 123.

[0079] In some embodiments, referring to Figure 3 , the number of both the first connecting sub - part 1221 and the second connecting sub - part 1222 is one. The first connecting sub - part 1221 is connected to the mounting part 121, and the first connecting sub - part 1221 is connected to the contact part 123.

[0080] In this way, it is beneficial to simplify the structure of the buffer part 122 and facilitate the manufacture of the buffer part 122.

[0081] When the cleaning disk 10 is installed on the cleaning device, the cleaning device can drive the cleaning disk 10 to rotate, thereby causing the cleaning member 20 to generate friction with the surface of the object to be cleaned, so as to achieve a better cleaning effect. Therefore, the circumferential side of the cleaning disk 10 may collide with the object.

[0082] The mounting part 121 can be only a part of the circumferential edge of the disk body 11, or can be the entire circumferential edge of the disk body 11.

[0083] In some embodiments, referring to Figure 1 and Figure 2 , both the mounting part 121 and the contact part 123 are annular structures, and the number of the buffer parts 122 is plural. The plurality of buffer parts 122 are arranged at equal intervals along the circumferential direction of the disk body 11.

[0084] Along the circumferential direction of the disk body 11, the distance between any two adjacent buffer parts 122 is the same.

[0085] In this way, the installation part 121 can cover any position on the circumferential edge of the disk body 11, so that any position on the circumferential edge of the disk body 11 can be protected by the buffer member 12. Moreover, the plurality of buffer parts 122 are arranged circumferentially, which is beneficial for any position on the circumferential direction of the contact part 123 to be collided so that some buffer parts 122 can generate elastic deformation.

[0086] In some embodiments, the first buffer sub-spaces 122a of each buffer part 122 are all open on one side along the circumferential direction of the disk body 11, and for any two adjacent first buffer sub-spaces 122a along the circumferential direction of the disk body 11, the opening direction of one is opposite to that of the other.

[0087] That is to say, when observing from the axis of the disk body 11, the opening directions of the first buffer sub-spaces 122a along the circumferential direction are uniformly clockwise or counterclockwise.

[0088] In this way, the arrangement modes of the buffer parts 122 are unified, which is convenient for simplifying the design and manufacturing process of the buffer member 12 and beneficial to reducing the production cost.

[0089] In some embodiments, referring to Figure 1 , the buffer part 122 is completely located inside the buffer space 12a. That is to say, along the axial direction of the disk body 11, the buffer part 122 does not protrude from either the installation part 121 or the contact part 123, so as to reduce the adverse effect on the absorption of collision energy caused by the interference between the elastic deformation of the buffer part 122 and other components in the cleaning device when the cleaning disk 10 is installed in the cleaning device.

[0090] The embodiment of the present application further provides a cleaning device. Referring to Figure 6 and Figure 7 , the cleaning device includes a device body 30, a cleaning member 20 and the cleaning disk 10 in any of the foregoing embodiments. The device body 30 is drivingly connected to the disk body 11 to drive the disk body 11 to rotate. The connection position between the device body 30 and the disk body 11 is located on one side of the disk body 11 along its axial direction, and the cleaning member 20 is located on the other side.

[0091] The axial direction of the disk body 11 is the straight line direction where the rotation axis of the disk body 11 is located.

[0092] The relative direction between the installation part 121 and the contact part 123 is the radial direction of the rotation axis of the disk body 11.

[0093] During the movement of the cleaning device, the cleaning disk 10 collides with other objects along the radial direction of the disk body 11. Due to the deformation of the buffer portion 122, the collision force transmitted to other components of the cleaning device is reduced, the risk of damage to the cleaning device is lowered, and it is beneficial to extend its service life.

[0094] In some embodiments, referring to Figure 7 , the axial direction of the disk body 11 can be the vertical direction.

[0095] It can be understood that the cleaning member 20 and the cleaning disk 10 are detachably connected.

[0096] The specific type of the cleaning member 20 is not limited, and it can be a rotary brush or a mopping cloth.

[0097] It can be understood that the cleaning member 20 is a flexible structure so as to keep in contact with the surface of the object to be cleaned through elastic deformation.

[0098] In some embodiments, in the projection perpendicular to the circumferential direction of the disk body 11, the projection of the cleaning disk 10 is located within the projection range of the cleaning member 20. Thus, it is beneficial to enable an external object to collide with the cleaning member 20 first. After absorbing some collision energy through the deformation of the cleaning member 20, the external object then collides with the cleaning disk 10, thereby reducing the collision force received by the cleaning disk 10.

[0099] The specific type of the cleaning device can be a floor-sweeping robot or the like.

[0100] The various embodiments / implementations provided in this application can be combined with each other without contradiction.

[0101] The above are only the preferred embodiments of this application and are not used to limit this application. For those skilled in the art, this application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims

1. A cleaning disk, characterized in that, The cleaning disc includes: A disc body; A buffer member, including a mounting portion, a buffer portion, and a contact portion. The mounting portion is provided on the circumferential edge of the disc body. The contact portion is provided on the side of the mounting portion away from the disc body. A buffer space is formed by the interval between the contact portion and the mounting portion. The buffer portion is located in the buffer space and connects the mounting portion and the contact portion. The buffer space includes a first buffer sub-space and a second buffer sub-space. The buffer portion encloses to form the first buffer sub-space. The second buffer sub-space is located on one side of the buffer portion along the circumferential direction of the disc body and is communicated with the first buffer sub-space. The buffer portion can elastically deform along the relative direction of the mounting portion and the contact portion.

2. The cleaning disc according to claim 1, characterized in that, At least one side of the two sides of the first buffer sub-space along the axial direction of the disc body is open.

3. The cleaning disk according to claim 1, characterized in that, In the projection perpendicular to the relative direction of the mounting portion and the contact portion, the projection of the connection area between the buffer portion and the mounting portion is within the projection range of the first buffer sub-space; And / or, the projection of the connection area between the buffer portion and the contact portion is within the projection range of the first buffer sub-space.

4. The cleaning disk according to claim 1, characterized in that, The buffer portion includes a first connection sub-portion and a second connection sub-portion. The first connection sub-portion and the second connection sub-portion are connected to each other along the relative direction of the mounting portion and the contact portion, and the extending directions of both are inclined to the relative direction of the mounting portion and the contact portion. A first buffer sub-space is formed by the interval between the first connection sub-portion and the second connection sub-portion along the relative direction of the mounting portion and the contact portion.

5. The cleaning disc according to claim 4, wherein, In the projection perpendicular to the relative direction of the mounting portion and the contact portion, the projection of the end of the first connection sub-portion away from the second connection sub-portion is outside the projection range of the connection area between the first connection sub-portion and the second connection sub-portion; And / or, the projection of the end of the second connection sub-portion away from the first connection sub-portion is outside the projection range of the connection area between the first connection sub-portion and the second connection sub-portion.

6. The cleaning disk according to claim 4, characterized in that, In the projection perpendicular to the relative direction of the mounting portion and the contact portion, the projection of the end of the first connection sub-portion away from the second connection sub-portion and the projection of the end of the second connection sub-portion away from the first connection sub-portion at least partially overlap.

7. The cleaning disk according to claim 4, characterized in that, The number of at least one of the first connection sub-portion and the second connection sub-portion is multiple, and the first connection sub-portion and the second connection sub-portion are alternately arranged along the relative direction of the mounting portion and the contact portion; Or, the number of both the first connection sub-portion and the second connection sub-portion is one. The first connection sub-portion is connected to the mounting portion, and the first connection sub-portion is connected to the contact portion.

8. The cleaning disk according to claim 1, characterized in that, Both the mounting portion and the contact portion are annular structures, and the number of the buffer portions is multiple. The multiple buffer portions are evenly spaced along the circumferential direction of the disc body.

9. The cleaning disc according to claim 8, characterized in that, One side of the first buffer sub-space of each buffer portion along the circumferential direction of the disc body is open, and for any two adjacent first buffer sub-spaces along the circumferential direction of the disc body, the opening direction of one is opposite to that of the other.

10. A cleaning device, characterized in that, The cleaning device includes a device body, a cleaning member, and the cleaning disc according to any one of claims 1 to 9. The device body is drivingly connected to the disc body to drive the disc body to rotate. The connection position between the device body and the disc body is located on one side of the disc body along its axial direction, and the cleaning member is located on the other side.

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