Dispensing machine for semiconductor component processing

Abstract

The utility model relates to a dispensing machine for processing semiconductor components, which comprises a protection mechanism, storage mechanisms are arranged on the left side and the right side of the outside of the protection mechanism, a feeding mechanism is arranged on the left side of the storage mechanism on the left side, and a dispensing mechanism is arranged in the protection mechanism. And the dispensing mechanism comprises a second linear module and a fourth linear module, the second linear module is fixedly installed on the inner bottom wall of the protection mechanism, a third linear module is fixedly installed outside the second linear module, and a double-shaft air cylinder is fixedly installed at the output end of the second linear module. According to the dispensing machine for processing the semiconductor components, through the arrangement of the dispensing mechanism, the storage mechanism and the feeding mechanism, the semiconductor components in the form of integrated blocks and chips can be automatically loaded, unloaded and dispensed, the labor cost is reduced, the human error condition is avoided, meanwhile, the semiconductor components are conveniently stored and transferred, and the processing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor component production, in particular to a dispensing machine for semiconductor component processing. Background Technique

[0002] Semiconductor components refer to electronic components made of semiconductor materials. These components have electrical conductivity between that of metal conductors and insulators and have unique electrical properties; semiconductor components are the cornerstone of modern electronic technology and are widely used in various electronic devices, including computers, mobile phones, televisions, washing machines, etc.; in the production process of semiconductor components, dispensing is one of the indispensable processing steps, which can firmly fix semiconductor components on a PCB board or other carriers to maintain the stability and reliability of circuit connections.

[0003] In the process of implementing this application, the inventor found that there are at least the following problems in this technology. When a small number of semiconductor components in the form of integrated circuits and chips are still manually loaded and unloaded piece by piece during the dispensing process, the dispensing efficiency of semiconductor components is poor. At the same time, there is a risk of human error. Therefore, a dispensing machine for semiconductor component processing is proposed to solve the above problems. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the utility model provides a dispensing machine for semiconductor component processing, which has the advantages of automatic loading, unloading and dispensing, etc., and solves the problem of poor dispensing efficiency of a small number of semiconductor components in the form of integrated circuits and chips in the prior art.

[0005] To achieve the above object, the utility model provides the following technical scheme: A dispensing machine for semiconductor component processing, including a protection mechanism, storage mechanisms are arranged on the left and right sides of the outside of the protection mechanism, a feeding mechanism is arranged on the left side of the left storage mechanism, and a dispensing mechanism is arranged inside the protection mechanism;

[0006] The dispensing mechanism includes a second linear module and a fourth linear module. The second linear module is fixedly installed on the inner bottom wall of the protection mechanism. A third linear module is fixedly installed on the outside of the second linear module. The output end of the second linear module is fixedly installed with a double-axis cylinder. The output end of the double-axis cylinder is fixedly installed with a U-shaped transfer rack. The fourth linear module is fixedly installed on the inner bottom wall of the protection mechanism. The output end of the fourth linear module is fixedly installed with a U-shaped transport rack. A roller conveyor is fixedly installed on the front side of the inner wall of the U-shaped transport rack. The output end of the third linear module is fixedly installed with a hot-melt dispensing head.

[0007] The feeding mechanism includes a bracket which is fixedly installed on the left side of the left storage mechanism. The inner bottom wall of the bracket is fixedly installed with a stable chute. A pressing plate is slidably installed inside the stable chute. The front surface of the pressing plate is fixedly installed with a movable rack. A reduction motor is fixedly installed inside the bracket. An active gear is fixedly installed on the outer part of the output shaft of the reduction motor. The active gear meshes with the movable rack.

[0008] Furthermore, the protection mechanism includes a protection chamber. The upper end of the front surface of the protection chamber is hinged with a protection door. One end of an adjustment cylinder is hinged to the upper end of the protection door on one side of the inner wall of the protection chamber. Feeding and discharging holes are formed on both the left and right sides of the protection chamber.

[0009] Furthermore, the storage mechanism includes two first linear modules which are respectively fixedly installed on the left and right sides of the protection chamber. The output ends of the first linear modules are fixedly installed with two carrier plates. The top of the carrier plate is fixedly installed with positioning spring pieces. A storage box whose one end is in contact with the positioning spring piece is placed on the top of the carrier plate. Card slots are formed on both the front and rear sides of the inner wall of the storage box.

[0010] Furthermore, the bracket is fixedly installed on the left side of the left first linear module. The pressing plate is located inside the feeding and discharging hole. The fourth linear module is located in front of the second linear module.

[0011] Compared with the prior art, the technical solution of the present application has the following beneficial effects:

[0012] For the dispensing machine used for semiconductor component processing, through the settings of the dispensing mechanism, the storage mechanism and the feeding mechanism, semiconductor components in the form of integrated circuits and chips can be automatically loaded and unloaded for dispensing, reducing labor costs and avoiding human error situations. At the same time, it enables convenient storage and transportation of semiconductor components, improving processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a schematic structural diagram of the present utility model;

[0014] Figure 2 is a schematic structural diagram of the storage mechanism of the present utility model;

[0015] Figure 3 is a schematic structural diagram of the feeding mechanism of the present utility model;

[0016] Figure 4 is a schematic structural diagram of the dispensing mechanism of the present utility model.

[0017] In the figure: 1, protective bin; 2, protective door; 3, adjusting cylinder; 4, hot melting glue head; 5, first linear module; 6, carrier plate; 7, positioning reed; 8, storage box; 9, card slot; 10, bracket; 11, stable sliding groove; 12, abutting plate; 13, movable rack; 14, reduction motor; 15, driving gear; 16, loading and unloading hole; 17, second linear module; 18, third linear module; 19, double-axis cylinder; 20, U-shaped transfer rack; 21, fourth linear module; 22, roller conveyor; 23, U-shaped transport rack. Specific implementation mode

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Please refer to Figures 1-4 , a dispensing machine for semiconductor component processing in this embodiment includes a protection mechanism, storage mechanisms are arranged on both the left and right sides of the outside of the protection mechanism, a feeding mechanism is arranged on the left side of the left storage mechanism, and a dispensing mechanism is arranged inside the protection mechanism.

[0020] In this embodiment, the dispensing mechanism includes a second linear module 17 and a fourth linear module 21. The second linear module 17 is fixedly installed on the inner bottom wall of the protection mechanism. A third linear module 18 is fixedly installed outside the second linear module 17. The output end of the second linear module 17 is fixedly installed with a double-axis cylinder 19. The output end of the double-axis cylinder 19 is fixedly installed with a U-shaped transfer rack 20. The fourth linear module 21 is fixedly installed on the inner bottom wall of the protection mechanism. The output end of the fourth linear module 21 is fixedly installed with a U-shaped transport rack 23. A roller conveyor 22 is fixedly installed on the front side of the inner wall of the U-shaped transport rack 23. The output end of the third linear module 18 is fixedly installed with a hot melting glue head 4. The fourth linear module 21 is located in front of the second linear module 17.

[0021] Specifically, after the loading mechanism loads the semiconductor components inside the left storage mechanism to the top of the U-shaped transport rack 23, the fourth linear module 21 drives the semiconductor components to move to the right to the U-shaped transfer rack 20. At this time, the second linear module 17 drives the U-shaped transfer rack 20 to move forward to the bottom of the semiconductor components, and starts the dual-axis cylinder 19 to drive the U-shaped transfer rack 20 to rise, driving the semiconductor components out of the top of the U-shaped transport rack 23 and driving them into the bottom of the hot melt glue head 4. Finally, the second linear module 17 and the third linear module 18 cooperate to control the position of the hot melt glue head 4 and the U-shaped transfer rack 20 to achieve rapid glue dispensing on the surface of the semiconductor components. Then, the second linear module 17 and the dual-axis cylinder 19 drive the U-shaped transfer rack 20 to reset the semiconductor components to the top of the U-shaped transport rack 23, so that the U-shaped transport rack 23 continues to be driven to the right by the fourth linear module 21, and transported to the inside of the right storage mechanism via the roller conveyor 22 for storage and unloading.

[0022] In this embodiment, the loading mechanism includes a bracket 10, which is fixedly installed on the left side of the left storage mechanism. A stabilizing slide 11 is fixedly installed on the inner bottom wall of the bracket 10, and a back plate 12 is slidably installed inside the stabilizing slide 11. A movable rack 13 is fixedly installed on the front of the back plate 12. A reduction motor 14 is fixedly installed inside the bracket 10, and a driving gear 15 is fixedly installed on the outside of the output shaft of the reduction motor 14, and the driving gear 15 is meshed with the movable rack 13.

[0023] Specifically, when the storage mechanism on the left drives the semiconductor components to move to the right side of the plate 12, the reduction motor 14 is started to drive the driving gear 15 to rotate, so that the driving gear 15 drives the movable rack 13 to move the plate 12 to the right inside the stable slide 11, thereby realizing the plate 12 to push out and load the semiconductor components.

[0024] In this embodiment, the protective mechanism includes a protective bin 1, a protective door 2 is hinged at the upper end of the front side of the protective bin 1, an adjusting cylinder 3 with one end hinged to the upper end of the inner wall of the protective bin 1 is hinged, and the protective bin 1 has inlet and outlet holes 16 on both sides, and the support plate 12 is located inside the inlet and outlet holes 16.

[0025] The provision of the material inlet and outlet holes 16 allows for convenient loading and unloading of semiconductor components.

[0026] Specifically, when semiconductor components are being glued, the regulating cylinder 3 is retracted to move the protective door 2 downward at the hinge with the protective chamber 1, so that the protective mechanism protects the glue dispensing operation environment and prevents external dust from affecting the glue dispensing operation.

[0027] In this embodiment, the storage mechanism includes two first linear modules 5, which are respectively and fixedly installed on the left and right sides of the protection bin 1. The output ends of the first linear modules 5 are fixedly installed with two carrier plates 6. The top of the carrier plate 6 is fixedly installed with positioning spring pieces 7. A storage box 8 with one end in contact with the positioning spring piece 7 is placed on the top of the carrier plate 6. Slots 9 are opened on the front and rear sides of the inner wall of the storage box 8. The bracket 10 is fixedly installed on the left side of the left first linear module 5.

[0028] Among them, the number of the left and right storage boxes 8 and the carrier plates 6 is two, so that pre-loading and unloading can be carried out for both loading and unloading, improving the loading and unloading efficiency; the setting of the positioning spring piece 7 enables the convenient disassembly and assembly of the storage box 8.

[0029] Specifically, when the loading mechanism operates, the left first linear module 5 is started to move the storage box 8 down by a certain position to realize the automatic loading of semiconductor components. After the dispensing mechanism finishes dispensing, the right first linear module 5 is started to drive the storage box 8 to move downward to realize the automatic unloading of semiconductor components.

[0030] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0031] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dispensing machine for semiconductor component processing, characterized in that, It includes a protection mechanism, and storage mechanisms are arranged on the left and right sides of the outside of the protection mechanism. A feeding mechanism is arranged on the left side of the left storage mechanism, and a dispensing mechanism is arranged inside the protection mechanism; The dispensing mechanism includes a second linear module (17) and a fourth linear module (21). The second linear module (17) is fixedly installed on the inner bottom wall of the protection mechanism. A third linear module (18) is fixedly installed on the outside of the second linear module (17). The output end of the second linear module (17) is fixedly installed with a double-axis cylinder (19). The output end of the double-axis cylinder (19) is fixedly installed with a U-shaped transfer rack (20). The fourth linear module (21) is fixedly installed on the inner bottom wall of the protection mechanism. The output end of the fourth linear module (21) is fixedly installed with a U-shaped transport rack (23). A roller conveyor (22) is fixedly installed on the front side of the inner wall of the U-shaped transport rack (23). The output end of the third linear module (18) is fixedly installed with a hot melt dispensing head (4).

2. The dispensing machine for semiconductor component processing according to claim 1, wherein: The feeding mechanism includes a bracket (10). The bracket (10) is fixedly installed on the left side of the left storage mechanism. A stable sliding groove (11) is fixedly installed on the inner bottom wall of the bracket (10). A pressing plate (12) is slidably installed inside the stable sliding groove (11). A movable rack (13) is fixedly installed on the front surface of the pressing plate (12). A reduction motor (14) is fixedly installed inside the bracket (10). A driving gear (15) is fixedly installed on the outside of the output shaft of the reduction motor (14). The driving gear (15) meshes with the movable rack (13).

3. The dispensing machine for semiconductor component processing according to claim 2, characterized in that: The protection mechanism includes a protection chamber (1). The upper end of the front surface of the protection chamber (1) is hinged with a protection door (2). An adjusting cylinder (3) with one end hinged to the upper end of the protection door (2) is hinged to the upper end of one side of the inner wall of the protection chamber (1). Feeding and discharging holes (16) are formed on both the left and right sides of the protection chamber (1).

4. A dispensing machine for semiconductor component processing according to claim 3, characterized in that: The storage mechanism includes first linear modules (5). The number of the first linear modules (5) is two. The first linear modules (5) are respectively fixedly installed on the left and right sides of the protection chamber (1). The output ends of the first linear modules (5) are fixedly installed with two carrier plates (6). A positioning spring piece (7) is fixedly installed on the top of the carrier plate (6). A storage box (8) with one end contacting the positioning spring piece (7) is placed on the top of the carrier plate (6). Card slots (9) are formed on the front and rear sides of the inner wall of the storage box (8).

5. The dispenser for semiconductor component processing according to claim 4, characterized in that: The bracket (10) is fixedly installed on the left side of the left first linear module (5). The pressing plate (12) is located inside the feeding and discharging hole (16). The fourth linear module (21) is located on the front side of the second linear module (17).

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