Integrated circuit cleaning equipment

Abstract

The utility model discloses integrated circuit cleaning equipment which comprises an ultrasonic cleaning pool and further comprises a bearing assembly and a partition assembly dividing the space of the ultrasonic cleaning pool into a cleaning area and a liquid preparation area, the partition assembly comprises a plurality of horizontally-arranged closed partition plates, and the closed partition plates are arranged at intervals. Vertical liquid preparation partition plates are arranged on the close end faces of the adjacent closed partition plates, liquid drainage holes are evenly formed in the liquid preparation partition plates, shielding parts are further arranged on the liquid preparation partition plates, and the bearing assembly is slidably installed in the ultrasonic cleaning pool and used for bearing the integrated circuit board; by arranging the partition assembly, the integrated circuit board is subjected to ultrasonic cleaning in the cleaning area, when the bearing assembly carries the integrated circuit board to enter the liquid preparation area, the shielding part opens the liquid drainage hole in the liquid preparation partition plate, and liquid in the liquid preparation area flushes the integrated circuit board in the bearing assembly through the liquid drainage hole in the liquid preparation partition plate; and the condition that dirt in the cleaning area is adhered to the integrated circuit board is avoided.

Description

Technical Field

[0001] The utility model relates to the field of integrated circuit cleaning, in particular to an integrated circuit cleaning device. Background Art

[0002] An integrated circuit is a circuit with specific functions that integrates a certain number of commonly used electronic components (such as resistors, capacitors, transistors, etc.) and the connections between these components through semiconductor technology. During the manufacturing or assembly process of existing integrated circuits, the surface of the circuit board may be contaminated with dust, oil, welding residue, flux and other pollutants, which can easily affect the performance and reliability of the integrated circuit. For this reason, the integrated circuit needs to be cleaned after production.

[0003] If the authorized utility model patent with publication number CN220678806U and publication date March 29, 2024, discloses an integrated circuit board surface cleaning processing equipment, including an ultrasonic cleaning box, a rotatably connected mounting frame in the ultrasonic cleaning box, and a secondary cleaner arranged above the ultrasonic cleaning box; the mounting frame includes a rotating rod, a fixing plate, several cavity fixing frames symmetrically arranged on the upper and lower end faces of the fixing plate, and a limit plate, and a limit groove is provided in the cavity fixing frame; the secondary cleaner includes a water pump arranged inside the ultrasonic cleaning box, a support frame fixedly connected to the back of the ultrasonic cleaning box and extending to the top of the mounting frame, and several spray heads arranged on the lower end face of the support frame and connected to the water pump; this patent does not require tight clamping of the circuit board to prevent damage to the circuit board, and facilitates the placement and fixation of the circuit board, improves the efficiency of circuit board placement, and at the same time, there will be no stacking of circuit boards to affect the cleaning effect of the circuit board, and secondary flushing can be performed later.

[0004] When cleaning existing integrated circuits, ultrasonic cleaning is typically used to remove dirt adhered to the integrated circuits. However, the dirt after cleaning will remain in the cleaning solution. When the integrated circuit is manually removed from the ultrasonic cleaning tank, the integrated circuit moves in the ultrasonic cleaning solution. The dirt in the ultrasonic cleaning solution easily adheres to the surface of the integrated circuit again, affecting the cleaning effect of the integrated circuit. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated circuit cleaning device to solve the above-mentioned deficiencies in the prior art.

[0006] In order to achieve the above purpose, the present invention provides the following technical solutions:

[0007] An integrated circuit cleaning device includes an ultrasonic cleaning tank and further includes:

[0008] A separating component that divides the space of the ultrasonic cleaning tank into a cleaning area and a liquid preparation area from bottom to top. The separating component includes multiple horizontally arranged closed partition boards, which are arranged at intervals. Vertical liquid preparation partition boards are provided on the adjacent end faces of adjacent closed partition boards. Drainage holes are evenly formed on the liquid preparation partition boards. A shielding part is also provided on the liquid preparation partition boards, and the shielding part is used to shield or open the drainage holes.

[0009] A carrying component that is slidably installed in the ultrasonic cleaning tank and is used to carry an integrated circuit board.

[0010] When the carrying component leaves the cleaning area and enters the liquid preparation area with the integrated circuit board, the shielding part opens the drainage holes based on the movement of the carrying component.

[0011] In the above, two liquid preparation partition boards on each closed partition board enclose a space in the liquid preparation area, and this space is used to fill the cleaning liquid.

[0012] In the above, in the initial state, the shielding part shields the drainage holes.

[0013] In the above, vertical guiding chutes are also formed on the adjacent end faces of the liquid preparation partition boards.

[0014] In the above, the shielding part includes a shielding baffle, which is slidably installed in the guiding chute, and the shielding baffle is connected to the guiding chute through a connecting spring.

[0015] In the above, an elastic traction block is installed on the surface of the shielding baffle.

[0016] In the above, when the connecting spring is not stressed, the shielding baffle shields the drainage holes.

[0017] In the above, the carrying component includes a carrying frame, multiple carrying frames are installed on the carrying frame, and a trigger block is installed on the carrying frame. The trigger block is used to squeeze the traction block, and the shielding baffle is driven by the traction block to slide along the guiding chute, so that the shielding baffle opens the drainage holes.

[0018] In the above, in the initial state, the shielding baffle is located at the lowest position of the guiding chute. When the carrying frame inserts the entire integrated circuit board into the ultrasonic cleaning tank, the trigger block on the carrying frame is located below the traction block.

[0019] In the above, the liquid level height of the cleaning liquid in the cleaning area should be lower than the height of the closed partition board.

[0020] The beneficial effects of the present utility model are as follows: In the above technical solution, the ultrasonic cleaning tank is divided into a cleaning area and a liquid preparation area by a partition component. The integrated circuit board is ultrasonically cleaned in the cleaning area. After the cleaning is completed, when the carrying component takes the integrated circuit board out of the cleaning area and enters the liquid preparation area, the shielding part opens the drain hole on the liquid preparation partition board, and the liquid in the liquid preparation area flushes the integrated circuit board in the carrying component through the drain hole on the liquid preparation partition board, avoiding the situation that the dirt in the cleaning area adheres to the integrated circuit board when the integrated circuit board leaves the cleaning area. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present utility model. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings.

[0022] Figure 1 Structural schematic diagram of the integrated circuit cleaning device provided by the embodiment of the present utility model;

[0023] Figure 2 Front structural schematic diagram of the integrated circuit cleaning device provided by the embodiment of the present utility model;

[0024] Figure 3 Internal structural schematic diagram of the ultrasonic cleaning tank provided by the embodiment of the present utility model;

[0025] Figure 4 Provided by the embodiment of the present utility model Figure 3 Enlarged schematic diagram at position A;

[0026] Figure 5 Connection schematic diagram of the shielding part and the liquid preparation partition board provided by the embodiment of the present utility model.

[0027] Explanation of the reference numerals in the drawings:

[0028] 1. Ultrasonic cleaning tank; 2. Partition component; 21. Closed partition board; 22. Liquid preparation partition board; 23. Drain hole; 24. Guide chute; 3. Carrying component; 31. Carrying frame; 32. Carrying frame; 33. Trigger block; 4. Integrated circuit board; 5. Cleaning area; 6. Liquid preparation area; 7. Shielding part; 71. Shielding baffle; 72. Connecting spring; 73. Traction block. Detailed implementation manners

[0029] In order to enable those skilled in the art to better understand the technical solutions of the present utility model, the following will further introduce the present utility model in detail Figures 1-5 , in conjunction with the attached

[0030] In each embodiment of the present utility model, for the convenience of description and understanding, the arrangement direction of multiple closed partition plates 21 is referred to as the length direction, the direction perpendicular to the length direction on the horizontal plane is referred to as the width direction, and the gravity direction is referred to as the vertical direction. That is, the length direction, the width direction, and the vertical direction constitute a three-dimensional rectangular coordinate system.

[0031] An integrated circuit cleaning device provided by an embodiment of the present utility model includes an ultrasonic cleaning tank 1, and further includes a partition component 2 and a carrying component 3. The partition component 2 divides the space of the ultrasonic cleaning tank 1 into a cleaning area 5 and a liquid preparation area 6 from bottom to top. The partition component 2 includes multiple horizontally arranged closed partition plates 21. The multiple closed partition plates 21 are arranged at intervals. Vertical liquid preparation partition plates 22 are provided on the adjacent end faces of the adjacent closed partition plates 21. Drain holes 23 are uniformly formed in the liquid preparation partition plates 22. A shielding portion 7 is further provided on the liquid preparation partition plates 22. The shielding portion 7 is used to shield or open the drain holes 23. The carrying component 3 is slidably installed in the ultrasonic cleaning tank 1. The carrying component 3 is used to carry an integrated circuit board 4. When the carrying component 3 carries the integrated circuit board 4 and leaves the cleaning area 5 and enters the liquid preparation area 6, the shielding portion 7 opens the drain holes 23 based on the movement of the carrying component 3.

[0032] Specifically, the ultrasonic cleaning tank 1 is placed with its opening facing upward, and the inside of the ultrasonic cleaning tank 1 is filled with a cleaning liquid. When it is necessary to clean the integrated circuit board 4, the integrated circuit board 4 is placed into the ultrasonic cleaning tank 1 manually or by a mechanical device. Subsequently, the ultrasonic cleaning tank 1 starts to work. When sound waves propagate in the liquid, there will be a periodic change in pressure. The pressure drop stage causes tiny vacuum bubbles (cavitation bubbles) to form in the cleaning liquid. These cavitation bubbles will rapidly expand and collapse during the high-pressure stage. When the cavitation bubbles collapse, a powerful shock wave and a tiny high-temperature liquid jet will be released. This impact effect can effectively remove dirt, grease, oxides and other impurities on the surface of the object, and complete the cleaning of the dirt on the integrated circuit board 4.

[0033] Among them, after the cleaning operation of the dirt on the integrated circuit board 4 is completed by using the ultrasonic cleaning method, the dirt on the integrated circuit board 4 will remain in the cleaning liquid. Subsequently, when the integrated circuit board 4 is taken out of the ultrasonic cleaning tank 1 manually or by a mechanical device, the integrated circuit board 4 moves in the cleaning liquid, and the dirt in the cleaning liquid is likely to adhere to the surface of the integrated circuit board 4 again, affecting the cleaning effect of the integrated circuit board 4.

[0034] In order to solve the above problems, in this embodiment, a partition component 2 is also included. The partition component 2 divides the internal space of the ultrasonic cleaning tank 1 into a cleaning area 5 and a liquid preparation area 6. The liquid preparation area 6 and the cleaning area 5 are arranged vertically up and down, wherein the partition component 2 specifically includes a plurality of horizontally arranged closed partitions 21, and the plurality of closed partitions 21 are arranged at intervals along the length direction. The adjacent end surfaces of the adjacent closed partitions 21 are provided with liquid preparation partitions 22, and the liquid preparation partitions 22 are arranged vertically. The two liquid preparation partitions 22 on each closed partition 21 cooperate with the inner wall of the ultrasonic cleaning tank 1 in the liquid preparation area. A space is enclosed in the domain 6, which is filled with cleaning liquid. Drain holes 23 are evenly provided on the liquid preparation partition 22. A shielding portion 7 is further provided on the adjacent end surface of the liquid preparation partition 22. The shielding portion 7 is used to cover or open the drainage hole 23. In the initial state, the shielding portion 7 blocks the drainage hole 23 on the liquid preparation partition 22. In this embodiment, the carrying component 3 is a hollow rectangular frame, and the integrated circuit board 4 is placed in the rectangular frame. The carrying component 3 carries the integrated circuit board 4 and is inserted into the gap between the adjacent liquid preparation partitions 22. When the carrying component 3 takes the integrated circuit board 4 away from the liquid preparation partition 22, the integrated circuit board 4 is inserted into the liquid preparation partition 22. When the cleaning area 5 is opened and enters the liquid preparation area 6, the shielding part 7 opens the drainage hole 23 based on the movement of the carrying component 3, wherein the shielding part 7 can be a combination of an electrically controlled telescopic rod and a shielding plate. In the initial state, the shielding plate blocks the drainage hole 23 on the liquid preparation partition 22, preventing the cleaning liquid in the liquid preparation area 6 from flowing into the cleaning area 5 through the drainage hole 23. When the carrying component 3 carries the integrated circuit board 4 upward to leave the cleaning area 5 and enter the liquid preparation area 6, the electrically controlled telescopic rod controls the shielding plate to move downward, and the shielding plate is staggered with the drainage hole 23, so that the drainage hole 23 is opened and the liquid preparation area 6 is opened. The cleaning liquid in the liquid area 6 can flow into the cleaning area 5; wherein, the working timing of the electric-controlled telescopic rod can be realized by a camera, that is, a camera is installed in the liquid preparation area 6 of the ultrasonic cleaning tank 1. When the camera detects that the carrier assembly 3 carrying the integrated circuit board 4 leaves the cleaning area 5 and enters the liquid preparation area 6, the camera sends an electrical signal to the electric-controlled telescopic rod, and the electric-controlled telescopic rod drives the baffle to move and stagger with the drainage hole 23, thereby achieving the purpose of opening the drainage hole 23. Among them, controlling the working timing of the electric-controlled telescopic rod by using a camera is an existing technology, and its principle will not be repeated here.

[0035] In this embodiment, the cleaning process of the integrated circuit board 4 is as follows:

[0036] First, the cleaning area 5 and the liquid preparation area 6 of the ultrasonic cleaning tank 1 are manually filled with cleaning liquid. The cleaning liquid in the liquid preparation area 6 is mainly located in the space enclosed by the two liquid preparation partitions 22 on each closed partition 21 within the liquid preparation area 6. At this time, the shielding plate blocks the drainage holes 23 on the liquid preparation partitions 22, separating the cleaning liquid in the cleaning area 5 from the cleaning liquid in the liquid preparation area 6.

[0037] Subsequently, the integrated circuit board 4 to be cleaned is manually placed into the carrier assembly 3, and the carrier assembly 3 passes through the gap between two adjacent liquid preparation partitions 22 in the vertical direction until the carrier assembly 3 and the integrated circuit board 4 are inserted into the cleaning liquid in the cleaning area 5. Then, the ultrasonic cleaning tank 1 starts working, and the integrated circuit board 4 is cleaned in the cleaning area 5.

[0038] Afterwards, manual or mechanical equipment moves upward in the vertical direction with the carrying component 3, and the carrying component 3 carries the integrated circuit board 4 out of the cleaning area 5. As the carrying component 3 carries the integrated circuit board 4 into the liquid preparation area 6, the electrically controlled telescopic rod drives the baffle plate to move downward, and the baffle plate is staggered with the drainage hole 23. At this time, the drainage hole 23 is opened, and the cleaning liquid in the liquid preparation area 6 flows out from the drainage hole 23. The outflowing cleaning liquid rinses the integrated circuit board 4 in the carrying component 3, thereby preventing the dirt in the cleaning area 5 from adhering to the integrated circuit board 4 when the integrated circuit board 4 leaves the cleaning area 5.

[0039] Among them, in this embodiment, after the cleaning liquid cleans the integrated circuit board 4 with a high degree of dirt, the clarity of the cleaning liquid will deteriorate, that is, the cleaning liquid will become turbid. The turbid cleaning liquid affects the camera's normal observation of the position of the integrated circuit board 4 in the carrier component 3. Therefore, when the cleaning liquid is turbid, the electrically controlled telescopic rod cannot promptly drive the baffle plate and the drainage hole 23 to be offset, and promptly allow the cleaning liquid in the liquid preparation area 6 to flow out of the drainage hole 23 to flush the integrated circuit board 4, affecting the cleaning effect of the integrated circuit board 4.

[0040] In order to solve the above problems, preferably, a vertical guide groove 24 is also provided on the adjacent end surface of the liquid preparation partition 22, and the shielding portion 7 includes a shielding baffle 71, which is slidably installed in the guide groove 24, and the shielding baffle 71 is connected to the guide groove 24 by a connecting spring 72. When the connecting spring 72 is not under force, the shielding baffle 71 blocks the drainage hole 23, and an elastic traction block 73 is installed on the surface of the shielding baffle 71, and the bearing assembly 3 includes a bearing frame 31, and a plurality of bearing frames 32 are installed on the bearing frame 31, and a trigger block 33 is installed on the bearing frame 32. The trigger block 33 is used to squeeze the traction block 73, and the traction block 73 slides the shielding baffle 71 along the guide groove 24, so that the shielding baffle 71 opens the drainage hole 23.

[0041] Specifically, in the initial state, the shielding baffle 71 is located at the lowest end of the guide slot 24. At this time, as the carrying frame 32 moves downward with the trigger block 33, the trigger block 33 does not cause the shielding baffle 71 to change its position. Moreover, when the carrying frame 32 is inserted into the ultrasonic cleaning tank 1 with the integrated circuit board 4 as a whole, the trigger block 33 on the carrying frame 32 is located below the traction block 73.

[0042] In this embodiment, the cleaning process of the integrated circuit board 4 is as follows:

[0043] First, the cleaning area 5 and the liquid preparation area 6 of the ultrasonic cleaning tank 1 are manually filled with cleaning liquid. The cleaning liquid in the liquid preparation area 6 is mainly located in the space enclosed by the two liquid preparation partitions 22 on each closed partition 21 within the liquid preparation area 6. At this time, because the connecting spring 72 is in an unstressed state, the shielding baffle 71 blocks the drainage hole 23 on the liquid preparation partition 22, thereby separating the cleaning liquid in the cleaning area 5 from the liquid preparation area 6.

[0044] Subsequently, the integrated circuit board 4 to be cleaned is manually placed into the carrier frame 32 of the carrier assembly 3. The carrier frame 32 carries the integrated circuit board 4 through the gap between two adjacent liquid preparation partitions 22 in the vertical direction until the integrated circuit board 4 in the carrier frame 32 is inserted into the cleaning liquid in the cleaning area 5. Then, the ultrasonic cleaning tank 1 starts working, and the integrated circuit board 4 is cleaned in the cleaning area 5.

[0045] Afterwards, manual or mechanical equipment moves the carrying assembly 3 upward in the vertical direction, and the carrying frame 32 carries the integrated circuit board 4 out of the cleaning area 5. Before the carrying frame 32 carries the integrated circuit board 4 into the liquid preparation area 6, the trigger block 33 on the carrying frame 32 abuts against the traction block 73. As the carrying frame 32 continues to move upward, the trigger block 33 moves up synchronously with the traction block 73. At this time, the traction block 73 moves up with the shielding baffle 71. At this time, the shielding baffle 71 is staggered with the drainage hole 23, and the drainage hole 23 is opened. The cleaning liquid in the liquid preparation area 6 flows out from the drainage hole 23, and the outflowing cleaning liquid rinses the integrated circuit board 4 in the carrying assembly 3 to prevent the dirt in the cleaning area 5 from adhering to the integrated circuit board 4 when the integrated circuit board 4 leaves the cleaning area 5, and through the trigger The cooperation between the block 33 and the traction block 73 ensures that the timing of moving the shielding baffle 71 is certain, which can avoid the situation where the turbid cleaning liquid affects the observation of the camera when the camera is used, resulting in the inability to grasp the moving timing of the shielding baffle 71; when the bottom of the entire integrated circuit board 4 is located above the drainage hole 23, the traction block 73 also moves to the top of the guide slot 24. At this time, as the supporting frame 32 continues to move upward, the trigger block 33 squeezes the traction block 73, and the traction block 73 undergoes elastic deformation. The deformed traction block 73 cannot limit the supporting assembly 3 from leaving the ultrasonic cleaning tank 1 with the integrated circuit board 4, so that the supporting frame 32 moves to the outside of the ultrasonic cleaning tank 1 with the integrated circuit board 4, and the cleaned integrated circuit board 4 is manually taken out of the supporting frame 32 to complete the cleaning process of the integrated circuit board 4.

[0046] It should be noted that when filling the cleaning liquid into the cleaning area 5 and the liquid preparation area 6 of the ultrasonic cleaning tank 1, the liquid level height of the cleaning liquid in the cleaning area 5 should be lower than the height of the closed partition 21 to ensure that the cleaning liquid in the closed partition 21 and the liquid preparation partition 22 can be separated to avoid contamination.

[0047] Only some exemplary embodiments of the present invention have been described by way of illustration above. Without doubt, for those of ordinary skill in the art, various different ways can be used to modify the described embodiments without departing from the spirit and scope of the present invention. Therefore, the above drawings and description are illustrative in nature and should not be construed as limiting the protection scope of the claims of the present invention.

Claims

1. An integrated circuit cleaning device, comprising an ultrasonic cleaning tank (1), characterized in that, It further includes: A separating component (2) that divides the space of the ultrasonic cleaning tank (1) from bottom to top into a cleaning area (5) and a liquid preparation area (6). The separating component (2) includes multiple horizontally arranged closed partition plates (21). The multiple closed partition plates (21) are arranged at intervals. Vertical liquid preparation partition plates (22) are provided on the adjacent end faces of the adjacent closed partition plates (21). Drainage holes (23) are evenly formed on the liquid preparation partition plates (22). A shielding portion (7) is further provided on the liquid preparation partition plates (22), and the shielding portion (7) is used to shield or open the drainage holes (23); A carrying component (3) that is slidably installed in the ultrasonic cleaning tank (1) and is used to carry an integrated circuit board (4); When the carrying component (3) carries the integrated circuit board (4) and leaves the cleaning area (5) and enters the liquid preparation area (6), the shielding portion (7) opens the drainage holes (23) based on the movement of the carrying component (3).

2. The integrated circuit cleaning device according to claim 1, wherein, Two liquid preparation partition plates (22) on each closed partition plate (21) enclose a space in the liquid preparation area (6) for filling the cleaning liquid.

3. An integrated circuit cleaning device according to claim 1, characterized in that, In the initial state, the shielding portion (7) shields the drainage holes (23).

4. An integrated circuit cleaning device according to claim 1, characterized in that, Vertical guiding chutes (24) are further formed on the adjacent end faces of the liquid preparation partition plates (22).

5. An integrated circuit cleaning device according to claim 4, characterized in that, The shielding portion (7) includes a shielding baffle (71) that is slidably installed in the guiding chute (24), and the shielding baffle (71) is connected to the guiding chute (24) through a connecting spring (72).

6. An integrated circuit cleaning device according to claim 5, characterized in that, An elastic traction block (73) is installed on the surface of the shielding baffle (71).

7. An integrated circuit cleaning device according to claim 6, characterized in that, When the connecting spring (72) is not stressed, the shielding baffle (71) shields the drainage holes (23).

8. An integrated circuit cleaning device according to claim 7, characterized in that, The carrying component (3) includes a carrying frame (31). Multiple carrying frames (32) are installed on the carrying frame (31). A trigger block (33) is installed on the carrying frame (32), and the trigger block (33) is used to squeeze the traction block (73), and drives the shielding baffle (71) to slide along the guiding chute (24) through the traction block (73), so that the shielding baffle (71) opens the drainage holes (23).

9. An integrated circuit cleaning device according to claim 8, characterized in that, In the initial state, the shielding baffle (71) is located at the lowest position of the guiding chute (24). When the carrying frame (32) carries the integrated circuit board (4) and is completely inserted into the ultrasonic cleaning tank (1), the trigger block (33) on the carrying frame (32) is located below the traction block (73).

10. An integrated circuit cleaning device according to claim 9, characterized in that, The liquid level height of the cleaning liquid in the cleaning area (5) should be lower than the height of the closed partition plate (21).

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