Rapid forming device for semiconductor diode pin

Abstract

The utility model discloses a rapid forming device for semiconductor diode pins, which comprises a plurality of fixing seats, the fixing seats are distributed in parallel, connecting blocks are arranged among the fixing seats, the fixing seats are provided with storage grooves for placing diode main bodies, two ends of each storage groove are provided with wiring grooves for the pins to pass through, and the wiring grooves are connected with the connecting blocks. And pressed grooves communicating with the wiring groove are formed in the two sides of the fixing base correspondingly, forming grooves are formed in the inner wall faces of the pressed grooves correspondingly, and extrusion assemblies are installed on the portions, located on the outer sides of the wiring groove, of the fixing base correspondingly. The device is simple in structure, diodes can be directly placed in the storage grooves, pins can be inserted into the strip-shaped openings along the wiring grooves, the pins can be directly bent to be of a U-shaped structure after the rotating plate and the pressing rod are pressed downwards in sequence, the middle sections of the pins are made to be in a UK shape, and the forming efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diode forming, in particular to a device for rapidly forming pins of a semiconductor diode. Background Art

[0002] During the production process of electronic products, a large number of diodes are required. When soldering the diodes onto the circuit board of the electronic product, it is necessary to form the pins of the diodes to adapt to the assembly of the circuit board.

[0003] However, currently, the forming of diodes generally involves directly bending the pins. However, ordinary bending cannot form a UK shape, resulting in the inability to control the insertion depth of the pins, and the bending efficiency is reduced, affecting the forming speed. Summary of the Invention

[0004] The technical problem to be solved by the utility model is to provide a device for rapidly forming pins of a semiconductor diode. After the diode is inserted into the storage groove, the pins can be directly bent and formed by the rotating plate and the pressing rod that are successively pressed down, so as to solve the problems proposed in the above background art.

[0005] The utility model is realized by the following technical solutions: A device for rapidly forming pins of a semiconductor diode, including a plurality of fixed seats, which are distributed in parallel between the fixed seats, and connecting blocks are installed between the fixed seats. Storage grooves for placing the diode body are provided on the fixed seats. Wiring grooves for the pins to pass through are provided at both ends of the storage groove. Pressure-receiving grooves communicating with the wiring grooves are provided on both sides of the fixed seat. Forming grooves are provided on the inner wall surfaces of the pressure-receiving grooves. Extrusion components are installed on the outer sides of the fixed seats at the wiring grooves.

[0006] As a preferred technical solution, the extrusion components all include a rotating plate and a pressing rod. The rotating plates are all installed on both sides of the fixed seat through hinge parts. Strip-shaped openings are provided on the rotating plates opposite to the wiring grooves. The pressing rods are all installed in the strip-shaped openings through hinge parts. Forming parts protrude from the inner side surfaces of the pressing rods.

[0007] As a preferred technical solution, arc-shaped first diversion parts are provided on the outer end faces of the wiring grooves, and arc-shaped second diversion parts are provided on both sides of the pressure-receiving grooves.

[0008] As a preferred technical solution, the middle of the storage groove is enlarged to form a groove for taking out.

[0009] As a preferred technical solution, positioning grooves are provided on the bottom surfaces of the fixed seats. The positioning grooves between the plurality of fixed seats are communicated. A positioning block is provided in the plurality of positioning grooves. The outer side surface of the positioning block is attached to the inner side surface of the positioning groove.

[0010] As a preferred technical solution, the fixed seats are all made of elastic metal materials.

[0011] As a preferred technical solution, the thickness of the pressure bar is set to be less than the thickness of the rotating plate.

[0012] The beneficial effects of the present utility model are as follows: The structure of the present utility model is simple. The diode can be directly placed into the storage groove, and the pin can be inserted into the strip-shaped opening along the wiring groove. After successively pressing down the rotating plate and the pressure bar, the pin can be directly bent into a "U" - shaped structure, and a UK - shaped form is formed in the middle section of the pin, increasing the forming efficiency. Description of the Drawings

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following - described drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0014] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0015] Figure 2 It is a bottom view of the present utility model;

[0016] Figure 3 It is a schematic diagram of the structure of the present utility model after removing any one of the rotating plates and the pressure bar.

[0017] Among them, 1. Fixed seat; 2. Storage groove; 3. Wiring groove; 4. Groove; 5. Rotating plate; 6. Strip - shaped opening; 7. Pressure bar; 8. Forming part; 9. Positioning block; 10. Compression groove; 11. Forming groove. Detailed Embodiment

[0018] The following will describe in detail the embodiments of the present utility model. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation of the present utility model.

[0019] All the features disclosed in this specification, or all the steps in the disclosed methods or processes, except for mutually exclusive features and / or steps, can be combined in any way.

[0020] Any feature disclosed in this specification (including any additional claims, abstract, and drawings), unless specifically stated, can be replaced by other equivalent or features with similar purposes. That is, unless specifically stated, each feature is only an example of a series of equivalent or similar features.

[0021] As Figure 1 , Figure 2 and Figure 3 shown, a semiconductor diode pin rapid prototyping device of the present utility model includes a plurality of fixed seats 1, the fixed seats 1 are distributed in parallel, and connection blocks are installed between the fixed seats 1. Storage grooves 2 for placing diode bodies are provided on the fixed seats 1. Wiring grooves 3 through which pins pass are provided at both ends of the storage grooves 2. Pressure receiving grooves 10 communicating with the wiring grooves 3 are provided on both sides of the fixed seats 1. Forming grooves 11 are provided on the inner wall surfaces of the pressure receiving grooves 10. Extrusion components are installed on the outer sides of the fixed seats 1 located outside the wiring grooves 3.

[0022] In this embodiment, the extrusion components each include a rotating plate 5 and a pressing rod 7. The rotating plates 5 are each installed on both sides of the fixed seat 1 through hinge members. Strip-shaped openings 6 are provided on the rotating plates 5 opposite to the wiring grooves 3. The pressing rods 7 are each installed in the strip-shaped openings 6 through hinge members. Forming portions 8 protrude from the inner side surfaces of the pressing rods 7.

[0023] In this embodiment, arc-shaped first diversion portions are provided on the outer end surfaces of the wiring grooves 3. Second diversion portions with arc-shaped structures are provided on both sides of the pressure receiving grooves 10. When the pins are bent and formed, the first diversion portion can make the bent portions of the pins be arranged in an arc shape, avoiding breakage caused by right-angle bending; and the second diversion plate can make the pins enter the pressure receiving grooves more conveniently.

[0024] In this embodiment, the middle of the storage grooves 2 is enlarged to form grooves 4 for taking out. The grooves facilitate the insertion of fingers or the taking out of the internal diodes, facilitating the material taking operation.

[0025] In this embodiment, positioning grooves are provided on the bottom surfaces of the fixed seats 1. The positioning grooves between the plurality of fixed seats 1 are communicated. A positioning block 9 is provided in the plurality of positioning grooves. The outer side surface of the positioning block 9 is fitted with the inner side surface of the positioning groove.

[0026] In this embodiment, the fixed seats 1 are each made of an elastic metal material, so that the fixed seats can be bent after being pressed.

[0027] In this embodiment, the thickness of the pressing rod 7 is set to be less than the thickness of the rotating plate 5. When the pressing rod bends and presses the pins, a part of the pins can enter the strip-shaped openings, so that the pins can be better positioned.

[0028] In use, the diode column to be used is placed into the storage slot, and the pins on the diode pass through the wiring slot and are inserted into the strip-shaped opening. At this time, first rotate the pressure lever with the hinge as the center towards the rotating plate, so that the pressure lever enters the strip-shaped opening. Then, simultaneously press down the rotating plate and the pressure lever. Through the pressing plate, the pin can be pressed into the pressure-receiving groove, causing the pin to be first bent into a "U" shape. As the rotating plate and the pressure lever continue to be pressed down, the forming part on the pressure lever can press a section of the pin into the forming groove, causing the bending of the pin to form a "C" part, so that the pin can be arranged in a UK shape;

[0029] After forming, the positioning block can be taken outwards. After losing the limit of the positioning block, both sides of the fixing seat can bend inwards, so that the C-shaped part on the pin can be removed from the forming groove. At this time, the diode can be directly taken out upwards to ensure the quality of the pin after forming and avoid affecting the shape of the pin during the taking-out process.

[0030] The above is only the specific implementation manner of the present utility model, but the protection scope of the present utility model is not limited thereto. Any change or replacement that is thought of without creative work should be covered within the protection scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the protection scope defined by the claims.

Claims

1. A semiconductor diode pin rapid prototyping device, characterized in that: It includes a plurality of fixed seats (1), the fixed seats (1) are distributed in parallel, and connecting blocks are installed between the fixed seats (1). Storage grooves (2) for placing diode bodies are provided on the fixed seats (1). Wiring grooves (3) through which pins pass are provided at both ends of the storage grooves (2). Pressure grooves (10) communicating with the wiring grooves (3) are provided on both sides of the fixed seats (1). Forming grooves (11) are provided on the inner wall surfaces of the pressure grooves (10). Extrusion assemblies are installed on the outer sides of the fixed seats (1) located at the wiring grooves (3).

2. The semiconductor diode pin rapid prototyping device according to claim 1, wherein: The extrusion assemblies each include a rotating plate (5) and a pressure rod (7). The rotating plates (5) are each installed on both sides of the fixed seat (1) through hinge members. Strip-shaped openings (6) are provided on the rotating plates (5) opposite to the wiring grooves (3). The pressure rods (7) are each installed in the strip-shaped openings (6) through hinge members. Forming portions (8) protrude from the inner side surfaces of the pressure rods (7).

3. The semiconductor diode pin rapid prototyping device according to claim 1, characterized in that: Arc-shaped first diversion portions are provided on the outer end faces of the wiring grooves (3). Arc-shaped second diversion portions are provided on both sides of the pressure grooves (10).

4. The semiconductor diode pin rapid prototyping device according to claim 1, characterized in that: The middle of the storage grooves (2) is enlarged to form grooves (4) for taking out.

5. The semiconductor diode pin rapid prototyping device according to claim 1, characterized in that: Positioning grooves are provided on the bottom surfaces of the fixed seats (1). The positioning grooves between the plurality of fixed seats (1) are communicated. A positioning block (9) is provided in the plurality of positioning grooves. The outer side surface of the positioning block (9) is fitted with the inner side surface of the positioning groove.

6. The semiconductor diode pin rapid prototyping device according to claim 1, characterized in that: The fixed seats (1) are each made of an elastic metal material.

7. The semiconductor diode pin rapid prototyping device according to claim 2, characterized in that: The thickness of the pressure rod (7) is set to be less than the thickness of the rotating plate (5).

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