Vehicle-mounted IGBT pin fin substrate cold forging demolding structure
By designing the cold forging and demolding structure of the bracket and demolding components, the problem of automatic demolding after cold forging and stamping of the vehicle-mounted IGBT needle fin substrate is solved, and efficient demolding and stable brace installation is achieved, reducing costs.
Patent Information
- Application Number
- CN202422405125.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-04
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-04
AI Technical Summary
In the prior art, it is difficult to automatically release the vehicle-mounted IGBT needle fin substrate after cold forging and stamping, and the automatic release structure usually requires live equipment, which increases the cost.
A cold forging and demolding structure including a bracket, an upper mold, a lower mold and a demolding assembly is designed. Automatic demolding is achieved by moving the upper mold up and down, and the bracket is fixed by connecting the components to avoid shaking, and components such as magnets and suction cups are used to assist demolding.
It realizes efficient automatic mold release of the vehicle-mounted IGBT needle fin substrate, reduces cost investment, improves mold release efficiency and fixing stability of the bracket.
Smart Images

Figure CN223171846U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of cold forging, in particular to a cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate. Background Art
[0002] The vehicle-mounted IGBT pin-fin substrate is a special heat dissipation substrate, which is specially designed to improve the heat dissipation performance of the IGBT power module. This substrate has a pin-fin structure. By greatly increasing the heat dissipation surface area, a pin-fin-shaped direct cooling structure is formed, thereby effectively improving the heat dissipation performance of the module and promoting the miniaturization of the power semiconductor module.
[0003] Currently, during the processing of the vehicle-mounted IGBT pin-fin substrate, cold forging and stamping are usually carried out on it. However, in the existing stamping dies, it is difficult to automatically demould the vehicle-mounted IGBT pin-fin substrate after cold forging and stamping, which has limitations. Although some existing stamping dies also have structures with automatic demoulding, such structures generally involve putting in charged equipment, which will increase the cost input to a certain extent. Therefore, a cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate is invented. Summary of the Utility Model
[0004] In view of the above and / or problems existing in the prior art of a cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate, the present utility model is proposed.
[0005] Therefore, the purpose of the present utility model is to provide a cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate, which can solve the above-mentioned existing problems.
[0006] To solve the above technical problems, according to one aspect of the present utility model, the following technical solutions are provided:
[0007] A cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate, which includes a bracket, a mounting surface, and a vehicle-mounted IGBT pin-fin substrate body. The bracket is provided on the top of the mounting surface. An upper die is provided at the top end of the bracket, and a lower die is provided at the bottom end of the bracket through a support rod. It further includes:
[0008] A demoulding assembly for automatically demoulding the vehicle-mounted IGBT pin-fin substrate body after cold forging and stamping by using the up and down movement of the upper die.
[0009] As a preferred scheme of the cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate described in the present utility model, wherein: the bracket is installed on the top of the mounting surface through a connection assembly to prevent the bracket from shaking.
[0010] As a preferred scheme of the cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate described in the present utility model, wherein: the connection assembly includes:
[0011] A thick screw, which is fixedly installed on the top of the installation surface and passes through the bracket;
[0012] A thin screw, which is fixedly installed on the top of the thick screw, and the thread directions of the thick screw and the thin screw are set to be opposite.
[0013] As a preferred scheme of a cold forging demoulding structure of a vehicle-mounted IGBT pin-fin substrate according to the present utility model, wherein: the connection assembly further includes:
[0014] A thick nut, which is threadedly connected to the thick screw;
[0015] A thin nut, which is threadedly connected to the thin screw.
[0016] As a preferred scheme of a cold forging demoulding structure of a vehicle-mounted IGBT pin-fin substrate according to the present utility model, wherein: a box body is fixedly installed at the top end of the bracket, a cylinder is fixedly installed in the inner cavity of the box body, and an upper die is fixedly installed by a piston rod of the cylinder.
[0017] As a preferred scheme of a cold forging demoulding structure of a vehicle-mounted IGBT pin-fin substrate according to the present utility model, wherein: the demoulding assembly includes:
[0018] Support plates, which are fixedly installed at both ends of the lower die;
[0019] A U-shaped rod, which is slidably connected in the support plate, one end of the U-shaped rod is inserted into the lower die from the bottom of the lower die, and one end of the U-shaped rod is located in the cavity on the lower die.
[0020] As a preferred scheme of a cold forging demoulding structure of a vehicle-mounted IGBT pin-fin substrate according to the present utility model, wherein: the demoulding assembly further includes:
[0021] An iron plate, which is fixedly installed on the other end of the U-shaped rod;
[0022] A spring, which is sleeved on the U-shaped rod, and both ends of the spring are fixedly connected to the iron plate and the support plate respectively.
[0023] As a preferred scheme of a cold forging demoulding structure of a vehicle-mounted IGBT pin-fin substrate according to the present utility model, wherein: the demoulding assembly further includes:
[0024] Magnets, which are fixedly installed at both ends of the upper die, and the magnets are located directly above the iron plate;
[0025] A suction cup, which is fixedly installed in one end of the U-shaped rod.
[0026] Compared with the prior art:
[0027] 1. By setting the demolding component, it is possible to realize the automatic demolding of the vehicle-mounted IGBT pin-fin substrate body after cold forging and stamping by using the up and down movement of the upper mold. This can not only improve the demolding efficiency of the vehicle-mounted IGBT pin-fin substrate body to a certain extent but also reduce the cost investment to a certain extent.
[0028] 2. By setting the connection component to install the bracket, it is possible to avoid the phenomenon that the bracket loosens due to vibration, and thus improve the fixing stability of the bracket to a certain extent. Brief Description of the Drawings
[0029] Figure 1 It is a front view schematic diagram of the structure of the present utility model;
[0030] Figure 2 For the present utility model Figure 1 An enlarged schematic diagram of the structure at A in it;
[0031] Figure 3 It is a front view schematic diagram of the connection component of the present utility model;
[0032] Figure 4 It is a schematic diagram of the bracket structure of the present utility model;
[0033] Figure 5 It is a top view schematic diagram of the vehicle-mounted IGBT pin-fin substrate body of the present utility model.
[0034] In the figure: bracket 10, mounting surface 20, thick screw 30, thin screw 31, thick nut 32, thin nut 33, upper mold 40, box body 41, cylinder 42, lower mold 50, support plate 60, U-shaped rod 61, iron plate 62, spring 63, magnet 64, suction cup 66, vehicle-mounted IGBT pin-fin substrate body 70. Detailed Description of the Embodiment
[0035] To make the purpose, technical solution, and advantages of the present utility model clearer, the following will further describe the embodiments of the present utility model in detail with reference to the drawings.
[0036] The present utility model provides a cold forging demolding structure for a vehicle-mounted IGBT pin-fin substrate. Please refer to Figures 1 - 5 , which includes a bracket 10, a mounting surface 20, and a vehicle-mounted IGBT pin-fin substrate body 70. A bracket 10 is provided at the top of the mounting surface 20. An upper mold 40 is provided at the top of the bracket 10. A lower mold 50 is provided at the bottom of the bracket 10 through a support rod. A box body 41 is fixedly installed at the top of the bracket 10. A cylinder 42 is fixedly installed in the inner cavity of the box body 41. The cylinder 42 fixedly installs the upper mold 40 through a piston rod. Among them, the mounting surface 20 includes but is not limited to the workbench surface.
[0037] The top of the installation surface 20 is installed with the support bracket 10 through a connecting component to prevent the bracket 10 from shaking;
[0038] The connecting component includes: a thick screw 30, a thin screw 31, a thick nut 32, and a thin nut 33;
[0039] The thick screw 30 is fixedly installed on the top of the installation surface 20, and the thick screw 30 passes through the bracket 10. The thin screw 31 is fixedly installed on the top of the thick screw 30, and the thread directions of the thick screw 30 and the thin screw 31 are set to be opposite. The thick nut 32 is threadedly connected to the thick screw 30, and the thin nut 33 is threadedly connected to the thin screw 31. Wherein, one end of the thick screw 30 is located in the inner cavity of the thick nut 32.
[0040] It further includes: a demoulding component for automatically demoulding the vehicle-mounted IGBT pin-fin substrate body 70 after cold forging and stamping by the up and down movement of the upper die 40;
[0041] The demoulding component includes: a support plate 60, a U-shaped rod 61, an iron plate 62, a spring 63, a magnet 64, and a suction cup 66;
[0042] Both ends of the lower die 50 are fixedly installed with the support plate 60. The U-shaped rod 61 is slidably connected in the support plate 60. One end of the U-shaped rod 61 is inserted into the lower die 50 from the bottom of the lower die 50, and one end of the U-shaped rod 61 is located in the cavity on the lower die 50. The iron plate 62 is fixedly installed on the other end of the U-shaped rod 61. The spring 63 is sleeved on the U-shaped rod 61, and both ends of the spring 63 are fixedly connected to the iron plate 62 and the support plate 60 respectively. Both ends of the upper die 40 are fixedly installed with the magnet 64, and the magnet 64 is located directly above the iron plate 62. A suction cup 66 is fixedly installed in one end of the U-shaped rod 61. Wherein, the suction force between the iron plate 62 and the magnet 64 can be set according to requirements. In addition, the elastic force of the spring 63 can also be set according to requirements.
[0043] When in specific use, the specific steps are as follows:
[0044] Step 1: Place the bracket 10 on the installation surface 20 and make the thick screw 30 pass through the bracket 10. Then, first thread the thick nut 32 onto the thick screw 30, and then thread the thin nut 33 onto the thin screw 31. Thus, the bracket 10 can be installed;
[0045] Step 2: Place the vehicle-mounted IGBT pin-fin substrate body 70 in the cavity of the lower die 50 and make the vehicle-mounted IGBT pin-fin substrate body 70 be in close contact with the suction cup 66. Thus, the suction cup 66 can adsorb on the bottom of the vehicle-mounted IGBT pin-fin substrate body 70;
[0046] Step 3: Move the upper die 40 towards the lower die 50 through the cylinder 42 until the vehicle-mounted IGBT pin-fin substrate body 70 is cold-forged and stamped through the cooperation of the upper die 40 and the lower die 50. Among them, when the upper die 40 moves towards the lower die 50, the magnet 64 will squeeze the iron plate 62 (at this time, the iron plate 62 will be adsorbed on the magnet 64), so that the iron plate 62 drives the U-shaped rod 61 to move downward. At this time, the spring 63 will deform. When the U-shaped rod 61 moves downward, the vehicle-mounted IGBT pin-fin substrate body 70 will be completely located in the cavity of the die 50 and be stamped by the upper die 40 (the vehicle-mounted IGBT pin-fin substrate body 70 is completely located in the cavity by relying on its own gravity, the pulling force of the U-shaped rod 61, and the pressing force of the upper die 40);
[0047] Step 4: After cold-forging and stamping the vehicle-mounted IGBT pin-fin substrate body 70, the upper die 40 can be moved away from the lower die 50 through the cylinder 42. At this time, the U-shaped rod 61 will rise to eject the vehicle-mounted IGBT pin-fin substrate body 70 to achieve demolding by relying on the suction force between the iron plate 62 and the magnet 64 and the elastic force of the spring 63.
[0048] Although the present invention has been described above with reference to the embodiments, various improvements can be made to it and components therein can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention can be combined with each other in any way. The exhaustive description of these combinations is not given in this specification only for the sake of saving space and resources. Therefore, the present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.
Claims
1. A cold forging demoulding structure for a vehicle-mounted IGBT pin-fin substrate, comprising a bracket (10), a mounting surface (20) and a vehicle-mounted IGBT pin-fin substrate body (70). The bracket (10) is provided at the top of the mounting surface (20). An upper die (40) is provided at the top end of the bracket (10). The bottom end of the bracket (10) is provided with a lower die (50) through a support rod, and it is characterized in that, Also included are: A demoulding component for automatically demoulding the vehicle-mounted IGBT pin-fin substrate body (70) after cold forging and stamping by using the up-and-down movement of the upper die (40).
2. The cold forging demoulding structure of a vehicle-mounted IGBT pin fin substrate according to claim 1, characterized in that, The top of the installation surface (20) is installed with a bracket (10) through a connecting component to prevent the bracket (10) from shaking.
3. The cold forging demolding structure of an in-vehicle IGBT pin fin substrate according to claim 2, wherein, The connecting component includes: A thick screw (30) fixedly installed on the top of the installation surface (20), and the thick screw (30) passes through the bracket (10); A thin screw (31) fixedly installed on the top of the thick screw (30), and the thread directions of the thick screw (30) and the thin screw (31) are set to be opposite.
4. The cold forging demoulding structure of an in-vehicle IGBT pin fin substrate according to claim 3, characterized in that, The connecting component further includes: A thick nut (32) threadedly connected to the thick screw (30); A thin nut (33) threadedly connected to the thin screw (31).
5. The cold forging demoulding structure of a vehicle-mounted IGBT pin-fin substrate according to claim 1, wherein The top end of the bracket (10) is fixedly installed with a box body (41), a cylinder (42) is fixedly installed in the inner cavity of the box body (41), and the upper die (40) is fixedly installed by the piston rod of the cylinder (42).
6. The cold forging and demolding structure of a vehicle-mounted IGBT pin fin substrate according to claim 1, wherein The demoulding component includes: Support plates (60) fixedly installed at both ends of the lower die (50); A U-shaped rod (61) slidably connected in the support plates (60), one end of the U-shaped rod (61) is inserted into the lower die (50) from the bottom of the lower die (50), and one end of the U-shaped rod (61) is located in the cavity on the lower die (50).
7. An in-vehicle IGBT pin-fin substrate cold forging and demolding structure according to claim 6, characterized in that, The demoulding component further includes: An iron plate (62) fixedly installed on the other end of the U-shaped rod (61); A spring (63) sleeved on the U-shaped rod (61), and both ends of the spring (63) are fixedly connected to the iron plate (62) and the support plate (60) respectively.
8. A cold forging demoulding structure of a vehicle-mounted IGBT pin fin substrate according to claim 7, characterized in that, The demoulding component further includes: Magnets (64) fixedly installed at both ends of the upper die (40), and the magnets (64) are located directly above the iron plate (62); A suction cup (66) fixedly installed in one end of the U-shaped rod (62).