Auxiliary positioning feeding device for wafer pressurized grinding

Abstract

The utility model relates to the field of grinding, in particular to an auxiliary positioning feeding device for wafer pressurized grinding, which comprises a grinding machine body, a grinding disc, a supporting column, a supporting plate, a sliding plate, a sliding block A, a telescopic rod A, a pressing plate, a clamping arm and the like. The supporting plate is fixed to the supporting column, the sliding plate is slidably connected to the supporting plate, the sliding block A is slidably connected into the sliding plate, the telescopic rod A is fixedly connected to the lower portion of the sliding block A, the pressing plate is fixedly connected to the lower portion of the telescopic rod A, and the clamping arm is slidably connected into the pressing plate. According to the utility model, the sliding plate, the sliding block A and the sliding block B are arranged to control the clamping arm to move left and right, so that the grinding position of the wafer can be changed, and the wafer is moved to a position with a good grinding effect on the grinding disc, thus the grinding disc can be fully used, the replacement of the grinding disc is reduced, and the use benefit of the grinding disc is improved.

Description

Technical Field

[0001] The utility model relates to the field of grinding, in particular to an auxiliary positioning and feeding device for wafer pressure grinding. Background Art

[0002] A wafer is a material commonly used to manufacture transistors, capacitors, resistors and other electronic components. During the production of wafers, defects such as burrs will appear on the surface of the wafers. Therefore, the wafers need to be ground. In the prior art during use, the grinding position is fixed at one place, resulting in easy wear at the fixed position of the grinding disc. As a result, the grinding effect of the wafer during grinding will be reduced, while the other positions of the grinding disc are already capable of grinding. If the grinding disc is replaced at this time, it will cause waste of the grinding disc and reduce the utilization efficiency of the grinding disc. Summary of the Utility Model

[0003] In order to overcome the disadvantage in the prior art that the fixed grinding position of the wafer leads to low utilization efficiency of the grinding disc, the utility model provides an auxiliary positioning and feeding device for wafer pressure grinding that can improve the utilization efficiency of the grinding disc.

[0004] It includes a grinding body, a grinding disc, a support column, a support plate, a sliding plate, a sliding block A, a telescopic rod A, a pressing plate, a clamping arm, a spring, a sliding block B, a telescopic rod B and a fixing ring. The grinding disc is rotatably connected to the grinding body, and the grinding body controls the rotation of the grinding disc. The support column is fixedly connected to the grinding body, the support plate is fixed on the support column, a slide rail is provided on the support plate, the sliding plate is slidably connected to the support plate through the slide rail, the sliding block A is slidably connected in the sliding plate, the sliding block A can slide in the left - right direction, the telescopic rod A is fixedly connected to the lower part of the sliding block A, the pressing plate is fixedly connected to the lower part of the telescopic rod A, the clamping arm is slidably connected in the pressing plate, two clamping arms are arranged in the pressing plate, the spring is sleeved on the clamping arm, one end of the spring is fixedly connected to the clamping arm, the other end of the spring is fixedly connected to the pressing plate, the sliding block B is slidably connected in the sliding plate, the sliding block B can slide in the left - right and front - back directions, the telescopic rod B is fixedly connected to the lower part of the sliding block B, and the fixing ring is fixedly connected to the lower part of the telescopic rod B.

[0005] Optionally, it further includes a support block, a trapezoidal block and a placement block. The support block is fixedly connected to the grinding body, the trapezoidal block is fixedly connected to the support block, the trapezoidal block can contact the clamping arm, and the placement block is fixedly connected to the grinding body.

[0006] Optionally, it further includes a placement ring. A placement plate is provided on the grinding body, and the placement ring is fixedly connected to the placement plate of the grinding body.

[0007] Optionally, it further includes a handle, and the handle is fixedly connected to the front side of the sliding plate.

[0008] Optionally, it further includes a placement cabinet which is fixedly connected to one side of the grinding body.

[0009] Optionally, it further includes anti-collision pads which are fixedly connected to the four corners of the grinding body.

[0010] Optionally, it further includes anti-slip pads. There are support feet under the grinding body, and the anti-slip pads are fixedly connected under the support feet.

[0011] Beneficial effects:

[0012] By setting the sliding plate, sliding block A and sliding block B, the present utility model controls the left and right movement of the clamping arm, can change the grinding position of the wafer, and move the wafer to a position on the grinding disc with good grinding effect, so that the grinding disc can be fully utilized, the replacement of the grinding disc can be reduced, and the utilization efficiency of the grinding disc can be improved.

[0013] By setting the support block, trapezoidal block and placement block, the present utility model enables the convenient placement or taking of the wafer, improving the convenience of use of the device. By setting the anti-collision pads, it plays a protective role and improves the use safety of the device. Description of the drawings

[0014] Figure 1 is a three-dimensional structural schematic diagram of the present utility model.

[0015] Figure 2 is a three-dimensional structural schematic diagram of the clamping arm, spring, telescopic rod A and telescopic rod B of the present utility model.

[0016] Figure 3 is a three-dimensional structural schematic of the sliding plate, telescopic rod A, pressing plate and fixing ring of the present utility model.

[0017] Figure 4 is a three-dimensional structural schematic of the clamping arm, spring, support block and trapezoidal block of the present utility model.

[0018] The marks in the drawings are: 1 - grinding body, 101 - grinding disc, 2 - support column, 3 - support plate, 4 - sliding plate, 5 - sliding block A, 6 - telescopic rod A, 7 - pressing plate, 8 - clamping arm, 9 - spring, 10 - sliding block B, 11 - telescopic rod B, 12 - fixing ring, 13 - support block, 14 - trapezoidal block, 15 - placement block, 16 - placement ring, 17 - handle, 18 - placement cabinet, 19 - anti-collision pad, 20 - anti-slip pad. Detailed implementation manners

[0019] The following further describes the present utility model with reference to the drawings and embodiments.

[0020] Embodiment 1: An auxiliary positioning feeding device for wafer pressure grinding, as Figures 1 - 3As shown in the figure, it includes a grinding body 1, a grinding disc 101, a support column 2, a support plate 3, a sliding plate 4, a sliding block A 5, a telescopic rod A 6, a pressing plate 7, a clamping arm 8, a spring 9, a sliding block B 10, a telescopic rod B 11 and a fixing ring 12. The grinding disc 101 is rotatably connected to the grinding body 1, and the grinding body 1 controls the rotation of the grinding disc 101. The support column 2 is fixedly connected to the grinding body 1, the support plate 3 is fixed on the support column 2, a slide rail is provided on the support plate 3, and the sliding plate 4 is slidably connected to the support plate 3 through the slide rail. The sliding block A 5 is slidably connected inside the sliding plate 4, and the sliding block A 5 can slide in the left-right direction. The telescopic rod A 6 is fixedly connected to the lower part of the sliding block A 5, the pressing plate 7 is fixedly connected to the lower part of the telescopic rod A 6, the clamping arm 8 is slidably connected inside the pressing plate 7, two clamping arms 8 are arranged inside the pressing plate 7, the spring 9 is sleeved on the clamping arm 8, one end of the spring 9 is fixedly connected to the clamping arm 8, and the other end of the spring 9 is fixedly connected to the pressing plate 7. The sliding block B 10 is slidably connected inside the sliding plate 4, and the sliding block B 10 can slide in the left-right and front-back directions. The telescopic rod B 11 is fixedly connected to the lower part of the sliding block B 10, and the fixing ring 12 is fixedly connected to the lower part of the telescopic rod B 11.

[0021] As Figure 1 and Figure 4 shown in the figure, it further includes a support block 13, a trapezoidal block 14 and a placement block 15. The support block 13 is fixedly connected to the grinding body 1, the trapezoidal block 14 is fixedly connected to the support block 13, the trapezoidal block 14 can contact the clamping arm 8, and the placement block 15 is fixedly connected to the grinding body 1.

[0022] When the device starts working, first place the wafer to be ground in the placement ring 16 to facilitate taking the wafer, use the handle 17 to move the sliding plate 4 forward, control the pressing plate 7 and the clamping arm 8 to move forward, so that the clamping arm 8 contacts the trapezoidal block 14, and when the clamping arm 8 enters the opening of the trapezoidal block 14, the trapezoidal block 14 stretches the clamping arm 8 in the pressing plate 7, and the spring 9 is compressed. At this time, the wafer can be placed between the clamping arms 8, and the telescopic rod A6 is controlled to shorten and move the clamping arm 8 upward, and the clamping arm 8 is disengaged from the trapezoidal block 14. Therefore, under the action of the spring 9, the clamping arm 8 can clamp and fix the wafer, move the sliding plate 4 backward, control the clamping arm 8 to move the wafer above the grinding disk 101, control the telescopic rod B11 to extend, and move the fixing ring 12 downward. At this time, the position where the fixing ring 12 points to the grinding disk 101 is the position where the wafer is ground. According to the wear position of the grinding disk 101, the sliding block B1 is used. 0 Change the position of the telescopic rod B11 so that the fixed ring 12 points to the position on the grinding disc 101 where normal grinding is possible. Then, slide the telescopic rod A6 via the sliding block A5 to slide the wafer above the fixed ring 12, completing the adjustment of the wafer's grinding position. Then, control the telescopic rod A6 to extend, causing the pressing plate 7 to press down on the wafer. The grinding machine body 1 is started to control the rotation of the grinding disc 101 to grind the wafer. When the wafer is completely ground, the sliding plate 4 is moved forward again, causing the clamping arm 8 to contact the trapezoidal block 14, separating the clamping arm 8. At this time, the wafer can be disengaged from the clamping arm 8, completing the wafer removal, and then the next wafer can be placed on it for grinding.

[0023] like Figure 1 As shown, a placement ring 16 is also included. A placement plate is provided on the grinding machine body 1 , and the placement ring 16 is fixedly connected to the placement plate of the grinding machine body 1 .

[0024] like Figure 1 As shown, a handle 17 is also included, and the handle 17 is fixedly connected to the front side of the sliding plate 4.

[0025] like Figure 1 As shown, a placement cabinet 18 is also included, and the placement cabinet 18 is fixedly connected to the left side of the grinding machine body 1.

[0026] like Figure 1 As shown, anti-collision pads 19 are also included, and the anti-collision pads 19 are fixedly connected to the four corners of the grinding machine body 1.

[0027] like Figure 1 As shown, an anti-skid pad 20 is also included. There are supporting feet under the grinding machine body 1, and the anti-skid pad 20 is fixedly connected under the supporting feet.

[0028] An anti-collision pad 19 is also provided outside the grinding body 1, which can prevent the staff from being accidentally injured by the grinding body 1; anti-slip pads 20 are provided under the support feet, which can prevent the grinding body 1 from shifting and affecting the wafer grinding. Two storage cabinets 18 are arranged on the left side of the grinding body 1, which can store some items needed for work and also place the personal belongings of the staff, facilitating the use of this device.

[0029] The above embodiments only represent the preferred embodiments of the present invention, and the description is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations, improvements and substitutions can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. An auxiliary positioning and feeding device for wafer pressing and grinding, characterized in that, It includes a grinding body (1), a grinding disc (101), a support column (2), a support plate (3), a sliding plate (4), a sliding block A (5), a telescopic rod A (6), a pressing plate (7), a clamping arm (8), a spring (9), a sliding block B (10), a telescopic rod B (11) and a fixing ring (12). The grinding disc (101) is rotatably connected to the grinding body (1), and the grinding body (1) controls the rotation of the grinding disc (101). The support column (2) is fixedly connected to the grinding body (1), the support plate (3) is fixed on the support column (2), a slide rail is provided on the support plate (3), and the sliding plate (4) is slidably connected to the support plate (3) through the slide rail. The sliding block A (5) is slidably connected inside the sliding plate (4), and the sliding block A (5) can slide in the left - right direction. The telescopic rod A (6) is fixedly connected to the lower part of the sliding block A (5), the pressing plate (7) is fixedly connected to the lower part of the telescopic rod A (6), the clamping arm (8) is slidably connected inside the pressing plate (7), two clamping arms (8) are arranged inside the pressing plate (7), the spring (9) is sleeved on the clamping arm (8), one end of the spring (9) is fixedly connected to the clamping arm (8), and the other end of the spring (9) is fixedly connected to the pressing plate (7). The sliding block B (10) is slidably connected inside the sliding plate (4), and the sliding block B (10) can slide in the left - right and front - back directions. The telescopic rod B (11) is fixedly connected to the lower part of the sliding block B (10), and the fixing ring (12) is fixedly connected to the lower part of the telescopic rod B (11).

2. The auxiliary positioning and feeding device for wafer pressure grinding according to claim 1, characterized in that, It also includes a support block (13), a trapezoidal block (14) and a placement block (15). The support block (13) is fixedly connected to the grinding body (1), the trapezoidal block (14) is fixedly connected to the support block (13), the trapezoidal block (14) can contact the clamping arm (8), and the placement block (15) is fixedly connected to the grinding body (1).

3. An auxiliary positioning and feeding device for wafer pressure grinding according to claim 2, characterized in that, It also includes a placement ring (16). A placement plate is provided on the grinding body (1), and the placement ring (16) is fixedly connected to the placement plate of the grinding body (1).

4. An auxiliary positioning and feeding device for wafer pressure grinding according to claim 3, characterized in that, It also includes a handle (17), and the handle (17) is fixedly connected to the front side of the sliding plate (4).

5. An auxiliary positioning and feeding device for wafer pressure grinding according to claim 4, characterized in that, It also includes a storage cabinet (18), and the storage cabinet (18) is fixedly connected to one side of the grinding body (1).

6. The auxiliary positioning and feeding device for wafer pressing and grinding according to claim 5, wherein It also includes a shock - proof pad (19), and the shock - proof pad (19) is fixedly connected to the four corners of the grinding body (1).

7. An auxiliary positioning and feeding device for wafer pressure grinding according to claim 6, characterized in that, It also includes an anti - slip pad (20). There are support feet under the grinding body (1), and the anti - slip pad (20) is fixedly connected to the support feet.

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