Mold base assembly of sound box mold

By setting up a lower mold seat cooling and cooling mechanism and an upper mold seat lifting and buffering mechanism in the audio mold mold assembly, the problems of poor heat dissipation and poor stability are solved, and efficient cooling and stable drop are achieved.

CN223173442UActive Publication Date: 2025-08-01SHENGDA SMART AUDIO (ZHAOQING) CO LTD
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Patent Information

Application Number
CN202421709850.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-18
Publication Date
2025-08-01
Estimated Expiration
2034-07-18

AI Technical Summary

Technical Problem

The heat dissipation effect of existing audio mold mold embryo components is poor, and the stability and buffering effect of the upper mold seat when lifting and lowering are poor, making it easy to crush the lower mold seat.

Method used

The cooling and cooling mechanism of the lower mold seat is adopted. By opening an annular groove cavity at the lower end of the lower mold seat and installing a cooling water pipe and a cooling fan, it combines the thermally conductive copper plate to achieve efficient cooling; the lifting and lowering buffer mechanism of the upper mold seat achieves stable buffering through the cooperation of the spring and the center rod.

Benefits of technology

It improves the cooling and cooling effect of the mold, and ensures the stability of the upper mold seat during the descent process, so as to avoid being crushed by the lower mold seat.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223173442U_ABST
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Abstract

The utility model discloses a mould base assembly of a sound mould, which belongs to the technical field of sound processing and comprises a bottom plate, a mounting seat is arranged on the side edge of the upper end of the bottom plate, a lower mould seat cooling mechanism is arranged at the central position of the upper end of the bottom plate, a lower mould seat is arranged on the side edge of the mounting seat, and a mould cavity is arranged at the upper end of the lower mould seat. According to the lower die base cooling mechanism, the annular groove cavity is formed in the lower end of the lower die base, and then the cooling pipe is installed in the annular groove cavity, so that the heat transfer principle can be better utilized; according to the cooling device, the upper die base lifting buffering mechanism is arranged, the upper die base can drive the spring on the surface of the center rod to stretch when descending, and therefore buffering of the upper die base is achieved, and the problem that the lower die base is crushed is avoided.
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Description

Technical Field

[0001] The utility model belongs to the technical field of audio processing, and particularly relates to an audio mold die block assembly. Background Art

[0002] With the improvement of living standards, people are increasingly pursuing spiritual enjoyment. When listening to music, people will use audio, and when processing audio, a die block will be used for injection molding. When using the die block for feeding, the heat dissipation effect is not good and the molding is relatively slow.

[0003] Chinese Patent Application No. 20222688164.0 discloses an audio mold die block assembly, including a frame. A bearing seat is fixedly arranged on the inner wall of the frame. A lower mold is fixedly arranged on the inner surface of the bearing seat. A hydraulic rod is fixedly arranged in the middle of the upper surface of the frame. The telescopic end of the hydraulic rod is fixedly connected with an upper mold. The beneficial effect of the utility model is that a water pump can convey the cooling water in the heat dissipation pipe to the first cooling cavity of the lower mold, so as to cool the lower mold. And the cooling water in the first cooling cavity will continue to be conveyed to the second cooling cavity of the upper mold through a water guide pipe, so as to cool the upper mold, so as to cool down the injection molded audio mold. The cooling water after exchanging heat with the die block will be conveyed back to the heat dissipation pipe by the water pump again, and several fans outside the heat dissipation pipe can dissipate heat from the heat dissipation pipe, so as to accelerate the cooling speed of the cooling water and ensure that the die block assembly can efficiently produce audio molds.

[0004] Although the above-mentioned disclosed patent realizes the processing of audio molds, the cooling effect on the mold base set therein is relatively poor. The cooling pipes cannot effectively contact the molds inside the mold base fully, and the overall heat dissipation efficiency is not high. The stability and buffering effect of the upper mold base during lifting and lowering are relatively poor, and it is easy to damage the lower mold base after long-term use. Summary of the Utility Model

[0005] To solve the problems raised in the above background art, the utility model provides an audio mold die block assembly, which has the characteristics of better cooling and temperature reduction effect on the mold and better stability during the descending process of the upper mold base.

[0006] To achieve the above purpose, the utility model provides the following technical scheme: an audio mold die block assembly, including a bottom plate. An installation seat is arranged on the side of the upper end of the bottom plate. A lower mold base cooling and temperature reduction mechanism is arranged at the center position of the upper end of the bottom plate. A lower mold base is arranged on the side of the installation seat. A mold cavity is opened at the upper end of the lower mold base. A support rod is arranged at the upper end of the installation seat. A top plate is arranged at the upper end of the support rod. A hydraulic cylinder is arranged at the upper end of the top plate. The lower end of the hydraulic cylinder is provided with an upper mold base. An injection pipe is arranged on the side of the upper mold base. An upper mold base lifting and buffering mechanism is arranged at the corner of the upper mold base.

[0007] Preferably, the lower die holder cooling and temperature reduction mechanism includes a cooling component, a support block, an installation box, and a cooling fan. A support block is arranged at the center position of the upper end of the bottom plate. An installation box is arranged at the upper end of the support block. A cooling fan is arranged inside the installation box. A cooling component is arranged inside the lower end of the lower die holder.

[0008] Preferably, the cooling component includes an annular groove cavity, a cooling water inlet, a cooling water outlet, and an annular cooling water pipe. An annular groove cavity is formed at the lower end of the lower die holder. An annular cooling water pipe is arranged inside the annular groove cavity. A cooling water outlet is arranged at one end of the annular cooling water pipe. A cooling water inlet is arranged at the other end of the annular cooling water pipe.

[0009] Preferably, the annular cooling water pipe is fixedly connected to the inner wall of the lower die holder, and a heat conduction copper plate is arranged at the connection between the annular cooling water pipe and the inner wall of the lower die holder.

[0010] Preferably, the upper die holder lifting and buffering mechanism includes a spring and a central rod. A central rod penetrates through the corners of the upper die holder. A spring is sleeved on the surface of the central rod. The upper and lower ends of the spring are fixedly connected to the lower end of the top plate and the upper end of the upper die holder by electric welding respectively.

[0011] Preferably, the upper die holder lifting and buffering mechanism further includes a through hole and a slider. A slider is arranged on the side of the upper die holder. A through hole corresponding to the support rod is formed inside the slider.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] 1. By providing the lower die holder cooling and temperature reduction mechanism, the mechanism can better utilize the heat transfer principle by forming an annular groove cavity at the lower end of the lower die holder and then installing the cooling pipe inside the annular groove cavity, so as to achieve the purpose of efficiently cooling and reducing the temperature of the mold.

[0014] 2. By providing the upper die holder lifting and buffering mechanism, the setting of this mechanism can enable the spring on the surface of the central rod to be stretched when the upper die holder descends, thereby realizing the buffering of the upper die holder and avoiding the problem of damaging the lower die holder. Description of the Drawings

[0015] Figure 1 is a perspective view of the present utility model;

[0016] Figure 2 is a perspective view of the lower die holder cooling and temperature reduction mechanism of the present utility model from the bottom view perspective;

[0017] Figure 3 is a perspective view of the cooling component of the present utility model from the bottom view perspective;

[0018] Figure 4 This is a three-dimensional view of the lifting buffer mechanism of the upper die base of the present utility model;

[0019] In the figure: 1, bottom plate; 2, lower die base cooling mechanism; 21, cooling component; 211, annular groove cavity; 212, cooling water inlet; 213, cooling water outlet; 214, annular cooling water pipe; 22, support block; 23, installation box; 24, cooling fan; 3, lower die base; 4, mold cavity; 5, injection pipe; 6, upper die base; 7, hydraulic cylinder; 8, top plate; 9, upper die base lifting buffer mechanism; 91, spring; 92, through hole; 93, slider; 94, central rod; 10, mounting seat; 11, support rod. Specific embodiments

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] Embodiment 1

[0022] Please refer to Figures 1-4 , the present utility model provides the following technical solutions: An audio mold die assembly includes a bottom plate 1, a mounting seat 10 is arranged on the upper side edge of the bottom plate 1, a lower die base cooling mechanism 2 is arranged at the center position of the upper end of the bottom plate 1, a lower die base 3 is arranged on the side of the mounting seat 10, a mold cavity 4 is opened at the upper end of the lower die base 3, a support rod 11 is arranged at the upper end of the mounting seat 10, a top plate 8 is arranged at the upper end of the support rod 11, a hydraulic cylinder 7 is arranged at the upper end of the top plate 8, an upper die base 6 is arranged at the lower end of the hydraulic cylinder 7, an injection pipe 5 is arranged on the side of the upper die base 6, and an upper die base lifting buffer mechanism 9 is arranged at the corner of the upper die base 6.

[0023] Specifically, the lower die base cooling mechanism 2 includes a cooling component 21, a support block 22, an installation box 23 and a cooling fan 24. A support block 22 is arranged at the center position of the upper end of the bottom plate 1, an installation box 23 is arranged at the upper end of the support block 22, a cooling fan 24 is arranged inside the installation box 23, and a cooling component 21 is arranged inside the lower end of the lower die base 3.

[0024] By adopting the above technical solutions, after the cooling component 21 is installed, the heat generated by the lower die base 3 is transferred and cooled by the principle of heat transfer, and then the cooling fan 24 inside the installation box 23 is turned on to cool the cooling component 21, thereby improving the cooling of the audio mold inside the lower die base 3.

[0025] Specifically, the cooling component 21 includes an annular groove cavity 211, a cooling water inlet 212, a cooling water outlet 213, and an annular cooling water pipe 214. An annular groove cavity 211 is provided at the lower end of the lower mold base 3. An annular cooling water pipe 214 is arranged inside the annular groove cavity 211. One end of the annular cooling water pipe 214 is provided with a cooling water outlet 213, and the other end of the annular cooling water pipe 214 is provided with a cooling water inlet 212.

[0026] By adopting the above technical solution, the annular cooling water pipe 214 is installed inside the annular groove cavity 211, and then cooling water is injected into the annular cooling water pipe 214 through the cooling water inlet 212. At the same time, it is pressurized by a booster pump (a publicly disclosed technology in the prior art, not shown in the text), and then discharged through the cooling water outlet 213 to achieve the purpose of cyclic cooling.

[0027] Specifically, the annular cooling water pipe 214 is fixedly connected to the inner wall of the lower mold base 3, and a heat-conducting copper plate is arranged at the connection between the annular cooling water pipe 214 and the inner wall of the lower mold base 3.

[0028] By adopting the above technical solution, the setting of the heat-conducting copper plate (drawn in the text but not labeled) can enable the heat generated by the lower mold base 3 to be quickly conducted to the annular cooling water pipe 214, thereby realizing the cooling of the audio mold inside the lower mold base 3.

[0029] When this embodiment is in use, after the cooling component 21 is installed, the heat generated by the lower mold base 3 is transferred and cooled by the principle of heat transfer. Then, by turning on the cooling fan 24 inside the installation box 23, the cooling component 21 is cooled, thereby enhancing the cooling of the audio mold inside the lower mold base 3. The annular cooling water pipe 214 is installed inside the annular groove cavity 211, and then cooling water is injected into the annular cooling water pipe 214 through the cooling water inlet 212. At the same time, it is pressurized by a booster pump (a publicly disclosed technology in the prior art, not shown in the text), and then discharged through the cooling water outlet 213 to achieve the purpose of cyclic cooling. The setting of the heat-conducting copper plate (drawn in the text but not labeled) can enable the heat generated by the lower mold base 3 to be quickly conducted to the annular cooling water pipe 214, thereby realizing the cooling of the audio mold inside the lower mold base 3.

[0030] Embodiment 2

[0031] The difference between this embodiment and Embodiment 1 is that the upper mold base lifting buffer mechanism 9 includes a spring 91 and a central rod 94. A central rod 94 penetrates through the corners of the upper mold base 6, and a spring 91 is sleeved on the surface of the central rod 94. The upper and lower ends of the spring 91 are fixedly connected to the lower end of the top plate 8 and the upper end of the upper mold base 6 by electric welding respectively.

[0032] By adopting the above technical solution, when processing the audio mold, the hydraulic cylinder 7 is opened, and the hydraulic cylinder 7 drives the upper die holder 6 to descend. The descent of the upper die holder 6 will slide on the surface of the central rod 94 and drive the spring 91 to stretch, thereby realizing the buffering work for the descent of the upper die holder 6 and avoiding damaging the lower die holder 3. Then, the material is injected into the interior of the mold cavity 4 through the injection pipe 5, and waiting for cooling and forming.

[0033] Specifically, the upper die holder lifting and buffering mechanism 9 further includes a through hole 92 and a slider 93. A slider 93 is arranged on the side of the upper die holder 6, and a through hole 92 corresponding to the support rod 11 is opened inside the slider 93.

[0034] By adopting the above technical solution, when the upper die holder 6 descends, it will drive the slider 93 to slide on the surface of the support rod 11, thereby improving the stability of the upper die holder 6 during the descending process.

[0035] When this embodiment is in use, when processing the audio mold, the hydraulic cylinder 7 is opened, and the hydraulic cylinder 7 drives the upper die holder 6 to descend. The descent of the upper die holder 6 will slide on the surface of the central rod 94 and drive the spring 91 to stretch, thereby realizing the buffering work for the descent of the upper die holder 6 and avoiding damaging the lower die holder 3. Then, the material is injected into the interior of the mold cavity 4 through the injection pipe 5, and waiting for cooling and forming. When the upper die holder 6 descends, it will drive the slider 93 to slide on the surface of the support rod 11, thereby improving the stability of the upper die holder 6 during the descending process.

[0036] Working principle and usage process of the present utility model: When the present utility model is in use, after the cooling component 21 is installed, heat generated by the lower die base 3 is transferred and cooled through the principle of heat transfer. Then, by turning on the cooling fan 24 inside the installation box 23, the cooling component 21 is cooled, thereby enhancing the cooling of the audio mold inside the lower die base 3. By installing the annular cooling water pipe 214 inside the annular groove cavity 211, and injecting cooling water into the annular cooling water pipe 214 through the cooling water inlet 212, and at the same time pressurizing through a booster pump (which is a publicly known technology and not shown in the text), and then discharging through the cooling water outlet 213, the purpose of a cyclic cooling is achieved. The setting of the heat-conducting copper plate (drawn in the text but not labeled) enables the heat generated by the lower die base 3 to be quickly conducted to the annular cooling water pipe 214, thereby realizing the cooling of the audio mold inside the lower die base 3; when processing the audio mold, turn on the hydraulic cylinder 7, the hydraulic cylinder 7 drives the upper die base 6 to descend. The descent of the upper die base 6 will slide on the surface of the central rod 94 and drive the spring 91 to stretch, thereby realizing the buffering work for the descent of the upper die base 6 and avoiding damaging the lower die base 3. Then, inject the material into the mold cavity 4 through the injection pipe 5 and wait for cooling and forming. When the upper die base 6 descends, it will drive the slider 93 to slide on the surface of the support rod 11, thereby enhancing the stability of the descent process of the upper die base 6.

[0037] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. An audio mold base assembly, including a bottom plate, characterized in that: An installation seat is arranged on the upper side edge of the bottom plate. A lower die base cooling and temperature reduction mechanism is arranged at the center position of the upper end of the bottom plate. A lower die base is arranged on the side of the installation seat. A die cavity is formed at the upper end of the lower die base. A support rod is arranged at the upper end of the installation seat. A top plate is arranged at the upper end of the support rod. A hydraulic cylinder is arranged at the upper end of the top plate. A upper die base is arranged at the lower end of the hydraulic cylinder. An injection pipe is arranged on the side of the upper die base. An upper die base lifting and buffering mechanism is arranged at the corner of the upper die base.

2. The mold base assembly of a sound mold according to claim 1, wherein: The lower die base cooling and temperature reduction mechanism includes a cooling component, a support block, an installation box and a heat dissipation fan. A support block is arranged at the center position of the upper end of the bottom plate. An installation box is arranged at the upper end of the support block. A heat dissipation fan is arranged inside the installation box. A cooling component is arranged inside the lower end of the lower die base.

3. The mold base assembly of a sound mold according to claim 2, characterized in that: The cooling component includes an annular groove cavity, a cooling water inlet, a cooling water outlet and an annular cooling water pipe. An annular groove cavity is formed at the lower end of the lower die base. An annular cooling water pipe is arranged inside the annular groove cavity. A cooling water outlet is arranged at one end of the annular cooling water pipe. A cooling water inlet is arranged at the other end of the annular cooling water pipe.

4. The sound mold die set assembly according to claim 3, wherein: The annular cooling water pipe is fixedly connected to the inner wall of the lower die base. A heat conduction copper plate is arranged at the connection between the annular cooling water pipe and the inner wall of the lower die base.

5. The mold base assembly of a sound mold according to claim 1, characterized in that: The upper die base lifting and buffering mechanism includes a spring and a central rod. A central rod is arranged through the corner of the upper die base. A spring is sleeved on the surface of the central rod. The upper and lower ends of the spring are respectively fixedly connected to the lower end of the top plate and the upper end of the upper die base by electric welding.

6. The mold base assembly of a sound mold according to claim 1, characterized in that: The upper die base lifting and buffering mechanism further includes a through hole and a slider. A slider is arranged on the side of the upper die base. A through hole corresponding to the support rod is formed inside the slider.