Solder strip adsorption module and solder strip carrying device

Abstract

The utility model relates to a welding strip adsorption module and a welding strip carrying device. The welding strip adsorption module comprises a bottom plate and an adsorption mechanism; the multiple adsorption mechanisms are arranged on one side of the bottom plate and used for adsorbing welding strips, and each adsorption mechanism comprises an adsorption block and a buffering piece. And the adsorption block is flexibly connected with the bottom plate through the buffer piece, so that the adsorption block has a buffer stroke in the adsorption direction. According to the welding strip adsorption module, the welding strip cannot be crushed in the adsorption process, and the welding strip carrying safety is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of battery production equipment, and more specifically, the utility model relates to a solder tape adsorption module and a solder tape handling device. Background Art

[0002] In the conventional string soldering process of BC (Back Contact) battery modules, the solder tape is usually placed on the battery cell by clamping both sides of the solder tape with jaws, supporting it from the back, transporting it above the battery cell, and after the jaws are opened, the solder tape is pressed and placed on the battery cell by a pressing mesh. In this method, there is a risk of damaging both sides of the solder tape during the clamping process. Summary of the Utility Model

[0003] An object of the utility model is to provide a solder tape adsorption module and a solder tape handling device.

[0004] According to a first aspect of the utility model, there is provided a solder tape adsorption module for use in battery production, comprising:

[0005] A bottom plate and an adsorption mechanism;

[0006] A plurality of the adsorption mechanisms are arranged on one side of the bottom plate and are used for adsorbing the solder tape, and the adsorption mechanism comprises an adsorption block and a buffer member;

[0007] The adsorption block is flexibly connected to the bottom plate through the buffer member, so that the adsorption block has a buffer stroke in the adsorption direction.

[0008] Optionally, it further comprises a guiding structure, the guiding structure is fixed on the bottom plate, and can limit the deflection angle of each adsorption mechanism in the adsorption direction.

[0009] Optionally, it further comprises an air joint, a plurality of air holes are arranged on the bottom plate, one end of each air hole is communicated with the air joint, and the other end is communicated with one adsorption mechanism, and the air joint can be connected to a pneumatic source, so that a plurality of the adsorption mechanisms can adsorb the solder tape.

[0010] Optionally, the buffer member is a buffer rod, the buffer rod is located in the air hole, one end of which is connected to the bottom plate, and the other end is threadedly connected to the adsorption block;

[0011] The buffer rod has a spring, and when the adsorption block is subjected to pressure in the adsorption direction, the spring is compressed.

[0012] Optionally, the buffer member is a buffer pad or a buffer suction nozzle, the buffer member is located in the air hole, one end of which is connected to the bottom plate, and the other end is adhesively connected to the adsorption block;

[0013] When the adsorption block is under pressure in the adsorption direction, at least a part of the buffer nozzle or the buffer pad is compressed.

[0014] Optionally, adsorption holes are provided on the adsorption block, and the adsorption holes are communicated with the air holes, so that the adsorption mechanism can adsorb the welding tape through the adsorption holes.

[0015] Optionally, the shape of the adsorption hole is a kidney-shaped hole, and when the welding tape is adsorbed on the adsorption block, the length direction of the kidney-shaped hole is consistent with the length direction of the welding tape, and the width of the kidney-shaped hole is smaller than the width of the welding tape.

[0016] Optionally, a positioning portion is further provided on the adsorption block, and the positioning portion is used to position the length direction of the kidney-shaped hole.

[0017] Optionally, the positioning portion is a convex structure, and two notches are symmetrically arranged on the convex structure in the width direction of the kidney-shaped hole.

[0018] According to a second aspect of the present invention, there is provided a welding tape handling device, including: the welding tape adsorption module according to the first aspect.

[0019] One technical effect of the present invention is that by providing a plurality of adsorption mechanisms on the bottom plate, the welding tape adsorption module can realize the handling of the welding tape by means of vacuum adsorption, and each adsorption mechanism is flexibly connected to the bottom plate, so that the welding tape will not be damaged during the adsorption process, and the safety of the welding tape handling is improved.

[0020] Through the following detailed description of the exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The drawings forming a part of the specification illustrate embodiments of the present invention and, together with the description, are used to explain the principles of the present invention.

[0022] Figure 1 is a partial schematic view of a welding tape handling device provided by the present invention.

[0023] Figure 2 is one of the structural schematic views of a welding tape adsorption module provided by the present invention.

[0024] Figure 3 is Figure 2 a top view of the provided welding tape adsorption module.

[0025] Figure 4 is Figure 3 the A-A cross-sectional view in

[0026] Figure 5 is Figure 4 One of the schematic diagrams of the first type of adsorption block in

[0027] Figure 6 is Figure 4 Another schematic diagram of the first type of adsorption block in

[0028] Figure 7 is Figure 6 The B-B cross-sectional view in

[0029] Figure 8 It is the second schematic diagram of the structure of a solder tape adsorption module provided by the present utility model.

[0030] Figure 9 is Figure 8 The top view of the solder tape adsorption module provided by

[0031] Figure 10 is Figure 9 The C-C cross-sectional view in

[0032] Figure 11 is Figure 10 One of the schematic diagrams of the second type of adsorption block in

[0033] Figure 12 is Figure 10 Another schematic diagram of the second type of adsorption block in

[0034] Figure 13 is Figure 12 The D-D cross-sectional view in

[0035] Figure 14 It is the third schematic diagram of the structure of a solder tape adsorption module provided by the present utility model.

[0036] Figure 15 is Figure 14 The top view of the solder tape adsorption module provided by

[0037] Figure 16 is Figure 15 The E-E cross-sectional view in

[0038] Figure 17 is Figure 16 One of the schematic diagrams of the third type of adsorption block in

[0039] Figure 18 is Figure 16 Another schematic diagram of the third type of adsorption block in

[0040] Figure 19 is Figure 18 The F-F cross-sectional view in

[0041] Explanation of reference numerals:

[0042] 1. Mounting plate; 2. Bottom plate; 3. Guide plate; 4. Adsorption block; 41. Adsorption hole; 42. Positioning part; 5. Buffer member; 51. Buffer rod; 52. Buffer nozzle; 53. Buffer pad; 6. Air joint; 7. Air hole. Detailed implementation manners

[0043] Now, various exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention.

[0044] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way a limitation on the present invention or its application or use.

[0045] Technologies and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies and devices should be regarded as part of the specification.

[0046] In all the examples shown and discussed here, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values.

[0047] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0048] As Figures 1 to 19 shown, according to a first aspect of the present invention, a solder strip adsorption module for use in battery production is provided, including: a bottom plate 2 and an adsorption mechanism; a plurality of the adsorption mechanisms are arranged on one side of the bottom plate 2 and are used for adsorbing the solder strip. The adsorption mechanism includes an adsorption block 4 and a buffer member 5; the adsorption block 4 is flexibly connected to the bottom plate 2 through the buffer member 5, so that the adsorption block 4 has a buffer stroke in the adsorption direction.

[0049] Specifically, as Figures 2 to 4 , Figures 8 to 10 and Figures 14 to 16 shown, in this embodiment, by arranging a plurality of adsorption mechanisms on the bottom plate 2, the plurality of adsorption mechanisms can suck and carry the solder strip by means of vacuum adsorption, avoiding the risk of damage to both sides of the solder strip easily caused when using the traditional method of clamping jaws to carry the solder strip.

[0050] Furthermore, during the adsorption process of each solder strip, it is usually adsorbed by multiple adsorption mechanisms. A flexible connection is set between the adsorption mechanisms and the bottom plate 2, so that during the adsorption of the solder strip by multiple adsorption mechanisms, the parallelism of each adsorption mechanism to the adsorption plane of the same solder strip is ensured, thereby ensuring the adsorption effect and improving the reliability of the solder strip adsorption module in sucking the solder strip.

[0051] Meanwhile, in practical applications, after the welding rod is adsorbed by the adsorption mechanism, it needs to be accurately placed on the battery cell to complete the welding of the subsequent process battery string. The flexible connection between the adsorption mechanism and the bottom plate 2 can ensure that the solder strip can be accurately placed on the battery, and the problem of the battery being damaged by pressure due to the poor parallelism between the battery and the adsorption mechanism can be avoided, improving the product yield.

[0052] In the above embodiment, the number and arrangement mode of the adsorption mechanisms on the bottom plate 2 can be designed according to actual needs. For example, multiple adsorption mechanisms can be arranged on the bottom plate 2 in an array form, so that each column of adsorption mechanisms can be used to adsorb a solder strip, and multiple columns of adsorption mechanisms can adsorb multiple welding rods simultaneously, improving the adsorption efficiency of the welding rods and the production efficiency.

[0053] In addition, the solder strip adsorption module provided in this embodiment integrates multiple adsorption mechanisms on the same bottom plate 2, so that in practical applications, the above module can be used alone, or multiple modules can be spliced and used, which can not only achieve higher adsorption efficiency, but also facilitate the quick change of models in the production of battery modules with different plate types.

[0054] Furthermore, in this embodiment, the flexible connection between the adsorption mechanism and the bottom plate 2 is realized by setting the buffer member 5 and the adsorption block 4. Among them, the buffer member 5 can be a structure with buffer performance such as a spring or an elastic pad to realize the flexible connection between the adsorption mechanism and the bottom plate 2. The adsorption block 4 is a structure with adsorption holes 41, and the adsorption effect of the adsorption mechanism can be realized by vacuum pumping.

[0055] The setting of the buffer member 5 enables the adsorption block 4 to have a certain buffer stroke, ensuring that when the solder strip is placed on the battery, the battery will not be damaged by pressure due to the poor parallelism between the battery and the adsorption block 4, improving the reliability of the solder strip adsorption module.

[0056] Optionally, as Figure 2 、 Figure 4 、 Figure 8 and Figure 10 shown, the solder strip adsorption module further includes a guiding structure, and the guiding structure is fixed on the bottom plate 2 and can limit the deflection angle of each adsorption mechanism in the adsorption direction.

[0057] Specifically, in this embodiment, the guiding structure can be set as the guiding plate 3 or the structure disposed on one side of the adsorption mechanism, so that during the process of adsorbing the welding tape or placing the welding tape on the battery, the guiding structure can limit the inclination of the adsorption block 4 caused by the flexible characteristic of the buffer member 5 itself, and prevent a large angular deviation from occurring between the adsorption surface of the adsorption block 4 and the welding rod, thereby reducing the risk of vacuum leakage and improving the reliability of the welding tape adsorption module in adsorbing the welding tape.

[0058] Optionally, as Figures 2 to 4 , Figures 8 to 10 and Figures 14 to 16 shown, the welding tape adsorption module further includes an air joint 6. A plurality of air holes 7 are provided on the bottom plate 2. One end of each air hole 7 communicates with the air joint 6, and the other end communicates with one of the adsorption mechanisms. The air joint 6 can be connected to a pneumatic source, enabling the plurality of adsorption mechanisms to adsorb the welding tape.

[0059] Specifically, in this embodiment, the air joint 6 is connected to the plurality of air holes 7 on the bottom plate 2, and the plurality of air holes 7 are respectively connected to the plurality of adsorption mechanisms. When the air joint 6 is connected to an external pneumatic source, the adsorption function of the adsorption mechanism can be realized by evacuating the air through the air holes 7. This structure is simple, with few components and low cost, providing power guarantee for the adsorption mechanism.

[0060] Optionally, as Figures 2 to 7 shown, the buffer member 5 is a buffer rod 51. The buffer rod 51 is located inside the air hole 7. One end thereof is connected to the bottom plate 2, and the other end is threadedly connected to the adsorption block 4. The buffer rod 51 has a spring. When the adsorption block 4 is subjected to pressure in the adsorption direction, the spring is compressed.

[0061] Specifically, in this embodiment, the buffer rod 51 is a rod-shaped buffer member 5 with a spring inside. In practical applications, one end thereof is threadedly connected to the adsorption block 4, and the other end is connected to the bottom plate 2 to achieve a flexible connection between the adsorption block 4 and the bottom plate 2. The buffer rod 51 is located inside the air hole 7, which can facilitate the guiding function for the adsorption block 4 on the one hand, and avoid the problem of vacuum leakage on the other hand.

[0062] In the above embodiment, the threaded connection form makes the connection between the adsorption block 4 and the buffer rod 51 relatively simple, and is convenient for disassembly and replacement of parts. Additionally, by providing a guiding plate 3 between the bottom plate 2 and the adsorption block 4, the buffer rod 51 can be hidden inside the guiding plate 3 to achieve the guiding function for the adsorption block 4. This is convenient for the overall installation of the adsorption mechanism on the one hand, and avoids a large angular deviation between the adsorption block 4 and the welding tape on the other hand, improving the reliability of the adsorption mechanism.

[0063] Optionally, as Figures 10 to 13, and Figures 16 to 19 As shown, the buffer member 5 is a buffer pad 53 or a buffer suction nozzle 52. The buffer member 5 is located in the air hole 7, one end of which is connected to the bottom plate 2, and the other end is bonded to the adsorption block 4. When the adsorption block 4 is pressured in the adsorption direction, at least a part of the buffer suction nozzle 52 or the buffer pad 53 is compressed.

[0064] Specifically, as Figures 16 to 19 shown, in this embodiment, the buffer pad 53 is a block structure made of silica gel. It is arranged in the air hole 7, one end is fixedly connected to the bottom plate 2, and the other end is adhesively bonded to the adsorption block 4 to achieve a flexible connection between the adsorption block 4 and the bottom plate 2, ensuring that when the solder tape is placed on the battery, the battery will not be damaged by the poor parallelism between the battery and the adsorption block 4.

[0065] In addition, as Figures 10 to 13 shown, the buffer suction nozzle 52 is a suction nozzle with a flexible material at the end. Using it as the buffer member 5 can also achieve the functions and effects of the buffer pad 53. In practical applications, since the adsorption block 4 is adhesively bonded to the buffer pad 53 or the buffer suction nozzle 52, and to achieve the adsorption function of the adsorption block 4, usually the buffer suction nozzle 52 and the buffer block member are also provided with through holes communicating with the adsorption block 4.

[0066] Optionally, as Figure 4 、 Figure 10 and Figure 16 shown, the adsorption block 4 is provided with adsorption holes 41, and the adsorption holes 41 communicate with the air hole 7, enabling the adsorption mechanism to adsorb the solder tape through the adsorption holes 41.

[0067] Specifically, in this embodiment, by providing the adsorption holes 41 on the adsorption block 4, the adsorption function of the adsorption block 4 is achieved. The adsorption holes 41 communicate with the air hole 7, allowing the vacuum pumping of the adsorption holes 41 to be realized through an external pneumatic source, thereby achieving the adsorption effect.

[0068] In practical applications, the shape and aperture size of the adsorption holes 41 can be designed according to actual needs. For example, the adsorption holes 41 can be set as long strips, circles, squares, etc. However, usually the adsorption holes 41 do not exceed the edge of the solder tape to avoid vacuum leakage and ensure the adsorption force.

[0069] Optionally, as Figure 6 、 Figure 12 and Figure 18 shown, the shape of the adsorption holes 41 is a waist-shaped hole, and when the adsorption block 4 adsorbs the solder tape, the length direction of the waist-shaped hole is consistent with the length direction of the solder tape, and the width of the waist-shaped hole is smaller than the width of the solder tape.

[0070] Specifically, in this embodiment, the solder ribbon is usually strip-shaped. Therefore, by designing the adsorption holes 41 as waist-shaped holes, the adsorption area between the solder ribbon and the adsorption holes 41 can be increased, ensuring that the solder ribbon can be firmly adsorbed and preventing it from falling during handling, thereby improving the reliability of the equipment.

[0071] Optionally, a positioning portion 42 is further provided on the adsorption block 4, and the positioning portion 42 is used to position the length direction of the waist-shaped hole.

[0072] Specifically, during the actual assembly process, since the adsorption holes 41 are waist-shaped holes, the assembly direction of their length needs to be consistent with the length direction of the welding rod. By providing the positioning portion 42 on the adsorption block 4, it is convenient for the rapid assembly of the adsorption block 4.

[0073] Optionally, the positioning portion 42 is a convex structure, and two notches are symmetrically provided on the convex structure in the width direction of the waist-shaped hole.

[0074] For example, as Figure 5 , Figure 6 , Figure 7 , Figure 11 , Figure 12 , Figure 13 , Figure 17 , Figure 18 and Figure 19 shown, in one embodiment, a convex structure is provided on the adsorption block 4, and two notches are symmetrically provided on the convex structure. When assembling the adsorption block, the length direction or width direction of the waist-shaped hole can be quickly confirmed according to the positions of the two notches to guide the installation direction of the adsorption block 4.

[0075] According to the second aspect of the present invention, as Figure 1 shown, a solder ribbon handling device is provided, including: the solder ribbon adsorption module described in the first aspect.

[0076] Specifically, in this embodiment, the solder ribbon adsorption function of the solder ribbon handling device is realized by providing one or more solder ribbon adsorption modules. Its structure is simple, with fewer components and lower cost, and is suitable for mass production. In addition, since it can safely adsorb and place the solder ribbon on the battery, the production yield is improved.

[0077] In one embodiment, multiple solder ribbon adsorption modules can be provided according to actual needs and arranged on the same mounting plate 1 as required, and then the mounting plate 1 is used to set them on the solder ribbon handling device to achieve the adsorption and handling of multiple solder ribbons at one time, improving the production efficiency.

[0078] In the above embodiments, the differences between the embodiments are mainly described. As long as the different optimization features between the embodiments do not conflict, they can be combined to form a better embodiment. For the sake of brevity, they will not be elaborated here.

[0079] Although some specific embodiments of the present invention have been described in detail by way of examples, those skilled in the art should understand that the above examples are for illustrative purposes only and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A solder strip adsorption module, which is applied to battery production, is characterized in that Comprising: A bottom plate (2) and an adsorption mechanism; A plurality of the adsorption mechanisms are arranged on one side of the bottom plate (2) and are used for adsorbing the welding tape, and the adsorption mechanism includes an adsorption block (4) and a buffer member (5); The adsorption block (4) is flexibly connected to the bottom plate (2) through the buffer member (5), so that the adsorption block (4) has a buffer stroke in the adsorption direction.

2. The solder strip adsorption module according to claim 1, wherein It further includes a guiding structure, the guiding structure is fixed on the bottom plate (2), and can limit the deflection angle of each adsorption mechanism in the adsorption direction.

3. The solder strip adsorption module according to claim 1 or 2, characterized in that It further includes an air joint (6), a plurality of air holes (7) are arranged on the bottom plate (2), one end of each air hole (7) is communicated with the air joint (6), and the other end is communicated with one adsorption mechanism, and the air joint (6) can be connected to a pneumatic source, so that a plurality of the adsorption mechanisms can adsorb the welding tape.

4. The solder strip adsorption module according to claim 3, characterized in that, The buffer member (5) is a buffer rod (51), the buffer rod (51) is located in the air hole (7), one end of which is connected to the bottom plate (2), and the other end is threadedly connected to the adsorption block (4); The buffer rod (51) has a spring, and when the adsorption block (4) is subjected to pressure in the adsorption direction, the spring is compressed.

5. The solder strip adsorption module according to claim 3, characterized in that, The buffer member (5) is a buffer pad (53) or a buffer suction nozzle (52), the buffer member (5) is located in the air hole (7), one end of which is connected to the bottom plate (2), and the other end is adhesively connected to the adsorption block (4); When the adsorption block (4) is subjected to pressure in the adsorption direction, at least a part of the buffer suction nozzle (52) or the buffer pad (53) is compressed.

6. The solder tape adsorption module according to claim 4 or 5, characterized in that The adsorption block (4) is provided with an adsorption hole (41), and the adsorption hole (41) is communicated with the air hole (7), so that the adsorption mechanism can adsorb the welding tape through the adsorption hole (41).

7. The solder strip adsorption module according to claim 6, characterized in that, The shape of the adsorption hole (41) is an oval hole, and when the welding tape is adsorbed on the adsorption block (4), the length direction of the oval hole is consistent with the length direction of the welding tape, and the width of the oval hole is smaller than the width of the welding tape.

8. The solder tape adsorption module according to claim 7, characterized in that, The adsorption block (4) is further provided with a positioning portion (42), and the positioning portion (42) is used for positioning the length direction of the oval hole.

9. The solder tape adsorption module according to claim 8, characterized in that The positioning portion (42) is a convex structure, and two notches are symmetrically arranged on the convex structure in the width direction of the oval hole.

10. A solder tape handling device, characterized in that, Comprising: The welding tape adsorption module according to any one of claims 1-9.

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