Top drying device for drying silicon wafers

Abstract

The utility model relates to the technical field of silicon wafer drying, in particular to a top drying device for drying silicon wafers, which comprises a fan, an air inlet pipe and an air inlet, the inlet end of the air inlet pipe is communicated with the outlet end of the fan, the air inlet is communicated with the outlet end of the air inlet pipe, and the air inlet is positioned above a flower basket. The design mode that the air inlet is located above the flower basket is adopted, the flower basket is dried in the mode of blowing air from top to bottom, and compared with a side wall drying mode, the mode is simple in structure and convenient to operate, the drying time of silicon wafers can be shortened, and the drying effect of the silicon wafers can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer drying, in particular to a top drying device for silicon wafer drying. Background Art

[0002] In the production process of solar cells, silicon wafers need to go through processes such as texturing, diffusion, etching, coating, and printing in sequence. In the texturing process, the silicon wafers need to be immersed in a reaction solution to etch the surface of the silicon wafers to form a textured surface. In the diffusion process after texturing, the silicon wafers need to be dried. Therefore, after the texturing process, the silicon wafers need to be cleaned and dried to remove the water stains on the surface of the silicon wafers to ensure the quality and performance of the silicon wafers.

[0003] In a photovoltaic trough cleaning device, drying is the last step in the device process. Currently, the drying method for silicon wafers is sidewall drying (that is, the air blowing method for drying the silicon wafers in the drying trough is sidewall air blowing). A drying pipeline is installed on the inner sidewall of the drying trough, and air is blown from the inner sidewall to a flower basket containing silicon wafers (during the drying process of the silicon wafers, the flower basket is the carrier of the silicon wafers) for drying. The air inlet mode of this drying method is: air inlet through the pipeline on the inner sidewall of the drying trough, and the air outlet mode is: air outlet from the bottom of the drying trough. This drying method is very likely to cause the flower basket near the air outlet to be not easily dried due to being far from the air inlet, with a long drying time and poor drying effect. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is: to solve the technical problems of long drying time and poor drying effect in the existing sidewall drying method for silicon wafers, the utility model provides a top drying device for silicon wafer drying. By improving the drying method of silicon wafers, the drying time of silicon wafers can be shortened, and the drying effect of silicon wafers can be improved.

[0005] The technical solution adopted by the utility model to solve its technical problems is: a top drying device for silicon wafer drying, comprising: a fan, an air inlet pipe, and an air inlet. The inlet end of the air inlet pipe is communicated with the outlet end of the fan, the air inlet is communicated with the outlet end of the air inlet pipe, and the air inlet is located above the flower basket.

[0006] Thus, the design method with the air inlet located above the flower basket adopts the air blowing method from top to bottom to perform the drying operation on the flower basket. Compared with the sidewall drying method, this method has a simple structure, is easy to operate, can shorten the drying time of silicon wafers, and improve the drying effect of silicon wafers.

[0007] Further, it further comprises: a uniform air distribution adjusting mechanism, the uniform air distribution adjusting mechanism is located below the air inlet and above the flower basket; wherein: the uniform air distribution adjusting mechanism is used to adjust the uniformity of the air supply from the air inlet.

[0008] Further, the air distribution adjusting mechanism includes: an air distribution plate and an air distribution adjusting plate. The air distribution adjusting plate is slidably connected to the air distribution plate. The air distribution adjusting plate is located below the air inlet, the air distribution plate is located below the air distribution adjusting plate, and the air distribution adjusting plate is located below the flower basket.

[0009] Further, it further includes: a bolt. The air distribution adjusting plate is connected to the air distribution plate through the bolt. Wherein: when the bolt is in a loosened state, the air distribution adjusting plate can slide relative to the air distribution plate; when the bolt is in a tightened state, the air distribution adjusting plate cannot slide relative to the air distribution plate.

[0010] Further, both the air distribution plate and the air distribution adjusting plate are provided with a plurality of first ventilation holes. Thus, by adjusting the relative positions of the air distribution plate and the air distribution adjusting plate, the effective ventilation size of the air distribution adjusting mechanism is changed (that is, the size of the common ventilation area between the first ventilation holes of the air distribution plate and the first ventilation holes of the air distribution adjusting plate is changed), so that the drying gas passing through the air distribution adjusting mechanism can be evenly blown to each position of the flower basket (that is, the air volume in each area of the flower basket remains constant, and the drying gas is fully dispersed evenly). In this way, the uniformity of silicon wafer drying can be improved.

[0011] Further, the air distribution plate is further provided with a plurality of second ventilation holes. Wherein: the first ventilation holes are located in the two side regions of the air distribution plate, and the second ventilation holes are located in the middle region of the air distribution plate.

[0012] Further, the diameter of the first ventilation hole is larger than the diameter of the second ventilation hole. Thus, the air volume acting on the central position of the flower basket by the first ventilation hole is larger than the air volume acting on the edge position of the flower basket by the second ventilation hole. In this way, the uniformity of silicon wafer drying can be further improved.

[0013] Further, it further includes: a heater. The inlet end of the heater is communicated with the outlet end of the fan, and the outlet end of the heater is communicated with the inlet end of the air inlet pipe. Thus, the air generated by the fan can be heated, and the hot air after the heating treatment acts on the flower basket to perform the drying operation on the silicon wafer.

[0014] Further, it further includes: a drying box. The fan and the heater are located outside the drying box and are connected to the drying box. The air inlet pipe and the air distribution adjusting mechanism are located inside the drying box. The air inlet pipe penetrates through the drying box and is communicated with the heater, and the air distribution adjusting mechanism is connected to the drying box.

[0015] Compared with the prior art, the beneficial effects of the present utility model are:

[0016] The design method with the air inlet located above the flower basket adopts the air blowing method from top to bottom to dry the flower basket. Compared with the side wall drying method, this method has a simple structure, is easy to operate, can shorten the drying time of the silicon wafer, and improve the drying effect of the silicon wafer. Brief Description of the Drawings

[0017] The present utility model will be further described below in conjunction with the drawings and embodiments.

[0018] Figure 1 It is a schematic structural view of the top drying device for drying silicon wafers of the present utility model;

[0019] Figure 2 It is a schematic structural view of the installation of the fan, air distribution adjustment mechanism and heater of the present utility model;

[0020] Figure 3 It is a schematic structural view of the air distribution adjustment mechanism of the present utility model;

[0021] Figure 4 It is a top view of the air distribution adjustment mechanism of the present utility model;

[0022] Figure 5 It is a schematic structural view of the installation of the silicon wafer and the flower basket of the present utility model.

[0023] In the figure: 1. Fan; 2. Air inlet pipe; 3. Air inlet; 4. Flower basket; 401. Silicon wafer; 5. Air distribution adjustment mechanism; 501. Air distribution plate; 502. Air distribution adjustment plate; 503. Bolt; 504. First ventilation hole; 505. Second ventilation hole; 6. Heater; 7. Drying box. Detailed Description of the Specific Embodiment

[0024] The present utility model will now be further described in detail in conjunction with the drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present utility model in a schematic manner, so they only show the components related to the present utility model.

[0025] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more.

[0026] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0027] As Figures 1 to 5 shown, it is the optimal embodiment of the present utility model. The top drying device for drying silicon wafers in this embodiment includes: a blower 1, an air inlet pipe 2, and an air inlet 3. The inlet end of the air inlet pipe 2 is communicated with the outlet end of the blower 1, the air inlet 3 is communicated with the outlet end of the air inlet pipe 2, and the air inlet 3 is located above the flower basket 4. Thus, the design method in which the air inlet 3 is located above the flower basket 4 adopts the blowing method from top to bottom to perform the drying operation on the flower basket 4. Compared with the side wall drying method, this method has a simple structure, is easy to operate, can shorten the drying time of the silicon wafers 401, and improve the drying effect of the silicon wafers 401.

[0028] In other words, in the side wall drying method, since the flower basket 4 close to the air outlet is far from the air inlet 3, it is not easy to dry (that is, a part of the flower basket 4 is dried, while another part is not dried). In order to ensure that all positions of the flower basket 4 are dried, the drying operation can only be continuously carried out. However, in this application, by blowing air from top to bottom through the air inlet 3, the drying time of the silicon wafers 401 can be shortened (that is, all positions of the flower basket 4 are dried synchronously, without continuously performing the drying operation after a part is dried and waiting for another part to be dried), and the drying effect of the silicon wafers 401 can be improved.

[0029] It should be noted that: as shown in the figure, the flower basket 4 serves as the carrier of the silicon wafer 401. When drying the silicon wafer 401, the silicon wafer 401 will be placed on the flower basket 4 and then the drying operation will be carried out, rather than stacking multiple silicon wafers 401 for drying.

[0030] In this embodiment, it further includes: an air distribution adjustment mechanism 5. The air distribution adjustment mechanism 5 is located below the air inlet 3 and above the flower basket 4. Among them: the air distribution adjustment mechanism 5 is used to adjust the uniformity of the air supply from the air inlet 3. The air distribution adjustment mechanism 5 includes: an air distribution plate 501, an air distribution adjustment plate 502 and a bolt 503. The air distribution adjustment plate 502 is slidably connected to the air distribution plate 501. The air distribution adjustment plate 502 is located below the air inlet 3, the air distribution plate 501 is located below the air distribution adjustment plate 502, the air distribution adjustment plate 502 is located below the flower basket 4, and the air distribution adjustment plate 502 is connected to the air distribution plate 501 through the bolt 503. Both the air distribution plate 501 and the air distribution adjustment plate 502 are provided with a plurality of first ventilation holes 504. Among them: when the bolt 503 is in a loosened state, the air distribution adjustment plate 502 can slide relative to the air distribution plate 501; when the bolt 503 is in a tightened state, the air distribution adjustment plate 502 cannot slide relative to the air distribution plate 501. Thus, by adjusting the relative positions of the air distribution plate 501 and the air distribution adjustment plate 502, the effective ventilation size of the air distribution adjustment mechanism 5 is changed (that is, the common ventilation area size between the first ventilation holes 504 of the air distribution plate 501 and the first ventilation holes 504 of the air distribution adjustment plate 502 is changed), so that the drying gas passing through the air distribution adjustment mechanism 5 can be evenly blown to each position of the flower basket 4 (that is, the air volume in each area of the flower basket 4 remains constant and the drying gas is fully dispersed evenly). In this way, the uniformity of the drying of the silicon wafer 401 can be improved.

[0031] In this embodiment, the air distribution plate 501 is further provided with a plurality of second ventilation holes 505. Among them: the first ventilation holes 504 are located in the two side regions of the air distribution plate 501, the second ventilation holes 505 are located in the middle region of the air distribution plate 501, and the diameter of the first ventilation holes 504 is larger than the diameter of the second ventilation holes 505. Thus, the air volume acting on the central position of the flower basket 4 by the first ventilation holes 504 is greater than the air volume acting on the edge position of the flower basket 4 by the second ventilation holes 505. In this way, the uniformity of the drying of the silicon wafer 401 can be further improved.

[0032] Specifically, since multiple wafers 401 need to be dried at one time during drying, several carriers 4 will be placed in the drying oven 7. During the placement process, the areas on both sides of the air distribution adjustment mechanism 5 are the central positions of the carriers 4, and a large air volume is required for drying in these areas. The area in the middle of the air distribution adjustment mechanism 5 is the edge position of the carrier 4, and only a small air volume is required to complete the drying in this area. Therefore, when designing, the diameter of the first ventilation holes 504 is designed to be larger than that of the second ventilation holes 505, which can meet the above requirements.

[0033] In this embodiment, it further includes: a heater 6 and a drying oven 7. The inlet end of the heater 6 is communicated with the outlet end of the blower 1, and the outlet end of the heater 6 is communicated with the inlet end of the air inlet pipe 2. The blower 1 and the heater 6 are located outside the drying oven 7 and are connected to the drying oven 7. The air inlet pipe 2 and the air distribution adjustment mechanism 5 are located inside the drying oven 7. The air inlet pipe 2 penetrates through the drying oven 7 and is communicated with the heater 6. The air distribution adjustment mechanism 5 is connected to the drying oven 7. Thus, the air generated by the blower 1 can be heated, and the hot air after the heat treatment acts on the carrier 4 to perform the drying operation on the wafers 401.

[0034] Specifically, the air distribution plate 501 is connected to the drying oven 7.

[0035] The drying process of the wafers 401 of the present utility model is as follows: First, open the door (not shown in the figure), place the carrier 4 to be dried into the drying oven 7, and close the door; then, start the blower 1 and the heater 6 to perform the drying operation on the wafers 401; finally, after the wafers 401 are dried, open the door and take out the dried carrier 4.

[0036] In summary, the design method of the air inlet 3 of the present utility model is located above the carrier 4, and the blowing method from top to bottom is adopted to perform the drying operation on the carrier 4. Compared with the side wall drying method, this method has a simple structure, is easy to operate, can shorten the drying time of the wafers 401, and improve the drying effect of the wafers 401.

[0037] The above is based on the ideal embodiments of the present utility model as an inspiration. Through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A top drying device for silicon wafer drying, characterized in that, Including: a fan (1), and an air inlet pipe (2), the inlet end of the air inlet pipe (2) being communicated with the outlet end of the fan (1); an air inlet (3), the air inlet (3) being communicated with the outlet end of the air inlet pipe (2), and the air inlet (3) being located above the flower basket (4).

2. The top drying device for silicon wafer drying according to claim 1, wherein, It further includes: a uniform air distribution adjusting mechanism (5), the uniform air distribution adjusting mechanism (5) being located below the air inlet (3) and above the flower basket (4); wherein: the uniform air distribution adjusting mechanism (5) is used to adjust the uniformity of the air supply from the air inlet (3).

3. The top drying device for silicon wafer drying according to claim 2, characterized in that, The uniform air distribution adjusting mechanism (5) includes: a uniform air distribution plate (501) and a uniform air distribution adjusting plate (502), the uniform air distribution adjusting plate (502) being slidably connected to the uniform air distribution plate (501), the uniform air distribution adjusting plate (502) being located below the air inlet (3), the uniform air distribution plate (501) being located below the uniform air distribution adjusting plate (502), and the uniform air distribution adjusting plate (502) being located below the flower basket (4).

4. The top drying device for drying silicon wafers according to claim 3, characterized in that, It further includes: a bolt (503), the uniform air distribution adjusting plate (502) being connected to the uniform air distribution plate (501) through the bolt (503); wherein: when the bolt (503) is in a loosened state, the uniform air distribution adjusting plate (502) can slide relative to the uniform air distribution plate (501); when the bolt (503) is in a tightened state, the uniform air distribution adjusting plate (502) cannot slide relative to the uniform air distribution plate (501).

5. The top drying device for drying silicon wafers according to claim 3, characterized in that, Both the uniform air distribution plate (501) and the uniform air distribution adjusting plate (502) are provided with a plurality of first ventilation holes (504).

6. The top drying device for drying silicon wafers according to claim 5, characterized in that, The uniform air distribution plate (501) is further provided with a plurality of second ventilation holes (505); wherein: the first ventilation holes (504) are located in the two side regions of the uniform air distribution plate (501), and the second ventilation holes (505) are located in the middle region of the uniform air distribution plate (501).

7. The top drying device for silicon wafer drying according to claim 6, characterized in that, The diameter of the first ventilation holes (504) is larger than the diameter of the second ventilation holes (505).

8. The top drying device for silicon wafer drying according to claim 2, characterized in that, It further includes: a heater (6), the inlet end of the heater (6) being communicated with the outlet end of the fan (1), and the outlet end of the heater (6) being communicated with the inlet end of the air inlet pipe (2).

9. The top drying device for silicon wafer drying according to claim 8, characterized in that, It further includes: a drying box (7), the fan (1) and the heater (6) being located outside the drying box (7) and connected to the drying box (7), the air inlet pipe (2) and the uniform air distribution adjusting mechanism (5) being located inside the drying box (7), the air inlet pipe (2) passing through the drying box (7) and being communicated with the heater (6), and the uniform air distribution adjusting mechanism (5) being connected to the drying box (7).

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