Test needle seat

Abstract

The utility model discloses a test needle seat, belongs to the field of test, and aims to solve the problems that when a thermistor chip is detected, probes are mainly clamped at two ends of the thermistor chip manually, and the clamping operation is tedious, time-consuming and labor-consuming. The clamping device comprises a supporting unit and a clamping unit. The supporting unit comprises a first supporting piece, at least one first conductive connecting rod and at least one first banana connector; the first supporting piece comprises a first supporting horizontal plate, a first supporting vertical plate and a second supporting horizontal plate, the first supporting horizontal plate and the second supporting horizontal plate are arranged in parallel, and the two ends of the first supporting vertical plate are connected with the first supporting horizontal plate and the second supporting horizontal plate respectively. The clamping tool for the thermistor chip can simplify the clamping operation of the thermistor chip, reduce the labor intensity of operators and improve the operation efficiency, and has high application value and good application prospects.

Description

Technical Field

[0001] The utility model relates to the field of testing, and specifically to a test pin base. More specifically, the present application provides a test pin base for a thermistor chip, which is a test pin base for measuring the electrical performance of a thermistor chip, capable of simplifying the fixed installation of the thermistor chip and meeting the connection requirements of different test instruments. Background Art

[0002] A thermistor, also known as a semiconductor thermistor, has a resistance value that changes with temperature, mainly including a positive temperature coefficient thermistor element (abbreviation: PTC, whose resistance value increases with temperature increase) and a negative temperature coefficient thermistor element (abbreviation: NTC, whose resistance value decreases with temperature increase). Among them, PTC thermistors are mainly used for overcurrent protection, startup of circuits and electronic components, and related instruments and application fields for flow rate, flow volume, and ray measurement; NTC thermistors are mainly used for temperature measurement, temperature compensation, surge current suppression, control, etc. In recent years, with the increasingly wide application of thermistors, the demand for thermistors has also increased day by day. For this reason, a large amount of research has been carried out on aspects such as thermistor preparation, performance, manufacturing, testing, packaging, etc.

[0003] For example, Chinese Patent Application CN201310351804.1 discloses a packaging method for thermistor chips based on tray arrangement. This method enables customers to directly perform mechanical packaging after receiving the thermistor chips, saving the time for end customers to re-arrange and align the thermistor chips and improving production efficiency.

[0004] Chinese Patent Application CN201310314320.X discloses a polymer thermistor element with multiple zero-power resistance values. This polymer thermistor element has high withstand voltage and non-operating current, large holding current, small overcurrent and volume, and sensitive overload response. By connecting different pins, a cooperative response function can be achieved between each thermistor, thus improving the safety of the circuit.

[0005] Chinese Patent Application CN201510702693.3 discloses a hot pressure-sensitive resistor adhesion production device and production method, which adopts a structure combining a special printing plate, a sleeve plate and a covering baking plate. The thermistor chip is screened by the printing plate, and then solder paste is printed on the thermistor chip by a silver printing machine; the varistor chip is screened by the sleeve plate; the sleeve plate with the screened varistor chip is sleeved on the printing plate with solder paste, and then a covering baking plate is placed on the sleeve plate. After the three plates are turned over, the printing plate and the sleeve plate are successively removed, and the product remains on the covering baking plate for baking together. The tooling of this invention patent is simple, has high working efficiency, and through the positioning posts and the sleeve plate, the thermistor chip and the varistor chip are adhered in the required shape, meeting the product design requirements, with low cost and good use effect.

[0006] Chinese Patent Application CN201110268732.5 discloses a linear feeding mechanism for thermistor chip detection and sorting, which has a horizontal feeding guide rail. The inlet end of the horizontal feeding guide rail is docked with a V-shaped receiving groove. The upper surface of the horizontal feeding guide rail and the bottom of the V-shaped receiving groove have continuous vertical guide grooves matching the thickness of the thermistor chip. The bottom of the horizontal feeding guide rail is placed on a vibrating seat extending a vertical armature. The vibrating seat is connected to the base through a substantially vertical vibrating reed, and an electromagnetic coil is fixed on the base on one side of the armature. This invention realizes the efficient upright feeding of thermistor chips with a clever structure and scientific principle, thus laying a foundation for the automated detection and sorting in mass production.

[0007] Chinese Patent Application CN202110478368.9 discloses an auxiliary tooling for screening and testing a thermistor chip with a surface electrode. By adding metal posts and insulating bases for limiting the metal posts, during testing, the thermistor chip is placed between one end of the metal post and the common electrode plate. The test pen tip contacts the metal post without contacting the surface of the resistor chip, which will not scratch the surface of the resistor chip, effectively protecting the resistor chip, and the resistor chip will not be displaced as the test pen moves, and the repeatability of the resistance value test is good.

[0008] Chinese Patent Application CN202311696652.9 discloses a soldering device for thermistor chip processing. In this structure, the push block pushes the limiting rod to move. At this time, the clamping arm drives the solder wire towards the tip of the soldering pen, so that the solder wire melts onto the tip of the soldering pen, facilitating chip soldering. The soldering process does not require multiple robotic arms to operate, which not only saves production costs but also reduces the operation difficulty.

[0009] In practice, the inventor has found that detecting the thermistor chip is the key to ensuring its subsequent stable operation. There are already mature detection devices on the market; before detection, one end of two probes is connected to the detection device, and the other ends of the two probes are respectively connected to the two sides of the thermistor chip to perform corresponding detection operations. In this structure, the connection between the probe and the detection device usually adopts a fixed or detachable connection method, and the connection is simple; while between the probe and the thermistor chip, the probe is usually manually connected to the thermistor chip. When performing a small number of tests, there are no corresponding problems; when a large number of rapid thermistor chip detections are required, the existing manual connection method is difficult to meet the corresponding needs. Therefore, there is an urgent need for new methods and / or devices to solve the corresponding technical problems. Summary of the Invention

[0010] The object of the present invention is to provide a test pin base for the problem that when detecting a thermistor chip, the probe is mainly manually clamped at both ends of the thermistor chip, and the clamping operation is cumbersome, time-consuming and laborious. Different from the prior art, the test pin base of the present application can be used as a clamping tool for the thermistor chip, simplifies the clamping operation of the thermistor chip, reduces the labor intensity of the operator, improves the operation efficiency, and has high application value and good application prospects. At the same time, the device can meet the clamping requirements of thermistor chips within a certain size range and has strong adaptability. Further, based on the improvement of its structure, it can simultaneously meet the clamping and measurement requirements of multiple thermistor chips, greatly improving the detection efficiency.

[0011] In order to achieve the above object, the present application adopts the following technical solutions:

[0012] A test pin base includes a support unit and a clamping unit;

[0013] The support unit includes a first support member, a first conductive link, and a first banana connector for connecting to a detection probe, and the first conductive link and the first banana connector are each at least one;

[0014] The first support member includes a first support horizontal plate, a first support vertical plate, and a second support horizontal plate. The first support horizontal plate and the second support horizontal plate are arranged parallel to each other. The two ends of the first support vertical plate are respectively connected to the first support horizontal plate and the second support horizontal plate. The first support horizontal plate, the first support vertical plate, and the second support horizontal plate are connected in sequence to form a single body, and the first support member is in an I shape;

[0015] The side of the first support horizontal plate facing the second support horizontal plate is denoted as the first chip support surface, and the side of the second support horizontal plate facing the first support horizontal plate is denoted as the second conductive connection surface. A chip installation space is formed between the first chip support surface, the first support vertical plate, and the second conductive connection surface;

[0016] The clamping unit includes a second insulating base one, a second telescopic assembly, a second PCB connecting plate two, a second connecting wire, and a second banana connector for connecting with a detection probe. The second telescopic assembly, the second connecting wire, and the second banana connector are each N in number, where N is a natural number and N≥1;

[0017] One end of the first conductive connecting rod is connected to the second PCB connecting plate two, and the second PCB connecting plate two and the first conductive connecting rod remain relatively stationary. The other end of the first conductive connecting rod passes through the second insulating base one and is connected to the first support member, and the first conductive connecting rod and the second insulating base one and the first support member remain relatively stationary;

[0018] The second telescopic assembly is connected to the second insulating base one, and the second insulating base one can support the second telescopic assembly. The second banana connector is arranged on the second PCB connecting plate two, and the second PCB connecting plate two can provide support for the second banana connector. The second banana connector, the second connecting wire, and the second telescopic assembly are electrically connected in sequence;

[0019] The first banana connector is arranged on the second PCB connecting plate two, and the second PCB connecting plate two can provide support for the first banana connector. The first banana connector, the first conductive connecting rod, and the first support member are electrically connected in sequence;

[0020] The second telescopic assembly includes a telescopic support two, a telescopic return spring two, and a telescopic pressing member two. The telescopic support two is fixedly connected to the second insulating base one, and the second insulating base one can provide support for the telescopic support two. A telescopic through hole two is arranged in the telescopic support two;

[0021] A support relief through hole one that cooperates with the second telescopic assembly is arranged on the support horizontal plate two;

[0022] One end of the telescopic pressing member two sequentially passes through the support relief through hole one and the second insulating base one and is connected to the telescopic support two, and the telescopic pressing member two can axially move relative to the telescopic support two. The telescopic pressing member two can move relative to each other within the chip installation space, and the telescopic pressing member two and the support horizontal plate two do not contact each other. The telescopic return spring two is arranged on the telescopic pressing member two, and the telescopic return spring two can provide a restoring force for the telescopic pressing member two towards the chip support surface one so that the chip to be measured is clamped between the chip support surface one and the telescopic pressing member two, and the telescopic pressing member two is electrically connected to the telescopic support two.

[0023] The first support member is made of a conductive material.

[0024] The first support member is made of a metal material.

[0025] The first support member is an I-shaped copper base.

[0026] The first conductive connecting rod is made of a conductive material.

[0027] The first conductive connecting rod is a metal threaded post, and further includes a first nut that cooperates with the first conductive connecting rod;

[0028] Through the cooperation of the first conductive connecting rod and the first nut, the relative static fixation between the first conductive connecting rod and the first and second insulating seats, between the first support member, and between the second PCB connecting plate two and the first conductive connecting rod is realized.

[0029] One end of the first conductive connecting rod passes through the first insulating seat and is connected to the second support horizontal plate.

[0030] The first insulating seat is connected to the second support horizontal plate, and the second support horizontal plate can provide support for the first insulating seat.

[0031] The second telescopic support is columnar, the second telescopic through hole is arranged along the axial direction of the second telescopic support, and the second connecting wire is electrically connected to the second telescopic support.

[0032] The first support relief through hole is a circular through hole, and there is no contact between the second telescopic pressing member and the second support horizontal plate.

[0033] The second telescopic return spring is sleeved on the second telescopic pressing member, and the second telescopic return spring is coaxially arranged with the second telescopic pressing member.

[0034] The second telescopic pressing member can move axially relative to the second telescopic support, and the moving distance range of the second telescopic pressing member is 0.1 - 20 mm.

[0035] The first insulating seat is rectangular.

[0036] The first insulating seat is made of insulating electrical wood board.

[0037] There are four first conductive connecting rods, which are evenly distributed on the second PCB connecting plate two.

[0038] It further includes a first reinforcing member, and one end of the first conductive connecting rod passes through the first reinforcing member and is connected to the second PCB connecting plate two.

[0039] The first reinforcing member is in a square shape with a mouth.

[0040] The first reinforcing member is made of insulating electrical wood board.

[0041] The second banana connector and the first banana connector are respectively banana female sockets.

[0042] The number of the second banana connectors is 1 to 50, and the number of the first banana connectors is 1 to 10.

[0043] The number of the second banana connectors is 20, and the second banana connectors are evenly distributed in two rows on the second PCB connecting plate two. The number of the first banana connectors and the first conductive connecting rods are both 4.

[0044] It further includes an oil bath device. Description of the Drawings

[0045] Figure 1 It is the front view schematic diagram of the main body support structure in the test pin base in Embodiment 1 (for the convenience of viewing, components such as the second PCB connecting plate two, the second connecting wire, and the second banana connectors are omitted).

[0046] Figure 2 It is the side view schematic diagram of the main body support structure in the test pin base in Embodiment 1 (for the convenience of viewing, some components are omitted).

[0047] Figure 3 It is the top view schematic diagram of the test pin base in Embodiment 1.

[0048] Markings in the figure: 1. First support member, 2. First conductive connecting rod, 3. First support horizontal plate, 4. First support vertical plate, 5. Second support horizontal plate, 6. First banana connector, 7. First strengthening member, 8. First second insulating seat, 9. Second telescopic assembly, 10. Second PCB connecting plate two, 11. Second banana connector. Detailed Embodiment

[0049] The following will describe the present invention in detail with reference to the drawings.

[0050] In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0051] Embodiment 1

[0052] This embodiment provides a test pin base, which includes a support unit and a clamping unit. Among them, the support unit includes a first support member, a first conductive link, and a first banana connector for connecting with a detection probe. The first support member uses an I-shaped copper base, which includes a first support horizontal plate, a first support vertical plate, and a second support horizontal plate. The first support horizontal plate and the second support horizontal plate are arranged parallel to each other. Both ends of the first support vertical plate are respectively connected to the first support horizontal plate and the second support horizontal plate. The first support horizontal plate, the first support vertical plate, and the second support horizontal plate are connected in sequence to form a whole, and the first support member is in an I shape. In a specific example, the support unit further includes a first reinforcing member in an O shape; further, the first second insulating seat is rectangular, and the first second insulating seat and the first reinforcing member are made of insulating bakelite. As shown in the figure, the side of the first support horizontal plate facing the second support horizontal plate is denoted as the first chip support surface, and the side of the second support horizontal plate facing the first support horizontal plate is denoted as the second conductive connection surface. A chip installation space is formed among the first chip support surface, the first support vertical plate, and the second conductive connection surface. The number of the first conductive links and the first banana connectors can be selected as multiple according to needs. In a specific example, the number of the first conductive links and the first banana connectors are both 4.

[0053] The clamping unit includes a first second insulating seat, a second telescopic assembly, a second second PCB connecting plate, a second connecting wire, and a second banana connector for connecting with a detection probe; the number of the second telescopic assemblies, the second connecting wires, and the second banana connectors are all N; N can be selected from 1 to 50 according to needs. In a specific example, the number of the second banana connectors is 20, and the second banana connectors are evenly distributed in two rows on the second second PCB connecting plate.

[0054] One end of the first conductive connecting rod is connected to the second PCB connecting plate II, and the other end of the first conductive connecting rod passes through the second insulating seat and is connected to the first support member. The first conductive connecting rods are evenly distributed on the second PCB connecting plate II. In this structure, the second PCB connecting plate II and the first conductive connecting rods remain relatively stationary, and the first conductive connecting rods and the first insulating seat I and the first support member remain relatively stationary; the first support member, the first insulating seat I, the first conductive connecting rods, and the second PCB connecting plate II together form the main support structure of the test probe base. Further, when a first reinforcing member is further included, one end of the first conductive connecting rod passes through the first reinforcing member and is connected to the second PCB connecting plate II; in this structure, the first reinforcing member is located near the second PCB connecting plate II and can play a role in strengthening and supporting the second PCB connecting plate II, and the first support member, the first insulating seat I, the first conductive connecting rods, the first reinforcing member, and the second PCB connecting plate II together form the main support structure of the test probe base, further improving the rigidity of the main support structure. In a specific example, the first conductive connecting rod is a metal threaded post (that is, the column is provided with threads throughout, which is a standard part and can be purchased on the market), and a first nut that cooperates with the first conductive connecting rod is further included. Through the cooperation of the first conductive connecting rod and the first nut, the relative static fixation between the first conductive connecting rod and the first support member, the first insulating seat I, the first reinforcing member, and the second PCB connecting plate II is realized.

[0055] The second telescopic assembly is connected to the first insulating seat I, the second banana connector is arranged on the second PCB connecting plate II, and the second banana connector, the second connecting wire, and the second telescopic assembly are electrically connected in sequence. The first banana connector is arranged on the second PCB connecting plate II, and the first banana connector, the first conductive connecting rod, and the first support member are electrically connected in sequence. In this structure, the first insulating seat I can support the second telescopic assembly, and the first banana connector and the second banana connector are respectively fixedly arranged on the second PCB connecting plate II.

[0056] The second telescopic component includes a second telescopic support, a second telescopic return spring, and a second telescopic pressing member; the second telescopic support is fixedly connected to the first second insulating seat, and the first second insulating seat can provide support for the second telescopic support; a second telescopic through hole is provided in the second telescopic support. At the same time, a first support relief through hole matching the second telescopic component is provided on the second support horizontal plate. One end of the second telescopic pressing member sequentially passes through the first support relief through hole and the first second insulating seat and is connected to the second telescopic support, and the second telescopic pressing member can axially move relative to the second telescopic support; the second telescopic pressing member can move relative to each other within the chip installation space, and the second telescopic pressing member and the second support horizontal plate do not contact each other. The second telescopic return spring is arranged on the second telescopic pressing member, and the second telescopic return spring can provide a restoring force for the second telescopic pressing member towards the first chip support surface, so that the chip to be measured is clamped between the first chip support surface and the second telescopic pressing member, and the second telescopic pressing member is electrically connected to the second telescopic support. In a specific example, the second telescopic support is columnar, the second telescopic through hole is arranged along the axis of the second telescopic support, and the second connecting wire is electrically connected to the second telescopic support. Further, the first support relief through hole is a circular through hole, and the second telescopic pressing member and the second support horizontal plate do not contact each other. Preferably, the second telescopic return spring is sleeved on the second telescopic pressing member, and the second telescopic return spring is coaxially arranged with the second telescopic pressing member.

[0057] For chip testing equipment, it usually includes two test probes. There are certain differences in the connection methods of test probes for different testing equipment, mainly divided into banana head connection form and clip connection form. The structure of the present application can meet the corresponding connection requirements. In this structure, for the two test probes, the following two connection methods are set: one is connected to the second telescopic component through the second banana connector and the second connecting wire (hereinafter referred to as: the first probe connection path); the other is connected to the first support through the first banana connector and the first conductive connecting rod (hereinafter referred to as: the second probe connection path). In the first probe connection path, the second telescopic pressing member can move along the axial direction of the second telescopic support, so as to form a space for clamping and fixing the chip between the end of the second telescopic pressing member facing the first chip support surface and the first chip support surface, and based on the reset action of the second telescopic return spring, the relative fixation between the chip and the test pin base is realized; and the setting of the first support relief through hole ensures that the second telescopic pressing member and the second support horizontal plate do not contact each other, avoiding short-circuit connection between the two test probes while ensuring the overall structural strength of the test pin base, and ensuring the reliable operation of the test probes. In a specific example, the second banana connector and the first banana connector are respectively banana head female seats, and the connection ends of the test probes are banana head male heads or clips. For the problem of differences in the connection methods of test probes, in the first probe connection path, when the connection end of the test probe is a banana head male head, it can be directly inserted into the second banana connector provided on the second PCB connecting plate two; when the connection end of the test probe is a clip, it can be directly clipped on the second telescopic support. For the problem of differences in the connection methods of test probes, in the second probe connection path, when the connection end of the test probe is a banana head male head, it can be directly inserted into the first banana connector provided on the second PCB connecting plate two; when the connection end of the test probe is a clip, it can be directly clipped on the first conductive connecting rod.

[0058] Furthermore, the first support member of the present application adopts an I-shaped copper base design. The first chip support surface can provide support for the chip to be tested and ensure the connection between the chip and the first chip support surface, simplifying the chip placement operation. At the same time, the second telescopic component adopts a telescopic structure design. During use, the second telescopic pressing member is pulled up relatively, and after the chip is placed, the second telescopic pressing member automatically resets, and the fixation operation of the second telescopic pressing member and the first chip support surface on the chip to be tested can be realized; at the same time, during the test, there is no need for manual clamping of the chip to be tested, which not only reduces the labor intensity of workers, but also can effectively reduce the errors caused by manual operation, further improving the accuracy and reliability of the test results. In the present application, based on the different numbers of the first banana connector and the second banana connector, multiple chips to be tested can be measured simultaneously, greatly improving the test efficiency. As shown in the figure, the attached drawing adopts the form of a large number of second banana connectors and a small number of first banana connectors, which is a reasonable choice based on the measuring device; when there are limited measuring devices, if two measuring devices are used for measurement at the same time, the number of the first banana connectors is 4, and the number of the second banana connectors is 20. By adopting this method, 20 chips to be tested can be fixedly placed at one time, and only the connection end of the test probe corresponding to the second banana connector needs to be replaced each time, greatly improving the test efficiency.

[0059] Furthermore, an oil bath device is further included. Based on the improved test probe base, the present application can be directly placed in the oil bath device, and the test temperature can be controlled by the oil bath device to meet the test requirements at a specific temperature. Through experimental verification, the present application can meet the temperature test requirements within ±0.1°C of the set temperature, greatly improving the accuracy of the test.

[0060] In the prepared test pin base, an I-shaped copper base (i.e., the first support member) carried by a second insulating base is designed at the bottom, and a second PCB connecting plate II carried by a first reinforcing member is provided at the top. At the same time, 20 second banana connectors with a diameter of 2 mm are designed on the second PCB connecting plate II. Threaded holes are designed at the four corners of the I-shaped copper base and the second insulating base I, and are fixedly connected to the first reinforcing member and the second PCB connecting plate II through the first conductive connecting rod. 20 circular holes with a diameter of 10 mm (i.e., the first support relief through holes) are also designed on the support horizontal plate II of the I-shaped copper base, so that the second telescopic assembly can pass through the middle of the support relief through holes without contacting the first support member. The second telescopic assembly is connected to the second banana connectors on the second PCB connecting plate II through the second connecting wires, and the second connecting wires are made of heat-resistant pure copper enameled wires. During the test, first lift the telescopic pressing member II in the second telescopic assembly, place the chip to be tested on the support horizontal plate I of the I-shaped copper base at its lower end, and make one side of the chip to be tested contact with the support horizontal plate I; then, lower the telescopic pressing member II to make the telescopic pressing member II contact with the other side of the chip to be tested; finally, insert the 2 mm banana male head connected to a test probe of the test equipment into the second banana connector on the second PCB connecting plate II, and insert the 2 mm banana male head connected to the other test probe into the first banana connector, and the measurement of the thermistor chip can be realized.

[0061] The above are only the preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A test pin base, characterized in that, It includes a support unit and a clamping unit; The support unit includes a first support member, a first conductive connecting rod, and a first banana connector for connecting with a detection probe. The first conductive connecting rod and the first banana connector are each at least one; The first support member includes a first support horizontal plate, a first support vertical plate, and a second support horizontal plate. The first support horizontal plate and the second support horizontal plate are arranged parallel to each other. The two ends of the first support vertical plate are respectively connected to the first support horizontal plate and the second support horizontal plate. The first support horizontal plate, the first support vertical plate, and the second support horizontal plate are connected in sequence to form an integral body, and the first support member is in an I shape; The side of the first support horizontal plate facing the second support horizontal plate is denoted as the first chip support surface, and the side of the second support horizontal plate facing the first support horizontal plate is denoted as the second conductive connection surface. A chip installation space is formed among the first chip support surface, the first support vertical plate, and the second conductive connection surface; The clamping unit includes a first second insulating seat, a second telescopic assembly, a second second PCB connecting plate, a second connecting wire, and a second banana connector for connecting with a detection probe. The second telescopic assembly, the second connecting wire, and the second banana connector are each N, where N is a natural number and N≥1; One end of the first conductive connecting rod is connected to the second second PCB connecting plate, and the second second PCB connecting plate and the first conductive connecting rod remain relatively stationary. The other end of the first conductive connecting rod passes through the first second insulating seat and is connected to the first support member, and the first conductive connecting rod and the first second insulating seat, the first support member remain relatively stationary; The second telescopic assembly is connected to the first second insulating seat, and the first second insulating seat can support the second telescopic assembly. The second banana connector is arranged on the second second PCB connecting plate, and the second second PCB connecting plate can provide support for the second banana connector. The second banana connector, the second connecting wire, and the second telescopic assembly are electrically connected in sequence; The first banana connector is arranged on the second second PCB connecting plate, and the second second PCB connecting plate can provide support for the first banana connector. The first banana connector, the first conductive connecting rod, and the first support member are electrically connected in sequence; The second telescopic assembly includes a second telescopic support, a second telescopic return spring, and a second telescopic pressing member. The second telescopic support is fixedly connected to the first second insulating seat, and the first second insulating seat can support the second telescopic support. A second telescopic through hole is arranged in the second telescopic support; A first support relief through hole matching with the second telescopic assembly is arranged on the second support horizontal plate; One end of the second telescopic pressing member sequentially passes through the first support relief through hole and the first second insulating seat and is connected to the second telescopic support, and the second telescopic pressing member can axially move relative to the second telescopic support. The second telescopic pressing member can move relative to each other within the chip installation space, and the second telescopic pressing member and the second support horizontal plate do not contact each other. The second telescopic return spring is arranged on the second telescopic pressing member, and the second telescopic return spring can provide a restoring force for the second telescopic pressing member towards the first chip support surface so that the chip to be tested is clamped between the first chip support surface and the second telescopic pressing member. The second telescopic pressing member is electrically connected to the second telescopic support.

2. The test probe base according to claim 1, wherein The first support member is made of a conductive material.

3. The test pin base according to claim 2, wherein The first support member is an I-shaped copper base.

4. The test probe base according to claim 1, wherein, The first conductive connecting rod is made of a conductive material.

5. The test probe base according to claim 1, wherein One end of the first conductive connecting rod passes through the second insulating seat and is connected to the second support horizontal plate.

6. The test probe base according to claim 5, wherein The first second insulating seat is connected to the second support horizontal plate, and the second support horizontal plate can provide support for the first second insulating seat.

7. The test probe base according to claim 1, wherein, The second telescopic support is columnar, the second telescopic through hole is arranged along the axial direction of the second telescopic support, and the second connecting wire is electrically connected to the second telescopic support.

8. The test probe base according to claim 7, characterized in that, The second telescopic return spring is sleeved on the second telescopic pressing member, and the second telescopic return spring is coaxially arranged with the second telescopic pressing member.

9. The test probe base according to claim 1, wherein It further includes a first reinforcing member, and one end of the first conductive connecting rod passes through the first reinforcing member and is connected to the second PCB connecting plate two.

10. The test probe base according to any one of claims 1 to 9, characterized in that, It further includes an oil bath device.

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