Photoresist smearing device for diode chip production

Abstract

The utility model belongs to the technical field of diode chip production equipment, and provides a photoresist smearing device for diode chip production, which comprises a station panel and a rolling brush, the rolling brush comprises a brush rod and a brush handle, the bottom of the brush rod is provided with a brush roll, the bottom of the brush rod is provided with a guide groove, two ends of the guide groove are provided with end plates, and the end plates are arranged on the station panel. The top of the end plate is connected with the top of the brush rod through a screw, the end plate is provided with a shaft hole used for installing a brush roller, the station panel is provided with a clamp used for elastically clamping a chip plate, the clamp comprises a fixing plate, a clamping opening and an arc-shaped plate, the arc-shaped opening of the arc-shaped plate faces the clamping opening, and the arc-shaped plate is provided with a Y-shaped elastic piece. The tail end of the Y-shaped elastic piece is connected with the cambered plate through a screw, two pressing blocks are arranged at the head end of the Y-shaped elastic piece, and the bottoms of the pressing blocks are located on the inner side of the clamping opening. The device is reasonable in design, simple in structure, high in stability, beneficial for improving the gluing efficiency and suitable for large-scale popularization.

Description

Technical Field

[0001] The utility model belongs to the technical field of diode chip production equipment, and particularly relates to a photoresist coating device for diode chip production. Background Art

[0002] Zener diodes are classified according to the breakdown voltage. Because of this characteristic, zener diodes are mainly used as voltage regulators or voltage reference elements. The characteristic of a zener diode is that before reverse conduction and breakdown, the current at both ends of it basically remains unchanged.

[0003] The chip volume of a zener diode is very small. Before cutting and separating, a series of operations are generally carried out in the form of a wafer layout, such as glass paste coating, wiping and polishing, photoresist coating, and dividing. Generally, when applying photoresist on the chip board, a handled roller brush is used for corresponding operations. However, if the chip board is directly held by hand, part of the photoresist will be coated on the fingers, which will directly affect the efficiency of picking and placing the chip board and the effect of pressing the chip layout next time. Moreover, many roller brushes are connected by springs, and when rolling and pressing on the chip board, slippage will occur. Content of the Utility Model

[0004] Aiming at the above technical problems existing in the process of applying photoresist, the utility model provides a photoresist coating device for diode chip production with reasonable design, simple structure, high stability and beneficial to improving the coating efficiency.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is that the photoresist coating device for diode chip production provided by the utility model includes a workbench panel and a roller brush. The workbench panel is used to place the chip board. The roller brush includes a brush rod and a brush handle. A brush roller is arranged at the bottom of the brush rod. A guide groove is arranged at the bottom of the brush rod. End plates are arranged at both ends of the guide groove. The top of the end plate is connected to the top of the brush rod by screws. A shaft hole for installing the brush roller is arranged on the end plate. A clamp for elastically clamping the chip board is arranged on the workbench panel. The clamp includes a fixing plate. A clamping opening is arranged at the bottom of the fixing plate. The clamping opening cooperates with a corner of the chip board. An arc-shaped plate is arranged on the side of the fixing plate. The arc-shaped opening of the arc-shaped plate faces the clamping opening. A Y-shaped elastic sheet is arranged on the arc-shaped plate. The tail end of the Y-shaped elastic sheet is connected to the arc-shaped plate by screws. Two pressing blocks are arranged at the head end of the Y-shaped elastic sheet. The bottom of the pressing block is located inside the clamping opening. A spring is arranged between the bottom surface of the head end of the Y-shaped elastic sheet and the top surface of the fixing plate. The spring is sleeved and matched with the pressing block.

[0006] Preferably, the briquette includes a pressing sheet, an active column is arranged on the top of the pressing sheet, the spring is sleeved on the active column, the active column is matched with an active hole arranged on a fixed plate, and a nut is arranged on the top of the active column.

[0007] Preferably, a V-shaped inclined surface is arranged at one end of the clamping port away from the bow-shaped plate.

[0008] Preferably, a pair of sinking grooves are arranged on the opposite side of the working station panel where the fixed plate is located. The shape of the sinking groove is a right-angled trapezoid, and the oblique waist of the right-angled trapezoid faces the symmetry center of the two sinking grooves. The bottom surface of the sinking groove is an inclined surface.

[0009] Preferably, a discharge outlet is arranged at the end of the sinking groove, a slide plate opening communicated with the discharge outlet is arranged on the side surface of the sinking groove, a collection box slidably matched with the slide plate opening is arranged in the slide plate opening, an inlet opposite to the discharge outlet is arranged on the collection box, and a folding plate handle is arranged at the end of the collection box.

[0010] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:

[0011] 1. For the photoresist coating device for diode chip production provided by the present utility model, the chip plate is placed under the fixture, and the chip plate is positioned by the clamping port and the bow-shaped plate. By pressing the Y-shaped elastic piece, the chip plate can be pressed. And by holding the rolling brush, the photoresist can be coated on the chip plate without staining the fingers, so as not to affect the efficiency of manually taking and placing the chip plate; the rolling brush is clamped by the end plate, which not only provides the rolling condition but also prevents the roller from falling off during the rolling process, which is beneficial to improving its practicability. This device is reasonably designed, simple in structure, high in stability and beneficial to improving the gluing efficiency, and is suitable for large-scale promotion. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0013] Figure 1 It is an axonometric view of the photoresist coating device for diode chip production provided for the embodiment;

[0014] Figure 2 It is a working diagram of the photoresist coating device for diode chip production provided for the embodiment;

[0015] Figure 3 It is a bottom view of the fixture provided for the embodiment;

[0016] Figure 4 Axonometric view of the collection box provided for the embodiment;

[0017] In the above figures, 1 is the chip board; 2 is the station panel; 21 is the sinking groove; 22 is the chute outlet; 23 is the slide plate opening; 3 is the roller brush; 31 is the brush rod; 32 is the brush handle; 33 is the brush roller; 34 is the guiding groove; 35 is the end plate; 36 is the shaft hole; 4 is the fixture; 41 is the fixing plate; 42 is the clamping opening; 421 is the V-shaped inclined plane; 43 is the bow-shaped plate; 44 is the Y-shaped elastic sheet; 45 is the pressing block; 451 is the pressing sheet; 452 is the movable column; 453 is the nut; 46 is the spring; 5 is the collection box; 51 is the inlet; 52 is the folding plate handle. Specific embodiments

[0018] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention will be further described below with reference to the drawings and embodiments. It should be noted that, without conflict, the embodiments of the present application and the features in the embodiments may be combined with each other. For the convenience of description, the words "upper", "lower", "left" and "right" as used below only represent the same directions as the upper, lower, left and right directions of the drawings themselves, and do not limit the structure.

[0019] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited by the limitations of the specific embodiments disclosed in the following specification.

[0020] Embodiment, as Figures 1 to 4 shown, the photoresist coating device for diode chip production provided by the present invention includes a station panel 2 and a roller brush 3. The station panel 2 is used to place the chip board 1. The roller brush 3 includes a brush rod 31 and a brush handle 32. A brush roller 33 is provided at the bottom of the brush rod 31. A guiding groove 34 is provided at the bottom of the brush rod 31. End plates 35 are provided at both ends of the guiding groove 34. The top of the end plate 35 is connected to the top of the brush rod 31 by screws. A shaft hole 36 for installing the brush roller 33 is provided on the end plate 35. A fixture 4 for elastically clamping the chip board 1 is provided on the station panel 2. The fixture 4 includes a fixing plate 41. A clamping opening 42 is provided at the bottom of the fixing plate 41. The clamping opening 42 cooperates with a corner of the chip board 1. A bow-shaped plate 43 is provided on the side of the fixing plate 41. The bow-shaped opening of the bow-shaped plate 43 faces the clamping opening 42. A Y-shaped elastic sheet 44 is provided on the bow-shaped plate 43. The tail end of the Y-shaped elastic sheet 44 is connected to the bow-shaped plate 43 by screws. Two pressing blocks 45 are provided at the head end of the Y-shaped elastic sheet 44. The bottom of the pressing block 45 is located inside the clamping opening 42. A spring 46 is provided between the bottom surface of the head end of the Y-shaped elastic sheet 44 and the top surface of the fixing plate 41. The spring 46 is sleeved and cooperates with the pressing block 45.

[0021] Specifically, place the chip plate 1 under the fixture 4. The clamping port 42 and the bow-shaped plate 43 position the chip plate 1. Pressing the Y-shaped elastic piece 44 can press the chip plate 1. Holding the roller brush 3 can coat the photoresist on the chip plate 1 without staining the fingers, so as not to affect the efficiency of manually picking and placing the chip plate 1. The roller brush 3 is clamped by the end plate 35. The end plate 35 controls the tension with the roller brush 3 by sliding along the guide groove 34. The end plate 35 is fixedly connected to the brush rod 31 by screws. This not only provides the condition for rolling and applying glue but also prevents the roller from slipping during the rolling process, with good stability and strong practicability.

[0022] To improve the flexibility of using the fixture 4, the pressing block 45 provided by the present utility model includes a pressing piece 451. An active column 452 is provided at the top of the pressing piece 451. The spring 46 is sleeved on the active column 452. The active column 452 cooperates with the active hole provided on the fixed plate 41. A nut 453 is provided at the top of the active column 452. Among them, in the natural state, the Y-shaped elastic piece 44 is pushed up by the spring 46, and the pressing piece 451 is in a suspended state. By pressing the Y-shaped elastic piece 44, the spring 46 is compressed, and the pressing piece 451 descends until it presses on the chip plate 1 with applied glue. The Y-shaped elastic piece 44 can simultaneously control the up and down movement of two pressing pieces 451, so it can ensure the pressing effect of the entire fixture 4 on the chip plate 1 to ensure the quality of glue application.

[0023] To improve the matching effect between the clamping port 42 and the chip plate 1, a V-shaped inclined surface 421 is provided at one end of the clamping port 42 away from the bow-shaped plate 43. This is because most chip plates 1 use square adhesive sheets as the substrate of the chip plate 1, and the V-shaped inclined surface 421 can fit with the corner edge of the chip plate 1, thereby improving the matching quality between the clamping port 42 and the chip plate 1.

[0024] To prevent excess photoresist from staying on the working station panel 2 for a long time and affecting the subsequent glue application quality, a pair of sinking grooves 21 are provided on the working station panel 2 on the opposite side of the fixed plate 41. The shape of the sinking grooves 21 is a right trapezoid, and the inclined waist of the right trapezoid faces the symmetry center of the two sinking grooves 21. The bottom surface of the sinking groove 21 is an inclined surface. The interval area between the two sinking grooves 21 is slightly larger than the glue application area of the chip plate 1. The photoresist that exceeds the area of the chip plate 1 and falls from the roller brush 3 can gradually flow along the inclined surface of the sinking groove 21 to the bottom of the groove, preventing the photoresist from gradually accumulating and affecting the glue application quality of other chip plates 1.

[0025] In order to effectively collect photoresist, the utility model is provided with a discharge outlet 22 at the end of the sedimentation tank 21, a slide plate opening 23 communicated with the discharge outlet 22 is arranged on the side surface of the sedimentation tank 21, a collection box 5 which is slidably matched with the slide plate opening 23 is arranged in the slide plate opening 23, an inlet 51 opposite to the discharge outlet is arranged on the collection box 5, and a folding plate handle 52 is arranged at the end of the collection box 5. In this way, the redundant photoresist can gradually flow from the sedimentation tank 21 into the collection box 5. The collection box 5 can be made to slide along the slide plate opening 23 by pulling the folding plate handle, and the collection box 5 can be directly taken out when it moves to the open position of the slide plate opening 23.

[0026] The above are only the preferred embodiments of the utility model, and the utility model is not limited to other forms. Any person skilled in the art may use the disclosed technical content to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the utility model without departing from the technical solution content of the utility model still belong to the protection scope of the technical solution of the utility model.

Claims

1. A photoresist coating device for diode chip production, comprising a workbench panel and a roller brush. The workbench panel is used to place the chip plate. The roller brush includes a brush rod and a brush handle. A brush roller is arranged at the bottom of the brush rod, and it is characterized in that, A guide groove is provided at the bottom of the brush rod. End plates are provided at both ends of the guide groove. The top of the end plate is connected to the top of the brush rod by screws. A shaft hole for installing the brush roller is provided on the end plate. A fixture for elastically clamping the chip plate is provided on the station panel. The fixture includes a fixing plate. A clamping opening is provided at the bottom of the fixing plate. The clamping opening cooperates with a corner of the chip plate. An arcuate plate is provided on the side of the fixing plate. The arcuate opening of the arcuate plate faces the clamping opening. A Y-shaped elastic piece is provided on the arcuate plate. The tail end of the Y-shaped elastic piece is connected to the arcuate plate by screws. Two pressing blocks are provided at the head end of the Y-shaped elastic piece. The bottom of the pressing block is located inside the clamping opening. A spring is provided between the bottom surface of the head end of the Y-shaped elastic piece and the top surface of the fixing plate. The spring is sleeved and cooperates with the pressing block.

2. The photoresist coating device for diode chip production according to claim 1, wherein The pressing block includes a pressing piece. A movable column is provided at the top of the pressing piece. The spring is sleeved on the movable column. The movable column cooperates with a movable hole provided on the fixing plate. A nut is provided at the top of the movable column.

3. The photoresist coating device for diode chip production according to claim 2, wherein, A V-shaped inclined surface is provided at one end of the clamping opening away from the arcuate plate.

4. The photoresist coating device for diode chip production according to claim 3, wherein A pair of sinking grooves are provided on the station panel on the opposite side of the fixing plate. The shape of the sinking groove is a right trapezoid and the oblique waist of the right trapezoid faces the symmetric center of the two sinking grooves. The bottom surface of the sinking groove is an inclined surface.

5. The photoresist coating device for diode chip production according to claim 4, wherein A discharge port is provided at the end of the sinking groove. A slide plate opening communicating with the discharge port is provided on the side of the sinking groove. A collection box slidably matched with it is provided in the slide plate opening. An inlet opposite to the discharge port is provided on the collection box. A folding plate handle is provided at the end of the collection box.

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