Microstrip line simulation capacitor
By employing a microstrip line to simulate a capacitor in the filter, the problem of insufficient space for capacitor structures in miniaturized filters is solved, achieving space saving and cost reduction, and improving performance consistency.
Patent Information
- Application Number
- CN202421615777.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-07-08
AI Technical Summary
In the existing technology, as the shape of the filter gradually shrinks, the space of the coupling plate decreases, making it difficult to meet the distance requirements between the capacitor and the screw hole, which affects the design of the capacitor structure.
Microstrip lines are used to simulate capacitors. By setting top and bottom microstrip lines on the substrate and connecting the top and bottom microstrip lines in through-holes, capacitors of corresponding specifications are formed, reducing space occupation. Grounding is achieved through conductive connection materials to prevent contact accidents.
This reduces the space occupied by capacitors on the coupling plate, lowers material costs, improves performance consistency, and meets the requirement of smaller filter size.
Smart Images
Figure CN223180970U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electrical components, and more specifically, it relates to a microstrip line analog capacitor. Background Technique
[0002] The coupling board is a structure used to couple and connect test instruments in a filter, and is generally located at the antenna end of the filter.
[0003] In the prior art, in order to meet the required indicators, electronic components such as ceramic capacitors are usually added to the microstrip line. At the same time, in order to meet the quality requirements during the installation of the coupling board, the adding position of the ceramic capacitor needs to be at a certain distance from the position of the screw hole.
[0004] However, with the development of technology and the gradual improvement of the requirements for filters, the external shape design of the filter becomes smaller and smaller, and the space of the coupling board also gradually decreases accordingly. As a result, when meeting the requirements of the indicators, the distance requirement between the capacitor and the screw hole cannot be met, leading to the difficulty in the design of the capacitor structure to meet the demand for the reduction of the external shape of the filter, which needs to be improved. Content of the Utility Model
[0005] In view of this, the purpose of this application is to provide a microstrip line analog capacitor to achieve the purpose of reducing the space occupied by the capacitor on the coupling board so as to meet the demand for the reduction of the external shape of the filter. The specific scheme is as follows:
[0006] A microstrip line analog capacitor includes a substrate for fixing. At least one through hole is provided through the substrate, and a top microstrip line and a bottom microstrip line are respectively arranged on both sides. A connecting strip is arranged in the through hole, and the top microstrip line and the bottom microstrip line are connected to the corresponding ends of the connecting strip; wherein, the length and width of the top microstrip line and the bottom microstrip line are both smaller than the corresponding length and width of one side of the substrate.
[0007] Preferably: Top and bottom ground planes for grounding are respectively arranged on both sides of the substrate. The top microstrip line is located within the top ground plane and a top gap is formed between the top microstrip line and the top ground plane; the bottom microstrip line is located within the bottom ground plane and a bottom gap is formed between the bottom microstrip line and the bottom ground plane.
[0008] Preferably: The diameter of the through hole, the length and width of the bottom microstrip line are adjustable.
[0009] Preferably: The thicknesses of the top microstrip line, the bottom microstrip line and the connecting strip are all 1OZ, and they are respectively a top copper-clad microstrip line, a bottom copper-clad microstrip line and a copper-clad connecting strip.
[0010] Preferably: the top-layer copper-clad microstrip line is a top-layer solder mask microstrip line, the bottom-layer copper-clad microstrip line is a bottom-layer solder mask microstrip line, and the copper-clad connection strip is a solder mask connection strip.
[0011] As can be seen from the above solutions, the present application provides a microstrip line analog capacitor, which has the following beneficial effects: by covering the substrate with a top-layer microstrip line and a bottom-layer microstrip line, and forming a capacitor with corresponding specifications when connecting the top-layer microstrip line and the bottom-layer microstrip line with a connection strip in the through hole, the space occupied by the capacitor on the coupling board is reduced, and at the same time, the material cost is reduced and the consistency of the coupling board index is improved, meeting the requirement of reducing the shape of the filter. Description of the Drawings
[0012] Figure 1 is a schematic structural diagram of this embodiment;
[0013] Figure 2 is a schematic structural diagram of this embodiment from another angle.
[0014] Description of the reference numerals: 1. Substrate; 2. Top-layer ground plane; 3. Top-layer microstrip line; 4. Top interval; 5. Through hole; 6. Bottom-layer microstrip line; 7. Bottom-layer ground plane; 8. Bottom interval. Detailed Embodiments
[0015] To make the technical solutions and advantages of the present utility model clearer, the following will further describe the present utility model in detail with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0016] As Figure 1 shown, a microstrip line analog capacitor includes a substrate 1 for fixing. Microstrip lines are provided on both sides of the substrate 1, and by connecting the microstrip lines on both sides, a capacitor with corresponding specifications is formed, thereby avoiding the installation of ceramic capacitors and effectively saving space.
[0017] As Figure 1 、 Figure 2 shown, at least one through hole 5 is provided through the substrate 1. A connection strip is provided in the through hole 5. It should be noted that the microstrip line includes a top-layer microstrip line 3 and a bottom-layer microstrip line 6 on both sides of the substrate 1, and the corresponding ends of the top-layer microstrip line 3 and the bottom-layer microstrip line 6 are connected to the connection strip. Among them, the lengths and widths of the top-layer microstrip line 3 and the bottom-layer microstrip line 6 are both smaller than the corresponding lengths and widths on one side of the substrate 1, and this is used to achieve the purpose of avoiding contact point accidents.
[0018] It should be noted that a top ground plane 2 and a bottom ground plane 7 for grounding are respectively arranged on both sides of the substrate 1. Among them, the top microstrip line 3 is located inside the top ground plane 2 and a top gap 4 is formed between the top microstrip line 3 and the top ground plane 2. The bottom microstrip line 6 is located inside the bottom ground plane 7 and a bottom gap 8 is formed between the bottom microstrip line 6 and the bottom ground plane 7. Furthermore, the top ground plane 2 and the bottom ground plane 7 are grounded through a conductive connection material, which effectively prevents contact electric shock accidents.
[0019] In order to effectively adjust the specification capacitance, the diameter of the via hole 5, the length and width of the bottom microstrip line 6 in the embodiments of the present application are adjustable.
[0020] At the same time, the thicknesses of the top microstrip line 3, the bottom microstrip line 6 and the connection strip in the embodiments of the present application are all 1OZ, and the top copper-clad microstrip line, the bottom copper-clad microstrip line and the copper-clad connection strip are respectively adopted. Among them, the top copper-clad microstrip line is a top surface solder mask microstrip line, the bottom copper-clad microstrip line is a bottom surface solder mask microstrip line, and the copper-clad connection strip is a surface solder mask connection strip.
[0021] In summary, the present application provides a microstrip line analog capacitor. The microstrip line analog capacitor forms a capacitor with corresponding specifications when the top microstrip line 3 and the bottom microstrip line 6 cover the substrate 1 and the connection strip connects the top microstrip line 3 and the bottom microstrip line 6 in the via hole 5, thereby reducing the space occupied by the capacitor on the coupling board, reducing the material cost and improving the consistency of the coupling board index, and meeting the requirement of reducing the shape of the filter.
[0022] The "first", "second", "third", "fourth", etc. (if any) involved in the present application are used to distinguish similar objects and do not have to be used to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments described here can be implemented in an order other than that illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method or device including a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods or devices.
[0023] It should be noted that the descriptions involving "first", "second", etc. in this application are for descriptive purposes only, and should not be construed as indicating or implying their relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. Additionally, the technical solutions between various embodiments may be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.
[0024] Specific examples are used in this article to elaborate on the principles and implementation manners of this application. The descriptions of the above embodiments are only for helping to understand the method and its core idea of this application; at the same time, for those of ordinary skill in the art, according to the idea of this application, there will be changes in the specific implementation manners and application scopes. In summary, the content of this specification should not be construed as a limitation to this application.
Claims
1. A microstrip line analog capacitor, characterized in that: It includes a substrate (1) for fixation. At least one through hole (5) is provided through the substrate (1), and a top microstrip line (3) and a bottom microstrip line (6) are respectively arranged on both sides. A connecting strip is arranged in the through hole (5), and the corresponding ends of the top microstrip line (3) and the bottom microstrip line (6) are connected to the connecting strip; wherein, the lengths and widths of the top microstrip line (3) and the bottom microstrip line (6) are both smaller than the corresponding lengths and widths of one side of the substrate (1).
2. The microstrip line analog capacitor according to claim 1, wherein: A top ground plane (2) and a bottom ground plane (7) for grounding are respectively arranged on both sides of the substrate (1). The top microstrip line (3) is located in the top ground plane (2) and a top gap (4) is formed between the top microstrip line (3) and the top ground plane (2); the bottom microstrip line (6) is located in the bottom ground plane (7) and a bottom gap (8) is formed between the bottom microstrip line (6) and the bottom ground plane (7).
3. A microstrip line analog capacitor according to claim 1, characterized in that: The diameter of the through hole (5), the length and width of the bottom microstrip line (6) are adjustable.
4. A microstrip line analog capacitor according to claim 1, characterized in that: The thicknesses of the top microstrip line (3), the bottom microstrip line (6) and the connecting strip are all 1OZ, and they are respectively a top copper-clad microstrip line, a bottom copper-clad microstrip line and a copper-clad connecting strip.
5. The microstrip line analog capacitor according to claim 4, characterized in that: The top copper-clad microstrip line is a top solder mask microstrip line, the bottom copper-clad microstrip line is a bottom solder mask microstrip line, and the copper-clad connecting strip is a solder mask connecting strip.