Anti-crack low-frequency high-power ceramic capacitor

Abstract

The utility model discloses an anti-crack low-frequency high-power ceramic capacitor, which relates to the field of capacitor structures, and comprises a capacitor internal mechanism and a terminal electrode, the capacitor internal mechanism comprises an internal electrode assembly, the internal electrode assembly is connected with the terminal electrode, and the capacitor internal mechanism comprises a plurality of laminated ceramic units. Each ceramic unit comprises a plurality of stacked ceramic membrane stacking blocks, each ceramic membrane stacking block comprises a ceramic membrane and an inner electrode, the inner electrode comprises a leading-out end and an embedding end which are oppositely arranged, the leading-out end is arranged at the end part of the ceramic membrane, the width of the leading-out end is b1, and the width of the embedding end is b2 and b1lt; and b2, the projections of the leading-out ends of the ceramic laminated film blocks in the single ceramic unit in the axial direction are staggered, and the sum of the widths of the leading-out ends on the same side is b2. Through the above structure, bending deformation of the ceramic diaphragm is reduced, and the capacitor structure is prevented from generating cracks.

Description

Technical Field

[0001] The utility model relates to the field of capacitor structures, and particularly relates to a crack-resistant low-frequency high-power ceramic capacitor. Background Technique

[0002] Low-frequency high-power ceramic capacitors are high-power capacitors used in fields such as power systems, electronic devices, and electric motors, using ceramic materials as dielectrics. Ceramic materials have the characteristics of high capacitance stability and low dielectric loss, and can maintain stable electrical performance under high voltage and temperature conditions. In addition, ceramic materials also have good high-temperature resistance and corrosion resistance, and are suitable for use in harsh environments. Ceramic capacitors usually adopt a multi-layer structure, composed of stacked ceramic dielectric films and metal electrodes. Low-frequency high-power ceramic capacitors have good insulation performance, stability, and high-temperature resistance, and are suitable for low-frequency high-power application scenarios. They are widely used in reactive power compensation in power systems, filtering and voltage regulation of high-power electronic devices, starting and speed regulation of electric motors, etc. Low-frequency high-power ceramic capacitors are mainly used in the power systems of electric vehicles, electric vehicle charging piles and charging equipment in the field of new energy vehicles, providing important support for the stable operation of power systems and the reliable and stable operation of electronic devices. With the continuous progress of new energy vehicle technology, the market demand for low-frequency high-power ceramic capacitors will gradually increase.

[0003] The manufacturing process flow of multi-layer ceramic capacitors (MLCC) (such as Figure 1 )

[0004] (1) First, add adhesives, plasticizers, solvents, and dispersants to the ceramic powder according to the set quality, and stir and mix in a ball mill for a set time until uniform to obtain a ceramic slurry with the required viscosity. The ceramic slurry is evenly coated on the film carrier tape by a doctor blade or spraying device on a casting machine, and the set thickness of the ceramic film is obtained by controlling the flow rate of the slurry. The film tape is dried and wound up to form a dry ceramic film.

[0005] (2) Then, the inner electrode slurry is printed on the ceramic film in the form of screen printing according to the designed screen pattern, and after drying, a multi-layer ceramic capacitor inner electrode layer with a certain thickness is formed. Then, the film pieces printed with the inner electrode slurry and the blank film pieces are pressed together in a staggered stacking manner according to the designed number of layers to form a ceramic block. After the ceramic block is compacted by warm isostatic pressing, it is then precisely cut to obtain capacitor chip green bodies with designed dimensions, capacitance values, and quantities.

[0006] (3) After that, the green body is heat-treated according to the set temperature curve to remove the binder, and then a fired capacitor chip green body is formed after high-temperature sintering. To facilitate the extraction of the internal electrodes and increase the adhesion of the end materials, the fired chip green body also needs to be chamfered. After chamfering the chip green body, the two ends with opposite polarities are coated with a conductive paste by dipping to form end electrodes. After silver firing, it is cured and tightly connected to the internal electrodes to become a multilayer ceramic capacitor component with substantial capacitance performance.

[0007] (4) A thermal barrier layer (usually nickel or copper) needs to be electroplated on the ends of the multilayer ceramic capacitor chip after silver firing. The purpose is to prevent the silver-containing end electrodes from being eroded by the solder during the welding process, resulting in an open circuit between the internal electrodes of the component and the outside. Although nickel and copper are solderable, they are prone to oxidation, resulting in poor solderability. Therefore, a tin-lead layer needs to be plated on the outermost layer finally to enhance the solderability of the capacitor component.

[0008] (5) After electroplating, the multilayer ceramic capacitor undergoes processes such as marking, screening, measurement, and packaging. After passing the inspection, it becomes a finished product.

[0009] To achieve a large capacitance for low-frequency high-power multilayer ceramic capacitors, a large number of internal electrodes and ceramic dielectric films are often laminated and pressed into a ceramic green body block in a misaligned stacking manner. The schematic diagram is shown in Figure 2 . In the prior art, rectangular internal electrode patterns with regular shapes and ceramic dielectric films are generally used. Its main feature is that the graphic width at the connection between the internal electrode and the external electrode (see b1 in Figure 2 ) is the same as the width buried inside the ceramic body (see b2 in Figure 2 ). The schematic diagram of the internal electrode stacking of the capacitor in the prior art is shown in Figure 3 .

[0010] Based on the processing principle of multilayer ceramic capacitors, since both the internal electrode paste and the ceramic dielectric film have a certain thickness, a thickness difference will be formed between the parts with internal electrodes and the blank parts after stacking into a green body block. The more layers of internal electrodes are stacked, the greater the difference. The schematic diagram of observing the ceramic green body block of the capacitor along the axial direction from the end of the capacitor is shown in Figure 4 .

[0011] To ensure greater density inside the ceramic capacitor, reduce pores and defects, and improve the density and performance of the material, the green body block after film stacking needs to be subjected to warm isostatic pressing. Warm isostatic pressing is to place the ceramic green body block in warm water and apply omnidirectional pressure to the block through the water, so that the material undergoes plastic deformation under temperature conditions. The schematic diagram of the principle is shown in Figure 5 .

[0012] Due to the existence of the thickness difference of the inner electrodes, under the action of warm isostatic pressing pressure, the ceramic dielectric diaphragm extends towards the part with the thickness difference and fills the voids, and the originally flat-stacked ceramic dielectric diaphragms undergo bending deformation. In the prior art, when observing the green body of a multi-layer ceramic capacitor along the axial direction from the end direction after warm isostatic pressing, each layer of inner electrodes is neatly aligned and has the same width, and the ceramic dielectric diaphragms near the inner electrodes are significantly deformed. For the schematic diagram, see Figure 6 .

[0013] In the cross-section of the joint part of the inner electrode and the end electrode of the multi-layer ceramic capacitor in the prior art, relatively deep dielectric deformation wrinkles can be observed under the dark field of the microscope. For the actual diagram, see Figure 7 a (dark field).

[0014] Due to the performance differences between different materials, such as different thermal expansion coefficients and different sintering shrinkage rates, etc., these differences will cause stress to be generated between the internal material layers during the debinding and sintering processes of the capacitor, and the part where the material undergoes bending deformation is the stress concentration part. In the joint part of the inner electrode and the end electrode of the multi-layer ceramic capacitor, during the sintering process, it undergoes oxidation shrinkage first due to being exposed to the air, and this is exactly the stress concentration part of the dielectric deformation. Under the superposition of the sintering shrinkage stress and the material deformation stress, it is very easy to exceed the bonding force between the material layers and generate cracks 16, see Figure 8 ; In the multi-layer ceramic capacitor with a larger number of electrode layers, tiny cracks can usually be observed in the dielectric deformation part at the end under the bright field of the microscope, see Figure 7 b (bright field).

[0015] These tiny cracks will reduce the ability of the multi-layer ceramic capacitor to resist mechanical stress and thermal stress. Low-frequency high-power multi-layer ceramic capacitors are generally used in fields such as power systems, electronic devices, and electric motors. During the installation and use processes, they will inevitably be subjected to mechanical stresses such as vibration and shock, and thermal stresses caused by high-power high-temperature environments and self-heating. These stresses will cause the original tiny cracks in the capacitor to expand, which is extremely likely to lead to leakage. And the leakage will cause local heating inside the device, further reducing the insulation performance of the ceramic dielectric and thus increasing the leakage. This process occurs cyclically and deteriorates continuously. Seriously, it will lead to cracking of the multi-layer ceramic capacitor, and even serious consequences such as combustion.

[0016] In order to improve the absorption ability of low-frequency high-power capacitors to surges and ripples, it is necessary to achieve a large capacitance and have a relatively large number of material stacking layers. Therefore, eliminating the cracks in the ceramic dielectric is the guarantee for improving the quality and use reliability of low-frequency high-power capacitors.

[0017] In view of this, the present application is specifically proposed. Summary of the Utility Model

[0018] The purpose of the present utility model is to provide a crack-resistant low-frequency high-power ceramic capacitor. By appropriately reducing the width of the lead-out end of each layer of the inner electrode assembly in the capacitor and staggering the projections of the lead-out ends of adjacent inner electrodes in the axial direction, the problem that the thickness difference inside the green body caused by the thickness superposition effect of the inner electrode in the prior art easily leads to cracks at the ends of the capacitor is solved.

[0019] The embodiment of the present utility model is realized through the following technical solutions: The embodiment of the present utility model provides a crack-resistant low-frequency high-power ceramic capacitor, including a capacitor internal mechanism and end electrodes. The capacitor internal mechanism includes an inner electrode assembly, and the inner electrode assembly is connected to the end electrodes. The capacitor internal mechanism includes several stacked ceramic units. A single ceramic unit includes multiple stacked ceramic film blocks. Each ceramic film block includes a ceramic film and an inner electrode. The inner electrode is arranged inside the ceramic film. The inner electrodes of each ceramic film are stacked to form an inner electrode assembly.

[0020] Among them, the inner electrode includes a lead-out end and an embedded end arranged oppositely. The lead-out end is arranged at the end of the ceramic film, and the embedded end is arranged inside the ceramic film. The lead-out ends between two adjacent ceramic film blocks are arranged oppositely. The inner electrode assembly includes a positive electrode and a negative electrode, and the positive electrode and the negative electrode are arranged oppositely and are both formed by stacking multiple lead-out ends.

[0021] The width of the lead-out end is b1, and the width of the embedded end is b2, and b1 < b2.

[0022] The projections of the lead-out ends of each ceramic film block in a single ceramic unit in the axial direction are staggered, and the sum of the widths of the lead-out ends on the same side is b2.

[0023] Preferably, a single ceramic unit includes a first ceramic film block, a second ceramic film block, a third ceramic film block, and a fourth ceramic film block stacked in sequence.

[0024] Among them, the first ceramic film block and the second ceramic film block are 180° rotation structures with each other, and the third ceramic film block and the fourth ceramic film block are 180° rotation structures with each other.

[0025] The inner electrode on the first ceramic film block is provided with several lead-out ends, and the width of each lead-out end of the first ceramic film block is b1 and they are arranged on the same side; the inner electrode on the third ceramic film block is provided with several lead-out ends, and the width of each lead-out end of the third ceramic film block is b1 and they are arranged on the same side.

[0026] The sum of the widths of the lead-out ends of the first ceramic film block and the total width of the lead-out ends of the third ceramic film block is b2; the lead-out ends of the first ceramic film block and the lead-out ends of the third ceramic film block are on the same side and are staggered.

[0027] Preferably, the inner electrode on the first ceramic laminated film block is provided with one lead-out end, and the inner electrode on the third ceramic laminated film block is provided with one lead-out end.

[0028] Preferably, the inner electrode on the first ceramic laminated film block is provided with two lead-out ends, there is a gap between the two lead-out ends of the first ceramic laminated film block, the width of the gap is b1, and the inner electrode on the third ceramic laminated film block is provided with one lead-out end.

[0029] Preferably, a single ceramic unit includes ceramic laminated film blocks A, B, C, D, E, and F laminated in sequence;

[0030] Among them, ceramic laminated film block A and ceramic laminated film block B are 180° rotation structures with respect to each other, ceramic laminated film block C and ceramic laminated film block D are 180° rotation structures with respect to each other, and ceramic laminated film block E and ceramic laminated film block F are 180° rotation structures with respect to each other;

[0031] The inner electrode on ceramic laminated film block A is provided with one lead-out end, and the widths are all b1. The inner electrode on ceramic laminated film block C is provided with one lead-out end, and the widths are all b1. The inner electrode on ceramic laminated film block C is provided with one lead-out end, and the width is b1, b1 = b2. The lead-out ends of ceramic laminated film block A, ceramic laminated film block C, and ceramic laminated film block E are all on the same side and are arranged in a staggered manner.

[0032] Preferably, the first ceramic laminated film block and the third ceramic laminated film block have the same structure. When the first ceramic laminated film block, the second ceramic laminated film block, the third ceramic laminated film block, and the fourth ceramic laminated film block are laminated, the projection of the lead-out end of the first ceramic laminated film block in the axial direction and the projection of the lead-out end of the third ceramic laminated film block in the axial direction can be spliced into a rectangle, and the splicing length of this rectangle is b2.

[0033] Preferably, the inner electrode of the first ceramic laminated film block is of a "concave" structure, and the inner electrode of the third ceramic laminated film block is of a "convex" structure.

[0034] Preferably, the inner electrode of ceramic laminated film block A is of a "convex" structure. When ceramic laminated film blocks A, B, C, D, E, and F are laminated, the projections of the lead-out ends of ceramic laminated film blocks C and E in the axial direction are respectively located on both sides of the projection of ceramic laminated film block A in the axial direction.

[0035] Preferably, 1 / 3b2 ≤ b1 ≤ 1 / 2b2.

[0036] Preferably, the lengths of the lead-out ends of the inner electrodes in each of the shown ceramic laminated film blocks are equal.

[0037] Compared with the prior art, the embodiment of the present utility model has the following advantages and beneficial effects:

[0038] 1. An anti-cracking low-frequency high-power ceramic capacitor provided by the embodiment of the present utility model has an internal structure of the capacitor set to include a plurality of stacked ceramic units. A plurality of internal electrodes are stacked on both sides of the edges of the ceramic units respectively, and then different ceramic units are stacked, that is, the internal electrodes are stacked continuously, and finally the positive and negative electrodes on both sides are formed. The positive and negative electrodes can be respectively connected to the terminal electrodes to make the capacitor operate. In the embodiment of the present utility model, each ceramic unit is composed of a plurality of stacked ceramic film blocks, and each ceramic film block includes a ceramic film and an internal electrode. Compared with the prior art, the structure of each internal electrode in the embodiment of the present utility model is designed, that is, the width of the lead-out end is set to be smaller than the width of the embedded end, and its stacking order is restricted, that is, the projections of the lead-out ends of each ceramic film block in the axial direction are misaligned, and the sum of the widths of the lead-out ends on the same side is b2. In this way, the thickness of the internal electrodes at both electrodes of the internal structure of the capacitor can be dispersed, the thickness of the internal electrodes at the lead-out ends can be reduced, the bending degree of the ceramic films at the positive and negative electrodes of the obtained capacitor becomes smaller, and no cracks will appear.

[0039] 2. The embodiment of the present utility model changes the overlapping state of the internal electrodes of the multilayer ceramic dielectric capacitor, reduces the overlapping thickness of the internal electrodes at the terminal electrode bonding part to about 1 / 2 to 1 / 3 of the prior art, can improve the thickness difference between the part with internal electrodes and the part without internal electrodes in the green body block of the capacitor, reduce the risk of the capacitor generating cracks, and thus improve the reliability of the capacitor in applications in high-power, high-temperature, and vibration environments.

[0040] Generally speaking, an anti-cracking low-frequency high-power ceramic capacitor provided by the embodiment of the present utility model reduces the width of the lead-out end of each internal electrode in the internal structure of the capacitor, realizes the misalignment of the projections of the lead-out ends of each ceramic film block in a single ceramic unit in the axial direction, so as to reduce the bending deformation of the ceramic film and avoid the generation of cracks in the capacitor structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0042] Figure 1 It is a process flow chart of the production of multilayer ceramic dielectric capacitors in the prior art;

[0043] Figure 2Schematic diagram of the laminated film of a multi-layer ceramic capacitor in the prior art;

[0044] Figure 3 Schematic diagram of the internal structure of a low-frequency multi-layer ceramic capacitor in the prior art;

[0045] Figure 4 Schematic diagram of the thickness difference of the green body bar blocks of a multi-layer ceramic capacitor in the prior art;

[0046] Figure 5 Schematic diagram of the principle of warm isostatic pressing of a multi-layer ceramic capacitor in the prior art;

[0047] Figure 6 Schematic diagram of the deformation of the ceramic laminated film block after warm isostatic pressing in the prior art;

[0048] Figure 7 Physical diagram of the dielectric deformation and cracks of a multi-layer ceramic capacitor in the prior art, where Figure 7 a is the dark field, Figure 7 b is the bright field;

[0049] Figure 8 Schematic diagram of the position where dielectric cracks occur in a multi-layer ceramic capacitor in the prior art;

[0050] Figure 9 Schematic diagram of the internal electrode structure provided in Embodiment 1 of the present invention, where Figure 9 a is the structure diagram of the first ceramic laminated film block, Figure 9 b is the structure diagram of the second ceramic laminated film block, Figure 9 c is the structure diagram of the third ceramic laminated film block, Figure 9 d is the structure diagram of the fourth ceramic laminated film block;

[0051] Figure 10 Schematic diagram of the deformation of the ceramic laminated film block after warm isostatic pressing provided in Embodiment 1 of the present invention;

[0052] Figure 11 Schematic diagram of the internal structure of the capacitor provided in Embodiment 1 of the present invention;

[0053] Figure 12 Schematic diagram of the internal electrode structure provided in Embodiment 2 of the present invention, where Figure 12 a is the structure diagram of the first ceramic laminated film block, Figure 12 b is the structure diagram of the second ceramic laminated film block, Figure 12 c is the structure diagram of the third ceramic laminated film block, Figure 12 d is the structure diagram of the fourth ceramic laminated film block;

[0054] Figure 13 Schematic diagram of the deformation of the ceramic laminated film block after warm isostatic pressing provided in Embodiment 2 of the present invention;

[0055] Figure 14 Structural schematic diagram of the internal mechanism of the capacitor provided in Embodiment 2 of the present utility model;

[0056] Figure 15 Structural schematic diagram of the internal electrode provided in Embodiment 3 of the present utility model, where Figure 15 a is the structural diagram of ceramic laminated block A, Figure 15 b is the structural diagram of ceramic laminated block B, Figure 15 c is the structural diagram of ceramic laminated block C, Figure 15 d is the structural diagram of ceramic laminated block D, Figure 15 e is the structural diagram of ceramic laminated block E, Figure 15 f is the structural diagram of ceramic laminated block F;

[0057] Figure 16 Schematic diagram of the deformation of the ceramic laminated block after warm isostatic pressing provided in Embodiment 3 of the present utility model;

[0058] Figure 17 Structural schematic diagram of the internal mechanism of the capacitor provided in Embodiment 3 of the present utility model.

[0059] Marks in the drawings and corresponding component names:

[0060] Internal mechanism of the capacitor, 2 - ceramic film, 3 - internal electrode, 4 - lead-out end, 5 - embedding end, 6 - first ceramic laminated block, 7 - second ceramic laminated block, 8 - third ceramic laminated block, 9 - fourth ceramic laminated block, 10 - ceramic laminated block A, 11 - ceramic laminated block B, 12 - ceramic laminated block C, 13 - ceramic laminated block D, 14 - ceramic laminated block E, 15 - ceramic laminated block F, 16 - crack. Detailed implementation manners

[0061] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and shown in the accompanying drawings here can be arranged and designed in various different configurations.

[0062] Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed present utility model, but merely represents the selected embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts fall within the scope of protection of the present utility model.

[0063] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.

[0064] In the description of the present utility model, it should be noted that the terms "first", "second", "third", etc. are only used for distinguishing descriptions and cannot be construed as indicating or implying relative importance. Embodiment

[0065] As Figures 9 - 17 shown, a crack-resistant low-frequency high-power ceramic capacitor provided by an embodiment of the present utility model includes a capacitor internal mechanism 1 and end electrodes. The capacitor internal mechanism 1 is responsible for capacitance and electrical performance. The capacitor internal mechanism 1 includes an inner electrode assembly, and the inner electrode assembly is connected to the end electrodes, enabling the capacitor to be connected to an external mechanism. The capacitor internal mechanism 1 includes a plurality of stacked ceramic units. Each single ceramic unit includes a plurality of stacked ceramic film blocks. Each ceramic film block includes a ceramic film sheet 2 and an inner electrode 3. The inner electrode 3 is disposed within the ceramic film sheet 2. The inner electrodes 3 of each ceramic film sheet are stacked to form an inner electrode assembly. Among them, the inner electrode 3 includes an extraction end 4 and an embedding end 5 which are oppositely disposed. The extraction end 4 is disposed at the end of the ceramic film sheet 2, and the embedding end 5 is disposed within the ceramic film sheet 2. The extraction ends 4 between two adjacent ceramic film blocks are oppositely disposed, so that electrodes with opposite polarities can be respectively formed on both sides of the capacitor internal mechanism 1, that is, the inner electrode assembly of the embodiment of the present utility model includes a positive electrode and a negative electrode, and the positive electrode and the negative electrode are oppositely disposed and are both formed by stacking a plurality of extraction ends 4. Compared with the prior art, the core of the embodiment of the present utility model lies in setting the width of the extraction end 4 as b1 and the width of the embedding end 5 as b2, where b1 < b2; and the projections of the extraction ends 4 of each ceramic film block in a single ceramic unit are misaligned axially, and the sum of the widths of the extraction ends 4 on the same side is b2. In the embodiment of the present utility model, by reducing the width of the extraction end 4 of the inner electrode 3 and setting it to be less than the width of the embedding end 5, during the process of staggered stacking of a plurality of ceramic film blocks, each inner electrode 3 will also be staggered and stacked. At the same time, in the embodiment of the present utility model, within a single ceramic unit, the projections of the extraction ends 4 of each ceramic film block are misaligned axially, which can reduce the stacking thickness of the extraction ends 4 axially, avoid excessive bending and deformation of the ceramic film sheet 2 during the process of filling the gaps, and ensuring that the sum of the widths of the extraction ends 4 on the same side is b2 can accurately avoid excessive bending and deformation of the ceramic film sheet 2 during the process of filling the gaps, thereby avoiding the crack 16 phenomenon in the prior art.

[0066] It should be noted that the "left" and "right" mentioned above refer to the left and right sides in the attached drawings, and the "axial direction" refers to the up and down directions in the attached drawings. The above description is only for more clearly describing the solutions of the embodiments of the present invention in combination with the attached drawings of the embodiments of the present invention. In the embodiments of the present invention, the direction is not limited by the above description. For the convenience of understanding, in the following description, the positions are described based on this.

[0067] Exemplarily, such as Figures 9 - 14As shown, a single ceramic unit includes a first ceramic laminated film block 6, a second ceramic laminated film block 7, a third ceramic laminated film block 8, and a fourth ceramic laminated film block 9 stacked in sequence; that is, each ceramic unit only includes four ceramic laminated film blocks. Of course, in other embodiments, the number of ceramic laminated film blocks in a single ceramic unit is not limited and can be set according to actual needs. Returning to the embodiment of the present utility model, the first ceramic laminated film block 6 and the second ceramic laminated film block 7 are in a 180° rotation structure with each other, and the third ceramic laminated film block 8 and the fourth ceramic laminated film block 9 are in a 180° rotation structure with each other; a plurality of lead-out ends 4 are provided on the internal electrode 3 of the first ceramic laminated film block 6, and the width of the lead-out end 4 of each first ceramic laminated film block 6 is b1 and is arranged on the same side; a plurality of lead-out ends 4 are provided on the internal electrode 3 of the third ceramic laminated film block 8, and the width of the lead-out end 4 of each third ceramic laminated film block 8 is b1 and is arranged on the same side; the sum of the widths of the lead-out ends 4 of the first ceramic laminated film block 6 and the total width of the lead-out ends 4 of the third ceramic laminated film block 8 is b2; the lead-out ends 4 of the first ceramic laminated film block 6 and the lead-out ends 4 of the third ceramic laminated film block 8 are arranged on the same side and are offset. Specifically, the stacking of the four ceramic laminated film blocks in the embodiment of the present utility model is limited by order. Specifically, the second ceramic laminated film block 7 is stacked on the first ceramic laminated film block 6, the third ceramic laminated film block 8 is stacked on the second ceramic laminated film block 7, and the fourth ceramic laminated film block 9 is stacked on the third ceramic laminated film block 8, and two adjacent ceramic laminated film blocks are cross-stacked. Specifically, the lead-out ends 4 of the first ceramic laminated film block 6 and the third ceramic laminated film block 8 can be to the left, and the lead-out ends 4 of the second ceramic laminated film block 7 and the fourth ceramic laminated film block 9 can be to the right; or the lead-out ends 4 of the first ceramic laminated film block 6 and the third ceramic laminated film block 8 can be to the right, and the lead-out ends 4 of the second ceramic laminated film block 7 and the fourth ceramic laminated film block 9 can be to the left. Because the lead-out ends 4 of the first ceramic laminated film block 6 and the third ceramic laminated film block 8 are in the same direction, and the lead-out ends 4 of the second ceramic laminated film block 7 and the fourth ceramic laminated film block 9 are in the same direction, then the lead-out ends 4 of the first ceramic laminated film block 6 and the third ceramic laminated film block 8 will be stacked axially, and the lead-out ends 4 of the second ceramic laminated film block 7 and the fourth ceramic laminated film block 9 will also be stacked axially. Since the lead-out ends 4 of the first ceramic laminated film block 6 of the embodiment of the present utility model and the lead-out ends 4 of the third ceramic laminated film block 8 are axially offset, then the lead-out ends 4 of the second ceramic laminated film block 7 and the fourth ceramic laminated film block 9 are also axially offset based on rotation. Here, the offset arrangement means that the projection parts in the axial direction overlap, which can reduce the thickness of the lead-out ends 4 of the internal electrode 3 in the stacking. At the same time, the sum of the widths of the lead-out ends 4 of the first ceramic laminated film block 6 and the total width of the lead-out ends 4 of the third ceramic laminated film block 8 is b2, which means that the sum of the widths of the lead-out ends 4 of the second ceramic laminated film block 7 and the total width of the lead-out ends 4 of the fourth ceramic laminated film block 9 is also b2, ensuring that the ceramic film 2 near the positive electrode and the negative electrode of the ceramic capacitor will not be overly bent and deformed.

[0068] The structure of the embodiment of the present utility model will be specifically described below through Embodiment 1 and Embodiment 2:

[0069] Embodiment 1: As shown in Figures 9 - 11 , an inner electrode 3 on the first ceramic laminate block 6 is provided with a lead-out end 4, and an inner electrode 3 on the third ceramic laminate block 8 is provided with a lead-out end 4. The first ceramic laminate block 6 and the third ceramic laminate block 8 have the same structure. When the first ceramic laminate block 6, the second ceramic laminate block 7, the third ceramic laminate block 8, and the fourth ceramic laminate block 9 are stacked, the projection of the lead-out end 4 of the first ceramic laminate block 6 in the axial direction and the projection of the lead-out end 4 of the third ceramic laminate block 8 in the axial direction can be spliced into a rectangle, and the splicing length of this rectangle is b2. Exemplarily, the four ceramic laminate blocks are all composed of a figure spliced by two rectangles. The first ceramic laminate block 6 and the second ceramic laminate block are in a 180° rotation structure, and the third ceramic laminate block 8 and the fourth ceramic laminate block are in a 180° rotation structure. The structures of the first ceramic laminate block 6 and the third ceramic laminate block 8 are also the same, except for the stacking direction. The lead-out end 4 of the first ceramic laminate block 6 is arranged inside, and the lead-out end 4 of the third ceramic laminate block 8 is arranged outside. When the four ceramic laminate blocks are stacked in sequence, the projections of the first ceramic laminate block 6 and the third ceramic laminate block 8 in the axial direction are just staggered, and the gap of the connecting part can be filled. In this way, although there are two connecting parts stacked on the left or right side in the axial direction respectively, due to the internal and external staggering of the two connecting parts, there is actually only one layer of thickness of the connecting part in the axial direction. The embodiment of the present utility model reduces the thickness of the positive electrode and the negative electrode on the premise of ensuring the performance of the capacitor electrode structure, and avoids excessive bending deformation of the ceramic film 2 when filling the voids. In the embodiment of the present utility model, the graphic width (see b1 in Figure 9 ) at the connection of each inner electrode 3 and the outer electrode is 1 / 2 of the width (see b2 in Figure 9 ) buried inside the ceramic body, where the length L1 is equal to the margin of the capacitor, and L2 is equal to the length of the capacitor opposite to the adjacent inner electrode 3. The schematic diagram of the overlapping of the inner electrodes 3 at the end of the capacitor adopting this scheme is shown in Figure 10 , and the perspective view of the structure of the inner electrode 3 of the capacitor is shown in Figure 11 . It should be noted that generally, when 1 / 3b2 ≤ b1 ≤ 1 / 2b2, the present utility model achieves better effects. Of course, in other embodiments, there is no limitation, as long as the purpose of avoiding excessive bending deformation of the ceramic film 2 when filling the voids can be achieved. Of course, in order to improve the consistency and reliability of the ceramic capacitor of the embodiment of the present utility model, the lengths of the lead-out ends 4 of the inner electrodes 3 in each of the shown ceramic laminate blocks are equal.

[0070] Embodiment 2: As shown in Figures 12 - 14As shown, the difference from Example 1 is that the structure of the internal electrode 3 is different. Specifically, the internal electrode 3 on the first ceramic laminate block 6 is provided with two lead terminals 4. There is a gap between the two lead terminals 4 of the first ceramic laminate block 6, and the width of the gap is b1. The internal electrode 3 on the third ceramic laminate block 8 is provided with one lead terminal 4. That is, among the four ceramic laminate blocks in Example 2, the first ceramic laminate block 6 has two lead terminals 4, and there is a gap between the two lead terminals 4. The third ceramic laminate block 8 is provided with one lead terminal 4. In the axial projection, the lead terminal 4 on the third ceramic laminate block 8 can be projected into the gap, just offset from the two lead terminals 4 of the first ceramic laminate block 6. Preferably, the internal electrode 3 of the first ceramic laminate block 6 is a "concave" structure, and the internal electrode 3 of the third ceramic laminate block 8 is a "convex" structure. Exemplarily, the graphic width of each internal electrode 3 at the connection with the external electrode (see Figure 12 b1) is the width buried inside the ceramic body (see Figure 12 1 / 3 of b2), where length L1 is equal to the capacitor margin, and L2 is equal to the length of the adjacent inner electrodes 3 of the capacitor facing each other. The schematic diagram of the overlapping inner electrodes 3 of the capacitor end using this scheme is shown in FIG. Figure 13 , the perspective view of the capacitor inner electrode 3 structure is shown in Figure 14 .

[0071] Example 3: Figures 15 - 17 As shown, in Example 3, a single ceramic unit includes a ceramic film stack block A10, a ceramic film stack block B11, a ceramic film stack block C12, a ceramic film stack block D13, a ceramic film stack block E14 and a ceramic film stack block F15 stacked in sequence; wherein, the ceramic film stack block A10 and the ceramic film stack block B11 are 180° rotated structures with each other, the ceramic film stack block C12 and the ceramic film stack block D13 are 180° rotated structures with each other, and the ceramic film stack block E14 and the ceramic film stack block F15 are 180° rotated structures with each other. Rotation structure; the internal electrode 3 on the ceramic film stack A10 is provided with a lead end 4, and the width is b1. The internal electrode 3 on the ceramic film stack C12 is provided with a lead end 4, and the width is b1. The internal electrode 3 on the ceramic film stack C12 is provided with a lead end 4, and the width is b1, b1=1 / 3b2. The lead end 4 of the ceramic film stack A10, the lead end 4 of the ceramic film stack C12, and the lead end 4 of the ceramic film stack E14 are all arranged on the same side and staggered with each other. Preferably, the internal electrode 3 of the ceramic film stack A10 has a "convex" structure. When the ceramic film stacks A10, B11, C12, D13, E14, and F15 are stacked, the axial projections of the lead ends 4 of the ceramic film stacks C12 and E14 are respectively located on both sides of the axial projection of the ceramic film stack A10. In Example 3, six ceramic film blocks are arranged in a staggered manner, and the width of the pattern at the connection between each inner electrode 3 and the outer electrode (see Figure 15The width buried inside the ceramic body (see Figure 15 is 1 / 3 of b2) in the figure, the length L1 is equal to the margin left for the capacitor, and L2 is equal to the length opposite to the adjacent inner electrode 3 of the capacitor. The schematic diagram of the overlapping of the inner electrodes 3 at the end of the capacitor adopting this scheme is shown in Figure 16 , and the perspective view of the structure of the inner electrode 3 of the capacitor is shown in Figure 17 .

[0072] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention. It should be noted that the structures or components illustrated in the drawings are not necessarily drawn to scale, and the present invention omits the description of well-known components and processing techniques and processes to avoid unnecessarily limiting the present invention.

Claims

1. An anti-cracking low-frequency high-power ceramic capacitor, comprising a capacitor internal mechanism (1) and end electrodes, wherein the capacitor internal mechanism (1) includes an internal electrode assembly, and the internal electrode assembly is connected to the end electrodes, characterized in that, The internal structure (1) of the capacitor includes several stacked ceramic units. Each single ceramic unit includes a plurality of stacked ceramic film blocks. Each of the ceramic film blocks includes a ceramic film (2) and an internal electrode (3). The internal electrode (3) is disposed within the ceramic film (2). The internal electrodes (3) of each ceramic film are stacked into an internal electrode assembly; Wherein, the internal electrode (3) includes a lead-out end (4) and an embedding end (5) which are oppositely disposed. The lead-out end (4) is disposed at the end of the ceramic film (2), and the embedding end (5) is disposed within the ceramic film (2). The lead-out ends (4) between two adjacent ceramic film blocks are oppositely disposed. The internal electrode assembly includes a positive electrode and a negative electrode, which are oppositely disposed and are both formed by stacking a plurality of lead-out ends (4); The width of the lead-out end (4) is b1, and the width of the embedding end (5) is b2, and b1 < b2; The projections of the lead-out ends (4) of each ceramic film block in a single ceramic unit are misaligned axially, and the sum of the widths of the lead-out ends (4) on the same side is b2.

2. The anti-cracking low-frequency high-power ceramic capacitor according to claim 1, characterized in that, A single ceramic unit includes a first ceramic film block (6), a second ceramic film block (7), a third ceramic film block (8), and a fourth ceramic film block (9) stacked in sequence; Wherein, the first ceramic film block (6) and the second ceramic film block (7) are in a 180° rotation structure with each other, and the third ceramic film block (8) and the fourth ceramic film block (9) are in a 180° rotation structure with each other; The internal electrode (3) on the first ceramic film block (6) is provided with a plurality of lead-out ends (4). The width of each lead-out end (4) of the first ceramic film block (6) is b1 and they are disposed on the same side; the internal electrode (3) on the third ceramic film block (8) is provided with a plurality of lead-out ends (4). The width of each lead-out end (4) of the third ceramic film block (8) is b1 and they are disposed on the same side; The sum of the widths of the lead-out ends (4) of the first ceramic film block (6) and the total width of the lead-out ends (4) of the third ceramic film block (8) is b2; the lead-out ends (4) of the first ceramic film block (6) and the lead-out ends (4) of the third ceramic film block (8) are on the same side and are misaligned.

3. The anti-cracking low-frequency high-power ceramic capacitor according to claim 2, wherein The internal electrode (3) on the first ceramic film block (6) is provided with one lead-out end (4), and the internal electrode (3) on the third ceramic film block (8) is provided with one lead-out end (4).

4. The anti-cracking low-frequency high-power ceramic capacitor according to claim 2, wherein The internal electrode (3) on the first ceramic film block (6) is provided with two lead-out ends (4). There is a gap between the two lead-out ends (4) of the first ceramic film block (6). The width of the gap is b1, and the internal electrode (3) on the third ceramic film block (8) is provided with one lead-out end (4).

5. An anti-cracking low-frequency high-power ceramic capacitor according to claim 1, characterized in that, A single ceramic unit includes a ceramic film block A (10), a ceramic film block B (11), a ceramic film block C (12), a ceramic film block D (13), a ceramic film block E (14), and a ceramic film block F (15) stacked in sequence; Among them, the ceramic laminated film block A (10) and the ceramic laminated film block B (11) are in a 180° rotation structure with each other, the ceramic laminated film block C (12) and the ceramic laminated film block D (13) are in a 180° rotation structure with each other, and the ceramic laminated film block E (14) and the ceramic laminated film block F (15) are in a 180° rotation structure with each other; The inner electrode (3) on the ceramic laminated block A (10) is provided with a lead-out end (4), and the widths are all b1. The inner electrode (3) on the ceramic laminated block C (12) is provided with a lead-out end (4), and the widths are all b1. The inner electrode (3) on the ceramic laminated block C (12) is provided with a lead-out end (4), and the width is b1. The b1 = b2. The lead-out ends (4) of the ceramic laminated block A (10), the lead-out ends (4) of the ceramic laminated block C (12), and the lead-out ends (4) of the ceramic laminated block E (14) are all on the same side and are arranged in a mutually staggered manner.

6. The anti-cracking low-frequency high-power ceramic capacitor according to claim 3, wherein, The structures of the first ceramic laminated film block (6) and the third ceramic laminated film block (8) are the same. When the first ceramic laminated film block (6), the second ceramic laminated film block (7), the third ceramic laminated film block (8) and the fourth ceramic laminated film block (9) are laminated, the projection of the lead-out end (4) of the first ceramic laminated film block (6) in the axial direction and the projection of the lead-out end (4) of the third ceramic laminated film block (8) in the axial direction can be spliced into a rectangle, and the splicing length of this rectangle is b2.

7. An anti-cracking low-frequency high-power ceramic capacitor according to claim 4, characterized in that, The inner electrode (3) of the first ceramic laminated film block (6) is of a "concave" structure, and the inner electrode (3) of the third ceramic laminated film block (8) is of a "convex" structure.

8. An anti-cracking low-frequency high-power ceramic capacitor according to claim 5, characterized in that, The inner electrode (3) of the ceramic laminated film block A (10) is of a "convex" structure. When the ceramic laminated film block A (10), the ceramic laminated film block B (11), the ceramic laminated film block C (12) and the ceramic laminated film block D (13), the ceramic laminated film block E (14) and the ceramic laminated film block F (15) are laminated, the projections of the lead-out ends (4) of the ceramic laminated film block C (12) and the ceramic laminated film block E (14) in the axial direction are respectively located on both sides of the projection of the ceramic laminated film block A (10) in the axial direction.

9. The anti-cracking low-frequency high-power ceramic capacitor according to claim 1, wherein, 1 / 3b2 ≤ b1 ≤ 1 / 2b2.

10. The anti-cracking low-frequency high-power ceramic capacitor according to claim 1, wherein The lengths of the lead-out ends (4) of the inner electrodes (3) in each of the shown ceramic laminated film blocks are equal.

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