Wafer temperature adjusting device and semiconductor equipment

Abstract

The utility model provides a wafer temperature adjusting device and semiconductor equipment. The wafer temperature adjusting device comprises an adjusting pipeline below a hot plate of the semiconductor equipment, and a liquid inlet control mechanism and an air inlet control mechanism which are respectively communicated with the adjusting pipeline; the liquid inlet control mechanism is used for introducing a liquid medium into the adjusting pipeline so as to adjust the temperature of the wafer placed above the hot plate for the first time; and the gas inlet control mechanism is used for introducing a gas medium into the adjusting pipeline and discharging a liquid medium in the adjusting pipeline so as to perform secondary adjustment on the temperature of the wafer by using the hot plate. The liquid inlet control mechanism is utilized to introduce a liquid medium into the adjusting pipeline to quickly cool the wafer, so that the temperature of the wafer after primary adjustment is within a threshold range, and then the gas inlet control mechanism is utilized to introduce a gas medium into the adjusting pipeline to discharge the liquid medium in the adjusting pipeline. And finally, the temperature of the wafer is finely adjusted for the second time by using the hot plate, so that accurate temperature control is realized.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor equipment, in particular to a wafer temperature regulating device and a semiconductor equipment. Background Art

[0002] In the semiconductor manufacturing industry, the lithography (LT) process is one of the key processes, which involves transferring a specific pattern or design onto a semiconductor substrate (such as a silicon wafer). Steps such as coating (COT) and development (DEV) in the LT process are the basis for forming a photoresist pattern. After these steps are completed, a bake process is often required to cure the photoresist, remove excess moisture or solvents, and enhance the adhesion between the photoresist and the substrate.

[0003] Since different photoresists and processes have different temperature requirements, in actual production, the temperature of the bake process needs to be adjusted according to the specific process recipe. This temperature conversion process not only increases the complexity of the operation but also may affect the wafer per hour (WPH) of the equipment to a certain extent, thus affecting the efficiency and productivity of the entire production line.

[0004] In the bake process, the hot plate is a key heating device. Different types of hot plates usually have different heating and cooling systems. Traditional hot plates usually use a cooling arm to extend in and a cooling air purge to cool down. However, for hot plates with a relatively large temperature difference, this cooling method by directly purging cold air often has poor effects, resulting in a slow cooling rate and thus affecting the WPH of the equipment. Therefore, when the hot plate temperature is high, it takes a longer time to cool down to the temperature required for the next process. During this period, the equipment cannot perform other operations, thereby reducing the overall production efficiency. In addition, if the cooling is uneven, it may also lead to inconsistent curing degrees of the photoresist, affecting the quality and stability of subsequent processes.

[0005] Therefore, there is an urgent need for a wafer temperature regulating device and a semiconductor equipment to improve the above problems. Summary of the Utility Model

[0006] The purpose of the utility model is to provide a wafer temperature regulating device and a semiconductor equipment, which can achieve rapid cooling of the wafer with high precision.

[0007] In a first aspect, the present utility model provides a wafer temperature adjustment device, comprising: an adjustment pipeline disposed below a hot plate of a semiconductor device, and a liquid inlet control mechanism and a gas inlet control mechanism respectively communicating with the adjustment pipeline;

[0008] The liquid inlet control mechanism is configured to introduce a liquid medium into the adjustment pipeline to perform a primary adjustment on the temperature of a wafer placed above the hot plate;

[0009] The gas inlet control mechanism is configured to introduce a gas medium into the adjustment pipeline to discharge the liquid medium in the adjustment pipeline, so as to perform a secondary adjustment on the temperature of the wafer by using the hot plate.

[0010] The beneficial effects of the present utility model are as follows: through the adjustment pipeline disposed below the hot plate of the semiconductor device, and the liquid inlet control mechanism and the gas inlet control mechanism respectively communicating with the adjustment pipeline; the liquid inlet control mechanism is configured to introduce a liquid medium into the adjustment pipeline to perform a primary adjustment on the temperature of the wafer placed above the hot plate; the gas inlet control mechanism is configured to introduce a gas medium into the adjustment pipeline to discharge the liquid medium in the adjustment pipeline, so as to perform a secondary adjustment on the temperature of the wafer by using the hot plate. First, the liquid inlet control mechanism is used to introduce a liquid medium into the adjustment pipeline to quickly cool down the wafer, so that the temperature of the wafer after the primary adjustment is within the threshold range. Then, the gas inlet control mechanism is used to introduce a gas medium into the adjustment pipeline to discharge the liquid medium in the adjustment pipeline. Finally, the hot plate is used to perform a second fine adjustment on the temperature of the wafer, thereby realizing precise temperature control.

[0011] Optionally, the liquid inlet control mechanism includes a liquid inlet pipeline and a first pneumatic valve;

[0012] A first connection node is provided at an input end of the adjustment pipeline;

[0013] The liquid inlet pipeline communicates with the adjustment pipeline through the first connection node;

[0014] The first pneumatic valve is disposed at the first connection node and is used to control the on-off of the first connection node. The beneficial effect thereof is that by providing the liquid inlet pipeline and the first pneumatic valve, the stability of controlling the liquid medium introduced into the adjustment pipeline can be improved, and the liquid medium can quickly adjust the temperature of the wafer, shortening the time for temperature adjustment.

[0015] Optionally, the gas inlet control mechanism includes a gas inlet pipeline and a second pneumatic valve;

[0016] A second connection node is further provided at the input end of the adjustment pipeline, and the second connection node is located on a side of the first connection node away from the liquid inlet pipeline;

[0017] The intake pipe is communicated with the regulating pipe through the second connection node;

[0018] The second pneumatic valve is arranged on the intake pipe and is used to control the on-off of the intake pipe. The beneficial effect is that by providing the intake pipe and the second pneumatic valve, after the temperature of the wafer is adjusted once by the liquid medium, the liquid medium in the regulating pipe is discharged and removed by using the gas medium, which is convenient for the hot plate to accurately adjust the temperature of the wafer, thus ensuring the accuracy and efficiency of temperature control.

[0019] Optionally, the liquid inlet control mechanism further includes a first solenoid valve;

[0020] The first solenoid valve is connected to the first pneumatic valve and is used to control the opening and closing of the first pneumatic valve;

[0021] And / or the intake control mechanism further includes a second solenoid valve;

[0022] The second solenoid valve is connected to the second pneumatic valve and is used to control the opening and closing of the second pneumatic valve. The beneficial effect is that by providing the first solenoid valve and the second solenoid valve to control the first pneumatic valve and the second pneumatic valve respectively, the accuracy of controlling the temperature adjustment of the wafer is achieved.

[0023] Optionally, it further includes a water return tank and a water return pipe;

[0024] The bottom of the water return tank is communicated with the water return pipe;

[0025] The top of the water return tank is communicated with the output end of the regulating pipe and is used to store the liquid medium and prevent the gas medium from entering the water return pipe. The beneficial effect is that by adding the water return tank, the gas medium can be prevented from entering the water return pipe.

[0026] Optionally, it further includes a liquid level sensor;

[0027] The liquid level sensor is arranged on the water return tank and is used to monitor the water level height in the water return tank;

[0028] The intake control mechanism is electrically connected to the liquid level sensor;

[0029] The intake control mechanism is further used to adjust the time for introducing gas into the pipe according to the water level height. The beneficial effect is that by providing the liquid level sensor and arranging it to be electrically connected to the intake control mechanism, the intake control mechanism can adjust the time for introducing gas into the pipe according to the water level height, ensuring that there is no liquid medium in the regulating pipe and further guaranteeing the accuracy of temperature adjustment.

[0030] Optionally, the liquid level sensor includes a first liquid level sensor and a second liquid level sensor;

[0031] Both the first liquid level sensor and the second liquid level sensor are disposed on the return water tank, and the first liquid level sensor is closer to the bottom of the return water tank than the second liquid level sensor.

[0032] Optionally, it further includes a water replenishing pipeline;

[0033] The water replenishing pipeline is communicated with the top of the return water tank. The beneficial effect is that by adding the water replenishing pipeline, the return water tank can be replenished with water in time, thereby ensuring the effect of preventing gas medium from entering the return water pipeline.

[0034] Optionally, it further includes a third pneumatic valve and a third solenoid valve;

[0035] The third pneumatic valve is disposed on the water replenishing pipeline for controlling the on-off of the water replenishing pipeline;

[0036] The third solenoid valve is connected to the third pneumatic valve for controlling the opening and closing of the third pneumatic valve;

[0037] The third solenoid valve is electrically connected to the first liquid level sensor for controlling the on-off of the water replenishing pipeline according to the water level height monitored by the first liquid level sensor. The beneficial effect is that by providing the third pneumatic valve and the third solenoid valve, and electrically connecting the third solenoid valve to the first liquid level sensor and cooperating with the first liquid level sensor, the on-off of the water replenishing pipeline is controlled according to the water level height monitored by the first liquid level sensor, thereby realizing timely replenishment of the return water tank with water.

[0038] In a second aspect, the present invention further provides a semiconductor device, including an adjusting device and a hot plate in any possible combination of the first aspect above;

[0039] The adjusting device includes an adjusting pipeline disposed below the hot plate, and a liquid inlet control mechanism and a gas inlet control mechanism respectively communicated with the adjusting pipeline;

[0040] The liquid inlet control mechanism is used for introducing a liquid medium into the adjusting pipeline to perform a primary adjustment on the temperature of the wafer placed above the hot plate;

[0041] The gas inlet control mechanism is used for introducing a gas medium into the adjusting pipeline to discharge the liquid medium in the adjusting pipeline, so as to perform a secondary adjustment on the temperature of the wafer by using the hot plate.

[0042] For the beneficial effects of the second aspect above, reference can be made to the description of the first aspect above. Description of the Drawings

[0043] Figure 1 Schematic structural diagram of a wafer temperature adjustment device provided by an embodiment of the present invention;

[0044] Figure 2 Schematic structural diagram of another wafer temperature adjustment device provided by an embodiment of the present invention;

[0045] Figure 3 Schematic structural diagram of another adjustment pipeline provided by an embodiment of the present invention.

[0046] Description of reference numerals:

[0047] 1, hot plate; 2, adjustment pipeline; 3, liquid inlet control mechanism; 4, air inlet control mechanism; 5, return water tank; 6, return water pipeline; 7, liquid level sensor; 8, water replenishment pipeline; 9, third pneumatic valve; 10, third solenoid valve;

[0048] 31, liquid inlet pipeline; 32, first pneumatic valve; 33, first solenoid valve;

[0049] 41, air inlet pipeline; 42, second pneumatic valve; 43, second solenoid valve;

[0050] 71, first liquid level sensor; 72, second liquid level sensor. Detailed implementation manners

[0051] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the drawings of the present utility model. Apparently, the described embodiments are some but not all of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts fall within the scope of protection of the present utility model. Unless otherwise defined, the technical terms or scientific terms used herein shall have the ordinary meanings understood by those of ordinary skill in the art to which the present utility model belongs. The technical solutions in the embodiments of the present utility model will be described below in conjunction with the drawings in the embodiments of the present utility model. Among them, in the description of the embodiments of the present utility model, the terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. As used in the specification and claims of the present utility model, the singular forms "a", "the", "above-mentioned", "this" and "such" are also intended to include the forms such as "one or more", unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of the present utility model, "at least one" and "one or more" mean one or more than two (including two). The term "and / or" is used to describe the association relationship of associated objects and means that three relationships can exist; for example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone, where A and B can be singular or plural. The character " / " generally means that the associated objects before and after are in an "or" relationship.

[0052] Reference to "an embodiment" or "some embodiments" in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present utility model. Thus, the phrases "in an embodiment", "in some embodiments", "in other some embodiments", "in still other embodiments" that appear in different places in this specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments", unless otherwise specifically emphasized in another way. The terms "comprise", "include", "have" and their variants all mean "including but not limited to", unless otherwise specifically emphasized in another way. The term "connection" includes direct connection and indirect connection, unless otherwise stated. "First" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features.

[0053] In the embodiments of the present utility model, "exemplarily" or "for example" is used to give examples, illustrations or explanations. Any embodiment or design solution described as "exemplarily" or "for example" in the embodiments of the present utility model should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0054] Regarding the problems existing in the prior art, such as Figure 1 As shown, the present utility model provides a wafer temperature adjustment device, including: an adjustment pipeline 2 disposed below a hot plate 1 of a semiconductor device, and a liquid inlet control mechanism 3 and a gas inlet control mechanism 4 respectively communicated with the adjustment pipeline 2; the liquid inlet control mechanism 3 is used to introduce a liquid medium (such as process cooling water (PCW)) into the adjustment pipeline 2 to perform a primary adjustment on the temperature of a wafer placed above the hot plate 1; the gas inlet control mechanism 4 is used to introduce a gas medium into the adjustment pipeline 2 to discharge the liquid medium in the adjustment pipeline 2, so as to perform a secondary adjustment on the temperature of the wafer by using the hot plate 1. Taking temperature reduction as an example, in use, first determine the target temperature (Target) to which the wafer needs to be reduced, and then use the liquid inlet control mechanism 3 to introduce a liquid medium into the adjustment pipeline 2 to quickly cool the wafer, taking away a large amount of heat, so that the temperature of the wafer after the primary adjustment is within the threshold range (such as Target ± 2°C). Although the liquid medium can achieve rapid cooling of the hot plate 1, when the temperature drops, it will cause the retention of the liquid medium, resulting in inaccurate temperature control. At this time, by using the gas inlet control mechanism 4 to introduce a gas medium (such as an inert gas) into the adjustment pipeline 2 to discharge the retained liquid medium in the adjustment pipeline 2, temperature control errors can be avoided, and finally, the hot plate 1 is used to perform a second fine adjustment on the temperature of the wafer, thereby achieving precise temperature control. Among them, the distribution of the adjustment pipeline 2 in the hot plate 1 can be adjusted according to actual needs, and can adopt Figure 1 the structure shown, or can also adopt Figure 3 the structure shown.

[0055] In some embodiments, in order to improve the stability of controlling the liquid medium introduced into the adjustment pipeline 2, enable rapid adjustment of the temperature of the wafer, and shorten the temperature adjustment time, such as Figure 1As shown, the liquid inlet control mechanism 3 includes a liquid inlet pipe 31 and a first pneumatic valve 32; a first connection node is provided at the input end of the regulating pipe 2; the liquid inlet pipe 31 is connected to the regulating pipe 2 through the first connection node; the first pneumatic valve 32 is arranged at the first connection node for controlling the on-off of the first connection node. In some specific embodiments, the liquid inlet control mechanism 3 further includes a first solenoid valve 33; the first solenoid valve 33 is connected to the first pneumatic valve 32 (such as pneumatically connected) for controlling the switch of the first pneumatic valve 32.

[0056] In some specific embodiments, in order to ensure the accuracy and efficiency of temperature control, such as Figure 1 As shown, the air inlet control mechanism 4 includes an air inlet pipe 41 and a second pneumatic valve 42; a second connection node is further provided at the input end of the regulating pipe 2, and the second connection node is located on the side of the first connection node away from the liquid inlet pipe 31; the air inlet pipe 41 is connected to the regulating pipe 2 through the second connection node; the second pneumatic valve 42 is arranged on the air inlet pipe 41 for controlling the on-off of the air inlet pipe 41. In some other specific embodiments, the air inlet control mechanism 4 further includes a second solenoid valve 43; the second solenoid valve 43 is connected to the second pneumatic valve 42 (such as pneumatically connected) for controlling the switch of the second pneumatic valve 42.

[0057] In some embodiments, in order to prevent the gas medium from entering the return water pipe 6, such as Figure 1 As shown, the regulating device further includes a return water tank 5 and a return water pipe 6; the bottom of the return water tank 5 is connected to the return water pipe 6; the top of the return water tank 5 is connected to the output end of the regulating pipe 2 for storing the liquid medium and preventing the gas medium from entering the return water pipe 6.

[0058] In some specific embodiments, to ensure that there is no liquid medium in the regulating pipe 2 and further guarantee the accuracy of temperature regulation, such as Figure 2 As shown, the regulating device further includes a liquid level sensor; the liquid level sensor is arranged on the return water tank 5 for monitoring the water level height in the return water tank 5; the air inlet control mechanism 4 is electrically connected to the liquid level sensor; the air inlet control mechanism 4 is further used for adjusting the time of introducing gas into the pipe according to the water level height. In some specific embodiments, the liquid level sensor includes a first liquid level sensor 71 and a second liquid level sensor 72; both the first liquid level sensor 71 and the second liquid level sensor 72 are arranged on the return water tank 5, and the first liquid level sensor 71 is closer to the bottom of the return water tank 5 than the second liquid level sensor 72.

[0059] In some specific embodiments, in order to timely replenish water to the water return tank 5, so as to ensure the effect of the water return tank 5 to prevent gas medium from entering the water return pipe 6, as Figure 2 shown, the regulating device further includes a water replenishing pipe 8; the water replenishing pipe 8 is communicated with the top of the water return tank 5.

[0060] In some specific embodiments, in order to realize timely replenishment of water to the water return tank 5, as Figure 2 shown, the regulating device further includes a third pneumatic valve 9 and a third solenoid valve 10; the third pneumatic valve 9 is arranged on the water replenishing pipe 8 and is used to control the on-off of the water replenishing pipe 8; the third solenoid valve 10 is connected to the third pneumatic valve 9 (such as pneumatically connected) and is used to control the opening and closing of the third pneumatic valve 9; the third solenoid valve 10 is electrically connected to the first liquid level sensor 71 and is used to control the on-off of the water replenishing pipe 8 according to the water level height monitored by the first liquid level sensor 71.

[0061] It should be noted that regarding the pneumatic connection, the first / second / third solenoid valves are used to receive the electrical signal of the control instruction and convert the electrical signal into air pressure, so as to control the opening and closing of the first / second / third pneumatic valves by using the air pressure, thereby realizing the on-off control of the liquid medium or gas medium.

[0062] Exemplarily, as Figure 2 shown, when it is necessary to reduce the temperature from 250 °C to 90 °C (i.e., the target temperature), the working process of the regulating device is as follows:

[0063] 1. Control the first pneumatic valve 32 to open through the first solenoid valve 33, and the process cooling water enters the regulating pipe 2 from the liquid inlet pipe 31 to quickly cool the wafer (i.e., the first adjustment), taking away a large amount of heat.

[0064] 2. Usually, the temperature of the hot plate 1 will quickly drop from 250 °C to the set value (such as 92 °C, 95 °C or 100 °C within three seconds, and the value of the set value depends on the temperature and flow rate of the process cooling water in the regulating pipe 2). When the temperature of the hot plate 1 reaches the set value, control the first pneumatic valve 32 to close. However, since there is still process cooling water with a lower temperature in the regulating pipe 2, the wafer on the hot plate 1 will be continuously cooled, making the wafer temperature lower than 90 °C (i.e., the target temperature).

[0065] 3. Control the second pneumatic valve 42 to open through the second solenoid valve 43, and inert gas (such as nitrogen, argon, etc.) enters the regulating pipe 2 from the air inlet pipe 41, thereby discharging all the process cooling water in the regulating pipe 2. When the first liquid level sensor 71 monitors that the water level height in the water return tank 5 is too low, the second pneumatic valve 42 closes to prevent the inert gas from entering the water return pipe 6.

[0066] 4. Control the third pneumatic valve 9 to open through the third solenoid valve 10, use the water replenishing pipe 8 to open the return water tank 5, and close the third pneumatic valve 9 when the second liquid level sensor 72 detects that the water level in the return water tank 5 reaches the upper limit value.

[0067] 5. The heater (not shown) of the hot plate 1 starts to work, and uses PID (Proportional, Integral, Derivative control) to control and adjust the output of the heater to achieve fine adjustment of the wafer temperature, and finally makes the wafer temperature stable at 90 °C, so as to achieve precise temperature control.

[0068] Based on the above adjustment device, as Figure 2 shown, a semiconductor device includes the above adjustment device and the hot plate 1; the adjustment device includes an adjustment pipe 2 arranged below the hot plate 1, and a liquid inlet control mechanism 3 and a gas inlet control mechanism 4 respectively communicated with the adjustment pipe 2; the liquid inlet control mechanism 3 is used to introduce a liquid medium into the adjustment pipe 2 to perform a primary adjustment on the temperature of the wafer placed above the hot plate 1; the gas inlet control mechanism 4 is used to introduce a gas medium into the adjustment pipe 2 to discharge the liquid medium in the adjustment pipe 2, so as to perform a secondary adjustment on the temperature of the wafer by using the hot plate 1.

[0069] Although the embodiments of the present invention have been described in detail above, it is obvious to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are all within the scope and spirit of the present invention described in the claims. Moreover, the present invention described herein can have other embodiments and can be implemented or realized in various ways.

Claims

1. A wafer temperature adjustment device, applied to semiconductor equipment, characterized in that Comprising: A regulating pipeline disposed below a hot plate of a semiconductor device, and a liquid inlet control mechanism and a gas inlet control mechanism respectively communicating with the regulating pipeline; The liquid inlet control mechanism is configured to introduce a liquid medium into the regulating pipeline to perform a primary regulation on the temperature of a wafer placed above the hot plate; The gas inlet control mechanism is configured to introduce a gas medium into the regulating pipeline to discharge the liquid medium in the regulating pipeline, so as to perform a secondary regulation on the temperature of the wafer by using the hot plate; The liquid inlet control mechanism includes a liquid inlet pipeline and a first pneumatic valve; a first connection node is provided at an input end of the regulating pipeline; the liquid inlet pipeline communicates with the regulating pipeline through the first connection node; the first pneumatic valve is disposed at the first connection node for controlling the on / off of the first connection node; The gas inlet control mechanism includes a gas inlet pipeline and a second pneumatic valve; a second connection node is further provided at the input end of the regulating pipeline, and the second connection node is located on a side of the first connection node away from the liquid inlet pipeline; the gas inlet pipeline communicates with the regulating pipeline through the second connection node; the second pneumatic valve is disposed on the gas inlet pipeline for controlling the on / off of the gas inlet pipeline.

2. The adjusting device according to claim 1, wherein: The liquid inlet control mechanism further includes a first solenoid valve; The first solenoid valve is connected to the first pneumatic valve for controlling the opening and closing of the first pneumatic valve; And / or the gas inlet control mechanism further includes a second solenoid valve; The second solenoid valve is connected to the second pneumatic valve for controlling the opening and closing of the second pneumatic valve.

3. The adjusting device according to claim 1, characterized in that: It further includes a water return tank and a water return pipeline; The bottom of the water return tank communicates with the water return pipeline; The top of the water return tank communicates with an output end of the regulating pipeline for storing the liquid medium and preventing the gas medium from entering the water return pipeline.

4. The adjusting device according to claim 3, characterized in that: It further includes a liquid level sensor; The liquid level sensor is disposed on the water return tank for monitoring the water level height in the water return tank; The gas inlet control mechanism is electrically connected to the liquid level sensor; The gas inlet control mechanism is further configured to adjust the time for introducing gas into the pipeline according to the water level height.

5. The adjusting device according to claim 4, characterized in that: The liquid level sensor includes a first liquid level sensor and a second liquid level sensor; Both the first liquid level sensor and the second liquid level sensor are disposed on the water return tank, and the first liquid level sensor is closer to the bottom of the water return tank than the second liquid level sensor.

6. The adjusting device according to claim 5, characterized in that: It further includes a water replenishing pipeline; The water replenishing pipeline communicates with the top of the water return tank.

7. The adjusting device according to claim 6, characterized in that: It further includes a third pneumatic valve and a third solenoid valve; The third pneumatic valve is disposed on the water replenishing pipeline for controlling the on / off of the water replenishing pipeline; The third solenoid valve is connected to the third pneumatic valve for controlling the opening and closing of the third pneumatic valve; The third solenoid valve is electrically connected to the first liquid level sensor for controlling the on / off of the water replenishing pipeline according to the water level height monitored by the first liquid level sensor.

8. A semiconductor device, characterized in that, Comprising the regulating device and the hot plate according to any one of claims 1 to 7; The adjusting device includes an adjusting pipeline arranged below the hot plate, and a liquid inlet control mechanism and a gas inlet control mechanism respectively communicated with the adjusting pipeline; The liquid inlet control mechanism is used to introduce a liquid medium into the adjusting pipeline to perform a primary adjustment on the temperature of the wafer placed above the hot plate; The gas inlet control mechanism is used to introduce a gas medium into the adjusting pipeline to discharge the liquid medium in the adjusting pipeline, so as to perform a secondary adjustment on the temperature of the wafer by using the hot plate. ​

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