Semiconductor etching equipment

Abstract

The utility model discloses semiconductor etching equipment, which relates to the technical field of semiconductor etching and comprises an etching tank and two support frames, the bottoms of the two support frames are fixedly connected with the bottom of an inner cavity of the etching tank, and a switching mechanism is mounted between the two support frames. According to the utility model, flexible switching among the stations is ensured through a rotating mechanism of the rotating frame, when etching operation is carried out on one station, the other station can simultaneously replace etched wafers and load new wafers, the downtime is shortened through the design, the production process is more continuous and automatic, and in addition, the production efficiency is improved. Through precise control of the transmission gear system, it is ensured that the storage plate is always kept in a horizontal state in the rotating process, wafers are prevented from deviating or falling off in the etching process, the uniformity and stability of the etching process are ensured, and then the product quality and the production precision are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor etching, in particular to a semiconductor etching device. Background Art

[0002] Etching is a technology that removes metal materials through chemical reactions or physical impacts. Semiconductor etching is to immerse a semiconductor in an etching solution to remove unwanted substances attached to its surface and ensure its cleanliness and purity.

[0003] For example, the semiconductor etching device disclosed in the publication number CN219085940U includes: a base; an etching solution tank assembly connected to the base for storing the etching solution; a linkage clamping assembly connected to the etching solution tank assembly; a purging device connected to the etching solution tank assembly; wherein, the purging device includes: a blower device connected to the etching solution tank assembly for blowing and clearing the liquid on the semiconductor plate; a pressurization transmission assembly connected to the etching solution tank assembly.

[0004] However, in the prior art, during the semiconductor etching process, operations such as loading and unloading will cause the equipment to stop, thus affecting the overall etching efficiency. Since these operations keep the equipment in a stopped state, the equipment cannot perform etching during this period, directly resulting in a decrease in production efficiency. In addition, frequent stops may reduce the utilization rate of the equipment, thereby reducing the actual production time of the equipment. Summary of the Utility Model

[0005] The purpose of the utility model is to solve the problem in the prior art that operations such as loading and unloading will cause the equipment to stop, thus affecting the overall etching efficiency, and to propose a semiconductor etching device.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme: a semiconductor etching device, including an etching tank and two support frames. The bottoms of the two support frames are fixedly connected to the bottom of the inner cavity of the etching tank, and a conversion mechanism is installed between the two support frames;

[0007] The conversion mechanism includes a rotating rod. The two ends of the rotating rod are respectively rotatably connected to the two support frames, and the outer surfaces of the two ends of the rotating rod are fixedly connected with rotating frames. Both ends of the rotating frame are fixedly connected with rotating rings. The inner sides of the rotating rings are rotatably connected with mounting frames. A positioning mechanism is installed between the two mounting frames. A second gear is arranged on the outer surface of the rotating rod. The second gear is fixedly connected to one of the support frames. The top and bottom of the second gear are both meshed with transmission gears. One side of the transmission gear is meshed with a first gear. The first gear is fixedly connected to the outer surface of the mounting frame.

[0008] Preferably, the transmission gear is rotatably connected to the side wall of the rotating frame, and one end of the rotating rod is fixedly connected with a handle.

[0009] Preferably, the positioning mechanism includes a placement plate, both ends of the placement plate are stuck inside the mounting frame, and fixing bolts are arranged on both sides of the top of the placement plate.

[0010] Preferably, the bottom end of the fixing bolt is fixedly connected with the placement plate, and the fixing bolt is threadedly connected with the mounting frame.

[0011] Preferably, second moving frames are arranged on both sides of the bottom of the fixing bolt, and two first moving frames are symmetrically arranged on the top of the fixing bolt.

[0012] Preferably, a plurality of pressing rods are threadedly connected to the top of the first moving frame, and a plurality of locking rods are threadedly connected to the bottom of the second moving frame.

[0013] Preferably, the bottom end of the first moving frame penetrates through the placement plate, the bottom end of the first moving frame is fixedly connected with the second moving frame, and the first moving frame is slidably connected with the placement plate.

[0014] Compared with the prior art, the advantages and positive effects of the present utility model are as follows:

[0015] 1. In the present utility model, the rotation mechanism of the rotating frame ensures the flexible switching between workstations. When one workstation is performing etching operation, the other workstation can simultaneously replace the etched wafer and load a new wafer. This design shortens the downtime and makes the production process more continuous and automated. In addition, through the precise control of the transmission gear system, it is ensured that the placement plate always remains horizontal during rotation, avoiding the offset or dropping of the wafer during etching, ensuring the uniformity and stability of the etching process, and thus improving the quality of the product and the precision of production.

[0016] 2. In the present utility model, through the coordinated action of the first moving frame, the second moving frame, the locking rod and the pressing rod, the system realizes the flexible adaptation and precise positioning of semiconductor wafers of different specifications. The linkage design between the moving frames ensures that no offset occurs during adjustment, thus ensuring that the wafer is always in the best processing position. The use of the locking rod further fixes the position of the moving frame to ensure that it does not displace during operation. Through the uniform clamping of the pressing rod, the wafer remains stable during etching, preventing displacement or dropping caused by vibration or rotation. At the same time, this design avoids damage to the wafer caused by excessive pressure, ensuring the safety and precision of the processing process and improving the reliability of the overall operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is an overall three-dimensional structural schematic diagram of a semiconductor etching device proposed by the present utility model;

[0018] Figure 2 This utility model provides a three-dimensional structural schematic diagram of a conversion mechanism of a semiconductor etching device;

[0019] Figure 3 This utility model provides a partial three-dimensional structural schematic diagram of a semiconductor etching device;

[0020] Figure 4 This utility model provides a three-dimensional structural schematic diagram of a positioning mechanism of a semiconductor etching device.

[0021] Legend description: 1. Etching tank; 2. Handle; 3. Support frame; 4. Conversion mechanism; 41. Rotating rod; 42. Rotating frame; 43. First gear; 44. Driving gear; 45. Second gear; 46. Mounting frame; 47. Rotating ring; 5. Positioning mechanism; 51. Placing plate; 52. Fixed bolt; 53. First moving frame; 54. Second moving frame; 55. Locking rod; 56. Extrusion rod. Detailed implementation mode

[0022] In order to more clearly understand the above-mentioned objects, features and advantages of this utility model, the following further describes this utility model in conjunction with the drawings and embodiments. It should be noted that, without conflict, the embodiments of this application and the features in the embodiments can be combined with each other.

[0023] In the following description, many specific details are set forth in order to fully understand this utility model. However, this utility model can also be implemented in other ways different from those described herein. Therefore, this utility model is not limited by the specific embodiments disclosed in the following specification.

[0024] Embodiment 1: As Figure 1 and Figure 2 shown, this utility model provides a semiconductor etching device, including an etching tank 1 and two support frames 3. The bottoms of the two support frames 3 are fixedly connected to the bottom of the inner cavity of the etching tank 1, and a conversion mechanism 4 is installed between the two support frames 3;

[0025] The conversion mechanism 4 includes a rotating rod 41. The two ends of the rotating rod 41 are respectively rotatably connected to the two support frames 3. The outer surfaces of the two ends of the rotating rod 41 are fixedly connected with rotating frames 42. Both ends of the rotating frame 42 are fixedly connected with rotating rings 47. The inner sides of the rotating rings 47 are rotatably connected with mounting frames 46. A positioning mechanism 5 is installed between the two mounting frames 46. A second gear 45 is arranged on the outer surface of the rotating rod 41. The second gear 45 is fixedly connected with one of the support frames 3. Both the top and the bottom of the second gear 45 are meshed with transmission gears 44. One side of the transmission gear 44 is meshed with a first gear 43. The first gear 43 is fixedly connected with the outer surface of the mounting frame 46. The transmission gear 44 is rotatably connected with the side wall of the rotating frame 42. One end of the rotating rod 41 is fixedly connected with a handle 2.

[0026] Specifically, the specific settings and functions of this embodiment are described as follows. First, the semiconductor wafer is accurately placed on the surface of the placement plate 51 for positioning. This step ensures that the wafer will not move or deviate during the etching process, guaranteeing the uniformity and consistency of the etching. Since the device is equipped with two placement plates 51, it means that the operations of two etching stations can be carried out simultaneously, greatly improving the working efficiency.

[0027] When the rotating rod 41 starts to rotate, it drives the rotating frame 42 to rotate together, thereby controlling the synchronous rotation of the two rotating rings 47. This design enables one of the rotating rings 47 to be accurately moved into the etching tank 1 to start the etching operation, while the other rotating ring 47 is moved out of the etching tank 1 to provide an opportunity to replace the wafer that has completed etching.

[0028] During the rotation, the second gear 45 remains stationary, but it exerts a force on the transmission gear 44, causing the transmission gear 44 to start rotating on its own. This self-rotation not only provides more precise control but also transmits the force of the transmission gear 44 to the first gear 43, prompting the first gear 43 to rotate synchronously. As the transmission progresses further, the second gear 45 is also driven to rotate, and then through the transmission system, the entire mounting frame and the placement plate 51 rotate on their own.

[0029] The key purpose of this self-rotation design is to ensure that the placement plate 51 always remains horizontal during the rotation of the rotating frame 42, avoiding any tilting or dropping. This design is particularly important for the safety of the semiconductor wafer because any tilting or dropping may cause damage to the wafer, thereby affecting the accuracy and quality of the entire production process.

[0030] Through the rotational design of the rotating frame 42, not only can the switching of workstations be flexibly achieved, but also while etching operations are being carried out at one workstation, the semiconductor wafer that has completed etching can be replaced at another workstation and a new wafer can be reloaded. This operation mode significantly shortens the downtime, making the entire production process more continuous and efficient. At the same time, the automated workstation switching and wafer replacement mechanisms reduce manual intervention, improve the automation level of production, ensure the accuracy and consistency of each step in the etching process, and thus improve the overall production efficiency.

[0031] Embodiment 2: As Figure 3 and Figure 4 shown, the positioning mechanism 5 includes a placement plate 51. Both ends of the placement plate 51 are stuck inside the mounting frame 46, and both sides of the top of the placement plate 51 are provided with fixing bolts 52. The bottom end of the fixing bolt 52 is fixedly connected to the placement plate 51, and the fixing bolt 52 is threadedly connected to the mounting frame 46. Both sides of the bottom of the fixing bolt 52 are provided with second moving frames 54, and two first moving frames 53 are symmetrically arranged at the top of the fixing bolt 52. A plurality of pressing rods 56 are threadedly connected to the top of the first moving frame 53, and a plurality of locking rods 55 are threadedly connected to the bottom of the second moving frame 54. The bottom end of the first moving frame 53 penetrates through the placement plate 51, and the bottom end of the first moving frame 53 is fixedly connected to the second moving frame 54. The first moving frame 53 is slidably connected to the placement plate 51.

[0032] The effect achieved by the entire embodiment is that, first, the semiconductor wafer is placed on the surface of the placement plate 51 to ensure that it is stably placed on the workstation. In order to be able to adapt to wafers of different sizes and ensure the accuracy of positioning, by adjusting the distance between the two first moving frames 53, wafers of different specifications can be flexibly adapted, and through precise adjustment, the wafer can be ensured to be in the optimal processing position.

[0033] In this process, the movement of the first moving frame 53 is not only carried out independently, but it is interlocked with the second moving frame 54. When the first moving frame 53 moves, the second moving frame 54 also slides synchronously. This prevents the offset problem that may be caused by the independent movement of a single moving frame, thereby further improving the positioning accuracy and stability of the wafer.

[0034] After adjusting the position of the first moving frame 53, in order to fix the position of the moving frame, a locking operation is performed using the locking rod 55. By screwing the locking rod 55, its bottom end abuts against the surface of the placement plate 51, thereby effectively fixing the position of the first moving frame 53 and ensuring that it will not displace during subsequent operations.

[0035] After the locking position, the rotation function of the extrusion rod 56 is utilized to perform the clamping operation of the wafer. By rotating the extrusion rod 56, the pressure it exerts can be evenly transmitted to the edge of the semiconductor wafer, thereby firmly clamping the wafer on the placement plate 51. This can ensure that the wafer will not shift or fall due to vibration or rotation during the entire etching process, and at the same time avoid damage to the wafer caused by excessive pressure, ensuring the safety and accuracy of the entire processing process.

[0036] Through the coordinated work of the first moving frame 53, the second moving frame 54, the locking rod 55, and the extrusion rod 56, it is not only possible to flexibly adjust to accommodate semiconductor wafers of different specifications, but also to ensure the stability and safety of the wafer during the processing.

[0037] The usage method and working principle of this device: When performing semiconductor etching, the semiconductor wafer is placed on the surface of the placement plate 51 and positioned. Since the device is equipped with two placement plates 51, there are two etching stations. When the rotating rod 41 rotates, it can drive the rotating frame 42 to rotate, thereby controlling the rotation of the two rotating rings 47, causing one of the rotating rings 47 to move into the etching tank 1 and the other to move out of the etching tank 1. During the rotation process, the second gear 45 remains fixed, and thus exerts a force on the transmission gear 44, causing it to start rotating on its own. At the same time, the transmission gear 44 can also transmit the force to the first gear 43, causing the first gear 43 and the second gear 45 to rotate synchronously. In this way, during the rotation of the rotating ring 47, the mounting frame 46 will also drive the placement plate 51 to rotate on its own, ensuring that the placement plate 51 always remains horizontal when the rotating frame 42 rotates, and avoiding tilting or falling.

[0038] By rotating the rotating frame 42, not only is it convenient to switch stations, but it is also possible to remove the wafer that has completed etching and replace it with a new wafer when etching a semiconductor wafer, thereby improving the overall etching efficiency.

[0039] When placing the semiconductor wafer, place it on the surface of the placement plate 51, and use the adjustment function of the first moving frame 53 to adjust the distance between the two first moving frames 53 to ensure accurate positioning of the semiconductor wafer. When the first moving frame 53 moves, the second moving frame 54 will also slide together, thereby achieving synchronous adjustment. When the position of the first moving frame 53 is determined, by turning the locking rod 55 to make it abut against the bottom of the placement plate 51, the position of the first moving frame 53 is fixed. At this time, rotating the extrusion rod 56 can firmly position the semiconductor wafer and prevent it from falling during the etching or station switching process, ensuring the smooth progress of the etching process.

[0040] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model in other forms. Any person skilled in the art may use the technical content disclosed above to make changes or modifications into equivalent embodiments with equivalent changes and apply them to other fields. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present utility model without departing from the content of the technical solution of the present utility model still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A semiconductor etching device, comprising an etching tank (1) and two support frames (3), wherein the bottoms of the two support frames (3) are fixedly connected to the bottom of the inner cavity of the etching tank (1), and it is characterized in that: A conversion mechanism (4) is installed between the two support frames (3); The conversion mechanism (4) includes a rotating rod (41). The two ends of the rotating rod (41) are respectively rotatably connected to the two support frames (3). The outer surfaces of the two ends of the rotating rod (41) are fixedly connected with rotating frames (42). Both ends of the rotating frame (42) are fixedly connected with rotating rings (47). The inner sides of the rotating rings (47) are rotatably connected with mounting frames (46). A positioning mechanism (5) is installed between the two mounting frames (46). A second gear (45) is arranged on the outer surface of the rotating rod (41). The second gear (45) is fixedly connected with one of the support frames (3). A transmission gear (44) is meshed with the top and bottom of the second gear (45). One side of the transmission gear (44) is meshed with a first gear (43). The first gear (43) is fixedly connected with the outer surface of the mounting frame (46).

2. A semiconductor etching device according to claim 1, characterized in that: The transmission gear (44) is rotatably connected with the side wall of the rotating frame (42). One end of the rotating rod (41) is fixedly connected with a handle (2).

3. A semiconductor etching device according to claim 1, characterized in that: The positioning mechanism (5) includes a placing plate (51). Both ends of the placing plate (51) are stuck inside the mounting frame (46). Fixed bolts (52) are arranged on both sides of the top of the placing plate (51).

4. A semiconductor etching device according to claim 3, characterized in that: The bottom ends of the fixed bolts (52) are fixedly connected with the placing plate (51). The fixed bolts (52) are in threaded connection with the mounting frame (46).

5. A semiconductor etching device according to claim 4, characterized in that: Second moving frames (54) are arranged on both sides of the bottom of the fixed bolts (52). Two first moving frames (53) are symmetrically arranged on the top of the fixed bolts (52).

6. The semiconductor etching apparatus according to claim 5, wherein: A plurality of pressing rods (56) are in threaded connection with the tops of the first moving frames (53). A plurality of locking rods (55) are in threaded connection with the bottoms of the second moving frames (54).

7. A semiconductor etching apparatus according to claim 6, characterized in that: The bottom ends of the first moving frames (53) penetrate through the placing plate (51). The bottom ends of the first moving frames (53) are fixedly connected with the second moving frames (54). The first moving frames (53) are slidably connected with the placing plate (51).

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