Wafer positioning device

Abstract

The utility model discloses a wafer positioning device, and the device comprises a transferring structure which comprises a plurality of wafer fork parts, and the plurality of wafer fork parts are jointly used for bearing and transferring a wafer; the suction cup comprises an adsorption surface and a plurality of positioning grooves, the adsorption surface is used for adsorbing the wafer, the positioning grooves are formed by sinking the adsorption surface in the third direction, the positioning grooves are at least provided with ports which are located at the edge of the suction cup and communicated with the outside, and the positioning grooves and the wafer fork parts are arranged in a one-to-one correspondence mode and matched in shape; each positioning groove is internally provided with a first detection assembly, each first detection assembly is provided with a plurality of detection pieces, and the plurality of detection pieces are used for detecting the positions of the corresponding sheet fork parts in the corresponding positioning grooves. According to the wafer positioning device, the wafer fork and the suction cup can be positioned, the deviation value of the initial position of the wafer on the suction cup is small, the wafer is prevented from being repeatedly adjusted, and the production efficiency is guaranteed.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, and particularly relates to a wafer positioning device. Background Art

[0002] In the field of semiconductor technology, different devices are required for the production and manufacturing of semiconductor wafers. Before the wafers leave the factory, an optical defect detection device is needed to detect the wafers to ensure the overall quality of the wafers. In the detection device, a wafer positioning device is usually used to position the wafers so that the wafers reach the detection position.

[0003] Currently, the positioning device usually uses mechanisms such as wafer forks to transfer the wafers to the positioning suction cups, and then directly positions the wafers. However, in this positioning device, it is impossible to achieve the positioning between the wafer fork and the positioning suction cup, resulting in a large deviation after the wafer is placed on the positioning suction cup, and repeated adjustments are required, which affects the production efficiency. Utility Model Content

[0004] This application provides a wafer positioning device, which can position between the wafer fork and the suction cup, so that the deviation of the initial position of the wafer on the suction cup is small, avoiding repeated adjustment of the wafer and ensuring the production efficiency.

[0005] This application provides a wafer positioning device, which includes: a transfer structure, including a plurality of wafer fork parts, and the plurality of wafer fork parts are jointly used to carry and transfer wafers; a suction cup, including an adsorption surface and a plurality of positioning grooves, the adsorption surface is used to adsorb the wafers, the positioning grooves are formed by the adsorption surface recessing along the third direction, and the positioning grooves at least have ports located at the edge of the suction cup and communicating with the outside. The plurality of positioning grooves are arranged in one-to-one correspondence with the plurality of wafer fork parts and have matching shapes. A first detection component is arranged in each positioning groove, and each first detection component has a plurality of detection parts, and the plurality of detection parts are used to detect the position of the corresponding wafer fork part in the corresponding positioning groove.

[0006] For the above wafer positioning device, among the plurality of detection parts of the first detection component, there are a first detection part, a second detection part and a third detection part. The first detection part, the second detection part and the third detection part are arranged at intervals in each positioning groove. The first detection part is used to detect the position information of the wafer fork part in the first direction, the first detection part is used to detect the position information of the wafer fork part in the second direction, and the third detection part is used to detect the position information of the wafer fork part in the third direction.

[0007] For the above wafer positioning device, the long side of the positioning groove extends along the first direction. The positioning groove includes a first side wall, a second side wall and a bottom wall that are perpendicular to each other. The first side wall is perpendicular to the first direction, the second side wall is perpendicular to the second direction, and the bottom wall is perpendicular to the third direction. The first detection part is installed on the first side wall, the second detection part is installed on the second side wall, and the third detection part is installed on the bottom wall.

[0008] The wafer positioning device as described above, wherein the first detection member, the second detection member, and the third detection member are all distance sensors, respectively used to detect the distances between the wafer fork portion and the first side wall, the second side wall, and the bottom wall.

[0009] The wafer positioning device as described above, wherein the first detection member, the second detection member, and the third detection member are all travel switches. There is one first detection member on the first side wall, one second detection member on the second side wall, and one third detection member on the bottom wall. The first detection member, the second detection member, and the third detection member can respectively detect whether the wafer fork portion is in place in the first direction, the second direction, and the third direction.

[0010] The wafer positioning device as described above, wherein the first detection member, the second detection member, and the third detection member are all travel switches. There are multiple first detection members on the first side wall, and the distances between the multiple first detection members and the first side wall increase in sequence, used to detect the specific position of the wafer fork portion in the first direction. There are multiple second detection members on the second side wall, and the distances between the multiple second detection members and the second side wall increase in sequence, used to detect the specific position of the wafer fork portion in the second direction. There are multiple third detection members on the bottom wall, and the distances between the multiple third detection members and the bottom wall increase in sequence, used to detect the specific position of the wafer fork portion in the third direction.

[0011] The wafer positioning device as described above, wherein the wafer fork portion has a plate-like structure, and the thickness direction of the plate-like structure is parallel to the third direction. The wafer fork portion has a first induction member, a second induction member, and a third induction member. The first induction member, the second induction member, and the third induction member are arranged at intervals on the surface of the wafer fork portion. The first induction member is arranged opposite to the first detection member in position, used to cooperate with the first detection member to detect the position of the wafer fork portion in the first direction. The second induction member is arranged opposite to the second detection member in position, used to cooperate with the second detection member to detect the position of the wafer fork portion in the second direction. The third induction member is arranged opposite to the third detection member in position, used to cooperate with the third detection member to detect the position of the wafer fork portion in the third direction.

[0012] The wafer positioning device as described above, wherein the wafer fork portion includes a connected first side surface, a second side surface, and a bottom surface. The first side surface is arranged at the end of the wafer fork portion in the first direction. The second side surface is perpendicular to the second direction, and the bottom surface is perpendicular to the third direction. The first induction member is arranged on the first side surface, the second induction member is arranged on the second side surface, and the third induction member is arranged on the bottom surface.

[0013] The wafer positioning device as described above, wherein in the first direction, the second detection member and the third detection member are arranged in a staggered manner.

[0014] The wafer positioning device described above, wherein the transfer structure includes two wafer forks, and the length of one wafer fork along the first direction is greater than that of the other wafer fork along the first direction; the suction cup includes two positioning grooves, the two positioning grooves are respectively arranged corresponding to the two wafer forks, and the extension length of each positioning groove along the first direction is greater than the length of the corresponding wafer fork along the first direction.

[0015] The wafer positioning device of the present application includes a transfer structure and a suction cup. The transfer structure includes a plurality of wafer forks, and the plurality of wafer forks are jointly used to carry and transfer wafers; the suction cup includes a suction surface and a plurality of positioning grooves. When the wafer forks transfer the wafers to the suction cup, each wafer fork aligns with the corresponding positioning groove and is inserted into the interior of the positioning groove from the port of the positioning groove. Since the positioning groove is recessed from the suction surface along the third direction, the wafer carried on the wafer fork can be accurately placed on the suction surface, and the wafer can be in direct contact with the suction surface. After the suction surface adsorbs the wafer, the positioning and fixing of the wafer on the suction cup can be achieved.

[0016] When the wafer fork is inserted into the interior of the positioning groove, the plurality of detection components in the positioning groove can detect the position of the wafer fork in the positioning groove to detect whether the wafer fork reaches the positioning position in the positioning groove, so as to complete the positioning between the wafer fork and the suction cup, and further make the initial position deviation of the wafer transported from the wafer fork to the suction cup smaller, avoiding repeated adjustment of the wafer position subsequently and ensuring production efficiency. Description of the Drawings

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required to be used in the embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic diagram of the overall structure of the wafer positioning device of the embodiment of the present application;

[0019] Figure 2 It is a sectional view of the wafer positioning device of the embodiment of the present application;

[0020] Figure 3 It is a sectional view of the wafer positioning device of the embodiment of the present application in cooperation with the wafer;

[0021] Figure 4 It is a schematic diagram of the transfer structure of the wafer positioning device of the embodiment of the present application;

[0022] Figure 5 It is a schematic diagram of another perspective of the transfer structure of the wafer positioning device of the embodiment of the present application.

[0023] Explanation of the Reference Numerals in the Drawings:

[0024] 10. Transfer structure; 11. Chip fork part; 111. First sensing part; 112. Second sensing part; 113. Third sensing part; 114. First side; 115. Second side; 116. Bottom surface; 12. Chip fork connection part; 20. Suction cup; 21. Adsorption surface; 22. Positioning groove; 221. First side wall; 222. Second side wall; 223. Bottom wall; 23. First detection component; 231. First detection piece; 232. Second detection piece; 233. Third detection piece; 24. Wafer detection piece;

[0025] 100. Wafer;

[0026] X. First direction; Y. Second direction; Z. Third direction. Detailed implementation manners

[0027] The features and exemplary embodiments of various aspects of the present application will be described in detail below. To make the objectives, technical solutions and advantages of the present application more clear and understandable, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than limiting the present application. For those skilled in the art, the present application can be implemented without some of these specific details. The following description of the embodiments is only intended to provide a better understanding of the present application by showing examples of the present application.

[0028] As Figures 1 to 5 shown, an embodiment of the present application provides a wafer positioning device, which includes: a transfer structure 10, including a plurality of chip fork parts 11, and the plurality of chip fork parts 11 are jointly used to carry and transfer the wafer 100; a suction cup 20, including an adsorption surface 21 and a plurality of positioning grooves 22, the adsorption surface 21 is used to adsorb the wafer 100, the positioning grooves 22 are recessed from the adsorption surface 21 along the third direction Z, and the positioning grooves 22 at least have ports located at the edge of the suction cup 20 and communicating with the outside. The plurality of positioning grooves 22 are arranged in one-to-one correspondence and with matching shapes with the plurality of chip fork parts 11, and a first detection component 23 is arranged in each positioning groove 22, and each first detection component 23 has a plurality of detection pieces, and the plurality of detection pieces are used to detect the position of the corresponding chip fork part 11 in the corresponding positioning groove 22.

[0029] As Figure 1 、 Figure 4 and Figure 5As shown in the figure, the transfer structure 10 in the embodiment of the present application has a plurality of wafer fork parts 11. The plurality of wafer fork parts 11 are connected by a wafer fork connection part 12. The plurality of wafer fork parts 11 jointly carry the wafer 100, so that there are a plurality of support points at the bottom of the wafer 100. The wafer 100 can be stably placed on the transfer structure 10 and transferred, so that the wafer 100 can stably reach the suction cup 20 for positioning. Moreover, the wafer fork part 11 also has an adsorption port. Through the adsorption port, the wafer fork part 11 can adsorb a part of the wafer 100 on the surface. During the process of transporting the wafer 100, the wafer 100 will not fall off from the surface of the wafer fork part 11, nor will there be relative displacement, thereby improving the positioning accuracy of the wafer 100 after being transported to the suction cup 20.

[0030] When the wafer positioning device of the present application is adopted, the specific movement and positioning process are as follows: The plurality of wafer fork parts 11 of the transfer structure 10 of the wafer positioning device carry the wafer 100 and move towards the suction cup 20. When contacting the suction cup 20, the plurality of wafer fork parts 11 respectively align with the ports of the plurality of positioning grooves 22 and enter the inside of the positioning grooves 22 from the ports communicating with the outside. Until the wafer fork part 11 completely enters the inside of the positioning groove 22, the wafer 100 can be abutted against the adsorption surface 21. At this time, the first detection component 23 detects the position of the wafer fork part 11 until the wafer fork part 11 reaches the positioning position. The positioning position is the position where the wafer 100 is positioned on the adsorption surface 21 of the suction cup 20. If the first detection component 23 detects that the wafer fork part 11 is not in the positioning position, the positions of the wafer fork part 11 and the wafer 100 carried on the wafer fork part 11 are jointly adjusted until adjusted to the positioning position. After the adsorption and positioning of the wafer 100 are completed, the wafer fork part 11 moves out from the port of the positioning groove 22 to complete the subsequent operations on the wafer 100.

[0031] Specifically, the wafer positioning device of the present application includes a transfer structure 10 and a suction cup 20. The transfer structure 10 includes a plurality of wafer fork parts 11, and the plurality of wafer fork parts 11 are jointly used to carry and transfer the wafer 100; the suction cup 20 includes an adsorption surface 21 and a plurality of positioning grooves 22. When the wafer fork part 11 transfers the wafer 100 to the suction cup 20, each wafer fork part 11 aligns with the corresponding positioning groove 22 and is inserted into the inside of the positioning groove 22 from the port of the positioning groove 22. Since the positioning groove 22 is recessed from the adsorption surface 21 along the third direction Z, the wafer 100 carried on the wafer fork part 11 is accurately placed on the adsorption surface 21, and the wafer 100 can be in direct contact with the adsorption surface 21. After the adsorption surface 21 adsorbs the wafer, the positioning and fixing of the wafer 100 on the suction cup 20 can be realized.

[0032] When the wafer fork part 11 is inserted into the positioning groove 22, multiple detection parts of the first detection component 23 in the positioning groove 22 can detect the position of the wafer fork part 11 in the positioning groove 22, so as to detect whether the wafer fork part 11 reaches the positioning position in the positioning groove 22, complete the positioning between the wafer fork part 11 and the suction cup 20, and further make the initial position deviation of the wafer 100 transported from the wafer fork part 11 to the suction cup 20 smaller, avoiding repeated adjustment of the position of the wafer 100 subsequently and ensuring the production efficiency.

[0033] Moreover, by setting the first detection component 23, the real-time position of the wafer fork part 11 in the positioning groove 22 can be detected in real time. After connecting the first detection component 23 to an external display device, the display device can reflect the detection information of the first detection component 23 in real time, realizing the visualization of the position of the wafer fork part 11.

[0034] Specifically, the suction cup 20 further includes multiple wafer detection parts 24, and the wafer detection parts 24 are distributed on the circumferential side of the suction cup and can detect the position of the wafer 100 on the suction cup 20 to determine whether the wafer 100 is accurately in place after positioning.

[0035] Optionally, the first detection component 23 can be set only in one positioning groove 22, and the remaining positioning grooves 22 are only used to accommodate the wafer fork part 11, which can reduce the setting of detection components to reduce the overall cost of the wafer positioning device.

[0036] As Figure 2 shown, in the wafer positioning device of the embodiment of the present application, among the multiple detection parts of the first detection component 23, there are a first detection part 231, a second detection part 232, and a third detection part 233. The first detection part, the second detection part, and the third detection part 233 are all arranged at intervals in each positioning groove 22. The first detection part 231 is used to detect the position information of the wafer fork part 11 in the first direction X, the first detection part 231 is used to detect the position information of the wafer fork part 11 in the second direction Y, and the third detection part 233 is used to detect the position information of the wafer fork part 11 in the third direction Z.

[0037] During specific implementation, the first detection part 231, the second detection part 232, and the third detection part 233 are arranged at intervals in the same positioning groove 22 and can avoid influencing each other. When the wafer fork part 11 enters the positioning groove 22, the first detection part 231, the second detection part 232, and the third detection part 233 can respectively detect the specific position of the wafer fork part 11 in the first direction X, the second direction Y, and the third direction Z, thus realizing the three-dimensional detection of the wafer fork part 11. By judging the three-dimensional position of the wafer fork part 11, it can be confirmed whether the wafer fork part 11 reaches the positioning position in the positioning groove 22.

[0038] As Figure 2As shown in the figure, the wafer positioning device of the embodiment of the present application. Among them, the long side of the positioning groove 22 extends along the first direction X. The positioning groove 22 includes a first side wall 221, a second side wall 222, and a bottom wall 223 that are perpendicular to each other in pairs. The first side wall 221 is perpendicular to the first direction X, the second side wall 222 is perpendicular to the second direction Y, and the bottom wall 223 is perpendicular to the third direction Z. The first detection member 231 is installed on the first side wall 221, the second detection member 232 is installed on the second side wall 222, and the third detection member 233 is installed on the bottom wall 223.

[0039] During specific implementation, the positioning groove 22 is a square groove, and its long side extends along the first direction X. It has two first side walls 221 spaced along the first direction X, one second side wall 222, and one bottom wall 223. The first side wall 221, the second side wall 222, and the bottom wall 223 are perpendicular to each other in pairs. The first detection member 231, the second detection member 232, and the third detection member 233 are respectively installed on the first side wall 221, the second side wall 222, and the bottom wall 223, so that the detection of the three-dimensional position of the wafer fork portion 11 in the positioning groove 22 by the first detection member 231, the second detection member 232, and the third detection member 233 is more intuitive and accurate. Among them, the first detection member 231 provided on the first side wall 221 can judge the specific position of the wafer fork portion 11 in the first direction X by detecting the position of the first side surface 114 of the wafer fork portion 11; the second detection member 232 provided on the second side wall 222 can judge the specific position of the wafer fork portion 11 in the second direction Y by detecting the position of the second side surface 115 of the wafer fork portion 11; the third detection member 233 provided on the bottom wall 223 can judge the specific position of the wafer fork portion 11 in the third direction Z by detecting the position of the bottom surface 116 of the wafer fork portion 11.

[0040] As Figure 2 shown in the figure, in the wafer positioning device of the embodiment of the present application, among them, the first detection member 231, the second detection member 232, and the third detection member 233 are all distance sensors, and are respectively used to detect the distances between the wafer fork portion 11 and the first side wall 221, the second side wall 222, and the bottom wall 223.

[0041] During specific implementation, the first detection member 231, the second detection member 232, and the third detection member 233 configured as distance sensors can directly detect the distances between the wafer fork portion 11 and the first side wall 221, the second side wall 222, and the bottom wall 223, so as to judge whether the wafer fork portion 11 reaches the positioning position in its three-dimensional direction. By using distance sensors, the measurement of the specific position of the wafer fork portion 11 is relatively accurate, and the distance sensors are sensitive and can detect the position of the wafer fork portion 11 in real time.

[0042] Specifically, the distance sensor is at least one of a photoelectric sensor, a capacitive sensor, and an inductive sensor, preferably a photoelectric sensor, which can quickly and accurately detect the position of the wafer fork portion 11 by reflected light.

[0043] In a wafer positioning device according to an alternative embodiment of the present application, the first detection member 231, the second detection member 232, and the third detection member 233 are all travel switches. There is one first detection member 231 on the first side wall 221, one second detection member 232 on the second side wall 222, and one third detection member 233 on the bottom wall 223. The first detection member 231, the second detection member 232, and the third detection member 233 can respectively detect whether the wafer fork portion 11 is in place in the first direction X, the second direction Y, and the third direction Z.

[0044] In specific implementation, the first detection member 231, the second detection member 232, and the third detection member 233 configured as travel switches are respectively provided on the first side wall 221, the second side wall 222, and the bottom wall 223, and there is only one detection member on each side wall or the bottom wall. The detection members are respectively provided at the predetermined positions of the wafer fork portion 11 in the first direction X, the second direction Y, and the third direction Z, that is, the above-mentioned positioning positions. After the wafer fork portion 1, when it enters the positioning groove 22 and contacts the first detection member 231, the second detection member 232, or the third detection member 233, the first detection member 231, the second detection member 232, or the third detection member 233 can send a signal indicating that the detection is in place, which means that the wafer fork portion 11 is positioned in the first direction X, the second direction Y, and the third direction Z, and the positioning between the wafer fork portion 11 and the chuck 20 is completed.

[0045] Providing one detection member on each side wall or the bottom wall is applicable to wafers with fixed positioning positions. By directly detecting whether the wafer fork portion 11 carrying the wafer is in place, the detection is completed. When it is necessary to detect wafers of the same type, the wafer positioning device in this embodiment can be used for batch detection to quickly position the wafers and ensure production efficiency.

[0046] In a wafer positioning device according to another alternative embodiment of the present application, the first detection member 231, the second detection member 232, and the third detection member 233 are all travel switches. There are multiple first detection members 231 on the first side wall 221, and the distances between the multiple first detection members 231 and the first side wall 221 increase in sequence, for detecting the specific position of the wafer fork portion 11 in the first direction X. There are multiple second detection members 232 on the second side wall 222, and the distances between the multiple second detection members 232 and the second side wall 222 increase in sequence, for detecting the specific position of the wafer fork portion 11 in the second direction Y. There are multiple third detection members 233 on the bottom wall 223, and the distances between the multiple third detection members 233 and the bottom wall 223 increase in sequence, for detecting the specific position of the wafer fork portion 11 in the third direction Z.

[0047] In specific implementation, the first detection member 231, the second detection member 232, and the third detection member 233 configured as travel switches are respectively disposed on the first side wall 221, the second side wall 222, and the bottom wall 223. A plurality of detection members are provided on each side wall or the bottom wall, and the distances between the plurality of detection members and their corresponding side walls or the bottom wall increase in sequence, so as to specifically detect different positions of the wafer fork portion 11 in various directions, thereby being able to provide real-time feedback on different positions of the wafer fork portion 11 in the positioning groove 22. When the detection members detect that the wafer fork portion 11 reaches the positioning positions in the first direction X, the second direction Y, and the third direction Z, it means that the positioning between the wafer fork portion 11 and the suction cup 20 is completed.

[0048] It should be noted that since the setting method is that the distances between a plurality of travel switches and their corresponding side walls or the bottom wall increase in sequence, the number of travel switches and the height difference between adjacent travel switches can be specifically set according to the positioning accuracy to meet the wafer positioning requirements.

[0049] The first detection member 231, the second detection member 232, and the third detection member 233 in the above two embodiments are all travel switches, which can be immediately triggered when the wafer fork portion 11 comes into contact, so as to accurately judge the position of the wafer fork portion 11 and make the positioning of the wafer fork portion 11 more accurate.

[0050] As Figure 4 and Figure 5 shown, for the wafer positioning device according to the embodiment of the present application, wherein, the wafer fork portion 11 has a plate-like structure, the thickness direction of the plate-like structure is parallel to the third direction Z, the wafer fork portion 11 has a first induction member 111, a second induction member 112, and a third induction member 113. The first induction member 111, the second induction member 112, and the third induction member 113 are spaced apart and disposed on the surface of the wafer fork portion 11. The first induction member 111 is disposed opposite to the first detection member 231 in position for cooperating with the first detection member 231 to detect the position of the wafer fork portion 11 in the first direction X. The second induction member 112 is disposed opposite to the second detection member 232 in position for cooperating with the second detection member 232 to detect the position of the wafer fork portion 11 in the second direction Y. The third induction member 113 is disposed opposite to the third detection member 233 in position for cooperating with the third detection member 233 to detect the position of the wafer fork portion 11 in the third direction Z.

[0051] In specific implementation, the first induction member 111, the second induction member 112, and the third induction member 113 of the wafer fork portion 11 are spaced apart and disposed on the surface of the wafer fork portion 11, and are respectively disposed opposite to the first detection member 231, the second detection member 232, and the third detection member 233 in position. Through the cooperation between the induction members and the corresponding detection members, the detection accuracy of each detection member for the wafer fork portion 11 can be improved.

[0052] Specifically, when the first detection member 231, the second detection member 232, and the third detection member 233 are distance sensors, the first sensing member 111, the second sensing member 112, and the third sensing member 113 can be set as structures such as metal, magnetic strip, or mirror to reflect the signals emitted by the detection members, thereby improving the overall detection sensitivity; when the first detection member 231, the second detection member 232, and the third detection member 233 are travel switches, the first sensing member 111, the second sensing member 112, and the third sensing member 113 can be set as structures protruding from the surface of the wafer fork portion 11 to align with the detection members and make contact with the corresponding detection members to ensure the detection accuracy of the detection members.

[0053] As Figure 4 and Figure 5 shown, in the wafer positioning device according to the embodiment of the present application, the wafer fork portion 11 includes a connected first side surface 114, a second side surface 115, and a bottom surface 116. The first side surface 114 is provided at the end of the wafer fork portion 11 in the first direction X. The second side surface 115 is perpendicular to the second direction Y, and the bottom surface 116 is perpendicular to the third direction Z. The first sensing member 111 is provided on the first side surface 114, the second sensing member 112 is provided on the second side surface 115, and the third sensing member 113 is provided on the bottom surface 116.

[0054] During specific implementation, the first side surface 114, the second side surface 115, and the bottom surface 116 of the wafer fork portion 11 are respectively arranged corresponding to the first side wall 221, the second side wall 222, and the bottom wall 223 of the positioning groove 22. The first sensing member 111, the second sensing member 112, and the third sensing member 113 respectively provided on the first side surface 114, the second side surface 115, and the bottom surface 116 can align with the first detection member 231, the second detection member 232, and the third detection member 233, thereby ensuring the detection accuracy and precision of each detection member.

[0055] As Figure 2 shown, in the wafer positioning device according to the embodiment of the present application, in the first direction X, the second detection member 232 and the third detection member 233 are arranged in a staggered manner.

[0056] During specific implementation, the long side of the positioning groove 22 extends in the first direction X. Therefore, the widths and heights of the positioning groove 22 in the second direction Y and the third direction Z are both small. The second detection member 232 and the third detection member 233 provided on the second side wall 222 and the bottom wall 223 are relatively close in both the second direction Y and the third direction Z. Arranging the second detection member 232 and the third detection member 233 in a staggered manner in the first direction X can increase the distance between them and avoid mutual influence between the second detection member 232 and the third detection member 233 during detection.

[0057] As Figure 1 、 Figure 4 and Figure 5As shown in the figure, the wafer positioning device according to the embodiment of the present application, wherein the transfer structure 10 includes two wafer forks 11, and the length of one wafer fork 11 along the first direction X is greater than that of the other wafer fork 11 along the first direction X; the suction cup 20 includes two positioning grooves 22, and the two positioning grooves 22 are respectively arranged corresponding to the two wafer forks 11, and the extension length of each positioning groove 22 along the first direction X is greater than the length of the corresponding wafer fork 11 along the first direction X.

[0058] During specific implementation, the transfer structure 10 moves towards the suction cup 20 along the first direction X, and the two wafer forks 11 enter into the corresponding positioning grooves 22 along the first direction X. The lengths of the two wafer forks 11 along the first direction X are different, and the lengths of the two positioning grooves 22 along the first direction X are different and are adapted to the two wafer forks 11. When the wafer forks 11 enter the corresponding positioning grooves 22, no conflict will occur. Such a setting avoids the problem that the wafer is inaccurately positioned due to the wafer forks 11 entering the wrong positioning grooves 22, and further improves the positioning accuracy and positioning efficiency of the wafer.

[0059] Optionally, the transfer structure 10 may include multiple wafer forks 11 with different lengths, and the suction cup 20 is correspondingly provided with multiple positioning grooves 22 with different lengths, which can also realize the loading and positioning of the wafer 100.

[0060] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, the elements defined by the statement "including..." do not exclude the existence of additional identical elements in the process, method, article or device including the said elements.

[0061] The above is only the specific implementation manner of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the above-described systems, modules and units can refer to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or substitutions within the technical scope disclosed by the present application, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A wafer positioning device, characterized in that, Comprising: A transfer structure (10), including a plurality of wafer fork parts (11), and the plurality of wafer fork parts (11) are jointly used to carry and transfer a wafer (100); A chuck (20), including an adsorption surface (21) and a plurality of positioning grooves (22), the adsorption surface (21) is used to adsorb the wafer (100), the positioning grooves (22) are recessed from the adsorption surface (21) along the third direction (Z), and the positioning grooves (22) at least have ports located at the edge of the chuck (20) and communicating with the outside. The plurality of positioning grooves (22) are arranged in one-to-one correspondence with the plurality of wafer fork parts (11) and are adapted in shape. A first detection component (23) is provided in each of the positioning grooves (22), and each of the first detection components (23) has a plurality of detection elements, and the plurality of detection elements are used to detect the position of the corresponding wafer fork part (11) in the corresponding positioning groove (22).

2. The wafer positioning device according to claim 1, wherein Among the plurality of detection elements of the first detection component (23), there are included a first detection element (231), a second detection element (232), and a third detection element (233). The first detection element (231), the second detection element (232), and the third detection element (233) are spaced apart in each of the positioning grooves (22). The first detection element (231) is used to detect the position information of the wafer fork part (11) in the first direction (X), the first detection element (231) is used to detect the position information of the wafer fork part (11) in the second direction (Y), and the third detection element (233) is used to detect the position information of the wafer fork part (11) in the third direction (Z).

3. The wafer positioning device according to claim 2, wherein The long side of the positioning groove (22) extends along the first direction (X). The positioning groove (22) includes a first side wall (221), a second side wall (222), and a bottom wall (223) that are perpendicular to each other in pairs. The first side wall (221) is perpendicular to the first direction (X), the second side wall (222) is perpendicular to the second direction (Y), and the bottom wall (223) is perpendicular to the third direction (Z). The first detection element (231) is installed on the first side wall (221), the second detection element (232) is installed on the second side wall (222), and the third detection element (233) is installed on the bottom wall (223).

4. The wafer positioning device according to claim 3, wherein, The first detection element (231), the second detection element (232), and the third detection element (233) are all distance sensors, and are respectively used to detect the distances between the wafer fork part (11) and the first side wall (221), the second side wall (222), and the bottom wall (223).

5. The wafer positioning device according to claim 3, wherein The first detection member (231), the second detection member (232), and the third detection member (233) are all travel switches. There is one first detection member (231) on the first side wall (221), one second detection member (232) on the second side wall (222), and one third detection member (233) on the bottom wall (223). The first detection member (231), the second detection member (232), and the third detection member (233) can respectively detect whether the blade fork portion (11) is in place in the first direction (X), the second direction (Y), and the third direction (Z).

6. The wafer positioning device according to claim 3, characterized in that, The first detection member (231), the second detection member (232), and the third detection member (233) are all travel switches. There are multiple first detection members (231) on the first side wall (221), and the distances between the multiple first detection members (231) and the first side wall (221) increase in sequence, for detecting the specific position of the blade fork portion (11) in the first direction (X). There are multiple second detection members (232) on the second side wall (222), and the distances between the multiple second detection members (232) and the second side wall (222) increase in sequence, for detecting the specific position of the blade fork portion (11) in the second direction (Y). There are multiple third detection members (233) on the bottom wall (223), and the distances between the multiple third detection members (233) and the bottom wall (223) increase in sequence, for detecting the specific position of the blade fork portion (11) in the third direction (Z).

7. The wafer positioning device according to any one of claims 4 to 6, characterized in that, The blade fork portion (11) has a plate-like structure, and the thickness direction of the plate-like structure is parallel to the third direction (Z). The blade fork portion (11) has a first sensing member (111), a second sensing member (112), and a third sensing member (113). The first sensing member (111), the second sensing member (112), and the third sensing member (113) are arranged at intervals on the surface of the blade fork portion (11). The first sensing member (111) is arranged opposite to the first detection member (231) in position, for cooperating with the first detection member (231) to detect the position of the blade fork portion (11) in the first direction (X). The second sensing member (112) is arranged opposite to the second detection member (232) in position, for cooperating with the second detection member (232) to detect the position of the blade fork portion (11) in the second direction (Y). The third sensing member (113) is arranged opposite to the third detection member (233) in position, for cooperating with the third detection member (233) to detect the position of the blade fork portion (11) in the third direction (Z).

8. The wafer positioning device according to claim 7, wherein The chip fork part (11) includes a connected first side surface (114), a second side surface (115) and a bottom surface (116). The first side surface (114) is arranged at the end of the chip fork part (11) in the first direction (X). The second side surface (115) is perpendicular to the second direction (Y). The bottom surface (116) is perpendicular to the third direction (Z). The first sensing element (111) is arranged on the first side surface (114). The second sensing element (112) is arranged on the second side surface (115). The third sensing element (113) is arranged on the bottom surface (116).

9. The wafer positioning device according to claim 3, wherein, In the first direction (X), the second detection element (232) and the third detection element (233) are arranged in a staggered manner.

10. The wafer positioning device according to claim 1, wherein, The transfer structure (10) includes two chip fork parts (11), and the length of one chip fork part (11) in the first direction (X) is greater than the length of the other chip fork part (11) in the first direction (X). The suction cup (20) includes two positioning grooves (22). The two positioning grooves (22) are respectively arranged corresponding to the two chip fork parts (11), and the extension length of each positioning groove (22) in the first direction (X) is greater than the length of the corresponding chip fork part (11) in the first direction (X).

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