Radiator, radiating assembly and power conversion equipment

Abstract

The utility model discloses a heat radiator, a heat radiation assembly and power conversion equipment, the heat radiator comprises a substrate and a heat pipe heat radiation unit, the first plate surface of the substrate is used for exchanging heat with a power heating device; the heat pipe radiating unit comprises a heat pipe and radiating fins, and a heat pipe evaporation section of the heat pipe is used for exchanging heat with the substrate; the heat pipe condensation section is located on the side, corresponding to the second plate face, of the base plate, and the multiple cooling fins are sequentially arranged on the heat pipe condensation section at intervals. According to the radiator, on one hand, the more efficient heat dissipation effect can be achieved through the heat pipe phase change heat dissipation principle, on the other hand, due to the fact that the heat dissipation fins are directly arranged on the condensation sections of the heat pipes, heat transfer paths are effectively reduced, the heat exchange efficiency of the heat pipes can be improved, and then the heat dissipation performance of the radiator is improved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and more specifically, to a radiator, a heat dissipation component, and a power conversion device. Background Art

[0002] In current power conversion equipment, high-heat-flux power semiconductor devices often require heat sinks to dissipate heat. However, as the heat flux of power semiconductor devices increases, the heat dissipation performance of existing heat sinks has reached a bottleneck and can no longer meet the higher heat dissipation requirements.

[0003] Therefore, how to improve the heat dissipation performance of the radiator has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0004] In view of this, the present application provides a radiator, a heat dissipation component and a power conversion device to improve the heat dissipation performance of the radiator.

[0005] To achieve the above objectives, this application provides the following technical solutions:

[0006] A radiator, comprising:

[0007] A substrate having a first plate surface and a second plate surface arranged opposite to each other, wherein the first plate surface is used for exchanging heat with a power heating device;

[0008] A heat pipe heat dissipation unit, the heat pipe heat dissipation unit includes a heat pipe and heat dissipation fins, the heat pipe has a heat pipe evaporation section and a heat pipe condensation section; the heat pipe evaporation section is connected to the substrate, the heat pipe condensation section is located on the side of the substrate corresponding to the second plate surface, and the number of the heat dissipation fins is plural and is arranged in the heat pipe condensation section in an interval arrangement.

[0009] In some embodiments of the present application, there are multiple heat pipe heat dissipation units, and the heat dissipation fins are all parallel to the second plate surface.

[0010] In some embodiments of the present application, the heat dissipation fins are constructed as common heat dissipation fins parallel to the second plate surface, and the heat pipe condensation sections of each of the heat pipe heat dissipation units are all arranged through the common heat dissipation fins.

[0011] In some embodiments of the present application, an embedding cavity for embedding the evaporation section of the heat pipe is provided on the substrate.

[0012] In some embodiments of the present application, the embedding cavity is constructed as a first embedding groove formed on the side of the substrate corresponding to the first plate surface, and the heat pipe evaporation section embedded in the first embedding groove is in contact with the power heating device for heat exchange.

[0013] In some embodiments of the present application, a clearance groove communicating the first embedded groove with the second plate surface is provided on the substrate. The heat pipe evaporation section and the heat pipe condensation section are connected by a heat pipe transition section, and the heat pipe transition section is bent and led out from the clearance groove.

[0014] In some embodiments of the present application, a sealing structure is provided in the assembly gap between the heat pipe transition section and the clearance groove.

[0015] In some embodiments of the present application, the embedded cavity is configured to form a second embedded groove on the side of the substrate corresponding to the second plate surface, and the heat pipe evaporation section is embedded in the second embedded groove. Wherein, the second embedded groove is not communicated with the first plate surface.

[0016] In some embodiments of the present application, the heat dissipation fins of the heat pipe heat dissipation unit are connected to the second plate surface in an angular arrangement.

[0017] In some embodiments of the present application, the included angle between the heat dissipation fins of the heat pipe heat dissipation unit and the second plate surface is 90°; the heat pipe condensation section of the heat pipe heat dissipation unit is parallel to the second plate surface.

[0018] Compared with the content of the background art introduction, in the actual application process of the above radiator, heat exchange is carried out between the first plate surface and the corresponding power heating device on the power conversion device, so that the heat of the power heating device can be transferred to the substrate. The substrate can absorb the heat of the substrate through the heat pipe evaporation section of the heat pipe, and the absorbed heat is transferred to the heat pipe condensation section, and then the heat dissipation fins on the heat pipe condensation section are used for condensation heat dissipation. The heat pipe phase change heat dissipation principle can be used to achieve a more efficient heat dissipation effect. Since the heat dissipation fins are directly arranged on the heat pipe condensation section, the heat transfer path is effectively reduced, which helps to enhance the heat exchange efficiency of the heat pipe, and then improves the heat dissipation performance of the radiator.

[0019] On the other hand, the present application also provides a heat dissipation assembly, including a mounting plate and the radiator described in any of the above solutions: wherein, the mounting plate has a first surface and a second surface arranged oppositely, the first surface of the mounting plate corresponds to the side where the power heating device is located, and at least one assembly notch is provided on the second surface of the mounting plate; the substrate of the radiator is embedded in the assembly notch in a one-to-one matching manner. Since the aforementioned radiator has the above technical effects, the heat dissipation assembly having the radiator should also have the corresponding technical effects, which will not be elaborated here.

[0020] In some embodiments of the present application, the assembly notch is configured to be a through notch penetrating from the second surface to the first surface;

[0021] Or, the assembly notch is configured to be a blind-end notch that does not penetrate to the first surface.

[0022] In some embodiments of the present application, the assembly notch is configured as a stepped notch structure that tapers step by step from the second side to the first side, and a stepped boss structure adapted to the stepped notch structure is provided on the substrate.

[0023] In some embodiments of the present application, the heat pipe of the heat sink bends and extends from the side of the substrate to one side of the second plate surface of the substrate, and a transition groove adapted to the bending structure of the heat pipe is provided at a position corresponding to the bending of the heat pipe in the assembly notch.

[0024] In some embodiments of the present application, the mounting plate is configured as a part of the wall of the power conversion device.

[0025] On the other hand, the present application also provides a power conversion device, including a housing. A partition is provided in the housing, and the partition divides the inner cavity of the housing into a first cavity and a second cavity. A power heating device is provided in the first cavity, and a heat dissipation device is provided in the second cavity. The heat dissipation device is arranged on the partition for heat exchange with the power heating device. The heat dissipation device is the heat sink or the heat dissipation assembly described in any of the above solutions. Since the aforementioned heat sink and heat dissipation assembly both have the above technical effects, the power conversion device having the heat sink or the heat dissipation assembly should also have the corresponding technical effects, which will not be elaborated here.

[0026] In some embodiments of the present application, a cooling fan is further provided in the second cavity. The second cavity has an air inlet and an air outlet. The cooling fan is arranged on the air flow path formed between the air inlet and the air outlet. The cooling fan is arranged close to the air inlet, and the air inlet surface of the cooling fan faces the air inlet.

[0027] In some embodiments of the present application, the air inlet is provided on one of the circumferential side walls of the second cavity perpendicular to the partition, and the air outlet is provided on at least one of the remaining circumferential side walls of the second cavity perpendicular to the partition.

[0028] In some embodiments of the present application, the air inlet is provided on the cavity wall of the second cavity opposite to the partition; the air outlet is provided on at least one of the circumferential side walls of the second cavity perpendicular to the partition.

[0029] In some embodiments of the present application, the heat dissipation channels formed between two adjacent heat dissipation fins on the heat dissipation device are configured along the air outlet direction of the cooling fan.

[0030] In some embodiments of the present application, a magnetic device is further disposed in the second cavity, and the cooling fan, the cooling device, and the magnetic device are arranged in sequence along the air flow path formed by the air inlet and the air outlet. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0032] Figure 1 The first structural schematic diagram of the radiator provided by the embodiment of the present application;

[0033] Figure 2 The second structural schematic diagram of the radiator provided by the embodiment of the present application;

[0034] Figure 3 The side view structural schematic diagram of the first radiator installed in the power conversion device provided by the embodiment of the present application;

[0035] Figure 4 The front view structural schematic diagram of the first radiator installed in the power conversion device provided by the embodiment of the present application;

[0036] Figure 5 The third structural schematic diagram of the radiator provided by the embodiment of the present application;

[0037] Figure 6 The fourth structural schematic diagram of the radiator provided by the embodiment of the present application;

[0038] Figure 7 The side view structural schematic diagram of the third radiator installed in the power conversion device provided by the embodiment of the present application with the first air inlet mode;

[0039] Figure 8 The front view structural schematic diagram of the third radiator installed in the power conversion device provided by the embodiment of the present application with the first air inlet mode;

[0040] Figure 9 The side view structural schematic diagram of the third radiator installed in the power conversion device provided by the embodiment of the present application with the second air inlet mode;

[0041] Figure 10 The fifth structural schematic diagram of the radiator provided by the embodiment of the present application;

[0042] Figure 11A schematic diagram of the substrate structure of a fifth radiator provided in an embodiment of the present application;

[0043] Figure 12 A sixth structural diagram of a radiator provided in an embodiment of the present application;

[0044] Figure 13 A seventh structural schematic diagram of a radiator provided in an embodiment of the present application;

[0045] Figure 14 A schematic diagram of the substrate structure of a seventh radiator provided in an embodiment of the present application;

[0046] Figure 15 A schematic diagram of the side structure of a fifth type of radiator installed in a power conversion device provided in an embodiment of the present application, adopting the first air intake method and with the radiating fins parallel to the base plate;

[0047] Figure 16 A schematic diagram of the front structure of a fifth type of radiator installed in a power conversion device provided in an embodiment of the present application, adopting the first air intake method and with the radiating fins parallel to the base plate;

[0048] Figure 17 A schematic side view of the structure of a fifth type of radiator installed in a power conversion device provided in an embodiment of the present application, using the second air intake method and with the radiating fins perpendicular to the base plate;

[0049] Figure 18 A schematic diagram of the front structure of a fifth type of radiator installed in a power conversion device provided in an embodiment of the present application, adopting the second air intake method and with the radiating fins perpendicular to the base plate;

[0050] Figure 19 A schematic side view of the structure of a fifth type of radiator installed in a power conversion device provided in an embodiment of the present application, using the first air intake method and with the radiating fins perpendicular to the base plate;

[0051] Figure 20 A schematic structural diagram of a substrate in which a seventh type of heat sink is installed in a power conversion device provided in an embodiment of the present application, wherein the substrate is constructed as a partition.

[0052] in, Figures 1 - 20 middle:

[0053] 1-first cavity;

[0054] 11-power heating device;

[0055] 2- second cavity;

[0056] 21-air inlet;

[0057] 22-air outlet;

[0058] 221 - First sub-air outlet;

[0059] 222 - Second sub-air outlet;

[0060] 223 - Third sub-air outlet;

[0061] 23 - Partition;

[0062] 231 - Installation opening;

[0063] 24 - Magnetic device;

[0064] 25 - Cooling fan;

[0065] 26 - Heat dissipation device;

[0066] 261 - Substrate;

[0067] 2611 - First embedding groove;

[0068] 2612 - Second embedding groove;

[0069] 2613 - Step boss structure;

[0070] 2614 - Avoidance groove;

[0071] 262 - Heat pipe;

[0072] 2621 - Heat pipe evaporation section;

[0073] 2622 - Heat pipe transition section;

[0074] 2623 - Heat pipe condensation section;

[0075] 263 - Heat dissipation fin;

[0076] 264 - First plate surface;

[0077] 265 - Second plate surface;

[0078] 266 - Fixing part;

[0079] 267 - Mounting plate;

[0080] 2671 - First surface;

[0081] 2672 - Second surface;

[0082] 2673 - Assembly notch;

[0083] 2674 - Transition groove;

[0084] 271 - Fourth sub-air outlet;

[0085] 272 - Fifth sub-air outlet;

[0086] 273 - Sixth sub - air outlet;

[0087] 274 - Seventh sub - air outlet. Detailed implementation mode

[0088] The core of the technical solution of this application lies in providing a radiator, a heat dissipation component and a power conversion device to improve the heat dissipation performance of the radiator.

[0089] Next, the technical solutions in the embodiments of this application will be clearly and completely described with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0090] Refer to Figure 1 and Figure 2 As shown, the embodiment of this application provides a radiator, including a base plate 261 and a heat pipe heat dissipation unit.

[0091] Among them, as shown when the radiator is applied to a power conversion device, the base plate 261 is mainly used for heat exchange with the power - generating heat - emitting device 11 in the power conversion device. Specifically, as shown in Figure 3 and Figure 1 and Figure 2 , the base plate has a first plate surface 264 and a second plate surface 265 arranged oppositely. The first plate surface 264 is used for heat exchange with the power - generating heat - emitting device 11. The heat exchange method can be direct - contact heat exchange. For example, as shown in Figure 3 and Figure 20 , the radiator is arranged on the partition plate 23 of the power conversion device. There is an installation opening 231 on the partition plate 23, and the power - generating heat - emitting device 11 is arranged at the installation opening 231. The first plate surface 264 of the base plate 261 is in contact with the power - generating heat - emitting device 11 for heat exchange. The contact heat exchange can be direct - contact heat exchange, or indirect - contact heat exchange through bonding with thermal conductive silicone, or other non - contact indirect heat exchange. The specific structural form is not limited. It should be noted that the structure between the base plate 261 and the partition plate 23 can be designed as a split - type fixed - connection structure. For example, it can but is not limited to adopt the design with matching connection holes as shown in Figure 20 and be fixedly connected by means of fasteners. It can also be designed as an integral structure, that is, the base plate 261 is used as part of the structure of the partition plate 23.

[0092] Refer to Figure 1 and Figure 2 , in combination with Figure 3, the heat pipe heat dissipation unit is disposed on the substrate 261, and is mainly used to absorb the heat of the substrate 261 and dissipate this part of the heat. Specifically, the heat pipe heat dissipation unit may include a heat pipe 262 and heat dissipation fins 263. The heat pipe 262 has a heat pipe evaporation section 2621 and a heat pipe condensation section 2623. Among them, the heat pipe evaporation section 2621 is connected to the substrate 261, and the connection method may but is not limited to fixed connection methods such as welding or bonding. The heat pipe condensation section 2623 is located on one side of the substrate 261 corresponding to the second plate surface 265. The number of heat dissipation fins 263 is multiple and is arranged at intervals on the heat pipe condensation section 2623. The arrangement method of each heat dissipation fin 263 on the heat pipe condensation section 2623 may but is not limited to be designed in an equally spaced parallel arrangement. This method is more convenient for design and manufacture. Specifically, the heat pipe condensation section 2623 and the heat dissipation fins 263 may but is not limited to be fixedly connected by welding or the like.

[0093] It is worth mentioning that those skilled in the art should be able to know the basic structure and working principle of the heat pipe 262. The working principle of the heat pipe 262 is to conduct heat from the heat source to the surface of the heat dissipation structure through the heat conduction and phase change characteristics of the heat pipe, and then dissipate the heat into the air through the heat dissipation fins (i.e., the aforementioned heat dissipation fins 263) on the surface of the heat dissipation structure, so as to achieve the purpose of heat dissipation. Specifically, the heat pipe evaporation section 2621 will absorb the heat generated by the heat source (such as a power semiconductor device), causing the liquid in its liquid absorption core tube to boil into steam. The steam with heat will move from the heat pipe evaporation section 2621 to the heat pipe condensation section 2623. When the steam transfers the heat to the heat pipe condensation section 2623, the steam condenses into a liquid. The condensed liquid returns to the heat pipe evaporation section 2621 through the capillary action of the liquid absorption core on the tube wall, and this repeated cycle process continuously dissipates heat.

[0094] It should be noted here that the heat pipe heat dissipation unit may have one heat pipe 262 or multiple (i.e., two or more) heat pipes 262. The number of heat pipe heat dissipation units provided on the substrate 261 may be one or multiple (i.e., two or more). Among them, Figure 1 and Figure 2 shows the structural form of two heat pipe heat dissipation units provided on the substrate 261.

[0095] In the above radiator, during actual application, heat exchange is carried out by bringing the first plate surface 264 into contact with the corresponding power heating device 11 on the power conversion device. Thus, the heat of the power heating device 11 can be transferred to the substrate 261. The substrate 261 can absorb the heat through the heat pipe evaporation section 2621 of the heat pipe 262. The absorbed heat is transferred to the heat pipe condensation section 2623, and then the heat dissipation fins 263 on the heat pipe condensation section 2623 are used for condensation heat dissipation. By utilizing the heat pipe phase change heat dissipation principle, a more efficient heat dissipation effect can be achieved. Since the heat dissipation fins 263 are directly arranged on the heat pipe condensation section 2623, the heat transfer path is effectively reduced, which helps to enhance the heat exchange efficiency of the heat pipe 262, and then improves the heat dissipation performance of the radiator.

[0096] In some specific implementation embodiments, referring to Figures 1 - 3 as shown, the heat pipe heat dissipation unit can specifically be designed into multiple (that is, two or more), Figures 1 - 3 only the structural forms of two heat pipe heat dissipation units are shown in

[0097] Among them, the heat dissipation fins 263 of each heat pipe heat dissipation unit are preferably designed to be parallel to the second plate surface 265. Such a design makes the arrangement of the heat dissipation fins 263 more convenient for manufacturing. Of course, it can be understood that when there are other design requirements, the heat dissipation fins 263 can also be designed into other arrangement forms other than being parallel to the second plate surface 265. For example, the heat dissipation fins 263 are arranged at a certain angle to the second plate surface 265 and the like. Figure 1 and Figure 2 In a further implementation embodiment, referring to Figure 1 and Figure 2 as shown, when multiple heat pipe heat dissipation units are arranged on the substrate 261,

[0098] only the case where two heat pipe heat dissipation units are arranged on the substrate 261 is shown in Figures 1 - 3As shown, the above-mentioned heat pipe condensation section 2623 and the second plate surface 265 are preferably designed to be arranged at an angle, that is, the heat pipe 262 is bent from the substrate 261 to the side of the second plate surface 265. The angle between the heat pipe condensation section 2623 and the second plate surface 265 is preferably but not limited to 90°±5°. By designing the above structure, it is more convenient to arrange the heat dissipation fins 263 on the heat pipe condensation section 2623.

[0099] In some specific embodiments, referring to Figure 1 and Figure 2 As shown, an embedding cavity for embedding the heat pipe evaporation section 2621 can be provided on the above-mentioned substrate 261. Among them, the heat pipe evaporation section 2621 can be specifically embedded in the embedding cavity by fixed connection methods such as welding. By designing such an embedded structural form, compared with the heat pipe evaporation section 2621 being attached to the surface of the substrate 261 on one side, the contact area between the heat pipe evaporation section 2621 and the substrate 261 is larger, which is more convenient for heat transfer between the two, that is, the heat transfer efficiency between the two is higher.

[0100] In a further embodiment, referring to Figure 1 As shown, the above-mentioned embedding cavity can be specifically configured to form a first embedding groove 2611 on the side of the substrate 261 corresponding to the first plate surface 264. The heat pipe evaporation section 2621 embedded in the first embedding groove 2611 exchanges heat with the power heating device 11 in a fitting manner. Here, the fitting heat exchange can be specifically direct contact heat exchange or indirect contact heat exchange, such as indirect contact heat exchange through a thermal conductive adhesive.

[0101] In addition, an avoidance groove 2614 communicating the first embedding groove 2611 with the second plate surface 265 can be provided on the substrate 261. Among them, the heat pipe evaporation section 2621 and the heat pipe condensation section 2623 can be specifically connected through a heat pipe transition section 2622. The heat pipe transition section 2622 is bent out from the avoidance groove 2614. The heat pipe transition section 2622 is a connecting structure between the heat pipe evaporation section 2621 and the heat pipe condensation section 2623. Specifically, the three heat pipe sections of the heat pipe evaporation section 2621, the heat pipe transition section 2622, and the heat pipe condensation section 2623 can be an integral structure or a split fixed connection structure. For example, the connection position between the heat pipe evaporation section 2621 and the heat pipe condensation section 2623 is directly inserted and connected, and the corresponding inserted connection section at this time constitutes the heat pipe transition section 2622. By designing the above structural form, the surface of the heat pipe evaporation section 2621 corresponding to the first plate surface 264 can directly exchange heat with the power heating device 11, the heat exchange is more direct, and the heat exchange efficiency is higher.

[0102] In a further embodiment, referring to Figure 1 Combined with Figure 3As shown, when the heat pipe transition section 2622 is bent and led out from the avoidance groove, a sealing structure is generally provided in the assembly gap between the heat pipe transition section 2622 and the avoidance groove 2614. The sealing structure effectively prevents air from passing through the first plate surface 264 from the second plate surface 265 and entering the corresponding first cavity 1 of the power conversion device, thereby affecting the internal electrical components. Among them, the sealing structure can be, but is not limited to, a sealing structure formed by welding or using sealing materials such as sealant for closing.

[0103] In some other specific embodiments, referring to Figure 2 As shown, the above-mentioned embedding cavity can also be configured as a second embedding groove 2612 formed on one side of the substrate 261 corresponding to the second plate surface 265. The heat pipe evaporation section 2621 is embedded in the second embedding groove 2612, wherein the second embedding groove 2612 is not communicated with the first plate surface 264. By designing the structure in the above form, compared with Figure 1 the structure, since the second embedding groove 2612 is not communicated with the first plate surface 264, the overall sealing performance of the corresponding substrate 261 of the radiator is better. Without additionally arranging a sealing structure for the substrate 261 itself, it can also prevent air from passing through the first plate surface 264 from the second plate surface 265 and entering the corresponding first cavity 1 of the power conversion device, thereby affecting the internal electrical components.

[0104] In some other specific embodiments, in addition to being designed into the aforementioned Figure 1 and Figure 2 shown structural forms, the embedding cavity can also be configured as a through hole penetrating from the first plate surface 264 to the second plate surface 265. The through hole can be designed with a waist-shaped through hole adapted to the heat pipe evaporation section 2621, and the heat pipe evaporation section 2621 is embedded in the through hole. The specific fixing method can be, but is not limited to, a welding fixing method. The structural form of the through hole, compared with the aforementioned Figure 1 and Figure 2 structural forms, has the advantages that at least the processing of the embedding cavity is more convenient.

[0105] In some specific embodiments, referring to Figure 5 and Figure 6 As shown, in addition to being designed into Figures 1 - 3In addition to the manner parallel to the second board surface 265 shown, the heat dissipation fins 263 can be designed to be connected to the second board surface 265 and arranged at a certain angle with respect to the second board surface 265. The value of this angle can be, but is not limited to, 90° ± 5°. Among them, when designed to form an angle of 90° ± 5° with the second board surface 265, it makes the processing and manufacturing more convenient. By designing the heat dissipation fins 263 in the above-mentioned structural form connected to the second board surface 265, the heat dissipation fins 263 not only contact and transfer heat with the heat pipe 262, but also contact and transfer heat with the substrate 261 at the same time. There are more heat transfer paths, which helps to improve the heat transfer effect, that is, helps to improve the heat dissipation effect of the radiator.

[0106] In some other specific implementation schemes, in addition to the heat pipe condensation section 2623 of the above heat pipe heat dissipation unit can be designed as Figure 1 and Figure 2 shown in the angular arrangement manner, it can also be designed with reference to Figure 5 and Figure 6 shown in the structure, that is, the heat pipe condensation section 2623 of the above heat pipe heat dissipation unit is parallel to the second board surface 265. This structural form is mainly to better adapt to the structure where the heat dissipation fins 263 are connected to the second board surface 265 and arranged at a certain angle with respect to the second board surface 265, and it is more convenient to arrange the heat dissipation fins 263 on the heat pipe condensation section 2623. Specifically, with reference to Figure 5 and Figure 6 shown, the heat dissipation fins 263 are arranged at an angle with respect to the second board surface 265. For example, the board surface of the fin plate of the heat dissipation fins 263 forms an angle of 90° ± 10° with the second board surface 265. At that time, the root of the heat dissipation fins 263 can be fixed to the second board surface 265, and at the same time, the heat pipe condensation section 2623 passes through the heat dissipation fins 263.

[0107] In addition, with reference to Figures 10 - 14As shown in the figure, the embodiment of the present application further provides a heat dissipation component, including a mounting plate 267 and the radiator described in any of the foregoing solutions. Among them, the mounting plate 267 is mainly used to carry the radiator for convenient installation. Specifically, the mounting plate 267 has a first surface 2671 and a second surface 2672 arranged oppositely. The first surface 2671 of the mounting plate 267 corresponds to the side where the power heating device is located, and is used for directly or indirectly exchanging heat with the power heating device 11. The heat exchange method can be direct contact heat exchange or indirect heat exchange, such as indirect contact heat exchange through a heat-conducting material (heat-conducting glue, etc.). At least one assembly notch 2673 is provided on the second surface 2672 of the mounting plate 267, that is, the number of assembly notches 2673 provided on the mounting plate 267 can be one, or two or more; the substrate 261 of the radiator is embedded in the assembly notch 2673 in a one-to-one matching manner, and the fixing method after embedding can be but not limited to using fixing parts such as fasteners for fixing. By designing the above structural form, each radiator forms a sub-module, and can be selected to be installed on the mounting plate 267 according to actual needs, and the layout is more flexible and convenient. For example, according to the layout position of the power heating device 11, an assembly notch 2673 matching it can be designed on the mounting plate 267, so that the power heating device 11 can be equipped with a corresponding radiator. Among them, the radiator can be designed with heat pipe heat dissipation units of corresponding sizes and quantities according to the requirements of its corresponding power heating device 11.

[0108] It should be noted that, referring to Figure 10 and Figure 11 As shown, the above-mentioned assembly notch 2673 can be specifically configured as a through notch that penetrates from the second surface 2672 to the first surface 2671. With such a design, the power heating device 11 can achieve conformal heat exchange with the substrate 261 of the radiator, that is, direct contact heat exchange, or indirect contact heat exchange with heat-conducting glue, etc., and the heat exchange efficiency is higher. Of course, in order to ensure the sealing performance, a sealing structure is generally provided in the assembly gap between the substrate 261 and the corresponding assembly notch 2673 of the mounting plate 267, and the sealing structure can be but not limited to being closed by welding seals or sealing materials such as sealants.

[0109] Of course, it can be understood that, referring to Figure 14 Combined with Figure 12 and Figure 13 , the above-mentioned assembly notch 2673 can also be configured as a blind-end notch that does not penetrate to the first surface 2671. At that time, the power heating device 1 communicates with the mounting plate 267 for heat exchange, and then exchanges heat with the substrate 261 of the radiator through the blind-end notch of the mounting plate 267, so as to achieve heat dissipation. Compared with Figure 10 and Figure 11For the solution, the assembly notch 2673 is designed as a blind-end notch structure, eliminating the need to consider the issue of additional sealing due to the design of the assembly notch 2673 on the mounting plate 267. It can better ensure the machining accuracy of the first plate surface 264, and at the same time, the sealing performance is easier to guarantee.

[0110] In a further embodiment, referring to Figure 10 and Figure 11 as shown, the assembly notch 2673 is configured as a stepped notch structure that tapers step by step from the second surface 2672 to the first surface 2671. A stepped boss structure 2613 adapted to the stepped notch structure is provided on the substrate 261. By designing such a structural form, even if the assembly notch 2673 penetrates the first surface 2671 and the second surface 2672, its stepped concave-convex mating structure can achieve better sealing performance and is more convenient for positioning during the assembly process.

[0111] In some specific embodiments, referring to Figure 11 and Figure 14 as shown, the heat pipe 262 of the radiator bends and extends from the side of the substrate 261 to the side of the second plate surface 265 of the substrate 261. A transition groove 2674 adapted to the bending structure of the heat pipe 262 is provided at a position corresponding to the bending of the heat pipe 262 in the assembly notch 2673. The bending part where the heat pipe 262 bends and extends from the side of the substrate 261 to the side of the second plate surface 265 of the substrate 261 corresponds to the aforementioned heat pipe transition section 2622, that is, the position where the heat pipe evaporation section 2621 is connected to the heat pipe condensation section 2623. The lead-out structure of the heat pipe transition section 2622 is adapted to the transition groove 2674. By designing the transition groove 2674, the lead-out of the heat pipe transition section 2622 is more convenient, and it has an auxiliary positioning function during assembly.

[0112] It should be noted that, referring to Figures 10 - 14 , in combination with Figure 3 as shown, the mounting plate 267 can be specifically configured as part of the wall of the power conversion device. For example, part of the wall of the partition 23, that is, the mounting plate 267 itself serves as part of the partition 23. Among them, the partition 23 is provided in the housing of the power conversion device and is used to divide the inner cavity of the housing into a first cavity 1 and a second cavity 2. A power heating device is provided in the first cavity 1, and a heat dissipation component is provided in the second cavity 2. By designing such a structural form, components can be saved, which helps to save costs.

[0113] In an embodiment of another aspect of the present application, referring to Figure 3 , Figure 4 , Figures 7 - 9 and Figures 15 - 19As shown, a power conversion device is also provided, including a housing. A partition 23 is arranged inside the housing, and the partition 23 divides the inner cavity of the housing into a first cavity 1 and a second cavity 2. A power heating device 11 (such as a semiconductor power device, etc.) is arranged in the first cavity 1, and a heat dissipation device 26 is arranged in the second cavity 2. The heat dissipation device 26 is arranged on the partition 23 for heat exchange with the power heating device 11. Among them, the heat dissipation device 26 is the radiator described in any of the above solutions or the heat dissipation assembly described in any of the above solutions. Since the aforementioned radiator and heat dissipation assembly both have the above technical effects, the power conversion device with this radiator or heat dissipation assembly should also have the corresponding technical effects, which will not be elaborated here.

[0114] In a further embodiment, in order to satisfy the air flow exchange between the second cavity 2 and the external environment of the housing, a heat dissipation fan 25 should also be arranged corresponding to the second cavity 2. The second cavity 2 has an air inlet 21 and an air outlet 22. The heat dissipation fan 25 is arranged on the air flow path formed by the air inlet 21 and the air outlet 22 to provide power for the air flow path formed by the air inlet 21 and the air outlet 22, and the heat dissipation device 26 is located on this air flow path.

[0115] It should be noted that the heat dissipation fan 25 can be specifically designed to be arranged close to the air inlet 21, or can be designed to be arranged close to the air outlet 22, or heat dissipation fans 25 are arranged close to both the air inlet 21 and the air outlet 22. And the number of heat dissipation fans 25 arranged at the air inlet 21 and the air outlet 22 is not limited, and can be selected and configured according to the actual heat dissipation requirements and the arrangement area of the corresponding heat dissipation fins 263.

[0116] In addition, referring to Figure 3 、 Figure 4 、 Figures 7 - 9 and Figures 15 - 19 As shown, when the heat dissipation fan 25 is arranged close to the air inlet 21, the air inlet surface of the heat dissipation fan 25 is preferably arranged facing the air inlet 21, and the heat dissipation channels formed by two adjacent heat dissipation fins 263 on the heat dissipation device are configured along the air outlet direction of the heat dissipation fan 25. Such an arrangement can make the air intake smoother and the installation of the heat dissipation fan 25 more convenient.

[0117] In some more specific embodiments, referring to Figure 3 、 Figure 4 、 Figure 9 、 Figure 15 、 Figure 16 and Figure 19As shown, the above-mentioned air inlet 21 is provided on one of the circumferential side walls of the second cavity 2 corresponding to the side wall perpendicular to the partition 23, and the air outlet 22 is provided on at least one of the remaining side walls of the second cavity 2 corresponding to the side wall perpendicular to the partition 23. Specifically, the air inlet 21 can be designed on any one of the four side walls, and the air inlet 21 faces the air inlet surface of the cooling fan 25; the air outlet 22 can specifically include at least one of the first sub-air outlet 221, the second sub-air outlet 222, and the third sub-air outlet 223; among them, the first sub-air outlet 221 faces the air outlet surface of the cooling fan 25, and the second sub-air outlet 222 and the third sub-air outlet 223 are respectively provided on two side walls of the second cavity 2 perpendicular to the air outlet surface of the cooling fan 25; the heat dissipation channels formed by two adjacent heat dissipation fins 263 on the radiator are configured to be along the air outlet direction of the cooling fan 25, so that the air flow of the cooling fan 25 can flow through the heat dissipation air duct formed by the heat dissipation fins 263. For example, referring to Figure 3 , Figure 4 , Figure 15 , Figure 16 shown, the heat dissipation fin 263 is parallel to the second plate surface 265 of the substrate 261; or for another example, referring to Figure 9 and Figure 19 shown, the heat dissipation fin 263 is perpendicular to the second plate surface 265 of the substrate 261. These arrangement methods all need to satisfy that the heat dissipation channels formed by two adjacent heat dissipation fins 263 on the heat dissipation device 26 are configured to be along the air outlet direction of the cooling fan 25.

[0118] In some other specific implementation schemes, referring to Figure 7 , Figure 8 , Figure 17 and Figure 18 shown, the above-mentioned air inlet 21 can be selectively arranged on the cavity wall of the second cavity 2 corresponding to the partition 23; the air outlet 22 is arranged on at least one of the circumferential side walls of the second cavity 2 corresponding to the side wall perpendicular to the partition 23. Specifically, the air outlet 22 can specifically include at least one of the fourth sub-air outlet 271, the fifth sub-air outlet 272, the sixth sub-air outlet 273, and the seventh sub-air outlet 274; among them, the fourth sub-air outlet 271, the fifth sub-air outlet 272, the sixth sub-air outlet 273, and the seventh sub-air outlet 274 are respectively arranged on four side walls of the second cavity 2 perpendicular to the partition 23; the air outlet surface of the cooling fan 25 faces the substrate fin group formed by the heat dissipation fins 263 of the heat dissipation device 26, and the heat dissipation channels formed by two adjacent heat dissipation fins 263 on the heat dissipation device 26 are configured to be along the air outlet direction of the cooling fan 25. At that time, the heat dissipation fin 263 needs to be designed to be perpendicular to the second plate surface 265 of the substrate 261 to satisfy that the air flow of the cooling fan 25 can flow through the heat dissipation air duct formed by the heat dissipation fins 263.

[0119] It should be noted that one or more of the fourth sub-air outlet 271, the fifth sub-air outlet 272, the sixth sub-air outlet 273, and the seventh sub-air outlet 274 can be designed on their respective corresponding side walls. During actual application, they can be arranged according to actual needs, and no more specific limitations are provided here.

[0120] In a further embodiment, with reference to Figure 3 , Figure 4 , Figure 9 , Figure 15 , Figure 16 and Figure 19 shown, a magnetic device 24 is further provided in the second cavity 2, and the heat dissipation fan 25, the heat dissipation device 26, and the magnetic device 24 are arranged in sequence along the air outlet direction of the heat dissipation fan 25. By designing such a structure, the external air flow passes through the heat dissipation device 26 and the magnetic device 24 in sequence through the heat dissipation fan 25. Since the high-temperature resistance performance of the magnetic device 24 is generally higher than that of the power heating device 11, the above-mentioned structure arrangement is more in line with the heat dissipation requirements of each device.

[0121] In addition, it should be noted that the embodiments in this specification are all described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts among the embodiments can be referred to each other.

[0122] As shown in this application and the claims, unless the context clearly indicates an exceptional situation, words such as "a", "one", "a kind", and / or "the" do not specifically refer to the singular, but may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements. An element defined by the statement "comprising one..." does not exclude the existence of another identical element in the process, method, commodity, or device including the element.

[0123] Among them, in the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B; "and / or" in this article is only a description of the association relationship of the associated objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "a plurality" means two or more than two.

[0124] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features.

[0125] In this article, specific examples are used to elaborate on the principles and implementation manners of the present application. The description of the above embodiments is only used to help understand the core idea of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A radiator, characterized in that, Comprising: A substrate (261) having a first plate surface (264) and a second plate surface (265) arranged oppositely, the first plate surface (264) being used for heat exchange with a power heating device (11); A heat pipe heat dissipation unit, the heat pipe heat dissipation unit comprising a heat pipe (262) and heat dissipation fins (263), the heat pipe (262) having a heat pipe evaporation section (2621) and a heat pipe condensation section (2623); the heat pipe evaporation section (2621) is connected to the substrate (261), the heat pipe condensation section (2623) is located on one side of the substrate (261) corresponding to the second plate surface (265), and the number of the heat dissipation fins (263) is multiple and is arranged at intervals on the heat pipe condensation section (2623).

2. The radiator according to claim 1, wherein, There are multiple of the heat pipe heat dissipation units, and the heat dissipation fins (263) are all parallel to the second plate surface (265).

3. The radiator according to claim 2, characterized in that, The heat dissipation fins (263) are configured as common heat dissipation fins parallel to the second plate surface (265), and the heat pipe condensation sections (2623) of each heat pipe heat dissipation unit penetrate through the common heat dissipation fins.

4. The radiator according to claim 1, wherein, An installation cavity for embedding the heat pipe evaporation section (2621) is provided on the substrate (261).

5. The radiator according to claim 4, wherein, The installation cavity is configured to be a first installation groove (2611) formed on one side of the substrate (261) corresponding to the first plate surface (264), and the heat pipe evaporation section (2621) embedded in the first installation groove (2611) is in contact with the power heating device (11) for heat exchange.

6. The radiator according to claim 5, wherein A relief groove (2614) communicating the first installation groove (2611) with the second plate surface (265) is provided on the substrate (261), the heat pipe evaporation section (2621) and the heat pipe condensation section (2623) are connected by a heat pipe transition section (2622), and the heat pipe transition section (2622) is bent and led out from the relief groove (2614).

7. The radiator according to claim 6, characterized in that, A sealing structure is provided in the assembly gap between the heat pipe transition section (2622) and the relief groove (2614).

8. The radiator according to claim 5, characterized in that, The installation cavity is configured to be a second installation groove (2612) formed on one side of the substrate (261) corresponding to the second plate surface (265), and the heat pipe evaporation section (2621) is embedded in the second installation groove (2612), wherein the second installation groove (2612) is not communicated with the first plate surface (264).

9. The radiator according to claim 1, wherein The heat dissipation fins (263) of the heat pipe heat dissipation unit are connected to the second plate surface (265) in an angular arrangement.

10. The radiator according to claim 9, wherein, The included angle between the heat dissipation fins (263) of the heat pipe heat dissipation unit and the second plate surface (265) is 90°; the heat pipe condensation section (2623) of the heat pipe heat dissipation unit is parallel to the second plate surface (265).

11. A heat dissipation component, characterized in that, Including a mounting plate (267) and a radiator according to any one of claims 1-10: The mounting plate (267) has a first surface (2671) and a second surface (2672) which are arranged oppositely. The first surface of the mounting plate (267) corresponds to the side where the power heating device is located. At least one assembly notch (2673) is provided on the second surface (2672) of the mounting plate (267); The substrate (261) of the radiator is embedded in the assembly notch (2673) in a one-to-one matching manner.

12. The heat dissipation component according to claim 11, wherein The assembly notch (2673) is configured as a through notch that penetrates from the second surface (2672) to the first surface (2671); Alternatively, the assembly notch (2673) is configured as a blind-end notch that does not penetrate to the first surface (2671).

13. The heat dissipation component according to claim 11, wherein The assembly notch (2673) is configured as a stepped notch structure that tapers step by step from the second surface (2672) to the first surface (2671). A stepped boss structure (2613) adapted to the stepped notch structure is provided on the substrate (261).

14. The heat dissipation component according to claim 11, wherein The heat pipe (262) of the radiator bends and extends from the side of the substrate (261) to the side of the second plate surface (265) of the substrate (261). A transition groove (2674) adapted to the bending structure of the heat pipe (262) is provided at a position corresponding to the bending of the heat pipe (262) in the assembly notch (2673).

15. The heat dissipation component according to claim 11, wherein The mounting plate (267) is configured as a partial wall of the power conversion device.

16. A power conversion device includes a housing, a partition (23) is arranged inside the housing, the partition (23) divides the inner cavity of the housing into a first cavity (1) and a second cavity (2), a power heating device (11) is arranged in the first cavity (1), a heat dissipation device (26) is arranged in the second cavity (2), and the heat dissipation device (26) is arranged on the partition (23) for heat exchange with the power heating device (11), and it is characterized in that, The heat dissipation device (26) is the radiator according to any one of claims 1-10 or the heat dissipation assembly according to any one of claims 11-15.

17. The power conversion device according to claim 16, characterized in that, A cooling fan (25) is further provided in the second cavity (2). The second cavity (2) has an air inlet (21) and an air outlet (22). The cooling fan (25) is arranged on the air flow path formed between the air inlet (21) and the air outlet (22). The cooling fan (25) is arranged close to the air inlet (21), and the air inlet surface of the cooling fan (25) faces the air inlet (21).

18. The power conversion device according to claim 17, wherein, The air inlet (21) is provided on one of the circumferential side walls of the second cavity (2) perpendicular to the partition (23), and the air outlet (22) is provided on at least one of the remaining circumferential side walls of the second cavity (2) perpendicular to the partition (23).

19. The power conversion device according to claim 17, characterized in that, The air inlet (21) is provided on the cavity wall of the second cavity (2) opposite to the partition (23); the air outlet (22) is provided on at least one of the circumferential side walls of the second cavity (2) perpendicular to the partition (23).

20. The power conversion device according to claim 17, characterized in that, The heat dissipation channels formed by two adjacent heat dissipation fins (263) on the heat dissipation device are configured along the air outlet direction of the cooling fan (25).

21. The power conversion device according to any one of claims 17-20, characterized in that, A magnetic device (24) is further provided in the second cavity (2). The cooling fan (25), the heat dissipation device (26), and the magnetic device (24) are arranged in sequence along the air flow path formed by the air inlet (21) and the air outlet (22).

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