Heat dissipation device and cooler

Abstract

Provided are a heat dissipation device, a cooler, and the like capable of reducing pressure loss. A heat dissipation device (11) is provided with: a flat plate-shaped part (111) having a flat plate shape; and a plurality of fins (112) protruding from the flat-plate-shaped portion (111) in a direction intersecting the plate surface of the flat-plate-shaped portion (111), in which a groove (114) recessed from the end surface (113) in the direction of the flat-plate-shaped portion (111) is formed in the center of the tip portion, which is a portion separated from the flat-plate-shaped portion (111), of the fins (112).

Description

Technical Field

[0001] The utility model relates to a heat dissipation device and a cooler. Background Art

[0002] Conventionally, semiconductor devices capable of improving cooling performance have been proposed.

[0003] For example, the semiconductor device described in Patent Document 1 includes a semiconductor module having a flat heat dissipation member, and a heat dissipation device joined to the heat dissipation member by metal bonding.

[0004] Prior Art Documents

[0005] Patent Documents

[0006] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2023-70910 Summary of the Utility Model

[0007] Problems to be Solved by the Utility Model

[0008] For a cooling device that cools an object to be cooled such as a semiconductor module or a heat dissipation device used in the cooling device, it is required to reduce the pressure loss while maintaining the cooling performance.

[0009] An object of the present utility model is to provide a heat dissipation device and the like capable of reducing the pressure loss.

[0010] Technical Solutions for Solving the Problems

[0011] The heat dissipation device according to the present utility model achieved based on this object includes: a flat plate-shaped portion; and a plurality of fins protruding from the flat plate-shaped portion in a direction crossing the plate surface of the flat plate-shaped portion, and a groove recessed from the end face toward the flat plate-shaped portion is formed at the center of the front end portion which is a portion away from the flat plate-shaped portion on the fin.

[0012] Here, the cross-sectional shape of the fin may be a quadrilateral, and one of the corners of the quadrilateral faces the upstream side of the flow direction of the coolant, and the other corner located on the same diagonal as the one corner faces the downstream side of the flow direction.

[0013] In addition, one groove may be formed in the same direction as the flow direction.

[0014] Alternatively, one groove may be formed in a direction inclined with respect to the flow direction.

[0015] Alternatively, one groove may be formed in a direction inclined with respect to the flow direction, and another groove may be formed in a direction crossing the inclined direction.

[0016] Alternatively, the depth of the groove may be 10% to 60% of the size in the protruding direction of the fin.

[0017] Alternatively, the cross-sectional shape of the fin may be a quadrilateral with two orthogonal diagonals, and the width of the groove may be 10% to 60% of the width of the two parallel sides of the fin.

[0018] Alternatively, the widths of the grooves formed by the plurality of fins may all be the same.

[0019] Alternatively, the width of the groove formed by the plurality of fins may be the same as the gap between adjacent fins.

[0020] Alternatively, from another perspective, the present invention is a cooler, comprising: the above heat dissipation device; and a housing that surrounds the plurality of fins in such a manner that a coolant flows between the plurality of fins of the heat dissipation device.

[0021] Effects of the utility model

[0022] According to the present invention, it is possible to provide a heat dissipation device and the like that can reduce pressure loss. Description of the drawings

[0023] Figure 1 It is a diagram showing an example of the appearance of the semiconductor device according to the embodiment.

[0024] Figure 2 It is an example of a diagram showing the parts of the semiconductor device according to the embodiment disassembled.

[0025] Figure 3 It is a diagram showing an example of the cross-section of the semiconductor device according to the embodiment.

[0026] Figure 4 It is a diagram showing an example of the state before joining two heat dissipation devices to a semiconductor module.

[0027] Figure 5 In (a), it is an example of a diagram showing the heat dissipation device viewed from above. (b) is an example of the cross-section taken along Vb-Vb of (a).

[0028] Figure 6 It is an example of a diagram showing the fin according to the first modification viewed from above.

[0029] Figure 7 It is an example of a diagram showing the fin according to the second modification viewed from above.

[0030] Description of reference numerals

[0031] 1... Semiconductor device, 2... Cooling device, 10... First cooler, 11, 21... Heat dissipation device, 12, 22... Housing, 13, 23... Cover, 14, 24... Case, 20... Second cooler, 30... Intermediate member, 40... Connecting member, 50... Support member, 100... Semiconductor module, 101... Power semiconductor element, 111, 211... Flat plate portion, 112, 212, 300, 400... Fins, 113... End face, 114, 414... Groove, 116... First corner portion, 117... Second corner portion. Detailed implementation mode

[0032] Hereinafter, with reference to the accompanying drawings, the implementation mode will be described in detail.

[0033] <Implementation mode>

[0034] Figure 1 It is a figure showing an example of the appearance of the semiconductor device 1 according to the implementation mode.

[0035] Figure 2 It is an example of a figure showing the parts constituting the semiconductor device 1 according to the implementation mode after being disassembled.

[0036] Figure 3 It is a figure showing an example of the cross section of the semiconductor device 1 according to the implementation mode. Figure 3 Is Figure 1 A cross-sectional view of the III-III part.

[0037] Figure 4 It is a figure showing an example of the state before joining the heat dissipation device 11 and the heat dissipation device 21 to the semiconductor module 100.

[0038] The semiconductor device 1 according to the implementation mode includes a semiconductor module 100 having a power semiconductor element 101 and a cooling device 2 for cooling the semiconductor module 100.

[0039] The semiconductor device 1 is, for example, mounted on an automobile in a state where the semiconductor module 100 is sandwiched between a later-described first cooler 10 and a second cooler 20 of the cooling device 2 as shown in Figure 1 . Hereinafter, the direction in which the first cooler 10 and the second cooler 20 are stacked may be referred to as the "vertical direction". In addition, in the rectangular parallelepiped-shaped first cooler 10 and second cooler 20, the long direction of the rectangular shape orthogonal to the vertical direction may be referred to as the "long direction", and the short direction of the rectangular shape may be referred to as the "short direction".

[0040] The semiconductor module 100 is a card-type power module having a power semiconductor element 101 mounted on a ceramic insulating substrate (not shown) and flat heat sinks 102 provided on both sides (upper and lower) of the power semiconductor element 101. The heat sinks 102 are formed of at least one of copper and aluminum materials such as aluminum and aluminum alloy.

[0041] The cooling device 2 includes a first cooler 10 and a second cooler 20 that are coolers capable of allowing a coolant to flow therethrough, and an intermediate member 30 interposed between the first cooler 10 and the second cooler 20. In addition, the cooling device 2 includes a connecting member 40 connected to the first cooler 10 and the second cooler 20, and a supporting member 50 that supports the first cooler 10 and the second cooler 20 via the connecting member 40.

[0042] (The first cooler 10)

[0043] The first cooler 10 includes a heat dissipation device 11 having fins 112, a housing 12 that houses the fins 112 of the heat dissipation device 11 and forms a space for the coolant to flow through, and a cover 13 that covers an opening of the housing 12. The housing 12 and the cover 13 constitute a housing 14 that surrounds the plurality of fins 112 in such a manner that the coolant flows between the plurality of fins 112 of the heat dissipation device 11.

[0044] The heat dissipation device 11 has a flat plate-like portion 111 and a plurality of fins 112 that protrude from the flat plate-like portion 111 in a direction orthogonal to the plate surface.

[0045] The flat plate-like portion 111 has a first surface 111a that is the surface on the side where the fins 112 are formed, and a second surface 111b that is the surface on the side where the fins 112 are not formed and is flat. The plurality of fins 112 are formed in a central portion of the first surface 111a, and the outer side of the region of the first surface 111a where the fins 112 are formed is a flat surface. Hereinafter, the flat surface outside the region where the fins 112 are formed may sometimes be referred to as the outer side surface 111c.

[0046] The fins 112 will be described in detail later.

[0047] Regarding the heat dissipation device 11, an example is a case where it is formed by cutting. In addition, the heat dissipation device 11 is formed of at least one of copper and aluminum materials. As the aluminum material, an example is the A1000 series of pure aluminum such as A1100.

[0048] Furthermore, the heat dissipation device 11 is integrated with the semiconductor module 100 by metal fusion bonding the second surface 111b of the flat plate-like portion 111 to the heat sink 102 of the semiconductor module 100. The metal fusion bonding is a bonding based on soldering or copper sintering.

[0049] The housing 12 is concave, having a flat bottom 121, side portions 122 extending from the outer peripheral portion of the bottom 121 in a direction orthogonal to the bottom 121, and a flange 123 protruding outward from the front end portions of the side portions 122 in a direction parallel to the bottom 121. A recess is formed by the bottom 121 and the side portions 122, and the flange 123 is formed around the recess. Examples of the material of the housing 12 include aluminum or copper.

[0050] The cover 13 is flat, and its outer shape is the same as the outer peripheral portion of the flange 123 of the housing 12. Moreover, by joining the cover 13 to the flange 123 of the housing 12, the cover 13 closes the opening of the recess of the housing 12. Examples of the joining method of the cover 13 and the housing 12 include brazing and laser welding.

[0051] On the cover 13, a circular first through-hole 131 is formed at one end in the longitudinal direction, and a circular second through-hole 132 is formed at the other end in the longitudinal direction. In addition, on the cover 13, between the first through-hole 131 and the second through-hole 132, there are formed the same number (three in this embodiment) of rectangular third through-holes 133 as the heat dissipation device 11, through which the fins 112 of the heat dissipation device 11 pass.

[0052] In a state where the fins 112 of the heat dissipation device 11 pass through the third through-holes 133, the cover 13 is joined to the outer side surface 111c around the fins 112 in the flat plate portion 111 of the heat dissipation device 11. Examples of the joining method of the cover 13 and the heat dissipation device 11 include brazing and laser welding.

[0053] Examples of the material of the cover 13 include aluminum or copper.

[0054] (The second cooler 20)

[0055] The second cooler 20 has a heat dissipation device 21 identical to the heat dissipation device 11 of the first cooler 10, and a housing 24 corresponding to the housing 14. The housing 24 has a housing 22 corresponding to the housing 12 of the first cooler 10, and a cover 23 identical to the cover 13 of the first cooler 10. That is, the second cooler 20 has substantially the same shape as the first cooler 10 except for forming a first through-hole 241 and a second through-hole 242, which will be described later. And the second cooler 20 is arranged symmetrically with respect to the semiconductor module 100 with the first cooler 10.

[0056] More specifically, the heat dissipation device 21 has a flat plate portion 211 that is the same as the flat plate portion 111 of the heat dissipation device 11, and fins 212 that are the same as the fins 112 of the heat dissipation device 11. The flat plate portion 211 has a first surface 211a, a second surface 211b, and an outer side surface 211c that are the same as the first surface 111a, the second surface 111b, and the outer side surface 111c of the flat plate portion 111, respectively.

[0057] The housing 22 has a bottom portion 221, a side portion 222, and a flange 223 that are the same as the bottom portion 121, the side portion 122, and the flange 123 of the housing 12, respectively.

[0058] The housing 22 is different from the housing 12. On the bottom portion 221, a circular first through hole 241 is formed at one end in the longitudinal direction, and a circular second through hole 242 is formed at the other end in the longitudinal direction.

[0059] The cover 23 is formed with a first through hole 231, a second through hole 232, and a third through hole 233 that are the same as the first through hole 131, the second through hole 132, and the third through hole 133 formed on the cover 13, respectively.

[0060] (Intermediate member 30)

[0061] The intermediate member 30 is a cylindrical member. The inner diameter of the intermediate member 30 is substantially the same as the diameters of the first through hole 131 and the second through hole 132 formed on the cover 13. The upper portion of the intermediate member 30 is joined to the cover 13, and the lower portion of the intermediate member 30 is joined to the cover 23. Examples of the joining method include laser welding or hard soldering.

[0062] Examples of the material of the intermediate member 30 include aluminum or copper.

[0063] (Connecting member 40)

[0064] The connecting member 40 is an elliptical cylindrical member in which the longitudinal direction of the housing 12 becomes the minor axis direction and the short direction of the housing 12 becomes the major axis direction. A circular first through hole 41 is formed at the central portion of the connecting member 40. The first through hole 41 has the same shape as the first through hole 241 and the second through hole 242 of the housing 22 of the second cooler 20. In addition, on the connecting member 40, second through holes 42 are formed on both outer sides in the major axis direction of the first through hole 41.

[0065] Examples of the material of the connecting member 40 include aluminum or copper.

[0066] (Supporting member 50)

[0067] On the support member 50, a first space 51 recessed from the upper surface is formed at one end in the longitudinal direction, and a second space 52 recessed from the upper surface is formed at the other end in the longitudinal direction. The opening 51a on the upper surface side of the first space 51 has the same shape as the first through hole 41 of the connecting member 40. The opening 52a on the upper surface side of the second space 52 has the same shape as the first through hole 41 of the connecting member 40. A groove 51b for fitting an O-ring 55 is formed around the opening 51a of the support member 50. A groove 52b for fitting an O-ring 56 is formed around the opening 52a of the support member 50. In addition, on the support member 50, internal threads 51c are formed on both outer sides in the major axis direction of the groove 51b. In addition, on the support member 50, internal threads 52c are formed on both outer sides in the major axis direction of the groove 52b.

[0068] In the support member 50, there is formed a communication hole that communicates the first space 51 with the outside in a direction orthogonal to the vertical direction ( Figure 1 and Figure 2 is the short direction in this case), and a first joint 53 is inserted into this communication hole. In addition, in the support member 50, there is formed a communication hole that communicates the second space 52 with the outside in a direction orthogonal to the vertical direction, and a second joint 54 is inserted into this communication hole.

[0069] Examples of the material of the support member 50 include aluminum or copper.

[0070] (Function of the semiconductor device 1)

[0071] In the semiconductor device 1 configured as described above, the coolant flowing into the first space 51 from the first joint 53 of the support member 50 flows into the interior of the second cooler 20 through the opening 51a and the first through hole 241 formed at one end in the longitudinal direction of the housing 22 of the second cooler 20. Then, the coolant flowing into the interior of the second cooler 20 travels in the longitudinal direction between the plurality of fins 212 of the heat dissipation device 21 and between the fin 212 and the side portion 222 of the housing 22, and flows out of the second cooler 20 through the second through hole 242 formed at the other end in the longitudinal direction of the housing 22.

[0072] Part of the coolant flowing into the interior of the second cooler 20 through the first through-hole 241 flows out of the second cooler 20 through the first through-hole 231 of the cover 23, and flows into the interior of the first cooler 10 through the interior of the intermediate member 30 and the first through-hole 131 of the cover 13 of the first cooler 10. Then, the coolant flowing into the interior of the first cooler 10 travels in the longitudinal direction between the plurality of fins 112 of the heat dissipation device 11 and between the fin 112 and the side portion 122 of the housing 12, and flows out of the first cooler 10 through the second through-hole 132 formed at the other end in the longitudinal direction on the cover 13.

[0073] The coolant flowing out of the first cooler 10 flows into the interior of the second cooler 20 through the interior of the intermediate member 30 and the second through-hole 232 of the cover 23 of the second cooler 20, and flows out of the second cooler 20 through the second through-hole 242 formed at the other end in the longitudinal direction of the housing 22.

[0074] The coolant flowing out of the second cooler 20 enters the second space 52 through the opening 52a formed in the support member 50 and flows out from the second joint 54.

[0075] In this way, while the coolant circulates inside the first cooler 10 and inside the second cooler 20, the semiconductor module 100 disposed between the first cooler 10 and the second cooler 20 is cooled.

[0076] In addition, in the first cooler 10 of the semiconductor device 1, the coolant goes from the first through-hole 131 of the cover 13 to the second through-hole 132. Hereinafter, the direction from the first through-hole 131 to the second through-hole 132 in the longitudinal direction is sometimes referred to as the "flow direction" of the coolant.

[0077] (Fins 112 of the heat dissipation device 11)

[0078] Figure 5 In (a) is an example of a view of the heat dissipation device 11 observed from above. Figure 5 In (b) is Figure 5 An example of a cross-section taken along Vb-Vb of (a) in.

[0079] As Figure 5 As shown in (a) in, the shape obtained by cutting the fin 112 with a plane orthogonal to the protruding direction (hereinafter sometimes referred to as the "cross-sectional shape") is square, and the first corner 116, which is an example of one corner of the square, faces the upstream side of the flow direction of the coolant, and the second corner 117 (an example of the other corner), which is located on the same diagonal as the first corner 116, faces the downstream side of the flow direction.

[0080] Further, on the fin 112, a groove 114 that is recessed from the end face 113 toward the flat plate portion 111 is formed at the front end portion, which is the portion away from the flat plate portion 111. The groove 114 is formed in a "×" shape. That is, the groove 114 is formed at the intersection of the diagonal line connecting the first corner portion 116 and the second corner portion 117 and the diagonal line orthogonal to this diagonal line, and is formed in two directions that are respectively 45 degrees in the clockwise direction and the counterclockwise direction with respect to the flow direction Figure 5 in (a). In other words, one groove 114 is formed in a direction inclined with respect to the flow direction, and another one is formed in a manner intersecting with this inclined direction. Further, the groove 114 is formed to penetrate the front end portion of the fin 112 in a direction parallel to the flat plate portion 111. The widths W1 of the grooves 114 respectively formed in the plurality of fins 112 are all the same. In addition, the width W1 of the groove 114 is the same as the size of the gap G between the adjacent fins 112. Further, as Figure 5 shown in (b), the depth h of the groove 114 is 10% or more of the size L in the protruding direction of the fin 112.

[0081] As described above, the heat dissipation device 11 includes a flat plate-shaped flat plate portion 111 and a plurality of fins 112 that protrude from the flat plate portion 111 in a direction intersecting the plate surface of the flat plate portion 111. And, on the fin 112, a groove 114 that is recessed from the end face 113 toward the flat plate portion 111 is formed at the center of the front end portion, which is the portion away from the flat plate portion 111.

[0082] In the heat dissipation device 11 configured as described above, since the groove 114 is formed in the fin 112, the flow path area at the front end portion of the fin 112 becomes larger compared to the configuration in which the groove 114 is not formed in the fin 112, so the pressure loss becomes smaller. In addition, the side with a larger flow path area is the front end portion side of the fin 112, rather than the flat plate portion 111 side. That is, the flow path area of the front end portion side away from the semiconductor module 100 is larger than that of the flat plate portion 111 side to which the semiconductor module 100 is joined. Therefore, even if the groove 114 is formed at the front end portion of the fin 112, a situation where the performance of cooling the semiconductor module 100 is reduced compared to the configuration in which the groove 114 is not formed in the fin 112 is suppressed.

[0083] The inventor of the present utility model conducted in-depth research and found that "the depth h of the groove is preferably 10% or more and 60% or less of the size L in the protruding direction of the fin 112". When the depth h of the groove is less than 10% of the size L in the protruding direction of the fin 112, the pressure loss cannot be sufficiently reduced. On the other hand, when the depth h of the groove exceeds 60% of the size L in the protruding direction, the performance of cooling the semiconductor module 100 will be reduced.

[0084] In addition, in the heat dissipation device 11, the cross-sectional shape of the fin 112 is a quadrilateral, and the first corner 116 (an example of one corner) of the quadrilateral faces the upstream side of the flow direction of the coolant, and the second corner 117 (an example of another corner) located on the same diagonal as the first corner 116 faces the downstream side of the flow direction. Therefore, the flow direction of the coolant can be changed by the first corner 116, and the coolant can be evenly divided. As a result, the coolant can be distributed to both ends of the heat dissipation device 11 in the direction orthogonal to the flow direction ( Figure 5 the up and down directions in (a) of

[0085] In addition, in Figure 5 In (a) of

[0086] a square is shown as an example of the quadrilateral, but the cross-sectional shape of the fin 112 can also be a rhombus or a rectangle.

[0087] Moreover, the inventor of the present utility model conducted in-depth research and found that "the width W1 of the groove 114 is preferably 10% to 60% of the width W0 of the parallel two faces of the fin 112". When the width W1 of the groove 114 is less than 10% of the width W0 of the parallel two faces, it is difficult for the coolant to flow into the groove 114, so the pressure loss cannot be sufficiently reduced. On the other hand, when the width W1 of the groove 114 exceeds 60% of the width W0 of the parallel two faces, the surface area of the fin 112 becomes smaller, and the performance of cooling the semiconductor module 100 will decrease.

[0088] In addition, in the heat dissipation device 11, the widths W1 of the grooves 114 formed in the plurality of fins 112 are all the same. Therefore, only one type of tool for cutting to form the groove 114 is required, so the cost of manufacturing the tool and the time for manufacturing the heat dissipation device 11 can be reduced.

[0089] Furthermore, in the heat dissipation device 11, the width W1 of the groove 114 formed in the plurality of fins 112 is the same as the size of the gap G between the adjacent fins 112. Therefore, the tool for cutting out the fin 112 with a square cross-sectional shape from a rectangular parallelepiped block and the tool for cutting to form the groove 114 can be the same, so the cost of manufacturing the tool and the time for manufacturing the heat dissipation device 11 can be reduced.

[0090] <Modification example of the fin>

[0091] Hereinafter, a modification example of the fin 112 will be described.

[0092] Figure 6 This is an example of a view of the fin 300 according to the first modification as observed from above.

[0093] The difference between the fin 300 according to the first modification and the fin 112 is that "only one groove 114 is formed". The components having the same functions in the fins 300 and 112 are labeled with the same reference numerals, and detailed descriptions thereof are omitted.

[0094] More specifically, on the fin 300, at the intersection of the diagonal line connecting the first corner portion 116 and the second corner portion 117 and the diagonal line orthogonal to this diagonal line, and in the direction Figure 6 that is 45 degrees in the counterclockwise direction with respect to the flow direction, one groove 114 is formed. In addition, the groove 114 is formed to penetrate the front end portion of the fin 300 in a direction parallel to the flat plate portion 111. The widths W1 of the grooves 114 respectively formed in the plurality of fins 300 are all the same, and the width W1 of the groove 114 is the same as the size of the gap G between the adjacent fins 300.

[0095] As described above, in the fin 300 according to the first modification, one groove 114 is formed in a direction inclined with respect to the flow direction. Even if there is only one groove 114, the flow path area at the front end portion of the fin 300 becomes larger than that of the configuration in which no groove 114 is formed in the fin 300, so the pressure loss becomes smaller. In addition, the side with a larger flow path area is the front end portion side of the fin 300, not the flat plate portion 111 side. Therefore, even if a groove 114 is formed at the front end portion of the fin 300, a decrease in the performance of cooling the semiconductor module 100 with respect to the configuration in which no groove 114 is formed in the fin 300 is suppressed.

[0096] In addition, the orientation of the groove 114 may also be in the direction Figure 6 that is 45 degrees in the clockwise direction with respect to the flow direction.

[0097] Figure 7 This is an example of a view of the fin 400 according to the second modification as observed from above.

[0098] The difference between the fin 400 according to the second modification and the fin 300 according to the first modification is that "the orientation of the groove 414 corresponding to the groove 114 is different". The components having the same functions in the fins 400 and 300 are labeled with the same reference numerals, and detailed descriptions thereof are omitted.

[0099] More specifically, on the fin 400, in the flow direction, that is, in the direction of the diagonal line connecting the first corner 116 and the second corner 117, one groove 414 is formed. In addition, the groove 414 is formed to penetrate the front end portion of the fin 400 in a direction parallel to the flat plate portion 111. The widths W1 of the grooves 414 respectively formed in the plurality of fins 400 are all the same, and the width W1 of the groove 414 is the same as the size of the gap G between the adjacent fins 400.

[0100] As described above, in the fin 400 according to the second modification, one groove 414 is formed in the same direction as the flow direction. By having the "groove 414 in the same direction as the flow direction", the flow in the flow direction is promoted and the pressure loss is reduced. In addition, since the flow path area is larger on the front end portion side of the fin 400 rather than on the flat plate portion 111 side, even if the groove 414 is formed in the front end portion of the fin 400, a decrease in the performance of cooling the semiconductor module 100 compared to the configuration where the groove 414 is not formed in the fin 400 is suppressed.

[0101] In addition, the width W1 of the groove 414 may not be the same as the size of the gap G between the adjacent fins 400. The pressure loss can be adjusted by adjusting the width W1 of the groove 414.

Claims

1. A heat dissipation device, comprising: A flat plate-shaped portion; and A plurality of fins protruding from the flat plate-shaped portion in a direction intersecting the plate surface of the flat plate-shaped portion, On the fin, at the central portion of the front end portion which is the portion away from the flat plate-shaped portion, a groove is formed that is recessed from the end face toward the flat plate-shaped portion.

2. The heat dissipation device according to claim 1, The cross-sectional shape of the fin is a quadrilateral, and one of the corners of the quadrilateral faces the upstream side of the flow direction of the coolant, and the other corner located on the same diagonal as the one corner faces the downstream side of the flow direction.

3. The heat dissipation device according to claim 2, One groove is formed in the same direction as the flow direction.

4. The heat dissipation device according to claim 2, One groove is formed in a direction inclined with respect to the flow direction.

5. The heat dissipation device according to claim 2, One groove is formed in a direction inclined with respect to the flow direction, and another groove is formed in a manner intersecting the inclined direction.

6. The heat dissipation device according to claim 1, The depth of the groove is 10% to 60% of the size of the fin in the protruding direction.

7. The heat dissipation device according to claim 2, The cross-sectional shape of the fin is a quadrilateral with two orthogonal diagonals, The width of the groove is 10% to 60% of the width between the parallel two faces of the fin.

8. The heat dissipation device according to claim 1, The widths of the grooves formed in the plurality of fins are all the same.

9. The heat dissipation device according to claim 1, The width of the groove formed in the plurality of fins is the same as the gap between adjacent fins.

10. A cooler, comprising: The heat dissipation device according to any one of claims 1 to 9; and A housing that surrounds the plurality of fins in such a manner that coolant flows between the plurality of fins of the heat dissipation device.

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