Connection terminal and charging device

Abstract

The utility model relates to a connecting terminal and a charging device. The connecting terminal comprises a main body structure and a conductive contact piece, the conductive contact piece comprises a base layer, a conductive layer and an anti-electrolysis layer, wherein the conductive layer and the anti-electrolysis layer are arranged on the base layer. The conductive layer comprises a phosphor copper layer and a first gold layer. Wherein the base layer is arranged on the main body structure, the phosphor copper layer is arranged on the base layer, the first gold layer is arranged on the phosphor copper layer, and the at least one anti-electrolysis layer is arranged on the first gold layer. Compared with a traditional connector, the conductive contact piece and the conductive layer of the conductive contact piece are more stable and reliable, the conductive layer and the base layer are protected through the anti-electrolysis layer, the electrolysis resistance and oxidation resistance of the conductive layer and the base layer made of copper or copper alloy are reliably improved, blackening of the conductive contact piece is avoided, the electric contact effect is guaranteed, the conductive contact piece is particularly suitable for a traditional Lightning connector, and the service life of the conductive contact piece is prolonged. And particularly, the problem that the fourth PIN from the left of the traditional Lightning joint is relatively easy to oxidize and blacken due to relatively large current is solved.

Description

Technical Field

[0001] The present application relates to the field of charging connections, and particularly to connection terminals and charging devices. Background Art

[0002] Connection lines, including data lines and charging lines, are usually connected by plug-in terminals. Conductive contacts are usually used in the connectors of connection lines to achieve electrical connection. Conductive contacts are also called PIN pins, and there are two design methods for them. One is to be arranged inside, and the other is to be exposed on the surface. Taking the Lightning connector as an example, the PIN pins are exposed on the surface.

[0003] In the connector of the connection line, when the usage time exceeds two years or the number of plugging and unplugging times exceeds 300 times, the surface of the connector is prone to oxidation and blackening, thus affecting the electrical contact effect, especially for the PIN pins of the Lightning connector. Summary of the Utility Model

[0004] Based on this, it is necessary to provide a connection terminal and a charging device.

[0005] In one embodiment, a connection terminal includes a main body structure and a conductive contact; the conductive contact includes a base layer, a conductive layer and an anti-electrolysis layer provided on the base layer, and the conductive layer includes a phosphor bronze layer and a first gold layer;

[0006] Wherein, the base layer is arranged on the main body structure, the phosphor bronze layer is arranged on the base layer, the first gold layer is arranged on the phosphor bronze layer, and at least one anti-electrolysis layer is arranged on the first gold layer.

[0007] For the above connection terminal, the base layer and the conductive layer are protected by the anti-electrolysis layer. On the one hand, a more stable and reliable conductive contact and its conductive layer design are provided compared with traditional connectors. On the other hand, the adhesion of the conductive layer to the base layer is enhanced through the design of the phosphor bronze layer. On the third hand, the anti-electrolysis property and anti-oxidation property of the conductive layer and the base layer made of copper or copper alloy are reliably improved, avoiding the blackening of the conductive contact and ensuring the electrical contact effect. It is especially suitable for traditional Lightning connectors, and particularly solves the problem that the 4th PIN pin from the left of the traditional Lightning connector is relatively prone to oxidation and blackening due to relatively large current.

[0008] In one of the embodiments, at least one anti-electrolysis layer is arranged between the phosphor bronze layer and the first gold layer; or,

[0009] The conductive layer further includes a second gold layer, the second gold layer is arranged on the first gold layer, at least one anti-electrolysis layer is arranged between the first gold layer and the second gold layer, and at least one anti-electrolysis layer is arranged on the second gold layer; or,

[0010] The outermost layer of the anti-electrolysis layer protrudes above the main body structure; or,

[0011] The outer surface of the anti-electrolysis layer is exposed to the external environment; or,

[0012] The main body structure has two opposite contact surfaces, and the conductive contact pieces are arranged on each of the contact surfaces; or,

[0013] The connection terminal further includes a control board, and the control board is connected to the conductive contact piece through the main body structure; or,

[0014] The connection terminal is a Lightning connector.

[0015] In one embodiment, the anti-electrolysis layer includes a nickel-tungsten layer and a platinum layer. The nickel-tungsten layer is disposed on the phosphor-copper layer, the first gold layer is disposed on the nickel-tungsten layer, and the platinum layer is disposed on the first gold layer; or,

[0016] The conductive layer further includes a second gold layer, and the anti-electrolysis layer includes a palladium-gold layer and a platinum layer. Wherein, the palladium-gold layer is disposed on the first gold layer, the second gold layer is disposed on the palladium-gold layer, and the platinum layer is disposed on the second gold layer; or,

[0017] The conductive layer further includes a second gold layer, and the anti-electrolysis layer includes a nickel-tungsten layer, a palladium-gold layer and a platinum layer. Wherein, the nickel-tungsten layer is disposed on the phosphor-copper layer, the first gold layer is disposed on the nickel-tungsten layer, the palladium-gold layer is disposed on the first gold layer, the second gold layer is disposed on the palladium-gold layer, and the platinum layer is disposed on the second gold layer.

[0018] In one embodiment, the main body structure has two opposite contact surfaces, and the conductive contact pieces are respectively arranged on each of the contact surfaces;

[0019] The base layer has two opposite conductive connection surfaces, and the conductive contact piece arranges a conductive layer on each of the conductive connection surfaces. The first gold layer of one of the conductive layers is disposed on the main body structure, and at least one anti-electrolysis layer is provided on the first gold layer of the other conductive layer.

[0020] In one embodiment, any one of the conductive connection surfaces is parallel to any one of the contact surfaces.

[0021] In one embodiment, the two conductive connection surfaces are respectively a first conductive connection surface and a second conductive connection surface;

[0022] The conductive layer disposed on the first conductive connection surface is the first conductive layer, and the first conductive layer further includes a second gold layer. The anti-electrolysis layer includes a nickel-tungsten layer, a palladium-gold layer, and a platinum-gold layer.

[0023] Wherein, the nickel-tungsten layer is disposed on the phosphor-copper layer, the first gold layer is disposed on the nickel-tungsten layer, the palladium-gold layer is disposed on the first gold layer, the second gold layer is disposed on the palladium-gold layer, and the platinum-gold layer is disposed on the second gold layer.

[0024] The conductive layer disposed on the second conductive connection surface is the second conductive layer. The first gold layer on the second conductive layer is welded to the main body structure, or the second conductive layer further includes a second gold layer disposed on the first gold layer, and the second gold layer is welded to the main body structure, or the anti-electrolysis layer includes a nickel-tungsten layer disposed between the phosphor-copper layer and the first gold layer.

[0025] In one embodiment, the base layer is provided with an empty groove at the second conductive connection surface, and the second conductive layer has an opening corresponding to the empty groove.

[0026] In one embodiment, the thickness of the phosphor-copper layer is 30 microns ± 4.5 microns, the thickness of the nickel-tungsten layer is 50 microns ± 7.5 microns, the thickness of the first gold layer is 1 micron ± 0.15 microns, the thickness of the palladium-gold layer is greater than or equal to 3 microns ± 0.45 microns, the thickness of the second gold layer is 1 micron ± 0.15 microns, and the thickness of the platinum-gold layer is 20 microns ± 3 microns.

[0027] In one embodiment, the thickness of the phosphor-copper layer is 30 microns, the thickness of the nickel-tungsten layer is 50 microns, the thickness of the first gold layer is 1 micron, the thickness of the palladium-gold layer is 3 microns, the thickness of the second gold layer is 1 micron, and the thickness of the platinum-gold layer is 20 microns.

[0028] In one embodiment, a charging device includes a power supply end, a wire, and the connection terminal of any one of the embodiments. The power supply end is sequentially connected to the conductive contact of the connection terminal through the wire and the main body structure of the connection terminal. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0030] Figure 1 This is a schematic structural diagram of an embodiment of the charging device described in this application.

[0031] Figure 2 for Figure 1 A schematic diagram of another direction of the embodiment shown.

[0032] Figure 3 This is a structural diagram of an embodiment of the connecting terminal described in this application.

[0033] Figure 4 for Figure 3 A schematic diagram of another direction of the embodiment shown.

[0034] Figure 5 for Figure 3 A schematic diagram of another direction of the embodiment shown.

[0035] Figure 6 This is a structural diagram of the first embodiment of the conductive contact sheet described in this application.

[0036] Figure 7 This is a structural diagram of the second embodiment of the conductive contact sheet described in this application.

[0037] Figure 8 for Figure 7 Schematic diagram of the structural decomposition of the embodiment shown.

[0038] Figure 9 for Figure 8 A schematic diagram of another direction of the embodiment shown.

[0039] Figure 10 This is a schematic structural diagram of the third embodiment of the conductive contact sheet described in this application.

[0040] Figure 11 for Figure 10 Schematic diagram of the structural decomposition of the embodiment shown.

[0041] Figure 12 for Figure 11 A schematic diagram of another direction of the embodiment shown.

[0042] Figure 13 This is a schematic diagram of the structural decomposition of the fourth embodiment of the conductive contact sheet described in this application.

[0043] Figure 14 for Figure 13 A schematic diagram of another direction of the embodiment shown.

[0044] Figure 15 for Figure 13 A schematic diagram of another direction of the embodiment shown.

[0045] Reference Numerals: 100, connecting terminal; 110, main body structure; 111, contact surface; 120, conductive contact piece; 121, base layer; 122, conductive layer; 123, phosphor bronze layer; 124, nickel tungsten layer; 125, first gold layer; 126, second gold layer; 127, palladium gold layer; 128, platinum layer; 129, conductive connection surface; 131, first conductive connection surface; 132, second conductive connection surface; 133, first conductive layer; 134, second conductive layer; 135, empty slot; 136, opening; 137, anti-electrolysis layer; 140, control board; 150, support member; 160, protective member; 200, power supply end; 300, wire; 400, charging device. Detailed Embodiment

[0046] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description to facilitate a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0047] It should be noted that when a component is referred to as being "disposed on" another component, it can be directly on the other component or there can also be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component at the same time. The terms "upper", "lower", and similar expressions used in the specification of the present application are only for illustrative purposes and do not represent the only implementation manner.

[0048] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0049] In the present application, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature can be that the first feature is in direct contact with the second feature or the first feature is in indirect contact with the second feature through an intermediate medium. Moreover, the first feature being "above" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the first feature has a higher horizontal height than the second feature. The first feature being "below" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the first feature has a lower horizontal height than the second feature.

[0050] Unless otherwise defined, all technical and scientific terms used in the specification of this application shall have the same meanings as commonly understood by those skilled in the technical field to which this application pertains. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0051] This application discloses a connection terminal and a charging device, which include some or all of the technical features of the following embodiments; that is, the connection terminal and the charging device include some or all of the following structures. In one embodiment of this application, a connection terminal includes a main body structure and a conductive contact piece; the conductive contact piece includes a base layer and a conductive layer and an anti-electrolytic layer provided on the base layer, and the conductive layer includes a phosphor bronze layer and a first gold layer; wherein, the base layer is provided on the main body structure, the phosphor bronze layer is provided on the base layer, the first gold layer is provided on the phosphor bronze layer, and at least one anti-electrolytic layer is provided on the first gold layer. For the above connection terminal, the base layer and the conductive layer are protected by the anti-electrolytic layer. On the one hand, a more stable and reliable conductive contact piece and its conductive layer design are provided compared with traditional connectors. On the other hand, the adhesion of the conductive layer to the base layer is enhanced through the design of the phosphor bronze layer. On the third hand, the anti-electrolytic property of the conductive layer and the oxidation resistance of the base layer made of copper or copper alloy material are reliably improved, preventing the conductive contact piece from turning black and ensuring the electrical contact effect. It is especially applicable to traditional Lightning connectors, and in particular solves the problem that the 4th PIN from the left of the traditional Lightning connector is relatively prone to oxidation and blackening due to relatively large current. The following will be combined with Figures 1 to 15 to describe the connection terminal and the charging device in detail.

[0052] In one of the embodiments, a charging device 400 is as Figure 1 shown, which includes a power supply end 200, a wire 300 and a connection terminal 100; the power supply end 200 is connected to the connection terminal 100 through the wire 300. Exemplarily, the power supply end 200 is electrically connected to the connection terminal 100 through the wire 300, and the connection terminal 100 can be used as the charging end of the charging device 400. In one of the embodiments, the connection terminal 100 can be the connection terminal 100 described in any embodiment herein. It can be understood that since the charging device 400 adopts the connection terminal 100, it also has the beneficial technical effects added by the connection terminal 100, which will not be elaborated herein.

[0053] Since the connector of the traditional connecting wire uses copper or copper alloy as the base layer of the PIN pins and only has a layer of gold on the surface of the PIN pin base layer, when the usage time is relatively long and the number of uses is relatively large, the gold layer is likely to separate from the base layer, resulting in the exposure of the copper layer as the base layer to the air and oxidation to black. For example, when the usage time exceeds two years or the number of plugging and unplugging times exceeds 300 times, the surface of the connector is likely to oxidize and turn black, thus affecting the electrical contact effect, especially obvious for the PIN pins of the Lightning connector; in contrast, in combination with Figure 2 and Figure 6 , in one embodiment, the connection terminal 100 includes a main body structure 110 and a conductive contact piece 120. The conductive contact piece 120 includes a base layer 121, a conductive layer 122 and an anti-electrolysis layer 137 provided on the base layer 121. The base layer 121 is provided on the main body structure 110. The wire 300 is connected to the main body structure 110, and the power supply end 200 is sequentially connected to the conductive contact piece 120 through the wire 300, the main body structure 110. In this embodiment, the outermost layer of the anti-electrolysis layer 137 protrudes from the main body structure 110. Those skilled in the art can understand that for each of the conductive contact pieces 120 on the connection terminal 100, they can be connected to each other through the base layer 121 of the conductive contact piece 120, or can be isolated from each other through the main body structure 110 instead of being connected. Through the design of the anti-electrolysis layer 137, protection is formed for the conductive layer 122 and the base layer 121. The base layer 121 is usually made of copper or copper alloy, and the conductive layer 122 usually has gold with a purity less than 100%, that is, gold alloy. Therefore, after adding the anti-electrolysis layer 137, the anti-electrolysis property and anti-oxidation property are improved, thus greatly improving the problem that the traditional conductive contact piece is prone to blackening and ensuring the electrical contact effect of the conductive contact pieces 120 in each embodiment.

[0054] Exemplarily, the power supply end 200 is electrically connected to the conductive contact piece 120 sequentially through the wire 300, the main body structure 110. In one embodiment, the power supply end 200 is connected to the conductive contact piece 120 and the anti-electrolysis layer 137 sequentially through the wire 300, the main body structure 110, the main body structure 110. Exemplarily, the power supply end 200 is connected to the conductive layer 122 and the anti-electrolysis layer 137 sequentially through the wire 300, the main body structure 110, the base layer 121, and the power supply end 200 is electrically connected to the conductive layer 122 and the anti-electrolysis layer 137 sequentially through the wire 300, the circuit in the main body structure 110, the base layer 121. The rest of the embodiments are similar and will not be elaborated. Such a structural design is beneficial to ensuring the power transmission performance of the connection terminal 100.

[0055] In one embodiment, a connection terminal 100 is asFigure 3 As shown, it includes a main body structure 110 and conductive contact pieces 120. The conductive contact pieces 120 are arranged on the main body structure 110 and exposed to the external environment. In this embodiment, the conductive contact pieces 120 are regularly arranged on the main body structure 110 and exposed to the external environment. Among them, the conductive contact pieces 120 are exposed to the external environment, that is, the connection terminal 100 can contact an external port or a connection base through the conductive contact pieces 120. That is to say, the conductive contact pieces 120 can be contacted relative to the outside world to achieve electrical connection. In specific applications, all of the conductive contact pieces 120 can be exposed to the external environment, or some of them can be exposed to the external environment, or only the outermost layer can be exposed to the external environment. Exemplarily, as Figure 3 shown, in this embodiment, eight of the conductive contact pieces 120 are regularly arranged in a row. In one embodiment, the connection terminal 100 is a Lightning connector. In other embodiments, the number of the conductive contact pieces 120 can vary, and the arrangement can also be different. Such a structural design is conducive to flexibly designing the connection terminal 100 according to product requirements.

[0056] In one embodiment, one of the conductive contact pieces 120 at a predetermined position of the connection terminal 100 is widened by 3% to 11% relative to other conductive contact pieces 120. In one embodiment, the fourth conductive contact piece 120 from the left of the connection terminal 100 is widened by 3% to 11% relative to other conductive contact pieces 120. Such a structural design is particularly applicable to the Lightning connector. The fourth PIN from the left of the traditional Lightning connector, that is, the fourth conductive contact piece 120 from the left, is relatively easy to oxidize and turn black due to relatively large current. However, in the embodiment with the above-mentioned relative widening design, it is beneficial to improve the load-bearing capacity of the conductive contact piece 120 at the predetermined position, and it has better heat dissipation. While improving the oxidation resistance, the effect of avoiding blackening is further improved.

[0057] Combined with Figure 4 and Figure 5, in this embodiment, the main body structure 110 has two opposite contact surfaces 111, and the conductive contact pieces 120 are arranged on each of the contact surfaces 111; in this embodiment, the conductive contact pieces 120 are arranged on each of the contact surfaces 111 in a regular arrangement, that is, at least two regularly arranged conductive contact pieces 120 are arranged on each of the contact surfaces 111. In one embodiment, the main body structure 110 has two opposite contact surfaces 111, and the conductive contact pieces 120 are respectively arranged on each of the contact surfaces 111; in this embodiment, the conductive contact pieces 120 are respectively arranged on each of the contact surfaces 111 in a regular arrangement, that is, the conductive contact pieces 120 are exposed to the external environment on both of the two contact surfaces 111. In one embodiment, the outer surface of the anti-electrolysis layer 137 of the conductive contact piece 120 is exposed to the external environment. In one embodiment, the base layer 121 of the conductive contact piece 120 is welded to the main body structure 110, or refer to Figure 7 , the conductive contact piece 120 has two second gold layers 126, and one of the second gold layers 126 is welded to the main body structure 110. In other embodiments, the main body structure 110 may also have only one of the contact surfaces 111, which can be flexibly set according to actual needs.

[0058] Continuing to combine Figure 4 and Figure 5 , in one embodiment, the connection terminal 100 further includes a control board 140, and the control board 140 is connected to the conductive contact piece 120 through the main body structure 110. Exemplarily, in this embodiment, the connection terminal 100 further includes a control board 140 and a protective member 160. The protective member 160 partially surrounds the main body structure 110 and exposes the connection terminal 100, and may also expose a part of the main body structure 110. The control board 140 is connected to the main body structure 110 and is connected to the connection terminal 100 through the main body structure 110. It can be understood that when the number of the connection terminals 100 exceeds one, the control board 140 is respectively connected to each of the connection terminals 100, including but not limited to direct conductive connection and indirect conductive connection. In this embodiment, the connection terminal 100 further includes a support member 150, the control board 140 is arranged on the support member 150, and the support member 150 is used to provide support and can also be used to protect the control board 140. Such a structural design is beneficial to providing connection terminals 100 with various different structural designs.

[0059] In one embodiment, the conductive contact piece 120 is as Figure 6As shown, it includes a base layer 121, a conductive layer 122 and an anti-electrolysis layer 137. The conductive layer 122 and the anti-electrolysis layer 137 are both arranged on the base layer 121. In this embodiment, the conductive layer 122 includes a phosphor copper layer 123 and a first gold layer 125. The base layer 121 is arranged on the main structure 110, the phosphor copper layer 123 is arranged on the base layer 121, the first gold layer 125 is arranged on the phosphor copper layer 123, and at least one anti-electrolysis layer 137 is arranged on the first gold layer 125. It can also be understood that the base layer 121, the phosphor copper layer 123, the first gold layer 125 and the The anti-electrolysis layer 137 can be exposed entirely or partially outside the main structure 110, but at least one surface of the anti-electrolysis layer 137 facing away from the first gold layer 125 must be exposed outside the main structure 110, that is, exposed to the external environment. In this embodiment, the anti-electrolysis layer 137 serves as the outermost layer of the conductive layer 122, and its outer surface is exposed to the external environment, allowing the connection terminal 100 to electrically contact other structural components through the anti-electrolysis layer 137, wherein these other structural components include but are not limited to external ports or connectors. The design of the phosphor copper layer 123 ensures that the conductive layer has better structural adhesion strength with the base layer made of copper or copper alloy, thereby enhancing the adhesion of the conductive layer to the base layer.

[0060] In one embodiment, at least one anti-electrolysis layer 137 is disposed between the phosphor copper layer 123 and the first gold layer 125. In one embodiment, the conductive contact 120 is as follows Figure 7 or Figure 10 As shown, the anti-electrolysis layer 137 includes a nickel-tungsten layer 124 and a platinum layer 128 . The nickel-tungsten layer 124 is disposed on the phosphorus-copper layer 123 . The first gold layer 125 is disposed on the nickel-tungsten layer 124 . The platinum layer 128 is disposed on the first gold layer 125 .

[0061] In one embodiment, the conductive contact 120 is as follows: Figure 7 As shown, the conductive contact 120 or the conductive layer 122 thereof further includes a second gold layer 126, which is disposed on the first gold layer 125; in this embodiment, the conductive layer 122 further includes a second gold layer 126, which is disposed on the first gold layer 125, at least one anti-electrolysis layer 137 is disposed between the first gold layer 125 and the second gold layer 126, and at least one anti-electrolysis layer 137 is disposed on the second gold layer 126. In one embodiment, as Figure 7As shown, the conductive layer 122 further includes a second gold layer 126, and the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium-gold layer 127, and a platinum layer 128. Among them, the nickel-tungsten layer 124 is disposed on the phosphor-copper layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, the palladium-gold layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium-gold layer 127, and the platinum layer 128 is disposed on the second gold layer 126; in other embodiments, the conductive layer 122 further includes a second gold layer 126, and the anti-electrolysis layer 137 includes a palladium-gold layer 127 and a platinum layer 128. Among them, the palladium-gold layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium-gold layer 127, and the platinum layer 128 is disposed on the second gold layer 126. In this embodiment, the outer surface of the platinum layer 128, that is, the side facing away from the second gold layer 126, is exposed to the external environment. In one of the embodiments, the platinum layer 128 protrudes from the main body structure 110.

[0062] With such a structural design, on the one hand, relatively thin gold layers can be adopted. Compared with only setting one gold layer, under the design purpose of protecting the surface of the connection terminal 100, each of the two gold layers can be made very thin. At the microscopic level, by setting two gold layers, the surface of the connection terminal 100 can be fully and gaplessly covered, ensuring that the noble metal, namely gold, can protect the base layer to enhance its oxidation resistance. In contrast, if only one gold layer is set, even if its thickness is the same as the total thickness of the first gold layer 125 and the second gold layer 126, due to process reasons, gaps may be left on the surface of the connection terminal 100 at the microscopic level. In this case, the entire gold layer needs to be thickened, that is, the double-layer design of the first gold layer 125 and the second gold layer 126, which is beneficial to reducing the consumption of gold.

[0063] Moreover, with such a structural design, compared with traditional PIN pins, a composite layer structure is proposed in this embodiment. A composite conductive layer 122 is provided on at least one side or both the upper and lower sides of the base layer 121. Through the cooperation of the conductive layer 122 with the phosphor copper layer 123, nickel tungsten layer 124, first gold layer 125, palladium gold layer 127, second gold layer 126, and platinum layer 128 in the anti-electrolysis layer 137, a more stable and reliable conductive contact 120 and its conductive layer 122 design are provided compared with traditional connectors. The adhesion of the conductive layer 122 to the base layer 121 is enhanced through the design of the phosphor copper layer 123. The anti-electrolysis property is improved while ensuring conductivity through the design of the nickel tungsten layer 124, palladium gold layer 127, and platinum layer 128. Also, through the stacking of the first gold layer 125, palladium gold layer 127, second gold layer 126, and platinum layer 128, the protection ability of the anti-electrolysis layer 137 for the conductive layer 122 and the base layer 121 is reliably improved, thereby enhancing the anti-electrolysis property of the conductive layer 122 and the anti-oxidation property of the base layer 121, preventing the conductive contact 120 from turning black, and ensuring the electrical contact effect of the conductive contact 120. It is especially suitable for traditional Lightning connectors, particularly solving the problem that the fourth PIN pin from the left of the traditional Lightning connector is relatively prone to oxidation and blackening due to relatively large current.

[0064] In one embodiment, in the conductive contact 120, the phosphor copper layer 123 is connected to the base layer 121 by immersion plating, the nickel tungsten layer 124 is connected to the phosphor copper layer 123 by immersion plating, and the first gold layer 125 is connected to the nickel tungsten layer 124 by immersion plating; in one embodiment, the second gold layer 126 is connected to the first gold layer 125 by immersion plating. This embodiment gives the combination relationship of the layers of the conductive layer 122, which can also be understood as the connection relationship of the layers; the layers include but are not limited to the phosphor copper layer 123, nickel tungsten layer 124, first gold layer 125, and second gold layer 126. In other embodiments, the layers can also be stably connected by other combination relationships. With such a design, the process is simple, and the conductive contact 120 and its conductive layer 122 of the connection terminal 100 are stable and reliable. After stability testing, it can be inserted and removed 9,000 to more than 10,000 times without the problem of surface blackening. It is especially suitable for Lightning connectors and can also be used in other application scenarios where the connection terminal 100 needs to be frequently inserted and removed.

[0065] Figure 6 In the illustrated embodiment, the conductive contact 120 is only provided on one conductive connection surface 129 of the base layer 121. In one embodiment, the conductive contact 120 is as Figure 7 shown, and is connected to Figure 6Different from the illustrated embodiments, the base layer 121 has two opposite conductive connection surfaces 129, and a conductive layer 122 is provided on each of the conductive connection surfaces 129 of the conductive contact piece 120. The first gold layer 125 of one of the conductive layers 122 is provided on the main body structure 110, and at least one anti-electrolysis layer 137 is provided on the first gold layer 125 of the other conductive layer 122. Such a structural design is conducive to providing a suitable connection terminal 100 according to the requirements of different connection terminals 100.

[0066] For the embodiment having the contact surface 111, in one embodiment, any one of the conductive connection surfaces 129 is parallel to any one of the contact surfaces 111, that is, the two contact surfaces 111 are parallel, the two conductive connection surfaces 129 are parallel, and any one of the conductive connection surfaces 129 is also parallel to any one of the contact surfaces 111. As Figure 7 shown, the two conductive connection surfaces 129 are parallel. In other embodiments, two non-parallel conductive connection surfaces 129 or two non-parallel contact surfaces 111 may also be used, as long as the product design requirements are met.

[0067] In one embodiment, as Figure 7 and Figure 8 shown, the two conductive connection surfaces 129 are respectively a first conductive connection surface 131 and a second conductive connection surface 132; it can also be understood that the conductive connection surface 129 includes a first conductive connection surface 131 and a second conductive connection surface 132. And, the conductive layer 122 provided on the first conductive connection surface 131 is a first conductive layer 133. Similarly, the conductive layer 122 provided on the second conductive connection surface 132 is a second conductive layer 134. Combining Figure 9 , the base layer 121 is disposed between the phosphor copper layer 123 on the first conductive layer 133 and the phosphor copper layer 123 on the second conductive layer 134. The first gold layer 125 on the second conductive layer 134 is welded to the main body structure 110, or for the embodiment having a second gold layer 126, that is, the second conductive layer 134 further includes a second gold layer 126 directly or indirectly provided on the first gold layer 125, then the second gold layer 126 is welded to the main body structure 110. Such a structural design is conducive to providing soldering performance through the first gold layer 125 or the second gold layer 126 and improving the soldering strength between the conductive contact piece 120 and the main body structure 110.

[0068] In one embodiment, as Figure 10As shown, the first conductive layer 133 further includes a second gold layer 126, and the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium-gold layer 127, and a platinum layer 128. Among them, the nickel-tungsten layer 124 is disposed on the phosphor-copper layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, the palladium-gold layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium-gold layer 127, and the platinum layer 128 is disposed on the second gold layer 126. The platinum layer 128 is exposed to the external environment, that is, the second gold layer 126 is indirectly exposed to the external environment through the platinum layer 128. It can be understood that for the embodiment with the platinum layer 128, since the platinum layer 128 is disposed on the second gold layer 126, the second gold layer 126 is covered. Therefore, the conductive contact 120 in the connection terminal 100 is exposed to the external environment through the platinum layer 128. With such a design, through the design of the nickel-tungsten layer 124, the palladium-gold layer 127, and the platinum layer 128, it is beneficial to improve the anti-electrolysis ability of the conductive contact 120. And through the sandwich structure of the nickel-tungsten layer 124 cooperating with two gold layers with the palladium-gold layer 127 sandwiched in the middle and stacking the platinum layer 128, sufficient antioxidant protection ability and anti-electrolysis ability are provided for the base layer 121 and the two gold layers, so that the PIN needle is not easily blackened during long-term use, thus ensuring the electrical contact effect of the conductive contact 120. In the trial production test, compared with the theoretical life of the traditional Lightning connector product, the service life of the conductive contact 120 can be extended by more than 10 times.

[0069] The above embodiments are actually measured below in combination with the common test methods of the connection terminal 100, and the test results are described as follows.

[0070] Appearance inspection: The connection terminal 100 has no deformation, crooked pins, white spots, charring, blackening, etc.

[0071] Insertion and extraction test: After 10,000 insertions and extractions of the connection terminal 100, the conductive contact 120 is not loose or blackened. As a comparison, for the traditional Lightning connector, when the number of insertions and extractions exceeds about 300 times, the gold fingers on the surface of the connector start to turn black; when the number of insertions and extractions exceeds 500 times, the black spots on the gold fingers on the surface of the connector are obvious; when the number of insertions and extractions exceeds 1000 times, the electrical contact performance of the gold fingers on the surface of the connector deteriorates.

[0072] Tin soldering test: The tin furnace is set at 245°C without adding flux. The product is vertically placed into the tin furnace for 3 to 5 seconds. As a result, 95% of the connection terminal 100 is tinned, indicating that the product has a good soldering and fixing effect.

[0073] Salt spray test: The concentration of the brine solution is 5% ± 0.5%, the pH value of the brine solution is 6.5 to 7.2, the spray rate is 1.0 ml to 2.0 ml / hour / 80 square centimeters, the ambient air temperature is 60°C ± 2°C, the brine temperature is 35°C ± 2°C, and there is no obvious oxidation or rusting of the connecting terminal 100 within 24 hours.

[0074] Sweat test: The 5V output no-load is immersed in artificial sweat for 3 minutes, and the conductive contact piece 120 of the connecting terminal 100 does not change color. In contrast, after about 8 to 10 seconds for the traditional Lightning connector, the gold fingers on the surface of the connector start to turn black. The sweat test, as an electrolysis test, is a key parameter for the anti-electrolysis ability of the conductive contact piece 120. During use, due to long-term plug-in use, usually the PIN pins, especially the positive extreme, will be charged. In this state, if it comes into contact with the finger skin with sweat, an electrolysis effect is likely to occur. In this embodiment, the design of the nickel-tungsten layer 124 in combination with the palladium-gold layer 127 and the platinum layer 128 forms a three-layer anti-electrolysis layer 137, which microscopically ensures a sufficient and complete surface coverage effect, and can effectively improve the anti-electrolysis ability of the connecting terminal 100. And through the design of the two-layer gold layer, it is beneficial to fully cover the surface of the PIN pins and improve the antioxidant performance of the base layer 121.

[0075] Bending test: Bend back and forth twice at 90 degrees with a pair of pointed-nose pliers, and there is no coating peeling off on the connecting terminal 100.

[0076] It can be seen that compared with the traditional Lightning connector, the above embodiments of the present application reliably improve the antioxidant property of the conductive contact piece 120 of the connecting terminal 100, avoid the blackening of the conductive contact piece 120, ensure the electrical contact effect of the conductive contact piece 120, and thus can achieve the beneficial technical effects of longer service life and more plugging and unplugging times.

[0077] Figure 10 In the illustrated embodiment, conductive layers 122 are respectively provided on both sides of the base layer 121. On one side, the conductive layer 122 and the anti-electrolysis layer 137 are provided for connecting the main body structure 110, and on the other side, the conductive layer 122 and the anti-electrolysis layer 137 are provided for connecting the external connector. Combining Figure 6 , it is also possible to only provide the conductive layer 122 and the anti-electrolysis layer 137 on one side of the base layer 121.

[0078] Combining Figure 11 and Figure 12In this embodiment, the base layer 121 has two conductive connection surfaces 129 facing each other, and the conductive contact 120 is provided with a conductive layer 122 on each conductive connection surface 129, wherein the conductive layer 122 provided on the first conductive connection surface 131 is a first conductive layer 133, and the first conductive layer 133 also includes a second gold layer 126, and the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium-gold layer 127, and a platinum-gold layer 128; that is, the phosphorus copper layer 123, the nickel-tungsten layer 124, the first gold layer 125, the palladium-gold layer 127, the second gold layer 126, and the platinum layer 128 are sequentially provided on the first conductive connection surface 131, and the conductive layer 122 provided on the second conductive connection surface 132 is the second conductive layer 134, and the first gold layer 125 on the second conductive layer 134 is welded to the main structure 110, or the second The conductive layer 134 further includes a second gold layer 126 disposed on the first gold layer 125, and the second gold layer 126 is welded to the main structure 110. Alternatively, the anti-electrolysis layer 137 includes a nickel-tungsten layer 124 disposed between the phosphorus-copper layer 123 and the first gold layer 125. In this embodiment, the anti-electrolysis layer 137 includes the nickel-tungsten layer 124 disposed between the phosphorus-copper layer 123 and the first gold layer 125. This positional relationship can also be understood as the nickel-tungsten layer 124 being disposed on the first gold layer 125. That is, the phosphorus-copper layer 123, the nickel-tungsten layer 124, the first gold layer 125, and the second gold layer 126 are sequentially disposed on the second conductive connection surface 132, and the base layer 121 is disposed between the phosphorus-copper layer 123 on the first conductive layer 133 and the phosphorus-copper layer 123 on the second conductive layer 134. The remaining embodiments are similar and are not further described. This structural design ensures that the phosphor copper layer 123 is securely attached to the base layer 121. The nickel-tungsten layer 124 exhibits excellent ductility and conductivity. Combined with the two relatively thin gold layers, this not only reduces the amount of gold material used but also reliably enhances the oxidation resistance of the conductive contact 120 of the connection terminal 100, preventing it from blackening and thus ensuring effective electrical contact. The second gold layer 126 of the second conductive layer 134 is connected to the main structure 110, for example, by welding, eliminating the need for an external anti-electrolytic layer 137 for protection.

[0079] For each layer structure disposed on the first conductive connection surface 131, in one embodiment, the phosphor bronze layer 123 is connected to the base layer 121 by immersion plating, the nickel tungsten layer 124 is connected to the phosphor bronze layer 123 by immersion plating, the first gold layer 125 is connected to the nickel tungsten layer 124 by immersion plating, the palladium gold layer 127 is connected to the first gold layer 125 by brush plating, the second gold layer 126 is connected to the palladium gold layer 127 by immersion plating, and the platinum layer 128 is connected to the second gold layer 126 by brush plating. For each layer structure disposed on the second conductive connection surface 132, in one embodiment, the phosphor bronze layer 123 is connected to the base layer 121 by immersion plating, the nickel tungsten layer 124 is connected to the phosphor bronze layer 123 by immersion plating, the first gold layer 125 is connected to the nickel tungsten layer 124 by immersion plating, and the second gold layer 126 is connected to the first gold layer 125 by immersion plating. Those skilled in the art can understand that the specific immersion plating process or brush plating process can be implemented by traditional technologies or simply adjusted, and the present application and each embodiment do not limit this.

[0080] In one embodiment, the thickness of the phosphor copper layer 123 is greater than or equal to 25.50 microns, the thickness of the nickel tungsten layer 124 is greater than or equal to 42.50 microns, and the thickness of the first gold layer 125 is greater than or equal to 0.85 microns; for the embodiment with the second gold layer 126, illustratively, the thickness of the second gold layer 126 is greater than or equal to 0.85 microns; for the embodiment with the palladium gold layer 127 and the platinum gold layer 128, illustratively, the thickness of the palladium gold layer 127 is greater than or equal to 2.55 microns, and the thickness of the platinum gold layer 128 is greater than or equal to 17.00 microns. In one embodiment, the thickness of the phosphor copper layer 123 is less than or equal to 34.50 microns, the thickness of the nickel tungsten layer 124 is less than or equal to 57.50 microns, and the thickness of the first gold layer 125 is less than or equal to 1.15 microns. For embodiments having a second gold layer 126, the thickness of the second gold layer 126 is illustratively less than or equal to 1.15 microns. For embodiments having a palladium gold layer 127 and a platinum gold layer 128, the thickness of the palladium gold layer 127 is illustratively less than or equal to 3.45 microns, and the thickness of the platinum gold layer 128 is illustratively less than or equal to 23.00 microns. In one embodiment, the thickness of the phosphor copper layer 123 is 30 microns ± 4.5 microns, i.e., the thickness of the phosphor copper layer 123 is greater than or equal to 25.50 microns and less than or equal to 34.50 microns, i.e., the thickness of the phosphor copper layer 123 is between 25.50 microns and 34.50 microns, and the same is not repeated below. The thickness of the nickel-tungsten layer 124 is 50 microns ± 7.5 microns, the thickness of the first gold layer 125 is 1 micron ± 0.15 microns, the thickness of the palladium-gold layer 127 is greater than or equal to 3 microns ± 0.45 microns, the thickness of the second gold layer 126 is 1 micron ± 0.15 microns, and the thickness of the platinum layer 128 is 20 microns ± 3 microns. The remaining embodiments are similar and will not be described in detail. For example, in this embodiment, the connection terminal 100 is a Lightning connector. Compared to traditional gold-plated PIN pins, this embodiment uses less gold material, and the conductive contact 120 has better stability and oxidation resistance.

[0081] In one embodiment, the thickness of the phosphor copper layer 123 is approximately 30 microns, the thickness of the nickel tungsten layer 124 is approximately 50 microns, and the thickness of the first gold layer 125 is approximately 1 micron. For embodiments having a second gold layer 126, the thickness of the second gold layer 126 is illustratively approximately 1 micron. For embodiments having a palladium gold layer 127 and a platinum gold layer 128, the thickness of the palladium gold layer 127 is illustratively approximately 3 microns, and the thickness of the platinum gold layer 128 is approximately 20 microns. In one embodiment, the thickness of the phosphor copper layer 123 is 30 microns ± 3 microns, i.e., the thickness of the phosphor copper layer 123 is 27 to 33 microns. The same is true below and will not be repeated. The thickness of the nickel-tungsten layer 124 is 50 μm ± 5 μm, the thickness of the first gold layer 125 is 1 μm ± 0.1 μm, the thickness of the palladium-gold layer 127 is 3 μm ± 0.3 μm, the thickness of the second gold layer 126 is 1 μm ± 0.1 μm, and the thickness of the platinum-gold layer 128 is 20 μm ± 2 μm. Alternatively, in one embodiment, the thickness of the phosphorus-copper layer 123 is 30 μm ± 1.2 μm, the thickness of the nickel-tungsten layer 124 is 50 μm ± 2 μm, the thickness of the first gold layer 125 is 1 μm ± 0.04 μm, the thickness of the palladium-gold layer 127 is 3 μm ± 0.12 μm, the thickness of the second gold layer 126 is 1 μm ± 0.04 μm, and the thickness of the platinum-gold layer 128 is 20 μm ± 0.8 μm. In one embodiment, the thickness of the phosphor copper layer 123 is 30 microns, the thickness of the nickel tungsten layer 124 is 50 microns, the thickness of the first gold layer 125 is 1 micron, the thickness of the palladium gold layer 127 is 3 microns, the thickness of the second gold layer 126 is 1 micron, and the thickness of the platinum gold layer 128 is 20 microns. The same applies to the remaining embodiments and is not further described. In each embodiment, microns are units of length. Other preset units of length may be used instead of microns if necessary. For example, the thickness of the first gold layer 125 and the second gold layer 126 is 1 preset unit of length, the thickness of the phosphor copper layer 123 is 30 preset units of length, the thickness of the nickel tungsten layer 124 is 50 preset units of length, the thickness of the palladium gold layer 127 is 3 preset units of length, and the thickness of the platinum gold layer 128 is 20 preset units of length. As an example, the preset length unit is micrometer, that is, 1 preset length unit is 1 micrometer; in other embodiments, the preset length unit may be 2 micrometers, that is, 1 preset length unit is 2 micrometers; or the preset length unit may be 0.5 micrometer, correspondingly 1 preset length unit is 0.5 micrometer.

[0082] Exemplarily, in one embodiment, the upper surface of the base layer 121 is first dip-coated with a phosphor copper layer 123 having a thickness of 30 microns or greater than 30 microns; the upper surface of the phosphor copper layer 123 is dip-coated with a nickel tungsten layer 124 having a thickness of 50 microns or greater than 50 microns; the upper surface of the nickel tungsten layer 124 is dip-coated with a first gold layer 125 having a thickness of 1 micron or greater than 1 micron; the upper surface of the first gold layer 125 is brush-plated with a palladium gold layer 127 having a thickness of 3 microns or greater than 3 microns; the upper surface of the palladium gold layer 127 is dip-coated with a second gold layer 126 having a thickness of 1 micron or greater than 1 micron; the upper surface of the second gold layer 126 is brush-plated with a platinum layer 128 having a thickness of 20 microns or greater than 20 microns. Similarly, the lower surface of the base layer 121 is first dip-coated with a phosphor copper layer 123 having a thickness of 30 microns or greater than 30 microns; the lower surface of the phosphor copper layer 123 is dip-coated with a nickel tungsten layer 124 having a thickness of 50 microns or greater than 50 microns; the lower surface of the nickel tungsten layer 124 is dip-coated with a first gold layer 125 having a thickness of 1 micron or greater than 1 micron; the lower surface of the first gold layer 125 is dip-coated with a second gold layer 126 having a thickness of 1 micron or greater than 1 micron. In one embodiment, the base layer 121 is made of copper or a copper alloy. Exemplarily, the material of the base layer 121 is pure copper or C2680, and C2680 belongs to a copper alloy with three or more elements, containing approximately 65% to 68% copper and 30% to 33% zinc, and also containing a small amount of elements such as aluminum, manganese, and iron.

[0083] In one embodiment, as Figure 13 and Figure 14 shown, the base layer 121 is provided with an empty groove 135 at the second conductive connection surface 132, the conductive layer 122 provided on the second conductive connection surface 132 is a second conductive layer 134, and the second conductive layer 134 has an opening 136 corresponding to the empty groove 135. In combination with Figure 15 , the phosphor copper layer 123, the nickel tungsten layer 124, the first gold layer 125, and the second gold layer 126 on the second conductive layer 134 have openings 136 corresponding to the empty groove 135. Such a design is beneficial to appropriately save materials while ensuring the electrical contact effect, and is beneficial to reducing the weight of the connection terminal 100 and its conductive contact piece 120, especially suitable for connection terminals 100 with a relatively large number of conductive contact pieces 120.

[0084] In other embodiments, the charging device employs the connection terminal 100 of any one of the embodiments. In one embodiment, a charging device 400 includes a power supply end 200, a wire 300, and the connection terminal 100 of any one of the embodiments, and the power supply end 200 is sequentially connected to the conductive contact piece 120 of the connection terminal 100 through the wire 300 and the main body structure 110 of the connection terminal 100.

[0085] Exemplarily, in one of the embodiments, a charging device 400 includes a power supply terminal 200, a wire 300, and a connection terminal 100; the connection terminal 100 includes a main body structure 110 and a conductive contact 120; the conductive contact 120 includes a base layer 121, a conductive layer 122 and an anti-electrolysis layer 137 provided on the base layer 121, and the conductive layer 122 includes a phosphor bronze layer 123 and a first gold layer 125; wherein, the base layer 121 is provided on the main body structure 110, the phosphor bronze layer 123 is provided on the base layer 121, the first gold layer 125 is provided on the phosphor bronze layer 123, and at least one anti-electrolysis layer 137 is provided on the first gold layer 125; the wire 300 is connected to the main body structure 110, and the power supply terminal 200 is sequentially connected through the wire 300, the main body structure 110 and the conductive contact 120. Exemplarily, in this embodiment, the base layers 121 are arranged on the main body structure 110 in a regular pattern.

[0086] Exemplarily, in one of the embodiments, in the charging device 400, the phosphor bronze layer 123 is connected to the base layer 121 by immersion plating, the first gold layer 125 is connected to the phosphor bronze layer 123 by immersion plating, and the anti-electrolysis layer 137 is connected to the first gold layer 125 by brush plating.

[0087] Exemplarily, in one of the embodiments, in the charging device 400, at least one anti-electrolysis layer 137 is provided between the phosphor bronze layer 123 and the first gold layer 125.

[0088] Exemplarily, in one of the embodiments, in the charging device 400, the anti-electrolysis layer 137 includes a nickel-tungsten layer 124 and a platinum layer 128, the nickel-tungsten layer 124 is provided on the phosphor bronze layer 123, the first gold layer 125 is provided on the nickel-tungsten layer 124, and the platinum layer 128 is provided on the first gold layer 125.

[0089] Exemplarily, in one of the embodiments, in the charging device 400, the nickel-tungsten layer 124 is connected to the phosphor bronze layer 123 by immersion plating, the first gold layer 125 is connected to the nickel-tungsten layer 124 by immersion plating, and the platinum layer 128 is connected to the first gold layer 125 by brush plating.

[0090] Exemplarily, in one of the embodiments, in the charging device 400, the conductive contact piece 120 further includes a second gold layer 126, the second gold layer 126 is disposed on the first gold layer 125, at least one of the anti-electrolysis layers 137 is disposed between the first gold layer 125 and the second gold layer 126, and at least one of the anti-electrolysis layers 137 is disposed on the second gold layer 126.

[0091] Exemplarily, in one of the embodiments, in the charging device 400, the anti-electrolysis layer 137 includes a palladium-gold layer 127 and a platinum layer 128. Among them, the palladium-gold layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium-gold layer 127, and the platinum layer 128 is disposed on the second gold layer 126.

[0092] Exemplarily, in one of the embodiments, in the charging device 400, the palladium-gold layer 127 is connected to the first gold layer 125 by brush plating, the second gold layer 126 is connected to the palladium-gold layer 127 by immersion plating, and the platinum layer 128 is connected to the second gold layer 126 by brush plating.

[0093] Exemplarily, in one of the embodiments, in the charging device 400, the conductive layer 122 further includes a second gold layer 126, the second gold layer 126 is disposed on the first gold layer 125, at least one of the anti-electrolysis layers 137 is disposed between the phosphor-copper layer 123 and the first gold layer 125, at least one of the anti-electrolysis layers 137 is disposed between the first gold layer 125 and the second gold layer 126, and at least one of the anti-electrolysis layers 137 is disposed on the second gold layer 126.

[0094] Exemplarily, in one of the embodiments, in the charging device 400, the anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium-gold layer 127 and a platinum layer 128. Among them, the nickel-tungsten layer 124 is disposed on the phosphor-copper layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, the palladium-gold layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium-gold layer 127, and the platinum layer 128 is disposed on the second gold layer 126.

[0095] Exemplarily, in one of the embodiments, in the charging device 400, the nickel-tungsten layer 124 is connected to the phosphor-bronze layer 123 by immersion plating, the first gold layer 125 is connected to the nickel-tungsten layer 124 by immersion plating, the palladium-gold layer 127 is connected to the first gold layer 125 by brush plating, the second gold layer 126 is connected to the palladium-gold layer 127 by immersion plating, and the platinum layer 128 is connected to the second gold layer 126 by brush plating.

[0096] Exemplarily, in one of the embodiments, in the charging device 400, the outermost layer of the anti-electrolysis layer 137 protrudes from the main body structure 110.

[0097] Exemplarily, in one of the embodiments, in the charging device 400, the outer surface of the anti-electrolysis layer 137 is exposed to the external environment.

[0098] Exemplarily, in one of the embodiments, in the charging device 400, the main body structure 110 has two opposite contact surfaces 111, and the conductive contact pieces 120 are provided on each of the contact surfaces 111.

[0099] Exemplarily, in one of the embodiments, in the charging device 400, the main body structure 110 has two opposite contact surfaces 111, and the conductive contact pieces 120 are regularly arranged on each of the contact surfaces 111.

[0100] Exemplarily, in one of the embodiments, in the charging device 400, the main body structure 110 has two opposite contact surfaces 111, and the conductive contact pieces 120 are respectively provided on each of the contact surfaces 111; the base layer 121 has two opposite conductive connection surfaces 129, and the conductive contact pieces 120 are provided with a conductive layer 122 on each of the conductive connection surfaces 129. The first gold layer 125 of one of the conductive layers 122 is provided on the main body structure 110, and at least one anti-electrolysis layer 137 is provided on the first gold layer 125 of the other conductive layer 122.

[0101] Exemplarily, in one of the embodiments, in the charging device 400, the main body structure 110 has two opposite contact surfaces 111, and the conductive contact pieces 120 are respectively and regularly arranged on each of the contact surfaces 111; the base layer 121 has two opposite conductive connection surfaces 129, and the conductive contact pieces 120 are provided with a conductive layer 122 on each of the conductive connection surfaces 129. The first gold layer 125 of one of the conductive layers 122 is provided on the main body structure 110, and at least one anti-electrolysis layer 137 is provided on the first gold layer 125 of the other conductive layer 122.

[0102] Exemplarily, in one embodiment, in the charging device 400, any one of the conductive connection surfaces 129 is parallel to any one of the contact surfaces 111.

[0103] Exemplarily, in one embodiment, in the charging device 400, the two conductive connection surfaces 129 are respectively a first conductive connection surface 131 and a second conductive connection surface 132; the conductive layer 122 disposed on the first conductive connection surface 131 is a first conductive layer 133, and the first conductive layer 133 further includes a second gold layer 126. The anti-electrolysis layer 137 includes a nickel-tungsten layer 124, a palladium-gold layer 127, and a platinum layer 128. Among them, the nickel-tungsten layer 124 is disposed on the phosphor-copper layer 123, the first gold layer 125 is disposed on the nickel-tungsten layer 124, the palladium-gold layer 127 is disposed on the first gold layer 125, the second gold layer 126 is disposed on the palladium-gold layer 127, and the platinum layer 128 is disposed on the second gold layer 126; the conductive layer 122 disposed on the second conductive connection surface 132 is a second conductive layer 134, and the first gold layer 125 on the second conductive layer 134 is welded to the main body structure 110, or the second conductive layer 134 further includes a second gold layer 126 disposed on the first gold layer 125, and the second gold layer 126 is welded to the main body structure 110, or the anti-electrolysis layer 137 includes a nickel-tungsten layer 124 disposed between the phosphor-copper layer 123 and the first gold layer 125.

[0104] Exemplarily, in one embodiment, in the charging device 400, for the first conductive layer 133 and the anti-electrolysis layer 137 disposed on the first conductive connection surface 131, the phosphor-copper layer 123 is connected to the base layer 121 by immersion plating, the nickel-tungsten layer 124 is connected to the phosphor-copper layer 123 by immersion plating, the first gold layer 125 is connected to the nickel-tungsten layer 124 by immersion plating, the palladium-gold layer 127 is connected to the first gold layer 125 by brush plating, the second gold layer 126 is connected to the palladium-gold layer 127 by immersion plating, and the platinum layer 128 is connected to the second gold layer 126 by brush plating.

[0105] Exemplarily, in one embodiment, in the charging device 400, for the second conductive layer 134 and the anti-electrolysis layer 137 disposed on the second conductive connection surface 132, the phosphor-copper layer 123 is connected to the base layer 121 by immersion plating, the nickel-tungsten layer 124 is connected to the phosphor-copper layer 123 by immersion plating, the first gold layer 125 is connected to the nickel-tungsten layer 124 by immersion plating, and the second gold layer 126 is connected to the first gold layer 125 by immersion plating.

[0106] Exemplarily, in one embodiment, in the charging device 400, the thickness of the phosphor copper layer 123 is 30 microns ± 4.5 microns, the thickness of the nickel tungsten layer 124 is 50 microns ± 7.5 microns, the thickness of the first gold layer 125 is 1 micron ± 0.15 micron, the thickness of the palladium gold layer 127 is greater than or equal to 3 microns ± 0.45 micron, the thickness of the second gold layer 126 is 1 micron ± 0.15 micron, and the thickness of the platinum layer 128 is 20 microns ± 3 microns.

[0107] Exemplarily, in one embodiment, in the charging device 400, the thickness of the phosphor copper layer 123 is about 30 microns, the thickness of the nickel tungsten layer 124 is about 50 microns, the thickness of the first gold layer 125 is about 1 micron, the thickness of the palladium gold layer 127 is about 3 microns, the thickness of the second gold layer 126 is about 1 micron, and the thickness of the platinum layer 128 is about 20 microns; or, the connection terminal is a Lightning connector. Exemplarily, in one embodiment, in the charging device 400, the thickness of the phosphor copper layer 123 is 30 microns, the thickness of the nickel tungsten layer 124 is 50 microns, the thickness of the first gold layer 125 is 1 micron, the thickness of the palladium gold layer 127 is 3 microns, the thickness of the second gold layer 126 is 1 micron, the thickness of the platinum layer 128 is 20 microns, and the connection terminal 100 is a Lightning connector.

[0108] Exemplarily, in one embodiment, the base layer 121 is provided with an empty groove 135 at the second conductive connection surface 132, and the second conductive layer 134 has an opening 136 corresponding to the empty groove 135.

[0109] Exemplarily, in one embodiment, in the charging device 400, the connection terminal 100 is a Lightning connector.

[0110] Exemplarily, in one embodiment, in the charging device 400, the connection terminal 100 further includes a control board 140, and the control board 140 is connected to the conductive contact piece 120 through the main body structure 110.

[0111] It should be noted that other embodiments of the present application further include connection terminals and charging devices formed by combining the technical features in the above embodiments and capable of being implemented.

[0112] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as within the scope described in this specification.

[0113] The above-described embodiments only express several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application shall be subject to the appended claims.

Claims

1. A connection terminal (100), characterized in that, It includes a main body structure (110) and a conductive contact piece (120); The conductive contact piece (120) includes a base layer (121), a conductive layer (122) and an anti-electrolysis layer (137) provided on the base layer (121). The conductive layer (122) includes a phosphor bronze layer (123) and a first gold layer (125); Wherein, the base layer (121) is provided on the main body structure (110), the phosphor bronze layer (123) is provided on the base layer (121), the first gold layer (125) is provided on the phosphor bronze layer (123), and at least one anti-electrolysis layer (137) is provided on the first gold layer (125).

2. The connection terminal (100) according to claim 1, characterized in that, At least one anti-electrolysis layer (137) is provided between the phosphor bronze layer (123) and the first gold layer (125); or, The conductive layer (122) further includes a second gold layer (126). The second gold layer (126) is provided on the first gold layer (125). At least one anti-electrolysis layer (137) is provided between the first gold layer (125) and the second gold layer (126), and at least one anti-electrolysis layer (137) is provided on the second gold layer (126); or, The outermost layer of the anti-electrolysis layer (137) protrudes from the main body structure (110); or, The outer surface of the anti-electrolysis layer (137) is exposed to the external environment; or, The main body structure (110) has two opposite contact surfaces (111), and each contact surface (111) is provided with the conductive contact piece (120); or, The connection terminal (100) further includes a control board (140), and the control board (140) is connected to the conductive contact piece (120) through the main body structure (110); or, The connection terminal (100) is a Lightning connector.

3. The connecting terminal (100) according to claim 1, characterized in that, The anti-electrolysis layer (137) includes a nickel-tungsten layer (124) and a platinum layer (128). The nickel-tungsten layer (124) is provided on the phosphor bronze layer (123), the first gold layer (125) is provided on the nickel-tungsten layer (124), and the platinum layer (128) is provided on the first gold layer (125); or, The conductive layer (122) further includes a second gold layer (126), and the anti-electrolysis layer (137) includes a palladium-gold layer (127) and a platinum layer (128). Wherein, the palladium-gold layer (127) is provided on the first gold layer (125), the second gold layer (126) is provided on the palladium-gold layer (127), and the platinum layer (128) is provided on the second gold layer (126); or, The conductive layer (122) further includes a second gold layer (126), and the anti-electrolysis layer (137) includes a nickel-tungsten layer (124), a palladium-gold layer (127), and a platinum layer (128). Among them, the nickel-tungsten layer (124) is disposed on the phosphor-copper layer (123), the first gold layer (125) is disposed on the nickel-tungsten layer (124), the palladium-gold layer (127) is disposed on the first gold layer (125), the second gold layer (126) is disposed on the palladium-gold layer (127), and the platinum layer (128) is disposed on the second gold layer (126).

4. The connection terminal (100) according to claim 1, characterized in that, The main body structure (110) has two opposite contact surfaces (111), and the conductive contacts (120) are respectively disposed on each of the contact surfaces (111); The base layer (121) has two opposite conductive connection surfaces (129), and the conductive contacts (120) are provided with a conductive layer (122) on each of the conductive connection surfaces (for each of the conductive connection surfaces (129), a conductive layer (122) is provided by the conductive contact (120)). The first gold layer (125) of one of the conductive layers (122) is disposed on the main body structure (110), and at least one anti-electrolysis layer (137) is provided on the first gold layer (125) of the other conductive layer (122).

5. The connection terminal (100) according to claim 4, characterized in that, Any one of the conductive connection surfaces (129) is parallel to any one of the contact surfaces (111).

6. The connection terminal (100) according to claim 5, characterized in that, The two conductive connection surfaces (129) are respectively a first conductive connection surface (131) and a second conductive connection surface (132); The conductive layer (122) disposed on the first conductive connection surface (131) is a first conductive layer (133). The first conductive layer (133) further includes a second gold layer (126), and the anti-electrolysis layer (137) includes a nickel-tungsten layer (124), a palladium-gold layer (127), and a platinum layer (128); Among them, the nickel-tungsten layer (124) is disposed on the phosphor-copper layer (123), the first gold layer (125) is disposed on the nickel-tungsten layer (124), the palladium-gold layer (127) is disposed on the first gold layer (125), the second gold layer (126) is disposed on the palladium-gold layer (127), and the platinum layer (128) is disposed on the second gold layer (126); The conductive layer (122) disposed on the second conductive connection surface (132) is a second conductive layer (134). The first gold layer (125) on the second conductive layer (134) is welded to the main body structure (110), or the second conductive layer (134) further includes a second gold layer (126) disposed on the first gold layer (125), and the second gold layer (126) is welded to the main body structure (110), or the anti-electrolysis layer (137) includes a nickel-tungsten layer (124) disposed between the phosphor-copper layer (123) and the first gold layer (125).

7. The connection terminal (100) according to claim 6, characterized in that, The base layer (121) is provided with an empty groove (135) at the second conductive connection surface (132), and the second conductive layer (134) has an opening (136) corresponding to the empty groove (135).

8. The connection terminal (100) according to claim 6, characterized in that, The thickness of the phosphor bronze layer (123) is 30 microns ± 4.5 microns, the thickness of the nickel tungsten layer (124) is 50 microns ± 7.5 microns, the thickness of the first gold layer (125) is 1 micron ± 0.15 microns, the thickness of the palladium gold layer (127) is greater than or equal to 3 microns ± 0.45 microns, the thickness of the second gold layer (126) is 1 micron ± 0.15 microns, and the thickness of the platinum layer (128) is 20 microns ± 3 microns.

9. The connection terminal (100) according to claim 8, characterized in that, The thickness of the phosphor bronze layer (123) is 30 microns, the thickness of the nickel tungsten layer (124) is 50 microns, the thickness of the first gold layer (125) is 1 micron, the thickness of the palladium gold layer (127) is 3 microns, the thickness of the second gold layer (126) is 1 micron, and the thickness of the platinum layer (128) is 20 microns.

10. A charging device (400), characterized in that, It includes a power supply end (200), a wire (300), and the connection terminal (100) as described in any one of claims 1 to 9. The power supply end (200) is sequentially connected to the conductive contact piece (120) of the connection terminal (100) through the wire (300) and the main structure (110) of the connection terminal (100).

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