Circuit board, circuit board assembly and electrical equipment
By embedding flow channels and setting interface components in the circuit board substrate, a heat dissipation cycle is formed, which solves the problem of insufficient heat dissipation for high-power circuit boards and achieves efficient heat dissipation and product miniaturization.
Patent Information
- Application Number
- CN202421631166.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-10
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-07-10
AI Technical Summary
Existing circuit board technology lacks sufficient heat dissipation capacity under high power requirements, failing to meet the demands for miniaturization and efficient heat dissipation.
A flow channel is embedded in the substrate of the circuit board. An interface component is set on the flow channel to connect to an external heat dissipation pipe to form a heat dissipation cycle. The heat of the power device is carried away by the working fluid in the flow channel, and the heat transfer path is optimized by thermally conductive insulating material.
It achieves efficient heat dissipation, meets the heat dissipation requirements of different application scenarios, and also features a miniaturized product design.
Smart Images
Figure CN223182380U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of on-vehicle components and heat dissipation of circuit boards related to power, and particularly relates to a circuit board, a circuit board assembly and an electrical device. Background Art
[0002] With the increasing power demand of power electronics technology, it is necessary to provide good heat dissipation for power devices surface-mounted on a circuit board. At the same time, due to the corresponding requirements for miniaturization of on-vehicle components and power-related products, there are development bottlenecks in the evolution of heat dissipation capabilities based on traditional circuit board technology.
[0003] In view of this, it is urgent to provide a heat dissipation solution for circuit board technology to meet the usage needs of high-power electrical products. Summary of the Utility Model
[0004] The purpose of this application is to provide a circuit board, a circuit board assembly and an electrical device, which can meet the trend design requirements of product miniaturization while effectively improving the heat dissipation capacity through structural optimization.
[0005] The circuit board provided by the embodiment of this application includes a substrate and a wiring layer stacked and arranged, and the wiring layer is used for electrically connecting with a power device; the circuit board further includes a runner body, the runner body is embedded in the substrate, the runner body has an internal cavity, and an interface component is arranged on the runner body, and the interface of the interface component is exposed outside the circuit board for connecting with an external heat dissipation pipeline.
[0006] Optionally, an installation groove is formed on the substrate, and the runner body is placed inside the installation groove.
[0007] Optionally, the shape and size of the installation groove are the same as those of the outer contour of the runner body.
[0008] Optionally, a thermally conductive insulating material is filled between the installation groove and the runner body.
[0009] Optionally, the installation groove includes a U shape, an S shape or a long strip shape.
[0010] Optionally, in the board thickness direction, the installation groove is a through groove penetrating the substrate or a blind groove not penetrating the substrate.
[0011] Optionally, at least two interface components are provided, at least one of the interface components is a liquid inlet interface, and at least one of the interface components is a liquid outlet interface.
[0012] Optionally, an outer substrate is arranged between the wiring layer and the substrate.
[0013] Optionally, the wiring layer and the outer substrate are respectively located on two sides of the substrate.
[0014] The embodiment of the present application further provides a circuit board assembly, including a circuit board and a power device arranged on the circuit board. The power device is electrically connected to the wiring layer. The circuit board adopts the circuit board as described above. In the direction perpendicular to the board surface, at least part of the power device overlaps with the flow channel body.
[0015] Compared with the prior art, this solution takes a new approach to propose an optimized heat dissipation structure for the circuit board. Specifically, a flow channel body is embedded in the substrate of the circuit board. The flow channel body has an internal cavity, and an interface component is arranged on the flow channel body. The interface of the interface component is exposed outside the circuit board and is used to connect with an external heat dissipation pipeline. With such a setting, a heat dissipation cycle can be established based on the flow channel body inside the board. The heat generated by the power device surface-mounted on the circuit board can be exchanged to the working medium in the internal cavity through the flow channel body on its opposite side, thereby quickly taking away the heat generated by the device operation.
[0016] Furthermore, based on the configuration of the flow channel body inside the board, the working temperature of the power device to be cooled can also be precisely controlled by controlling the temperature of the working medium, which can meet the heat dissipation requirements of different application scenarios.
[0017] In an alternative solution of the present utility model, a thermally conductive insulating material is filled between the mounting groove of the substrate and the flow channel body, which can ensure a good low thermal resistance adaptation relationship between the flow channel body and the groove wall of the mounting groove. In this way, the heat on the substrate side can be laterally transferred to the flow channel body side, that is, the heat of the adjacent substrate can be taken away by the working medium in the flow channel body. In addition, based on this thermally conductive insulating material, it also plays the role of insulation and stress buffering at the same time.
[0018] In another preferred solution of the present utility model, in the direction perpendicular to the board surface, at least part of the power device overlaps with the flow channel body. In this way, for each power device, the length of the heat transfer path to the flow channel body can be controlled, the path thermal resistance can be reduced, and the overall heat exchange efficiency can be effectively improved.
[0019] The embodiment of the present application further provides an electrical device, which includes the circuit board as described above, or includes the circuit board assembly as described above. Based on the description of the specific structure and corresponding technical effects of the foregoing circuit board, this electrical device also has the above technical effects. Description of the Drawings
[0020] Figure 1 It is a schematic diagram of a typical circuit board heat dissipation architecture;
[0021] Figure 2 It is a schematic diagram of another typical circuit board heat dissipation architecture;
[0022] Figure 3 An exploded view of the assembly of a circuit board provided by an embodiment of the present application;
[0023] Figure 4 is Figure 3 a sectional view of the assembly relationship formed at the A-A cutting position in
[0024] Figure 5 is Figure 3 a schematic diagram of the assembly relationship formed in the B direction in
[0025] Figure 6 is Figure 4 the C-C sectional view in
[0026] Figure 1 - Figure 2 In
[0027] circuit board 10, power device 20, heat sink 30, thermal conductive adhesive 40, thermal conductive block 50;
[0028] Figure 3 - Figure 6 In
[0029] circuit board 1, wiring layer 11, substrate 12, mounting groove 121, outer substrate 13, power device 2, flow channel body 3, internal cavity 31, interface component 4, thermally conductive insulating material 5. Detailed implementation manners
[0030] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0031] Generally, the power devices of electrical equipment are surface-mounted on a circuit board to achieve corresponding functions. With the development of electrical technology, high-power devices generate relatively high heat, and it is necessary to provide good heat dissipation for the power devices. For example, but not limited to, heat-generating devices such as MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), and diodes, to ensure the working reliability and service life of the power devices.
[0032] A typical circuit board heat dissipation solution is as Figure 1 shown. The power device 20 is surface-mounted on the surface of the circuit board 10, and a heat sink 30 is provided on the circuit board 10 on the side opposite to the power device 20. The vias of the circuit board 10 are filled with a thermal conductive adhesive 40, and the heat generated by the power device 20 can be transferred to the heat sink 30 side through the thermal conductive adhesive 40 filled in each via. Another typical circuit board heat dissipation solution is as Figure 2As shown, the circuit board 10 is internally embedded with a heat conduction block 50, and the heat generated by the power device 20 can be transferred to the radiator 30 side through the heat conduction block 50 made of ceramic or copper.
[0033] In the above related technology, the heat is transferred to the radiator 30 based on the heat dissipation path inside the board, and the heat is taken away by the radiator 30. The thermal resistance of the heat dissipation path is relatively high. Limited by the actual heat conduction amount of the heat dissipation path, it cannot meet the heat dissipation requirements of high-power devices. In addition, in order to achieve the heat dissipation effect, the radiator usually occupies a certain size space, and it cannot meet the trend requirements of high-power heat dissipation and product miniaturization.
[0034] Based on this, the embodiment of the present application provides a circuit board with an optimized structure. Without loss of generality, the following will take the circuit board shown in the figure as the description main body in combination with the drawings, and elaborate on its heat dissipation structure layout scheme. Please refer to Figure 3 , which is an exploded assembly diagram of a circuit board provided by an embodiment of the present application.
[0035] A power device 2 is provided on the circuit board 1, and each power device 2 is electrically connected to the wiring layer 11 on the surface layer of the circuit board 1. For example, but not limited to, the wiring layer 11 can be a copper foil layer or other metal layers. The power device 2 and the wiring layer 11 can be welded and bonded through a welding agent, and corresponding electrical connections can be established through the wiring layer (not shown in the figure) arranged in the substrate 12 of the circuit board 1 to form a circuit board assembly. In a specific implementation, the power device 2 can be of different device types and is determined according to the overall design requirements of the product. The embodiment of the present application does not make any limitations.
[0036] For the circuit board 1 provided by the embodiment of the present application, a flow channel body 3 is embedded in its substrate 12. Please refer to Figure 4 and Figure 5 , where Figure 4 is Figure 3 the sectional view of the assembly relationship formed at the A-A cutting position in Figure 5 is Figure 3 the schematic diagram of the assembly relationship formed in the B direction in
[0037] Combined with Figure 3 and Figure 4 shown, the flow channel body 3 has an internal cavity 31, and an interface component 4 is provided on the flow channel body 3. The interface of the interface component 4 is exposed outside the circuit board 1 and is used to connect to an external heat dissipation pipeline (not shown in the figure). In this way, the heat generated by the operation of the power device 2 can be exchanged to the working medium in the internal cavity 31 through the body of the flow channel body 3 on its opposite side.
[0038] Combined with Figure 3 and Figure 5As shown, in this embodiment, two interface components 4 are provided on the interface component 4, one serving as a liquid inlet interface and the other as a liquid outlet interface. This allows a heat dissipation cycle to be established based on the intra-board flow channel 3, rapidly removing heat generated by the device during operation. Based on the configuration of the intra-board flow channel, the operating temperature of the power device 2 to be dissipated can also be precisely controlled by controlling the temperature of the working fluid, meeting the heat dissipation requirements of various application scenarios.
[0039] Among them, the interface component 4 can adopt sealing forms such as end face sealing or radial sealing, which can be achieved by those skilled in the art using existing technologies, so it will not be described in detail herein.
[0040] In a specific implementation, the substrate 12 may define mounting slots 121, into which the flow channel body 3 is positioned, thereby determining the layout of the flow channel body 3 within the board surface. The flow channel body 3 is arranged on the circuit board 1 to maximize overlap with the power devices 20 to be dissipated heat, perpendicular to the board surface. This allows for a controlled heat transfer path length from each power device 20 to the flow channel body 3, reducing path thermal resistance and effectively improving overall heat exchange efficiency.
[0041] For example, the U-shaped flow channel body 3 is shown in the figure to illustrate the assembly relationship between the flow channel body 3 and the mounting groove 121 on the base plate 12. Of course, in other specific implementations, the flow channel body 3 can be of other structural forms.
[0042] For example, the flow channel body can be a continuously extended flow channel body (not shown in the figure) in a strip or S-shaped shape. Here, for a continuously extended flow channel body, only one interface component 4 is required at each end of the flow channel body to form a flow path within the entire internal cavity 31 of the flow channel body. This simple structure facilitates implementation.
[0043] In addition, for the flow channel body formed by continuous extension, an interface component 4 (not shown in the figure) can also be added at the middle position of the flow channel body to improve the heat exchange efficiency by shortening the flow path, effectively avoiding the temperature increase of the working fluid when it flows to the end of the path, which affects the heat dissipation effect of the power device at the corresponding position.
[0044] In other possible implementations, the flow channel body can also be a discontinuously extended flow channel body such as an E-shaped or F-shaped flow channel body (not shown in the figure), which can be determined according to the layout of the surface-mounted power device 2, as long as effective heat exchange can be achieved. This embodiment of the present application is not limited.
[0045] In addition, for the flow channel body formed by non-connected extension, only two interface components can be configured, one as the liquid inlet interface and the other as the liquid outlet interface; multiple interface components can also be configured to improve the fluidity of the working medium in the cavity of the non-connected extension flow channel body and reasonably control the flow path. Specifically, it can be determined according to the overall design requirements of the product, and the embodiments of the present application do not make limitations.
[0046] As shown in Figure 3 , the shape and size of the installation groove 121 are consistent with the outer contour of the flow channel body 3. Here, "consistent" means that the shape and size are consistent within the tolerance range, realizing the small-gap assembly of the two, and at the same time reasonably controlling the manufacturing cost.
[0047] Furthermore, please refer to Figure 4 and Figure 6 together, wherein Figure 6 is Figure 4 the C-C cross-sectional view in
[0048] As shown in the figure, a thermally conductive insulating material 5 can be filled between the installation groove 121 and the flow channel body 3, which can ensure a good low thermal resistance adaptation relationship between the flow channel body 3 and the groove wall of the installation groove 121. In this way, the heat on the substrate 12 side can be transferred horizontally to the flow channel body 3 side, that is, the heat of the adjacent substrate is taken away by the working medium in the flow channel body 3. In addition, based on this thermally conductive insulating material, it also plays the role of insulation and stress buffering at the same time.
[0049] For the circuit board 1 provided by the embodiments of the present application, during processing, the structures of each layer of the circuit board can be press-molded with the flow channel body. It can be understood that the corresponding press-fitting process can be realized by using the existing technology, and will not be elaborated here.
[0050] To improve the product integration, in specific implementation, devices can be surface-mounted on both side surfaces of the circuit board 1 and are electrically connected to the surface wiring layers 11 on the corresponding sides respectively. At the same time, power devices 2 to be dissipated can be arranged on both side surfaces of the circuit board 1, and as shown in Figure 4 , heat dissipation is respectively realized through the flow channel bodies 3 embedded in the substrate 12. Compared with the structure form of using a radiator for heat dissipation, within the same board surface size, this solution can realize double-sided device packaging, combining the miniaturization of the product and the evolution and improvement of functions.
[0051] Another example is Figure 6 as shown in the figure, in the board thickness direction, the installation groove 121 is a through groove penetrating the substrate 12, the thickness dimension of the flow channel body 3 is smaller than the thickness dimension of the substrate 12, and a thermally conductive insulating material is also filled on the opposite side of the flow channel body 3 and the power device 20. In other possible implementation manners, the installation groove 121 can also be a blind groove that does not penetrate the substrate 12, and the embedding of the flow channel body 3 can also be reliably realized.
[0052] Further, for another example Figure 3 and Figure 6 As shown, an outer substrate 13 is further provided between the substrate 12 and the wiring layer 11 to improve the insulation effect therebetween.
[0053] In addition to the foregoing circuit board, the embodiment of the present application further provides an electrical device, which includes a circuit board, and the circuit board may be the foregoing Figure 3 to Figure 6 shown circuit board. In a specific implementation, the electrical device may be an in-vehicle power supply or a high-power switching power supply, etc. The embodiment of the present application does not make a limitation.
[0054] It should be understood that the other functional components of the electrical device are not the core inventive points of the present application, and those skilled in the art can implement them based on the prior art, so they will not be elaborated herein.
[0055] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A circuit board includes a substrate and a wiring layer stacked thereon, and the wiring layer is used for electrically connecting to a power device; characterized in that, The circuit board further includes a runner body, which is embedded in the substrate. The runner body has an internal cavity, and an interface component is provided on the runner body. The interface of the interface component is exposed outside the circuit board for connection with an external heat dissipation pipeline.
2. The circuit board according to claim 1, wherein, An installation groove is formed in the substrate, and the runner body is disposed inside the installation groove.
3. The circuit board according to claim 2, wherein The shape and size of the installation groove are the same as those of the outer contour of the runner body.
4. The circuit board according to claim 3, wherein A thermally conductive insulating material is filled between the installation groove and the runner body.
5. The circuit board according to any one of claims 2 to 4, characterized in that, The installation groove includes a U shape, an S shape or a long strip shape.
6. The circuit board according to any one of claims 2 to 4, characterized in that, In the board thickness direction, the installation groove is a through groove penetrating the substrate or a blind groove not penetrating the substrate.
7. The circuit board according to any one of claims 1 to 4, characterized in that, The interface component is provided with at least two. At least one of the interface components is a heat dissipation fluid inlet interface, and at least one of the interface components is a heat dissipation fluid outlet interface.
8. The circuit board according to any one of claims 1 to 4, characterized in that, An outer substrate is provided between the wiring layer and the substrate.
9. The circuit board according to claim 8, wherein, The wiring layer and the outer substrate are respectively located on both sides of the substrate.
10. A circuit board assembly includes a circuit board and a power device disposed on the circuit board. The power device is electrically connected to the trace layer, and is characterized in that, The circuit board adopts the circuit board according to any one of claims 1 to 9. In the direction perpendicular to the board surface, at least part of the power devices overlap with the runner body.
11. An electrical device, characterized in that, The electrical device includes the circuit board according to any one of claims 1 to 9, or includes the circuit board assembly according to claim 10.