Electrical device

Abstract

The utility model discloses an electric appliance device, which comprises a shell and a power board, the shell is provided with a plurality of enclosing parts, the enclosing parts are not communicated with one another, and each enclosing part is provided with an accommodating cavity for accommodating heat-conducting glue; the power board is provided with a plurality of device groups, and the device groups are installed in the accommodation cavity. Before the power board is installed on the shell, a proper amount of heat-conducting glue is poured into the containing cavity of each enclosing part of the shell in advance. Before the heat-conducting glue is solidified, the power board is installed on the shell, the heat-conducting glue can wrap the power devices of the device group, the use amount of the heat-conducting glue can be effectively controlled while the requirement for heat dissipation of the high-loss power devices is met, the material cost is saved, the weight of the whole machine is reduced, and the logistics cost is reduced. Meanwhile, the glue filling amount of the heat-conducting glue is reduced, so that the assembly time of production can be saved, and the assembly cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical equipment, in particular to an electrical device. Background Art

[0002] Related electrical products, such as micro-inverter products and micro-storage products, need to meet the protection level of IP65 or above. At the same time, since high-power devices are configured in the electrical products, the electrical products generate a large amount of heat during operation. It is necessary to solve the problem of temperature rise of the internal devices of the electrical products to avoid the abnormal operation of the electrical products or the equipment using the electrical products due to too high temperature.

[0003] Currently, the related electrical products on the market all adopt the scheme of filling with thermal conductive glue, that is, filling the inner cavity of the shell of the electrical product with thermal conductive glue. With this scheme of filling with thermal conductive glue, a large amount of thermal conductive glue is required, increasing the manufacturing cost. At the same time, a large amount of thermal conductive glue is also likely to increase the weight of the whole machine, thereby increasing the logistics cost. At the same time, in the production process, due to the large amount of glue filling, more glue filling time is required, resulting in a higher manufacturing cost of the overall electrical product. Summary of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide an electrical device.

[0005] The technical solution adopted by the utility model to solve its technical problem is: constructing an electrical device, including a shell and a power board. The shell is provided with a plurality of enclosing parts that are not connected to each other, and each enclosing part is provided with a receiving cavity for receiving thermal conductive glue;

[0006] A plurality of device groups are arranged on the power board, and the device groups are installed in the receiving cavity.

[0007] In some embodiments, the shell includes a top plate, the top plate has a first surface and a second surface opposite to each other, a first limiting plate is provided on the first surface of the top plate, the first limiting plate is annular, and the first limiting plate and the top plate jointly define at least one of the enclosing parts.

[0008] In some embodiments, the shell further includes a side plate connected to the top plate, and the side plate extends towards the side of the first surface;

[0009] A second limiting plate is further provided on the first surface of the top plate, the second limiting plate is connected to the side plate, and the top plate, the side plate and the second limiting plate jointly define at least one of the enclosing parts.

[0010] In some embodiments, a boss is further provided on the first surface of the top plate, at least part of the boss is provided with a concave structure, and the concave structure forms at least one of the enclosing parts.

[0011] In some embodiments, a third limiting plate is further provided on the first surface of the top plate. The third limiting plate is connected to the outer side surface of the boss and the side plate, and the top plate, the side plate, the third limiting plate and the outer side surface of the boss jointly define at least one of the enclosing parts.

[0012] In some embodiments, a fourth limiting plate is further provided on the first surface of the top plate. The fourth limiting plate is connected to the outer side surface of the boss, and the top plate, the fourth limiting plate and the outer side surface of the boss jointly define at least one of the enclosing parts.

[0013] In some embodiments, a plurality of heat sinks are further provided on the outer side surface of the housing.

[0014] In some embodiments, the structure of the enclosing part is similar to the arrangement structure of the device groups.

[0015] In some embodiments, each of the device groups includes a plurality of power devices.

[0016] In some embodiments, the power devices include capacitors, inductors, resistors, and transformers.

[0017] Implementing the present utility model has the following beneficial effects: The electrical device includes a housing and a power board. The housing is provided with a plurality of enclosing parts that are not connected to each other, and each enclosing part is provided with an accommodation cavity for accommodating thermal conductive glue; a plurality of device groups are provided on the power board, and the device groups are installed in the accommodation cavities. Among them, before the power board is installed on the housing, an appropriate amount of thermal conductive glue is pre-poured into the accommodation cavities of the respective enclosing parts of the housing. Before the thermal conductive glue solidifies, the power board is installed on the housing, and the thermal conductive glue will wrap the power devices of the device groups. While meeting the heat dissipation of high-loss power devices, the usage amount of the thermal conductive glue can be effectively controlled, saving material costs, reducing the weight of the whole machine, and reducing logistics costs. At the same time, the reduction of the glue filling amount of the thermal conductive glue can save the assembly time of production and reduce the assembly cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the present utility model, the present utility model will be further described below in conjunction with the drawings and embodiments. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts. In the drawings:

[0019] Figure 1 is a schematic structural diagram of the electrical device in some embodiments of the present utility model;

[0020] Figure 2It is an exploded view of an electrical device in some embodiments of the present utility model;

[0021] Figure 3 It is a schematic structural view of a housing in some embodiments of the present utility model;

[0022] Figure 4 It is a schematic structural view of a power board in some embodiments of the present utility model.

[0023] The reference numerals are: 10 - housing, 11 - top plate, 12 - side plate, 121 - first side plate, 122 - second side plate, 123 - third side plate, 124 - fourth side plate, 13 - first limiting plate, 14 - boss, 141 - concave structure, 142 - first side, 143 - second side, 15 - third limiting plate, 16 - heat sink, 20 - power board, 21 - device group, 211 - first device group, 212 - second device group, 213 - third device group, 214 - fourth device group. Detailed implementation manners

[0024] In order to have a clearer understanding of the technical features, objectives and effects of the present utility model, the specific implementation manners of the present utility model will now be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the orientation or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are based on the orientation or positional relationships shown in the accompanying drawings and are constructed and operated in a specific orientation, and are only for the convenience of describing the technical solution, rather than indicating that the device or element referred to must have a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0025] It should also be noted that unless otherwise clearly specified and defined, terms such as "installation", "connection", "connection", "fixation", "setting" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located above the other element, or there may also be one or more intermediate elements. Terms such as "first", "second", "third", etc. are only for the convenience of describing the technical solution and cannot be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0026] In the following description, specific details such as specific system architectures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present utility model. However, those skilled in the art should clearly understand that the present utility model can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details from interfering with the description of the present utility model.

[0027] Please refer to Figures 1 to 2 , the present utility model shows an electrical device, which may include but is not limited to micro-inverter products and micro-energy storage products. Among them, a micro-inverter, that is, a micro inverter, is a device that converts direct current into alternating current in a solar photovoltaic system and can be directly connected to a single solar cell module, enabling each module to operate at the maximum power point. A micro-energy storage device, that is, a micro energy storage device, can store electrical energy and provide backup power for loads when needed. Micro-inverter products and micro-energy storage products can be applied to fields such as smart home devices, micro-electromechanical systems, micro-robots, implantable medical devices, radio frequency identification tags, remote environmental sensors, wearable electronic products, electric vehicles, etc.

[0028] Combined with Figures 1 to 4 , in some embodiments, the electrical device may include a housing 10 and a power board 20. The housing 10 is provided with a plurality of enclosing parts 30, and the plurality of enclosing parts 30 are not connected to each other. Each enclosing part 30 is provided with a receiving cavity for accommodating thermal conductive glue, and the receiving cavities between the enclosing parts 30 are all independently arranged and not connected to each other. Here, the case where the plurality of enclosing parts 30 includes one enclosing part 30, in this embodiment, the number of the enclosing parts 30 can be multiple, such as two, three, four, or any other number. Preferably, the enclosing part 30 may include but is not limited to a first enclosing part 31, a second enclosing part 32, a third enclosing part 33, and a fourth enclosing part 34. In other embodiments, the enclosing part 30 can also be defined as a "fence structure".

[0029] A number of device groups 21 are provided on the power board 20. The device groups 21 are installed in the accommodation cavity and are wrapped by the thermal conductive adhesive in the accommodation cavity. Here, the case where there is one device group 21 is included. In this embodiment, the number of the device groups 21 can be multiple, such as two, three, four or any other number. Preferably, the device group 21 may include, but is not limited to, a first device group 211, a second device group 212, a third device group 213, and a fourth device group 214. Further, each device group 21 includes a number of power devices. Here, the case where there is one power device among the number of power devices means that one device group 21 can include one, two, three or any other number of power devices. The power device can be a high-loss device with a large amount of heat generation. Among them, the power device includes, but is not limited to, a capacitor, an inductor, a resistor, and a transformer.

[0030] In this embodiment, by providing a single or multiple enclosing parts 30, the high-power devices with a large amount of heat generation can be enclosed by the electrical device. The enclosing parts 30 can be individually filled with thermal conductive adhesive and the respective enclosing parts 30 are not connected to each other. While ensuring the heat dissipation of the high-power devices, the usage amount of the thermal conductive adhesive can be effectively controlled, the material cost can be reduced, the weight of the whole machine can be reduced, and the logistics cost can be reduced. At the same time, in the production process, the potting time can be reduced and the assembly cost can be saved.

[0031] In some embodiments, the structure of the enclosing part 30 is similar to the arrangement structure of the device group 21, so that when the device group 21 is installed in the receiving cavity of the corresponding enclosing part 30, the amount of the thermal conductive adhesive can be reduced, the overall weight of the electrical device can be effectively reduced, and the production and manufacturing cost can also be reduced.

[0032] In some embodiments, the housing 10 can be made of a metal material, and the metal material can include, but is not limited to, aluminum, aluminum alloy or stainless steel, and no specific limitation is made here.

[0033] Combined with Figure 3 and Figure 4 , in some embodiments, the housing 10 can be a flat plate structure or a cylindrical structure. The housing 10 can include a top plate 11. The top plate 11 has a first surface and a second surface facing away from each other. A first limiting plate 13 is provided on the first surface of the top plate 11. The first limiting plate 13 is annular. The first limiting plate 13 and the top plate 11 jointly define at least one of the enclosing parts 30. The enclosing part 30 can be, for example, Figure 3 the first enclosing part 31 shown. The first enclosing part 31 can be used to accommodate the first device group 211 (as Figure 4 shown). The power devices of the first device group 211 can be inductors, transformers, switching tubes, etc.

[0034] In some embodiments, the housing further includes a side plate 12 connected to the top plate 11. The side plate 12 extends toward the first surface side. A second limiting plate (not shown) is further provided on the first surface of the top plate 11. The second limiting plate is connected to the side plate 12. The top plate 11, the side plate 12, and the second limiting plate jointly define at least one enclosing portion 30. Adopting this structural manner can reduce the amount of the third limiting plate provided and can appropriately reduce the manufacturing cost.

[0035] Combined with Figure 3 and Figure 4 , in some embodiments, a boss 14 is further provided on the first surface of the top plate 11. At least part of the boss 14 is provided with a concave structure 141. The concave structure 141 forms at least one enclosing portion 30. The enclosing portion 30 can be the second enclosing portion 32 as shown in FIG. 3. The second enclosing portion 32 can be used to accommodate the second device group 212 (as shown in Figure 4 ). The power device of the second device group 212 can be a capacitor.

[0036] Combined with Figure 3 and Figure 4 , in some embodiments, a third limiting plate 15 is further provided on the first surface of the top plate 11. The third limiting plate is connected to the outer side surface of the boss and the side plate 12. Here, the outer side surface of the boss 14 is the side surface of the boss facing the side plate 12. The top plate 11, the side plate 12, the third limiting plate, and the outer side surface of the boss jointly define at least one such enclosing portion 30.

[0037] The enclosing portion 30 can be the third enclosing portion 33 or the fourth enclosing portion 34 as shown in Figure 3 . The structure of the third enclosing portion 33 is generally a rectangular columnar structure, and the structure of the fourth enclosing portion 34 is generally an L-shaped columnar structure. Among them, the third enclosing portion 33 can accommodate the third device group 213 (as shown in Figure 4 ), and the fourth enclosing portion 34 can accommodate the fourth device group 214 (as shown in Figure 4 ).

[0038] Specifically, the side plate 12 can include a first side plate 121, a second side plate 122, a third side plate 123, and a fourth side plate 124 that are sequentially connected end to end. The overall structure of the boss 14 can be generally cubic. One side of the boss 14 can be connected to the second side plate 122. The boss 14 can include a first side surface 142 and a second side surface 143 that face away from each other. The first side surface 142 is disposed opposite to the first side plate 121, and the second side surface 143 is disposed opposite to the third side plate 123.

[0039] Among them, a third limiting plate 15 connects the first side plate 121 and the first side surface 142. The third limiting plate 15 is in the shape of a straight plate. The third limiting plate 15, the top plate 11, the first side plate 121, the second side plate 122, and the first side surface 142 together define the third enclosed portion 33. The structure of the third enclosed portion 33 is generally a rectangular columnar structure, which can accommodate the third device group 213. The power devices of the third device group 213 can include, but are not limited to, safety capacitors, common mode inductors, varistors, etc.

[0040] Among them, another third limiting plate 15 connects the third side plate 123 and the second side surface 143. The third limiting plate 15 is in the shape of a Z-shaped plate. The third limiting plate 15, the top plate 11, the second side plate 122, the third side plate 123, and the second side surface 143 together define the fourth enclosed portion 34. The structure of the fourth enclosed portion 34 is generally an L-shaped columnar structure, and the fourth enclosed portion 34 can accommodate the fourth device group 214. The power devices of the fourth device group 214 can include, but are not limited to, safety capacitors, common mode inductors, varistors, etc.

[0041] In some embodiments, a fourth limiting plate (not shown) is further provided on the first surface of the top plate 11. The fourth limiting plate is connected to the outer side surface of the boss 14 and is not connected to the side plate 12. At this time, the top plate 11, the fourth limiting plate, and the outer side surface of the boss 14 together define at least one enclosed portion 30.

[0042] In some embodiments, a plurality of heat sinks 16 are further provided on the outer side surface of the housing. The heat sinks 16 can be provided on the outer side surface of the side plate 12 and are arranged at intervals along the circumferential direction of the side plate 12, which can improve the heat dissipation effect. The heat sinks 16 can be made of a metal material, and the metal material includes, but is not limited to, aluminum, aluminum alloy, or stainless steel. Of course, the heat sinks 16 can also be defined as heat dissipation plates.

[0043] The electrical device is assembled as follows: Before the power board 20 is installed on the housing 10, an appropriate amount of thermal conductive glue is pre-poured into the accommodation cavities of the respective enclosed portions 30 of the housing 10. Before the thermal conductive glue solidifies, the power board 20 is installed on the housing 10. The thermal conductive glue will wrap the power devices of the device group 21. While meeting the heat dissipation of the high-loss power devices, the usage amount of the thermal conductive glue can be effectively controlled, saving material costs, reducing the weight of the whole machine, and reducing logistics costs. At the same time, the reduction of the glue filling amount of the thermal conductive glue can save the assembly time of production and reduce the assembly cost.

[0044] Understandably, the above embodiments only represent the preferred embodiments of the present utility model, and the description thereof is relatively specific and detailed. However, it should not be construed as a limitation to the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, the above technical features can be freely combined, and several modifications and improvements can also be made, which all fall within the protection scope of the present utility model. Therefore, all equivalent transformations and modifications made to the scope of the claims of the present utility model shall fall within the scope covered by the claims of the present utility model.

Claims

1. An electrical device, characterized in that, It includes a housing and a power board. The housing is provided with a plurality of enclosing parts which are not communicated with each other, and each enclosing part is provided with a receiving cavity for accommodating heat-conducting glue. A plurality of device groups are provided on the power board, and the device groups are installed in the receiving cavities.

2. The electrical device according to claim 1, wherein The housing includes a top plate which has a first surface and a second surface opposite to each other. A first limiting plate is provided on the first surface of the top plate. The first limiting plate is annular, and the first limiting plate and the top plate jointly define at least one of the enclosing parts.

3. The electrical device according to claim 2, wherein, The housing further includes a side plate connected to the top plate, and the side plate extends towards the side of the first surface. A second limiting plate is further provided on the first surface of the top plate. The second limiting plate is connected to the side plate, and the top plate, the side plate and the second limiting plate jointly define at least one of the enclosing parts.

4. The electrical device according to claim 3, characterized in that, A boss is further provided on the first surface of the top plate. At least part of the boss is provided with a concave structure, and the concave structure forms at least one of the enclosing parts.

5. The electrical device according to claim 4, characterized in that, A third limiting plate is further provided on the first surface of the top plate. The third limiting plate is connected to the outer side surface of the boss and the side plate, and the top plate, the side plate, the third limiting plate and the outer side surface of the boss jointly define at least one of the enclosing parts.

6. The electrical device according to claim 4, characterized in that: A fourth limiting plate is further provided on the first surface of the top plate. The fourth limiting plate is connected to the outer side surface of the boss, and the top plate, the fourth limiting plate and the outer side surface of the boss jointly define at least one of the enclosing parts.

7. The electrical device according to any one of claims 1 to 6, characterized in that: A plurality of heat sinks are further provided on the outer side surface of the housing.

8. The electrical device according to any one of claims 1 to 6, characterized in that, The structure of the enclosing part is similar to the arrangement structure of the device group.

9. The electrical device according to any one of claims 1 to 6, characterized in that, Each device group includes a plurality of power devices.

10. The electrical device according to claim 9, characterized in that, The power devices include capacitors, inductors, resistors, transformers.

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