Efficient heat dissipation hardware electronic component shell

Abstract

The utility model discloses an efficient heat dissipation hardware electronic component shell, and relates to the technical field of hardware electronic component shells. The efficient heat dissipation hardware electronic component shell comprises a mounting bottom plate, a mounting groove is formed in the upper surface of the mounting bottom plate, two rectangular grooves are formed in the upper surface of the mounting bottom plate, the hardware electronic component shell and a fixing device are arranged on the mounting groove, and the fixing device is arranged on the mounting bottom plate. The two first cooling fans can pump heat on the cooling fins out of the interior of the hardware electronic component shell, meanwhile, the second cooling fan is started to pump external cold gas into the interior of the hardware electronic component shell, the external cold gas directly blows the cooling fins and the electronic component, and the cooling fins and the electronic component are cooled. And heat generated by blowing the cooling fins and the electronic components can be discharged out of the interior of the hardware electronic component shell through the cooling grooves, heat dissipation is conducted on the cooling fins and the electronic components in a suction mode and a blowing mode, and the heat dissipation efficiency of the hardware electronic component shell is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of hardware electronic component housings, and particularly relates to a hardware electronic component housing with efficient heat dissipation. Background Technique

[0002] Electronic components are components of electronic elements and small electrical machines and instruments. They are often composed of several parts and can be common in similar products. They often refer to certain parts in industries such as electrical appliances, radio, and instruments, such as capacitors, transistors, hairsprings, and mainsprings, which are the general terms of electronic devices.

[0003] At present, electronic components are usually used in cooperation with the housing during use. However, most of the existing hardware electronic component housings do not have a heat dissipation structure. During the operation of electronic components, heat is generated. If the generated heat cannot be dissipated in time, it is easy to cause the local temperature of the electronic components to be too high, which affects the overall performance of the electronic components and reduces the service life of the electronic components. Content of the Utility Model

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art, and to provide a hardware electronic component housing with efficient heat dissipation, which can solve the problem that most of the existing hardware electronic component housings do not have a heat dissipation structure. During the operation of electronic components, heat is generated. If the generated heat cannot be dissipated in time, it is easy to cause the local temperature of the electronic components to be too high, which affects the overall performance of the electronic components and reduces the service life of the electronic components.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A hardware electronic component housing with efficient heat dissipation, including a mounting bottom plate. An installation groove is opened on the upper surface of the installation bottom plate. Two rectangular grooves are opened on the upper surface of the installation bottom plate. Sliding grooves are opened on the front and rear inner walls of the two rectangular grooves. A hardware electronic component housing and a fixing device are arranged on the installation groove. The fixing device is arranged on the installation bottom plate;

[0006] A heat dissipation device is arranged on the hardware electronic component housing. The heat dissipation device includes two first heat dissipation fans. Both of the two first heat dissipation fans are fixedly installed on the hardware electronic component housing. The input ends of the two first heat dissipation fans are communicated with the inside of the hardware electronic component housing;

[0007] Among them, a first dust-proof cover is arranged on the upper surface of the hardware electronic component housing. The first dust-proof cover is installed on the upper surface of the hardware electronic component housing through fixing threads.

[0008] Preferably, a heat dissipation groove communicated with it is opened on the right side of the hardware electronic component housing, and a dust-proof net is fixedly installed inside the heat dissipation groove;

[0009] Among them, a second cooling fan is fixedly installed on the left side of the housing of the hardware electronic component, and the output end of the second cooling fan communicates with the inside of the housing of the hardware electronic component.

[0010] Preferably, a second dust-proof housing is arranged on the left side of the housing of the hardware electronic component. The second dust-proof housing is fixedly installed on the left side of the second dust-proof housing through fixing threads, and a heat sink is fixedly connected to the top of the housing of the hardware electronic component.

[0011] Preferably, the fixing device includes a bidirectional threaded rod, the bidirectional threaded rod is rotatably connected to the inner wall of the rectangular groove, and the right end of the bidirectional threaded rod rotatably penetrates through the right side of the mounting base plate;

[0012] Among them, a connection head is fixedly connected to the right end of the bidirectional threaded rod, and two moving sleeves are threadedly sleeved on the outer wall of the bidirectional threaded rod.

[0013] Preferably, connecting plates are fixedly sleeved on the outer walls of the two moving sleeves, the two connecting plates are both slidably connected to the rectangular groove, and clamping columns are fixedly connected to the opposite surfaces of the two connecting plates;

[0014] Among them, sliders are fixedly connected to the front and rear surfaces of the two connecting plates, and the four sliders are respectively slidably connected to the corresponding sliding grooves.

[0015] Preferably, the fixing device further includes a rectangular plate, the rectangular plate is fixedly connected to the front surface of the housing of the hardware electronic component, and rectangular card slots are opened on both sides of the left side of the rectangular plate;

[0016] Among them, circular card slots are opened on the inner walls of the two rectangular card slots, the number of the fixing devices is two, and the structures of the two fixing devices are arranged in a front-back mirror image.

[0017] Compared with the prior art, the beneficial effects of the present utility model are:

[0018] (1). For the housing of the hardware electronic component with efficient heat dissipation, the two first cooling fans will extract the heat on the heat sink from the inside of the housing of the hardware electronic component. At the same time, the second cooling fan starts to draw the relatively cold gas outside into the inside of the housing of the hardware electronic component. The relatively cold gas outside directly blows on the heat sink and the electronic components, and the heat of the heat sink and the electronic components blown will be discharged from the inside of the housing of the hardware electronic component through the heat dissipation slots. The heat sink and the electronic components are dissipated by both suction and blowing methods, improving the heat dissipation efficiency of the housing of the hardware electronic component.

[0019] (2) For the hardware and electronic component housing with efficient heat dissipation, two bidirectional threaded rods drive two moving sleeves corresponding to each other on the left and right to move away from each other. The two moving sleeves drive the connecting plates connected to them to move away from each other, so that the four connecting plates are separated from the inner walls of the four rectangular card slots, and the four clamping columns are separated from the inner walls of the four circular card slots. When the four clamping columns completely leave the inner walls of the four circular card slots, the hardware and electronic component housing can be removed from the mounting base plate. The whole disassembly process is simple and convenient, improving the convenience of installing and disassembling the hardware and electronic component housing. The installation slot plays a guiding role in the installation of the hardware and electronic component housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The present invention will be further described below in conjunction with the drawings and embodiments:

[0021] Figure 1 is a schematic structural diagram of the whole of the present invention;

[0022] Figure 2 is a schematic diagram of the connection between the first heat dissipation fan and the hardware and electronic component housing of the present invention;

[0023] Figure 3 is a schematic diagram of the connection between the slider and the connecting plate of the present invention;

[0024] Figure 4 is a schematic diagram of the upper surface of the mounting base plate of the present invention;

[0025] Figure 5 is a schematic diagram of the position of the heat dissipation fins of the present invention.

[0026] Reference numerals: 1, mounting base plate; 2, hardware and electronic component housing; 3, bidirectional threaded rod; 4, connecting plate; 5, rectangular plate; 6, moving sleeve; 7, rectangular groove; 8, first dust-proof shell; 9, second dust-proof shell; 10, first heat dissipation fan; 11, dust-proof net; 12, connecting head; 13, circular card slot; 14, rectangular card slot; 15, clamping column; 16, slider; 17, installation slot; 18, sliding groove; 19, second heat dissipation fan; 20, heat dissipation fin. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0027] This part will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the drawings. The function of the drawings is to supplement the description in the text part of the specification, enabling people to intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be construed as a limitation on the protection scope of the present invention.

[0028] In the description of the present utility model, it should be understood that when it comes to orientation descriptions, such as the upper, lower, front, rear, left, right, etc. indicating the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0029] In the description of the present utility model, "greater than", "less than", "exceeding", etc. are understood not to include the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or the sequence relationship of the indicated technical features.

[0030] In the description of the present utility model, unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present utility model in combination with the specific content of the technical solution.

[0031] Please refer to Figures 1-5 , the present utility model provides a technical solution: a hardware electronic component housing with efficient heat dissipation, including a mounting base plate 1. An installation groove 17 is provided on the upper surface of the mounting base plate 1. Two rectangular grooves 7 are provided on the upper surface of the mounting base plate 1. Sliding grooves 18 are provided on the front and rear inner walls of the two rectangular grooves 7. A hardware electronic component housing 2 is provided on the installation groove 17, and a fixing device is provided on the mounting base plate 1;

[0032] A heat dissipation device is provided on the hardware electronic component housing 2. The heat dissipation device includes two first heat dissipation fans 10. Both of the two first heat dissipation fans 10 are fixedly installed on the hardware electronic component housing 2, and the input ends of the two first heat dissipation fans 10 are communicated with the inside of the hardware electronic component housing 2;

[0033] Among them, a first dust-proof shell 8 is provided on the upper surface of the hardware electronic component housing 2, and the first dust-proof shell 8 is installed on the upper surface of the hardware electronic component housing 2 through fixing threads.

[0034] Furthermore, a heat dissipation slot communicated with it is provided on the right side of the hardware electronic component housing 2, and a dust-proof net 11 is fixedly installed inside the heat dissipation slot;

[0035] Among them, a second heat dissipation fan 19 is fixedly installed on the left side of the hardware electronic component housing 2, and the output end of the second heat dissipation fan 19 is communicated with the inside of the hardware electronic component housing 2.

[0036] Further, a second dust-proof cover 9 is provided on the left side of the housing 2 of the hardware electronic component. The second dust-proof cover 9 is fixedly installed on the left side of the second dust-proof cover 9 through fixing threads. A heat sink 20 is fixedly connected to the top of the housing 2 of the hardware electronic component.

[0037] Further, the fixing device includes a bidirectional threaded rod 3. The bidirectional threaded rod 3 is rotatably connected to the inner wall of the rectangular groove 7, and the right end of the bidirectional threaded rod 3 rotatably penetrates through the right side of the mounting base plate 1.

[0038] Wherein, a connection head 12 is fixedly connected to the right end of the bidirectional threaded rod 3, and two moving sleeves 6 are threadedly sleeved on the outer wall of the bidirectional threaded rod 3.

[0039] Further, connecting plates 4 are fixedly sleeved on the outer walls of the two moving sleeves 6. The two connecting plates 4 are both slidably connected to the rectangular groove 7. Columns 15 are fixedly connected to the opposite surfaces of the two connecting plates 4.

[0040] Wherein, sliders 16 are fixedly connected to the front and rear surfaces of the two connecting plates 4. The four sliders 16 are respectively slidably connected to the corresponding sliding grooves 18.

[0041] Further, the fixing device further includes a rectangular plate 5. The rectangular plate 5 is fixedly connected to the front surface of the housing 2 of the hardware electronic component. Rectangular clamping grooves 14 are provided on both sides of the left side of the rectangular plate 5.

[0042] Wherein, circular clamping grooves 13 are provided on the inner walls of the two rectangular clamping grooves 14. The number of the fixing devices is two, and the structures of the two fixing devices are mirror images of each other front and back.

[0043] Further, when using the housing of the hardware electronic component with high-efficiency heat dissipation, when the electronic component on the mounting base plate 1 starts to generate heat during operation, first, the heat sink 20 will absorb the heat of the electronic component. At the same time, two first cooling fans 10 are started. The two first cooling fans 10 will extract the heat on the heat sink 20 from the inside of the housing 2 of the hardware electronic component. At the same time, the second cooling fan 19 is started to draw the relatively cold gas outside into the inside of the housing 2 of the hardware electronic component. The relatively cold gas outside blows directly on the heat sink 20 and the electronic component. The heat blown from the heat sink 20 and the electronic component will be discharged from the inside of the housing 2 of the hardware electronic component through the heat dissipation grooves. The heat sink 20 and the electronic component are cooled by both suction and blowing methods, improving the heat dissipation efficiency of the housing 2 of the hardware electronic component.

[0044] Further, when removing the housing 2 of the hardware electronic component, the staff rotates the two bidirectional threaded rods 3 through the two connectors 12 at the same time. The two bidirectional threaded rods 3 drive the two left-right corresponding moving sleeves 6 to move away from each other. The two moving sleeves 6 drive the connecting plates 4 connected to them to move away from each other. As a result, the four connecting plates 4 are separated from the inner walls of the four rectangular card slots 14, and the four clamping columns 15 are separated from the inner walls of the four circular card slots 13. When the four clamping columns 15 are completely separated from the inner walls of the four circular card slots 13, the housing 2 of the hardware electronic component can be removed from the mounting base plate 1. The entire disassembly process is simple and convenient, improving the convenience of installing and disassembling the housing 2 of the hardware electronic component. The installation groove 17 plays a guiding role in the installation of the housing 2 of the hardware electronic component.

[0045] Working principle: When using the housing of the hardware electronic component with high-efficiency heat dissipation, when the electronic components on the mounting base plate 1 start to generate heat during operation, first, the heat sink 20 will absorb the heat of the electronic components. At the same time, the two first cooling fans 10 are started. The two first cooling fans 10 will extract the heat on the heat sink 20 from the inside of the housing 2 of the hardware electronic component. At the same time, the second cooling fan 19 is started to draw the relatively cold gas outside into the inside of the housing 2 of the hardware electronic component. The relatively cold gas outside blows directly on the heat sink 20 and the electronic components. The heat blown from the heat sink 20 and the electronic components will be discharged from the inside of the housing 2 of the hardware electronic component through the heat dissipation grooves. The heat sink 20 and the electronic components are cooled by both suction and blowing methods, improving the heat dissipation efficiency of the housing 2 of the hardware electronic component.

[0046] Further, when removing the housing 2 of the hardware electronic component, the staff rotates the two bidirectional threaded rods 3 through the two connectors 12 at the same time. The two bidirectional threaded rods 3 drive the two left-right corresponding moving sleeves 6 to move away from each other. The two moving sleeves 6 drive the connecting plates 4 connected to them to move away from each other. As a result, the four connecting plates 4 are separated from the inner walls of the four rectangular card slots 14, and the four clamping columns 15 are separated from the inner walls of the four circular card slots 13. When the four clamping columns 15 are completely separated from the inner walls of the four circular card slots 13, the housing 2 of the hardware electronic component can be removed from the mounting base plate 1. The entire disassembly process is simple and convenient, improving the convenience of installing and disassembling the housing 2 of the hardware electronic component. The installation groove 17 plays a guiding role in the installation of the housing 2 of the hardware electronic component.

[0047] The above has described the embodiments of the present invention in detail with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those of ordinary skill in the art in the technical field, various changes can be made without departing from the gist of the present invention.

Claims

1. A housing for a hardware electronic component with efficient heat dissipation, characterized in that, Including: An installation base plate (1), on the upper surface of the installation base plate (1), there are installation grooves (17) opened, on the upper surface of the installation base plate (1), there are two rectangular grooves (7) opened, on the front and rear inner walls of the two rectangular grooves (7), there are sliding grooves (18) opened, and on the installation groove (17), there is a hardware electronic component housing (2); A fixing device, which is arranged on the installation base plate (1); A heat dissipation device, which is arranged on the hardware electronic component housing (2), the heat dissipation device includes two first heat dissipation fans (10), both of the two first heat dissipation fans (10) are fixedly installed on the hardware electronic component housing (2), and the input ends of the two first heat dissipation fans (10) are both communicated with the inside of the hardware electronic component housing (2); Among them, on the upper surface of the hardware electronic component housing (2), there is a first dust-proof housing (8), and the first dust-proof housing (8) is installed on the upper surface of the hardware electronic component housing (2) through fixing threads.

2. The housing of a hardware electronic component with efficient heat dissipation according to claim 1, characterized in that: On the right side of the hardware electronic component housing (2), there is a heat dissipation slot communicated with it, and a dust-proof net (11) is fixedly installed inside the heat dissipation slot; Among them, on the left side of the hardware electronic component housing (2), a second heat dissipation fan (19) is fixedly installed, and the output end of the second heat dissipation fan (19) is communicated with the inside of the hardware electronic component housing (2).

3. The housing of a hardware and electronic component with efficient heat dissipation according to claim 1, characterized in that: On the left side of the hardware electronic component housing (2), there is a second dust-proof housing (9), the second dust-proof housing (9) is fixedly installed on the left side of the second dust-proof housing (9) through fixing threads, and on the top of the hardware electronic component housing (2), there is a heat dissipation fin (20) fixedly connected.

4. The housing of a hardware electronic component with high-efficiency heat dissipation according to claim 1, characterized in that: The fixing device includes a bidirectional threaded rod (3), the bidirectional threaded rod (3) is rotatably connected to the inner wall of the rectangular groove (7), and the right end of the bidirectional threaded rod (3) rotatably penetrates through the right side of the installation base plate (1); Among them, on the right end of the bidirectional threaded rod (3), there is a connection head (12) fixedly connected, and two moving sleeves (6) are threadedly sleeved on the outer wall of the bidirectional threaded rod (3).

5. The housing of a hardware electronic component with high-efficiency heat dissipation according to claim 4, characterized in that: On the outer walls of the two moving sleeves (6), there are connecting plates (4) fixedly sleeved, both of the two connecting plates (4) are slidably connected with the rectangular groove (7), and on the opposite surfaces of the two connecting plates (4), there are clamping columns (15) fixedly connected; Among them, on the front and rear surfaces of the two connecting plates (4), there are sliders (16) fixedly connected, and the four sliders (16) are respectively slidably connected with the corresponding sliding grooves (18).

6. The housing of a hardware electronic component with efficient heat dissipation according to claim 1, characterized in that: The fixing device further includes a rectangular plate (5), the rectangular plate (5) is fixedly connected to the front surface of the hardware electronic component housing (2), and on the left side of the rectangular plate (5), there are rectangular clamping grooves (14) opened on both sides; Among them, on the inner walls of the two rectangular clamping grooves (14), there are circular clamping grooves (13) opened, the number of the fixing devices is two, and the structures of the two fixing devices are mirror images of each other front and back.

Images