OLED heat dissipation structure and display device

Abstract

The utility model relates to the technical field of liquid crystal display, in particular to an OLED heat dissipation structure and a display device, the OLED heat dissipation structure comprises a back plate, a heat dissipation plate, double-sided foam and a liquid crystal panel, the plate surface of the heat dissipation plate is tightly attached to the back plate and is stably installed, the plate surface of the heat dissipation plate is provided with an avoiding groove, and the double-sided foam is arranged in the avoiding groove and adheres to the back plate and the liquid crystal panel. The radiating plate is in direct contact with the back plate in a gapless manner, so that a gap between the radiating plate and the back plate is eliminated; the double-faced foam is located in the receding groove and adheres to the liquid crystal panel and the back plate, the gap between the liquid crystal panel and the heat dissipation plate is reduced, and therefore the heat dissipation efficiency is improved, and the heat dissipation effect is better.

Description

Technical Field

[0001] The utility model belongs to the technical field of liquid crystal display, and particularly relates to an OLED heat dissipation structure and a display device. Background Art

[0002] With the rapid development of OLED technology, OLED liquid crystal display screens are widely popular due to their excellent color performance, high contrast ratio, and thin and light design. However, when working at high brightness for a long time, if the heat generated by the liquid crystal panel cannot be dissipated in time and effectively, it will cause the screen temperature to rise, thereby affecting the display effect and the service life of the device.

[0003] In the prior art, the heat dissipation structure of the OLED liquid crystal display screen is that the heat dissipation plate is pasted on the inner side of the backplane through double-sided adhesive, and then a double-sided foam is used to bond the liquid crystal panel on the heat dissipation plate. The heat of the liquid crystal panel is dissipated through the heat dissipation plate and the backplane. However, when using double-sided adhesive and double-sided foam for bonding, there are certain gaps between the liquid crystal panel and the heat dissipation plate, and between the heat dissipation plate and the backplane. The excessive gap becomes a bottleneck for heat conduction, which limits the overall heat dissipation efficiency of the display screen and results in poor heat dissipation effect.

[0004] Therefore, in view of the above technical problems, the utility model provides an OLED heat dissipation structure, in which the heat dissipation plate is in direct contact with the backplane without gaps, the heat dissipation plate is provided with a relief groove, and the double-sided foam is located in the relief groove and bonds the liquid crystal panel and the backplane respectively, so as to reduce the gap between the liquid crystal panel and the heat dissipation plate, thereby improving the heat dissipation efficiency to solve the above problems. Summary of the Utility Model

[0005] In view of the above problems existing in the prior art, the utility model provides an OLED heat dissipation structure, which includes a backplane, a heat dissipation plate, a double-sided foam, and a liquid crystal panel. The surface of the heat dissipation plate is closely attached to the backplane for stable installation. The surface of the heat dissipation plate is provided with a relief groove, and the double-sided foam is arranged in the relief groove and bonds the backplane and the liquid crystal panel.

[0006] Optionally, the backplane is provided with heat dissipation holes, and the heat dissipation holes are arranged in a staggered pattern or a honeycomb pattern.

[0007] Optionally, the heat dissipation plate is provided with a first sunk platform, and the backplane is provided with a second sunk platform. The first sunk platform is sleeved into the second sunk platform for fastening installation.

[0008] Optionally, the first sunk platform is fastened and installed with the second sunk platform through a fastener, and the top end of the fastener is not higher than the top surface of the first sunk platform.

[0009] Optionally, both the first sunk platform and the second sunk platform are frustum-shaped or cylindrical, and the outer diameter of the first sunk platform is smaller than the inner diameter of the second sunk platform.

[0010] Optionally, an internal thread is provided at the bottom of the second sunk platform, and the first sunk platform and the second sunk platform are fixedly connected by screws.

[0011] Optionally, the heat dissipation plate is an aluminum plate, and the heat dissipation holes are circular or diamond-shaped.

[0012] Optionally, the avoidance groove is a through groove for positioning and attaching the double-sided foam.

[0013] Optionally, the avoidance groove is rectangular, arc-shaped or wavy.

[0014] The present utility model also provides a display device, including the above OLED heat dissipation structure.

[0015] The technical solution of the present utility model has the following advantages or beneficial effects:

[0016] For the OLED heat dissipation structure provided by the present utility model, the heat dissipation plate is in direct contact with the backplane without gaps, eliminating the gaps between the heat dissipation plate and the backplane; the heat dissipation plate is provided with an avoidance groove, and the double-sided foam is located in the avoidance groove to bond the liquid crystal panel and the backplane respectively, reducing the gap between the liquid crystal panel and the heat dissipation plate, thereby improving the heat dissipation efficiency and achieving better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Referring to the accompanying drawings to more fully describe the embodiments of the present utility model. However, the accompanying drawings are only for illustration and explanation and do not constitute a limitation to the scope of the present utility model.

[0018] Figure 1 Schematic diagram of the heat dissipation structure of an OLED liquid crystal display screen in the prior art;

[0019] Figure 2 Schematic diagram of the OLED heat dissipation structure of the present utility model;

[0020] Figure 3 Exploded schematic diagram of the OLED heat dissipation structure of the present utility model;

[0021] Figure 4 Schematic diagram of the assembly structure of the backplane, heat dissipation plate and double-sided foam;

[0022] Figure 5 For Figure 4 Magnified schematic diagram of A in

[0023] Figure 6 Schematic diagram of the structure of the heat dissipation plate assembled with screws;

[0024] Figure 7 Schematic diagram of the structure of the backplane provided with heat dissipation holes;

[0025] Figure 8Schematic diagram of the structure where the first sunk platform and the second sunk platform are adhesively bonded with glue;

[0026] Figure 9 Schematic diagram of the structure where the first sunk platform and the second sunk platform are adhesively bonded with a rubber strip;

[0027] Figure 10 Schematic diagram of the heat dissipation channel;

[0028] Figure 11 Temperature test diagram of the heat dissipation holes.

[0029] Illustration description:

[0030] 1. Backplane; 2. Heat dissipation plate; 3. Double-sided adhesive tape; 4. Double-sided foam; 5. Liquid crystal panel; 6. Avoidance groove; 7. First sunk platform; 8. Second sunk platform; 9. Screw; 10. Heat dissipation hole; 11. Glue; 12. Rubber strip; 13. Heat dissipation channel. Detailed implementation manners

[0031] For the convenience of understanding the present utility model, the present utility model will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present utility model are given in the drawings. However, the present utility model can be implemented in many other different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure content of the present utility model more thorough and comprehensive.

[0032] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0033] In the description of the present utility model, unless otherwise defined, all the technical and scientific terms used in the present utility model have the same meaning as commonly understood by those skilled in the technical field to which the present utility model belongs. The terms used in the description of the present utility model in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0034] In the description of the present utility model, the technical terms "first", "second", etc. are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "a plurality" is more than two unless otherwise specifically defined.

[0035] Figure 1 is a schematic diagram of the heat dissipation structure of an existing OLED liquid crystal display screen. As Figure 1 shown, the heat dissipation plate 2 is adhered to the inner side of the backplane 1 through double-sided tape 3, and then a double-sided foam 4 is used to bond the liquid crystal panel 5 on the heat dissipation plate 2. The heat of the liquid crystal panel 5 is dissipated through the heat dissipation plate 2 and the backplane 1. However, when using the double-sided tape 3 and the double-sided foam 4 to fit, there are certain gaps between the liquid crystal panel 5 and the heat dissipation plate 2, and between the heat dissipation plate 2 and the backplane 1. The excessive gaps become the bottleneck of heat conduction, which limits the overall heat dissipation efficiency of the display screen, and the heat dissipation effect is relatively poor.

[0036] Figure 2 is a schematic diagram of the OLED heat dissipation structure of the present invention. As Figure 2-7 shown, the OLED heat dissipation structure provided by the embodiment of the present invention includes a backplane 1, a heat dissipation plate 2, a double-sided foam 4 and a liquid crystal panel 5. The plate surface of the heat dissipation plate 2 is closely attached to the backplane 1 for stable installation. An avoidance groove 6 is provided on the plate surface of the heat dissipation plate 2. The double-sided foam 4 is arranged in the avoidance groove 6 and bonds the backplane 1 and the liquid crystal panel 5. Specifically, the backplane 1 is the installation main body, and it can be formed by plastic injection molding. The heat dissipation plate 2 is preferably an aluminum plate, which has good thermal conductivity and is easy to shape and process. The heat dissipation plate 2 can well dissipate the heat of the OLED liquid crystal display screen. The double-sided foam 4 has adhesive on both sides, can bond the backplane 1 and the liquid crystal panel 5 respectively, and has certain buffering performance, which can prevent the liquid crystal panel 5 from hitting the heat dissipation plate 2.

[0037] Furthermore, in this embodiment, a plurality of first sinking platforms 7 are provided on the plate surface of the heat dissipation plate 2, and a plurality of second sinking platforms 8 corresponding to the first sinking platforms 7 are provided on the plate surface of the backplane 1. The first sinking platforms 7 are sleeved into the second sinking platforms 8 for fastening installation, so that the backplane 1 and the heat dissipation plate 2 are closely attached and contacted, improving the contact heat transfer effect. Specifically, both the first sinking platforms 7 and the second sinking platforms 8 are frustum-shaped or cylindrical grooves, and the outer diameter of the first sinking platforms 7 is smaller than the inner diameter of the second sinking platforms 8, so that the first sinking platforms 7 can be sleeved into the second sinking platforms 8, and then fastened and connected through fasteners. Among them, the fasteners can be screws or rivets, and the top of the fasteners cannot protrude above the surface of the heat dissipation plate 2, that is, the fasteners are not higher than the top surface of the first sinking platforms 7, to prevent the fasteners from touching the liquid crystal panel 5. Preferably, in this embodiment, both the first sinking platforms 7 and the second sinking platforms 8 are frustum-shaped, the fastener is a screw 9, and internal threads are provided at the bottom of the second sinking platforms 8. The first sinking platforms 7 are fastened and installed with the second sinking platforms 8 through screws 9. The setting of the sinking platforms can prevent the top of the screws 9 from touching the liquid crystal panel 5. It should be noted that the plate surface of the heat dissipation plate 2 is closely attached to the plate surface of the backplane 1, eliminating the gap between the heat dissipation plate 2 and the backplane 1, with higher contact heat conduction efficiency and better heat dissipation effect, significantly improving the heat dissipation performance of the display screen.

[0038] Furthermore, in this embodiment, a plurality of avoidance grooves 6 are provided on the surface of the heat dissipation plate 2. The avoidance grooves 6 penetrate through the plate body of the heat dissipation plate 2, that is, the avoidance grooves 6 are through grooves. The avoidance grooves 6 can be arranged continuously or in segments, and their shapes can be rectangular, arc-shaped, wavy, etc. In this embodiment, the avoidance grooves 6 are arranged as rectangular through grooves. Preferably, the setting of the avoidance grooves 6 can be determined according to the required position for bonding the liquid crystal panel 5. That is, the avoidance grooves 6 can be used as the reference for positioning and attaching the double-sided foam 4. There is no need to add other structures for positioning. The double-sided foam 4 is directly attached to the backplane 1 in the avoidance grooves 6. It should be noted that when the double-sided foam 4 is attached in the avoidance grooves 6, the gap between the liquid crystal panel 5 and the heat dissipation plate 2 changes from the original thickness of the entire double-sided foam 4 to the thickness of the double-sided foam 4 minus the thickness of the heat dissipation plate 2. That is, the gap between the liquid crystal panel 5 and the heat dissipation plate 2 is reduced, so that the heat conduction efficiency between the liquid crystal panel 5 and the heat dissipation plate 2 is improved, the heat dissipation effect is better, and the heat dissipation performance of the display screen is significantly improved.

[0039] Furthermore, in this embodiment, in order to further improve the heat dissipation effect of the display screen, a plurality of heat dissipation holes 10 are provided on the side and / or back of the backplane 1. The heat dissipation holes 10 are arranged in a staggered pattern or a honeycomb pattern. The heat dissipation holes 10 can form an air heat dissipation channel 13 (as Figure 10 shown). The heat dissipation holes 10 can increase the complexity and turbulence of air flow, thereby improving the heat dissipation efficiency. In order to more fully reflect the heat dissipation efficiency of the heat dissipation holes 10, tests are conducted on liquid crystal display screens with and without heat dissipation holes 10. The test results are as Figure 11 shown, where no via means no heat dissipation holes 10 are provided, and n*n thermal via means heat dissipation holes 10 are provided. As can be seen from Figure 11 this, for the display screen with heat dissipation holes 10 provided, the junction temperature (Junction Temp.), the temperature of the top layer of the circuit board (PCB Top), and the temperature of the bottom layer of the circuit board (PCB Bottom) are all significantly reduced. It can be seen that the heat dissipation holes 10 can significantly improve the heat dissipation efficiency and the heat dissipation effect is better. It should be noted that the shape of the heat dissipation holes 10 can be compared through simulation analysis to study the influence of different shapes on air flow, and the optimal shape of the heat dissipation holes 10 is selected. Preferably, the shape of the heat dissipation holes 10 is circular or diamond-shaped, which is convenient for processing and forming. The size of the heat dissipation holes 10 (such as diameter, aspect ratio, etc.) can be accurately designed according to the heat dissipation requirements and simulation calculations to avoid adverse effects on the heat dissipation effect caused by too large or too small hole diameters while maintaining sufficient ventilation. The layout of the heat dissipation holes 10 can be obtained through simulation analysis to maximize the air flow efficiency and achieve rapid and uniform heat dissipation.

[0040] In some embodiments, the first sunk platform 7 can also be firmly bonded to the second sunk platform 8 by glue 11 or a rubber strip 12. Specifically, as Figure 8As shown, when using glue 11 for bonding, an appropriate amount of glue 11 is filled in the second sinking platform 8, then the first sinking platform 7 is aligned with the second sinking platform 8, and finally the heat dissipation plate 2 is pressed tightly until the glue 11 hardens, so that the heat dissipation plate 2 and the backplane 1 are firmly connected. As Figure 9 As shown, when using the rubber strip 12 for bonding, the rubber strip 12 is arranged in the second sinking platform 8 to form a rubber strip ring, then the first sinking platform 7 is aligned with the second sinking platform 8 and the outer surface of the first sinking platform 7 falls into the rubber strip ring, and finally the heat dissipation plate 2 is pressed tightly, so that the heat dissipation plate 2 and the backplane 1 are firmly connected.

[0041] The present utility model also provides a display device, and the display device includes the OLED heat dissipation structure in the above embodiment.

[0042] Implementing the OLED heat dissipation structure and its display device of the present utility model, the heat dissipation plate 2 and the backplane 1 are closely attached without gaps. At the same time, the gaps between the liquid crystal panel 5 and the heat dissipation plate 2, and between the liquid crystal panel 5 and the backplane 1 are significantly reduced, enhancing the contact heat transfer efficiency between the two, thereby effectively improving the heat dissipation performance of the display device and achieving a better heat dissipation effect. This not only helps to extend the service life of the display device, but also improves the display effect and user experience. At the same time, the heat dissipation structure of the present utility model has high practicality and popularization value, and can be widely applied to various OLED liquid crystal display screen products or display devices.

[0043] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0044] The above embodiments only represent several implementation manners of the present utility model, and the description is relatively specific and detailed, but it should not be understood as a limitation to the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several deformations and improvements can be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model should be subject to the appended claims.

Claims

1. The OLED heat dissipation structure is characterized in that It includes a backplane, a heat dissipation plate, double-sided foam, and a liquid crystal panel. The surface of the heat dissipation plate is closely attached to and firmly installed on the backplane. An avoidance groove is provided on the surface of the heat dissipation plate, and the double-sided foam is arranged in the avoidance groove and bonds the backplane and the liquid crystal panel.

2. The OLED heat dissipation structure according to claim 1, wherein The backplane is provided with heat dissipation holes, and the heat dissipation holes are arranged in a staggered pattern or a honeycomb pattern.

3. The OLED heat dissipation structure according to claim 1, wherein, The heat dissipation plate is provided with a first sunk platform, and the backplane is provided with a second sunk platform. The first sunk platform is sleeved into the second sunk platform for fastening installation.

4. The OLED heat dissipation structure according to claim 3, characterized in that, The first sunk platform is fastened and installed with the second sunk platform through a fastener, and the top end of the fastener is not higher than the top surface of the first sunk platform.

5. The OLED heat dissipation structure according to claim 4, wherein, Both the first sunk platform and the second sunk platform are frustum-shaped or cylindrical, and the outer diameter of the first sunk platform is smaller than the inner diameter of the second sunk platform.

6. The OLED heat dissipation structure according to claim 5, wherein Internal threads are provided at the bottom of the second sunk platform, and the first sunk platform and the second sunk platform are tightly connected by screws.

7. The OLED heat dissipation structure according to claim 2, wherein, The heat dissipation plate is an aluminum plate, and the heat dissipation holes are circular or diamond-shaped.

8. The OLED heat dissipation structure according to claim 1, characterized in that, The avoidance groove is a through groove, and the avoidance groove is for positioning and attaching the double-sided foam.

9. The OLED heat dissipation structure according to claim 1, wherein, The avoidance groove is rectangular, arc-shaped or wavy.

10. A display device, characterized in that, It includes the OLED heat dissipation structure according to any one of claims 1-9.

Images