Wireless communication module with heat dissipation function

Abstract

The utility model relates to the technical field of wireless communication modules, and discloses a wireless communication module with a heat dissipation function, which comprises a module body, a support block fixedly arranged at the bottom of the module body, and a heat dissipation assembly arranged at the bottom of the module body, the heat dissipation assembly comprises a heat dissipation mechanism installed at the bottom of the module body, an auxiliary mechanism is installed at the bottom of the module body and located on the inner side of the heat dissipation mechanism, the heat dissipation mechanism comprises an L-shaped supporting block, and the L-shaped supporting block is fixedly installed on the side wall of the module body. And a sleeving block is fixedly mounted at the bottom of the L-shaped supporting block, and a water pump is fixedly mounted on the inner wall of the sleeving block. According to the utility model, the problems of rapid development of the existing wireless communication technology, continuous improvement of performance and power consumption of wireless communication equipment, temperature rise in the equipment, and influence on stability and service life of the equipment are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of wireless communication modules, in particular to a wireless communication module with a heat dissipation function. Background Art

[0002] A wireless communication module is an electronic device that integrates components such as a radio frequency transceiver, a microcontroller, and an antenna. It allows devices to communicate via wireless signals. These modules are widely used in Internet of Things (IoT) devices, enabling remote data transmission and interoperability between devices. There are many types of wireless communication modules, including but not limited to Wi-Fi modules, Bluetooth modules, LoRa modules, ZigBee modules, 4G / 5G modules, and NB-IoT modules.

[0003] With the rapid development of wireless communication technology, the performance and power consumption of wireless communication equipment continue to improve, resulting in an increase in the internal temperature of the equipment, affecting the stability and life of the equipment. Utility Model Content

[0004] The purpose of the present utility model is to provide a wireless communication module with a heat dissipation function, so as to achieve the purpose of solving the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a wireless communication module with heat dissipation function, comprising a module body,

[0006] A support block fixedly mounted on the bottom of the module body;

[0007] and a heat dissipation component arranged at the bottom of the module body;

[0008] The heat dissipation assembly includes a heat dissipation mechanism installed at the bottom of the module body;

[0009] An auxiliary mechanism is installed at the bottom of the module body, and the auxiliary mechanism is located inside the heat dissipation mechanism.

[0010] Preferably, there are four support blocks, and the four support blocks are equal in shape and size. The four support blocks are fixedly installed at the four corners of the bottom of the module body, and the position of the device can be supported by the support blocks.

[0011] Preferably, the heat dissipation mechanism includes an L-shaped support block, which is fixedly installed on the side wall of the module body, a socket block is fixedly installed on the bottom of the L-shaped support block, a water pump is fixedly installed on the inner wall of the socket block, a cooling pipe is fixedly installed on one end of the water pump, and an arc-shaped clip is installed on the side wall of the cooling pipe, and the top of the arc-shaped clip is fixedly connected to the bottom of the module body.

[0012] Preferably, the side wall of the cooling pipe is in contact with the bottom of the module body, the inner wall of the water pump is communicated with the inside of the cooling pipe, and an inclined plate is fixedly installed on the inner wall of the L-shaped support block, which can improve the stability of the L-shaped support block through the inclined plate.

[0013] Preferably, there are a plurality of arc-shaped buckles, and the plurality of arc-shaped buckles are respectively equidistantly distributed on the side wall of the cooling pipe.

[0014] Preferably, the auxiliary mechanism includes a heat conducting plate, the heat conducting plate is fixedly installed at the bottom of the module body, a heat dissipation copper pipe is fixedly installed on the side wall of the heat conducting plate, and the other end of the heat dissipation copper pipe is provided with a heat dissipation fin.

[0015] Preferably, the top of the heat dissipation fin is in contact with the bottom of the module body, and the heat dissipation fin is symmetrically arranged with respect to the middle plane in the left and right directions of the heat conducting plate.

[0016] The utility model provides a wireless communication module with a heat dissipation function. It has the following beneficial effects:

[0017] (1) In the utility model, by an operator connecting an external coolant to one end of the water pump and then turning on the water pump, one end of the coolant can be made to enter the inner wall of the cooling pipe. The side wall of the cooling pipe is in contact with the bottom of the module body, so as to cool the bottom of the module body, solving the problem that with the rapid development of the existing wireless communication technology, the performance and power consumption of wireless communication devices are continuously improved, resulting in an increase in the internal temperature of the devices, which affects the stability and service life of the devices.

[0018] (2) In the utility model, the heat conducting plate can conduct the temperature at the bottom of the module body, and further transport it to the surface of the heat dissipation fin through the heat dissipation copper pipe. Under the combined action of the heat dissipation fin, the heat dissipation copper pipe and the heat conducting plate, the temperature at the bottom of the module body can be dissipated, facilitating the operator to better use the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic diagram of the external structure of the utility model;

[0020] Figure 2 is a schematic diagram of the back structure of the utility model;

[0021] Figure 3 is a partial structure schematic diagram of the heat dissipation mechanism of the utility model;

[0022] Figure 4 is the utility model Figure 2 partial enlarged view of A in.

[0023] In the figure: 1. Module body; 2. Support block; 4. Heat dissipation component; 41. Heat dissipation mechanism; 411. Socket block; 412. L-shaped support block; 413. Inclined plate; 414. Water pump; 415. Cooling pipe; 416. Arc-shaped buckle; 42. Auxiliary mechanism; 421. Heat conduction plate; 422. Heat dissipation copper pipe; 423. Heat dissipation fin. Detailed implementation mode

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0025] Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present invention, and should not be construed as a limitation to the present invention.

[0026] In the present invention, unless otherwise clearly specified and defined, terms such as "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation mode of the present invention will now be described with reference to the accompanying drawings.

[0028] Embodiment 1: A preferred embodiment of a wireless communication module with a heat dissipation function provided by the present invention is as Figures 1 to 4 shown: A wireless communication module with a heat dissipation function includes a module body 1,

[0029] a support block 2 fixedly installed at the bottom of the module body 1. The number of the support blocks 2 is four, and the shapes and sizes of the four support blocks 2 are equal. The four support blocks 2 are respectively fixedly installed at the four corner positions of the bottom of the module body 1, and the position of the device can be supported through the support block 2;

[0030] and a heat dissipation component 4 arranged at the bottom position of the module body 1;

[0031] The heat dissipation component 4 includes a heat dissipation mechanism 41 installed at the bottom position of the module body 1;

[0032] An auxiliary mechanism 42 is installed at the bottom position of the module body 1, and the auxiliary mechanism 42 is located inside the heat dissipation mechanism 41.

[0033] The heat dissipation mechanism 41 includes an L-shaped support block 412. The L-shaped support block 412 is fixedly installed on the side wall of the module body 1. A socket block 411 is fixedly installed at the bottom of the L-shaped support block 412. A water pump 414 is fixedly installed on the inner wall of the socket block 411. One end of the water pump 414 is fixedly installed with a cooling pipe 415. An arc-shaped buckle 416 is installed on the side wall of the cooling pipe 415. The top of the arc-shaped buckle 416 is fixedly connected to the bottom of the module body 1.

[0034] In this embodiment, the side wall of the cooling pipe 415 is in contact with the bottom of the module body 1. The inner wall of the water pump 414 is communicated with the inside of the cooling pipe 415. An inclined plate 413 is fixedly installed on the inner wall of the L-shaped support block 412. The stability of the L-shaped support block 412 can be improved by the inclined plate 413.

[0035] Furthermore, the number of the arc-shaped buckles 416 is multiple, and the multiple arc-shaped buckles 416 are respectively equidistantly distributed on the side wall of the cooling pipe 415.

[0036] During the specific implementation process, when an operator uses the device, the external coolant can be connected to one end of the water pump 414, and then the water pump 414 is turned on, so that one end of the coolant can enter the inner wall of the cooling pipe 415. The side wall of the cooling pipe 415 is in contact with the bottom of the module body 1, so as to cool the bottom of the module body 1.

[0037] Embodiment 2: On the basis of Embodiment 1, a preferred embodiment of a wireless communication module with a heat dissipation function provided by the present utility model is as Figures 1 to 4 shown: The auxiliary mechanism 42 includes a heat conduction plate 421. The heat conduction plate 421 is fixedly installed at the bottom of the module body 1. A heat dissipation copper pipe 422 is fixedly installed on the side wall of the heat conduction plate 421. The other end of the heat dissipation copper pipe 422 is installed with a heat dissipation fin 423.

[0038] In this embodiment, the top of the heat dissipation fin 423 is in contact with the bottom of the module body 1. The heat dissipation fin 423 is symmetrically arranged with respect to the middle plane in the left and right directions of the heat conduction plate 421.

[0039] During the specific implementation process, the heat conduction plate 421 can conduct the temperature at the bottom of the module body 1, and further transport it to the surface of the heat dissipation fin 423 through the heat dissipation copper pipe 422. Under the combined action of the heat dissipation fin 423, the heat dissipation copper pipe 422 and the heat conduction plate 421, the temperature at the bottom of the module body 1 can be dissipated.

[0040] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art will understand that various changes, modifications, substitutions, and variations can be made to the embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

[0041] As described above, only the preferred specific embodiments of the present invention are provided, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, should be covered by the protection scope of the present invention.

Claims

1. A wireless communication module with a heat dissipation function, comprising a module body (1), a support block (2) fixedly installed at the bottom of the module body (1); and a heat dissipation component (4) arranged at the bottom position of the module body (1); characterized in that: the heat dissipation component (4) includes a heat dissipation mechanism (41) installed at the bottom position of the module body (1); an auxiliary mechanism (42) is installed at the bottom position of the module body (1), and the auxiliary mechanism (42) is located inside the heat dissipation mechanism (41).

2. The wireless communication module with a heat dissipation function according to claim 1, wherein: The number of the support blocks (2) is four, the shapes and sizes of the four support blocks (2) are equal, and the four support blocks (2) are respectively fixedly installed at the four corner positions of the bottom of the module body (1).

3. The wireless communication module with heat dissipation function according to claim 1, characterized in that: The heat dissipation mechanism (41) includes an L-shaped support block (412), the L-shaped support block (412) is fixedly installed on the side wall of the module body (1), a socket block (411) is fixedly installed at the bottom of the L-shaped support block (412), a water pump (414) is fixedly installed on the inner wall of the socket block (411), a cooling pipe (415) is fixedly installed at one end of the water pump (414), an arc-shaped buckle (416) is installed on the side wall of the cooling pipe (415), and the top of the arc-shaped buckle (416) is fixedly connected to the bottom of the module body (1).

4. The wireless communication module with a heat dissipation function according to claim 3, characterized in that: The side wall of the cooling pipe (415) is in contact with the bottom of the module body (1), the inner wall of the water pump (414) is communicated with the inside of the cooling pipe (415), and an inclined plate (413) is fixedly installed on the inner wall of the L-shaped support block (412).

5. A wireless communication module with a heat dissipation function according to claim 4, characterized in that: The number of the arc-shaped buckles (416) is multiple, and the multiple arc-shaped buckles (416) are respectively equidistantly distributed on the side wall of the cooling pipe (415).

6. The wireless communication module with a heat dissipation function according to claim 1, characterized in that: The auxiliary mechanism (42) includes a heat conduction plate (421), the heat conduction plate (421) is fixedly installed at the bottom of the module body (1), a heat dissipation copper pipe (422) is fixedly installed on the side wall of the heat conduction plate (421), and a heat dissipation fin (423) is installed at the other end of the heat dissipation copper pipe (422).

7. The wireless communication module with a heat dissipation function according to claim 6, characterized in that: The top of the heat dissipation fin (423) is in contact with the bottom of the module body (1), and the heat dissipation fin (423) is symmetrically arranged with respect to the middle plane in the left and right directions of the heat conduction plate (421).

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