Dispensing device for semiconductor diode production

Abstract

The utility model discloses a dispensing device for semiconductor diode production, which relates to the technical field of semiconductor diode production and comprises a workbench, a mounting table is rotatably mounted on the workbench, and a plurality of groups of placing grooves are formed in the mounting table. According to the design scheme of the utility model, the mounting table is rotatably mounted on the workbench, the diode placement seats are mounted in the placement grooves, and when semiconductor diodes on one group of diode placement seats are dispensed by the dispensing mechanism, the diode placement seats subjected to dispensing are upwards jacked up from the placement grooves by the jacking mechanism; the mounting table rotates to a station to carry out a new round of dispensing and replacement of the diode placing seat, so that the equipment can carry out feeding and discharging without stopping, and the working efficiency is improved. And the production efficiency of the semiconductor diode is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor diode production, in particular to a glue dispensing device for semiconductor diode production. Background Art

[0002] A diode is an electronic component with two electrodes that allows current to flow in only one direction. Many applications utilize its rectification function, while varactors are used as electronic adjustable capacitors. The current directionality of most diodes is often referred to as "rectification." The most common function of a diode is to allow current to flow in only one direction (called forward bias) and block it in the opposite direction (called reverse bias). Therefore, a diode can be thought of as an electronic version of a check valve.

[0003] However, the existing dispensing device for semiconductor diode production has low dispensing efficiency and can only dispense glue to one group of diodes at a time. Moreover, the dispensing head is a fixed structure and its angle cannot be adjusted. For this reason, CN 216094559 U discloses a dispensing device for semiconductor diode production, comprising a base, wherein the four corners of the upper end face of the base are fixedly connected to columns, the upper end face of the columns is fixedly connected to a top frame, the upper end face of the top frame is detachably connected to a glue box, the lower end face of the top frame is installed with a cylinder, telescopic columns are provided on both sides of the cylinder, the lower end face of the drive shaft of the cylinder is fixedly connected to a glue preparer, the lower end face of the glue preparer is fixedly connected to a glue seat, and the lower end face of the glue seat is connected to multiple groups of universal bamboo tubes. The above-mentioned dispensing device is provided with multiple groups of dispensing heads and multiple groups of placement holes, and the number of dispensing heads and placement holes is equal, so that when dispensing semiconductor diodes, the dispensing efficiency can be greatly improved, and multiple groups of semiconductor diodes can be dispensed at the same time, thereby improving the use effect of the dispensing device for semiconductor diode production.

[0004] However, after processing a group of diodes, the dispensing device needs to manually remove the diode placement seat from the equipment and replace it with a new group of diode placement seats. During the process of replacing the diode placement seat, the equipment is in a shutdown state, affecting the production efficiency of the diode. Utility Model Content

[0005] In order to overcome the above-mentioned defects in the prior art, the utility model provides a dispensing device for producing semiconductor diodes.

[0006] The technical solution adopted by the utility model to solve its technical problems is: a dispensing device for semiconductor diode production, including a workbench, a mounting table rotatably installed on the workbench, a plurality of groups of placement slots are provided on the mounting table, and the plurality of groups of placement slots are arranged in a circular array on the mounting table, and diode placement seats are installed in the placement slots. A top plate is provided above the workbench, and a dispensing mechanism is installed on the top plate. The dispensing mechanism is aligned with any group of the diode placement seats, and a lifting mechanism is fixedly installed on the end of the workbench away from the dispensing mechanism.

[0007] Furthermore, an extension platform is provided on the left and right sides of the workbench, and columns are fixedly installed at the four corners of the extension platform, and the top plate is fixedly installed on the columns.

[0008] Furthermore, the dispensing mechanism includes a first cylinder, which is fixedly mounted on the top plate, a glue preparer is fixedly mounted on the power output end of the first cylinder, a light rod is fixedly mounted on both ends of the top of the glue preparer, the light rod is slidably mounted on the top plate, the side of the glue preparer is connected to a glue tank through a hose, the glue tank is fixedly mounted on the top plate, the bottom end of the glue preparer is fixedly connected to a glue seat, and several groups of dispensing heads are mounted on the bottom end of the glue seat.

[0009] Furthermore, a through slot is provided at the center of the mounting platform, an inner gear ring is fixedly installed on the inner wall of the through slot, a servo motor is fixedly installed inside the workbench, a gear is fixedly installed on the power output shaft of the servo motor, and the gear and the inner gear ring are meshed with each other.

[0010] Furthermore, several groups of placement holes are provided on the top of the diode placement seat, and the number of the placement holes is consistent with the number of dispensing heads. Several groups of positioning columns are fixedly installed on the bottom of the diode placement seat. The positioning columns are arranged in a circular array on the diode placement seat. The diameter of any group of positioning columns is smaller than the diameter of other positioning columns. Positioning holes corresponding to the positioning columns are provided on the bottom surface of the placement groove.

[0011] Furthermore, the lifting mechanism includes a second cylinder, a mounting groove is provided on the top of the extension platform on the right side, the second cylinder is fixedly installed in the mounting groove, a clamping block is fixedly installed on the power output shaft of the second cylinder, a clamping groove matching the clamping block is provided at the bottom center of the diode placement seat, and a through hole is provided at the axis center of the placement groove.

[0012] The beneficial effect of the present invention is that the design of the present invention is that a mounting table is rotatably installed on the workbench, and the diode placement seat is installed in the placement groove. When the semiconductor diodes on one group of diode placement seats are dispensed with glue by the dispensing mechanism, the lifting mechanism lifts the diode placement seat with dispensing completed from the placement groove to facilitate manual or robotic replacement of a new diode placement seat. When the new diode placement seat is replaced, the dispensing mechanism completes the dispensing operation, and the mounting table rotates one workstation to perform a new round of dispensing and replacement of the diode placement seat, thereby realizing non-stop loading and unloading of the equipment, and effectively improving the production efficiency of semiconductor diodes. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0015] Figure 2 This is the main view of the utility model;

[0016] Figure 3 It is a left view of the utility model;

[0017] Figure 4 for Figure 3 Schematic diagram of the cross-sectional structure in the AA direction;

[0018] Figure 5 This is a structural diagram of the mounting platform of the utility model;

[0019] Figure 6 This is a structural diagram of the diode placement seat of the utility model.

[0020] In the figure: 1. workbench, 2. mounting table, 3. placement groove, 4. diode placement seat, 5. top plate, 6. extension table, 7. column, 8. first cylinder, 9. glue preparer, 10. glue box, 11. glue seat, 12. dispensing head, 13. through groove, 14. inner gear ring, 15. servo motor, 16. gear, 17. placement hole, 18. positioning column, 19. positioning hole, 20. second cylinder, 21. mounting groove, 22. clamping block, 23. clamping groove, 24. through hole. DETAILED DESCRIPTION

[0021] In order to more clearly illustrate the technical solution of the present invention, the present invention is further described below in conjunction with the accompanying drawings. Obviously, the drawings described below are only one embodiment of the present invention. For ordinary technicians in this field, without paying any creative work, other embodiments can be obtained based on these drawings and embodiments, which all fall within the scope of protection of the present invention.

[0022] according to Figure 1-6 As shown, a dispensing device for semiconductor diode production includes a workbench 1, on which a mounting platform 2 is rotatably mounted via a bearing, a plurality of groups of placement slots 3 are provided on the mounting platform 2, and the plurality of groups of placement slots 3 are arranged in a circular array on the mounting platform 2, and diode placement seats 4 are cooperatively mounted in the placement slots 3. A top plate 5 is provided above the workbench 1, and a dispensing mechanism is cooperatively mounted on the top plate 5. The dispensing mechanism is aligned with any group of diode placement seats 4, and a lifting mechanism is fixedly mounted on the end of the workbench 1 away from the dispensing mechanism.

[0023] In this embodiment, an extension table 6 is provided on the left and right sides of the workbench 1, and columns 7 are fixedly installed at the four corners of the extension table 6. The top plate 5 is fixedly installed on the columns 7. The dispensing mechanism includes a first cylinder 8, which is fixedly installed on the top plate 5. The power output end of the first cylinder 8 is fixedly installed with a glue preparer 9, and the top two ends of the glue preparer 9 are fixedly installed with a light rod 25, which is slidably installed on the top plate 5. The side of the glue preparer 9 is connected to the glue tank 10 through a hose, and the glue tank 10 is fixedly installed on the top plate 5. The bottom end of the glue preparer 9 is fixedly connected to the glue seat 11, and the bottom end of the glue seat 11 is installed with several groups of dispensing heads 12.

[0024] In this embodiment, a through groove 13 is opened at the center of the mounting table 2, and an inner gear ring 14 is fixedly installed on the inner wall of the through groove 13. A servo motor 15 is fixedly installed inside the workbench 1, and a gear 16 is fixedly installed on the power output shaft of the servo motor 15. The gear 16 and the inner gear ring 14 are engaged with each other. The gear 16 is driven to rotate by the servo motor 15, and the mounting table 2 is rotated on the workbench 1 with the cooperation of the gear 16 and the inner gear ring 14.

[0025] In this embodiment, several groups of placement holes 17 are provided on the top of the diode placement seat 4, and the number of the placement holes 17 is consistent with the number of the dispensing heads 12. Several groups of positioning columns 18 are welded on the bottom of the diode placement seat 4. The positioning columns 18 are arranged in a circular array on the diode placement seat 4. The preferred number of positioning columns 18 is three groups, and the diameter of one group of positioning columns 18 is smaller than the diameter of the other positioning columns 18. Positioning holes 19 corresponding to the positioning columns 18 are provided on the bottom surface of the placement groove 3. The diode placement seat 4 is installed in the placement groove 3 by aligning the positioning columns 18 with the positioning holes 19, and the fool-proof design of the positioning columns 18 avoids the incorrect installation angle of the diode placement seat 4, which makes it impossible to align with the dispensing head 12.

[0026] In this embodiment, the lifting mechanism includes a second cylinder 20, and a mounting groove 21 is provided on the top of the right extension platform 6. The second cylinder 20 is fixedly installed in the mounting groove 21. A clamping block 22 is fixedly installed on the power output shaft of the second cylinder 20. A clamping groove 23 matching the clamping block 22 is provided at the bottom center of the diode placement seat 4, and a through hole 24 is provided at the axis center of the placement groove 3. When the through hole 24 is aligned with the second cylinder 20, the push rod of the second cylinder 20 is extended to insert the clamping block 22 into the clamping groove 23, and push the diode placement seat 4 upward from the placement groove 3 to facilitate the replacement of the diode placement seat 4.

[0027] When the present invention is in use, the diode placement seat 4 is first installed in the placement groove 3 in sequence, and then the first cylinder 8 drives the dispensing head 12 to descend for the dispensing operation. After the dispensing is completed, the dispensing head 12 rises, and the servo motor 15 drives the mounting table 2 to rotate one station, and repeats the above steps to perform continuous dispensing operations on semiconductor diodes. When the diode placement seat 4 after dispensing is completed moves to the position of the second cylinder 20, the push rod of the second cylinder 20 extends to lift the diode placement seat 4 from the placement groove 3, so that manual or robotic replacement of the new diode placement seat 4 is possible. When the new diode placement seat 4 is replaced, the dispensing head 12 completes the dispensing operation, and the servo motor 15 drives the mounting table 2 to rotate one station for a new round of dispensing and replacement of the diode placement seat 4, thereby realizing non-stop loading and unloading of the equipment, and effectively improving the production efficiency of semiconductor diodes.

[0028] The above embodiments are merely exemplary embodiments of the present invention and are not intended to limit the scope of the present invention. The scope of protection of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the spirit and scope of protection of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present invention.

Claims

1. A dispensing device for semiconductor diode production, comprising a workbench (1), characterized in that: The workbench (1) is rotatably provided with a mounting platform (2), and the mounting platform (2) is provided with a plurality of placement slots (3), which are arranged in a circular array on the mounting platform (2), and a diode placement seat (4) is installed in the placement slot (3). A top plate (5) is provided above the workbench (1), and a dispensing mechanism is installed on the top plate (5), and the dispensing mechanism is aligned with any one group of the diode placement seats (4). Extension platforms (6) are provided on the left and right sides of the workbench (1), and columns (7) are fixedly installed at the four corners of the extension platform (6). ), the top plate (5) is fixedly mounted on the column (7), a lifting mechanism is fixedly mounted on one end of the workbench (1) away from the dispensing mechanism, the lifting mechanism includes a second cylinder (20), a mounting groove (21) is provided on the top of the right extension platform (6), the second cylinder (20) is fixedly mounted in the mounting groove (21), a clamping block (22) is fixedly mounted on the power output shaft of the second cylinder (20), a clamping groove (23) matching the clamping block (22) is provided at the bottom center of the diode placement seat (4), and a through hole (24) is provided at the axis center of the placement groove (3).

2. A dispensing device for semiconductor diode production according to claim 1, characterized in that: The dispensing mechanism includes a first cylinder (8), the first cylinder (8) is fixedly mounted on the top plate (5), a glue preparator (9) is fixedly mounted on the power output end of the first cylinder (8), a light rod (25) is fixedly mounted on the top two ends of the glue preparator (9), the light rod (25) is slidably mounted on the top plate (5), the side of the glue preparator (9) is connected to a glue box (10) through a hose, the glue box (10) is fixedly mounted on the top plate (5), the bottom end of the glue preparator (9) is fixedly connected to a glue seat (11), and the bottom end of the glue seat (11) is mounted with a plurality of groups of dispensing heads (12).

3. A dispensing device for semiconductor diode production according to claim 2, characterized in that: A through slot (13) is provided at the center of the mounting platform (2), an inner gear ring (14) is fixedly mounted on the inner wall of the through slot (13), a servo motor (15) is fixedly mounted inside the workbench (1), a gear (16) is fixedly mounted on the power output shaft of the servo motor (15), and the gear (16) and the inner gear ring (14) are meshed with each other.

4. The dispensing device for semiconductor diode production according to claim 3, characterized in that: The top of the diode placement seat (4) is provided with a plurality of placement holes (17), the number of the placement holes (17) being consistent with the number of the dispensing heads (12), the bottom of the diode placement seat (4) is fixedly provided with a plurality of positioning columns (18), the positioning columns (18) being arranged in a circular array on the diode placement seat (4), wherein the diameter of one group of the positioning columns (18) is smaller than the diameter of the other positioning columns (18), and the bottom surface of the placement groove (3) is provided with positioning holes (19) corresponding to the positioning columns (18).

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