Device for improving wrinkling of printed circuit board (PCB) press-fit copper foil

Abstract

The utility model relates to a device for improving wrinkling of a printed circuit board (PCB) press-fit copper foil, which comprises a conveying device body, three frames in an inverted U shape are fixed between the front side and the rear side of the conveying device body, a resin storage box is fixed on the upper surface of the frame on the middle side, and a coating device body is fixed on the inner top wall of the frame on the middle side; and a preheating mechanism for preheating the PCB is arranged on the frame on the left side. According to the device for improving wrinkling of the PCB press-fit copper foil, the surface of the PCB copper foil is coated with a layer of cured resin through the coating device body, so that the PCB copper foil does not deform along with a prepreg in the high-temperature press-fit process, a layer of cured resin is arranged between the copper foil and the prepreg resin, and the carrier copper foil has rigid support; and preheating is carried out in the coating process, and the PCB is preheated, so that thermal stress caused by rapid temperature rise in the pressing process of the PCB can be reduced, and the risk of copper foil wrinkling is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of copper foil control, in particular to a device for improving wrinkling of PCB pressed copper foil. Background Art

[0002] Printed circuit boards (PCBs) support electronic components and serve as the electrical connections between them. Copper foil lamination is a crucial step in PCB manufacturing, involving the process of laminating the copper foil onto an insulating substrate. This process is highly technical, requiring precise equipment and strict process control to ensure the performance and reliability of the final product.

[0003] The wrinkling of pressed copper foil has been a common problem that has plagued the rapid development of factories. The wrinkling of copper foil is mainly caused by factors such as uneven distribution of inner layer patterns, too fast resin flow, and thin copper foil thickness. Since copper foil has great ductility, it will deform with the flow of resin during high-temperature pressing. Since the inner layer pattern has a large copper-free area, the amount of resin flow required to be filled is large, causing the copper foil to deform as well, showing poor wrinkling of wavy lines with the resin flow. The wrinkled copper thickness directly leads to open circuits, pad defects and other irreparable scrap in the later process. Therefore, this application proposes a device to improve the wrinkling of PCB pressed copper foil to solve the above problems. Utility Model Content

[0004] In response to the shortcomings of the existing technology, the utility model provides a device for improving the wrinkling of PCB pressed copper foil, which has the advantages of improving PCB performance. It solves the problem that due to the large copper-free area of the inner layer pattern, the flow of resin required to be filled is large, causing the copper foil to be deformed, showing poor wrinkling of the wavy lines with the resin flow, and the wrinkled copper thickness directly leading to open circuits, pad defects and other irreparable scrap in the later process.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a device for improving wrinkling of copper foil laminated on a PCB, comprising a conveyor body, three inverted U-shaped frames fixed between the front and rear sides of the conveyor body, a resin storage box fixed to the upper surface of the middle frame, and a coating device body fixed to the inner top wall of the middle frame;

[0006] The left frame is provided with a preheating mechanism for preheating the PCB, and the middle frame is provided with an adjustment mechanism for adjusting the PCB coating environment;

[0007] The preheating mechanism includes an electric heating plate fixed to the inner walls of the front and rear sides of the left frame, a fan A is fixed on the upper surface of the left frame, the air inlet end of the fan A is connected to and fixed with a filter tip, a filter screen is fixed on the upper surface of the filter tip, a horizontal cross tube is fixed to the inside of the left frame through a bracket, and the lower surface of the cross tube is connected to no less than two heating nozzles.

[0008] Furthermore, at least a number of heating nozzles are evenly distributed and arranged in a front-to-back tilted manner, and the heating nozzles face the electric heating plate.

[0009] Furthermore, the electric heating plate has a two-section structure, and both ends are inclined, and the angle of the lower inclined section of the electric heating plate is greater than the angle of the upper inclined section.

[0010] Furthermore, a tee pipe is connected between the air outlet end of the fan A and the horizontal pipe, and the A port of the tee pipe is connected to the air outlet end of the fan A, and the BC port of the tee pipe is connected to the horizontal pipe.

[0011] Furthermore, the regulating mechanism includes a fan B fixed on the upper surface of the frame on the middle side, the air outlet end of the fan B is connected to a tee, the BC ports of the tee are connected to a side flow pipe, the end of the side flow pipe away from the tee is connected to and fixed with an air flow nozzle, and a horizontal temperature control tube is fixed inside the frame on the middle side, and the lower surface of the temperature control tube is connected to no less than two hot air heads, and the temperature control tube is connected to the horizontal tube and the side flow tube through the pipeline.

[0012] Furthermore, two baffles and a temperature sensor are fixed inside the frame on the middle side, convection fans are fixed on the front and back of the frame on the right side, and a visual camera is fixed on the top of the frame on the right side.

[0013] Compared with the existing technology, the technical solution of this application has the following beneficial effects:

[0014] The device for improving wrinkling of PCB pressed copper foil uses a coating device body to coat a layer of cured resin on the surface of the PCB copper foil, so that the copper foil no longer deforms along with the prepreg during the high-temperature pressing process. A layer of cured resin is provided between the copper foil and the prepreg, and the carrier copper foil already has rigid support. Preheating is performed during the coating process to reduce thermal stress caused by rapid temperature rise during the pressing process, thereby reducing the risk of copper foil wrinkling. This facilitates subsequent coating of the resin film and helps reduce uneven resin flow during the PCB pressing process, thereby reducing copper foil wrinkling caused by uneven resin flow. The temperature in the middle side frame can be adjusted to a suitable coating temperature to improve the coating effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the preheating mechanism of the utility model;

[0017] Figure 3 This is a schematic diagram of the adjustment mechanism of the utility model.

[0018] In the figure: 1 conveying device body, 2 frame, 3 resin storage box, 4 coating device body, 5 preheating mechanism, 501 electric heating plate, 502 fan A, 503 filter tip, 504 filter screen, 505 horizontal pipe, 506 heating nozzle, 6 adjustment mechanism, 61 fan B, 62 side flow pipe, 63 air flow nozzle, 64 temperature control tube, 65 hot air head. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] See also Figure 1-3 In this embodiment, a device for improving wrinkling of copper foil during PCB lamination includes a conveyor body 1. Three inverted U-shaped frames 2 are fixed between the front and rear sides of the conveyor body 1. A resin storage box 3 is fixed to the upper surface of the middle frame 2. A coating device body 4 is fixed to the inner top wall of the middle frame 2.

[0021] The left side frame 2 is provided with a preheating mechanism 5 for preheating the PCB, and the middle side frame 2 is provided with an adjustment mechanism 6 for adjusting the PCB coating environment;

[0022] The present application provides a PCB pressed copper foil improvement device with a reasonable structure and complete functions, which can effectively solve the copper foil wrinkling problem in the prior art.

[0023] The preheating mechanism 5 includes an electric heating plate 501 fixed to the inner walls of the front and rear sides of the left frame 2, a fan A502 is fixed on the upper surface of the left frame 2, the air inlet end of the fan A502 is connected to and fixed with a filter 503, a filter screen 504 is fixed on the upper surface of the filter 503, a horizontal cross tube 505 is fixed to the inside of the left frame 2 through a bracket, and the lower surface of the cross tube 505 is connected to no less than two heating nozzles 506.

[0024] The preheating mechanism 5 operates by heating air via an electric heating plate 501, which is then transferred to the PCB using the airflow generated by fan A 502. Filter 503 and filter screen 504 ensure the cleanliness of the incoming air, while cross-tube 505 and heating nozzle 506 ensure even heat distribution across the PCB, achieving preheating. This design helps improve the quality and efficiency of the PCB lamination process and reduces problems such as copper foil wrinkling.

[0025] Among them, no less than a number of heating nozzles 506 are evenly distributed and arranged in a front-to-back tilted shape, and the heating nozzles 506 face the electric heating plate 501.

[0026] Heating nozzles 506 are evenly spaced across the lower surface of transverse tube 505 and arranged in a forward-backward tilt. This layout helps ensure that airflow evenly covers the surface of the PCB, achieving uniform preheating. Heating nozzles 506 face the heating plate 501, meaning their position and angle are designed to directly receive heat generated by the heating plate 501.

[0027] The electric heating plate 501 is a two-section structure, and both ends are inclined. The angle of the lower inclined section of the electric heating plate 501 is greater than the angle of the upper inclined section.

[0028] The heating plate 501 adopts a two-stage structure, with both ends designed to be inclined. This structural design helps improve thermal efficiency and allows for better circulation and distribution of hot air. The angle of the lower inclined section of the heating plate 501 is greater than that of the upper inclined section. This is likely to optimize the air flow path, allowing the hot air to be more efficiently drawn into the fan A502 and distributed to the heating nozzle 506 through the cross pipe 505.

[0029] Among them, a three-way pipe is connected between the air outlet end of fan A502 and the horizontal pipe 505, and the A port of the three-way pipe is connected to the air outlet end of fan A502, and the BC port of the three-way pipe is connected to the horizontal pipe 505.

[0030] The outlet of fan A502 is connected to cross pipe 505 via a tee. Port A of the tee is directly connected to the outlet of fan A502, while port BC is connected to cross pipe 505. This connection allows the airflow generated by fan A502 to flow smoothly into cross pipe 505 and ultimately be delivered to the PCB through heating nozzles 506. The tee design provides flexible airflow control, potentially allowing for adjustment of air volume and direction to suit varying preheating requirements.

[0031] It should be noted that in order to adjust the airflow path, valves are installed between each pipe, which will not be elaborated here.

[0032] Among them, the adjustment mechanism 6 includes a fan B61 fixed on the upper surface of the middle side frame 2, the air outlet end of the fan B61 is connected to a three-way pipe, and the BC ports of the three-way pipe are connected to the side flow pipe 62. The end of the side flow pipe 62 away from the three-way pipe is connected to the air flow nozzle 63, and a horizontal temperature control tube 64 is fixed inside the middle side frame 2. The lower surface of the temperature control tube 64 is connected to no less than two hot air heads 65. The temperature control tube 64 is connected to the cross pipe 505 and the side flow tube 62 through the pipeline.

[0033] Among them, two baffles and a temperature sensor are fixed inside the middle side frame 2, convection fans are fixed on the front and back of the right side frame 2, and a visual camera is fixed on the top of the right side frame 2.

[0034] Finally, this application coats the copper foil with a layer of cured resin, preventing it from deforming with the prepreg during the high-temperature lamination process. A layer of cured resin exists between the copper foil and the prepreg, providing rigid support for the carrier copper foil. This prevents the copper foil from deforming with the resin flow during the high-temperature lamination process. This can lead to wrinkling and scrapping of the copper foil due to the large copper-free areas in the inner pattern and the large amount of resin required to fill it. This improves the yield of the laminated panels and reduces the cost of scrapping the panel material.

[0035] The working principle of the above embodiment is as follows: the PCB with copper foil is transported and coated by the conveying device body 1. First, the PCB passes through the preheating mechanism 5 on the left. Under the operation of the fan A502, the outer gas is filtered through the filter 504 and then passes through the filter tip 503 to reach the horizontal pipe 505 and is ejected through the heating nozzle 506. At this time, the gas will be heated by the electric heating plate 501 and directly reach the upper side of the PCB to preheat the PCB. After preheating, it reaches the middle side frame 2 and is coated with resin by the coating device body 4. The fan B61 is operated at the PCB inlet and outlet on both sides of the frame 2, and the gas is ejected through the air flow nozzle 63 to form an air wall to increase the sealing effect in the middle side frame 2. At the same time, the hot air in the horizontal pipe 505 and the normal temperature gas in the side flow pipe 62 can adjust the temperature in the middle side frame 2 to facilitate the coating of the copper foil resin. Finally, the convection fan in the rightmost frame 2 is used to cool the coated resin to facilitate rapid shaping of the resin.

[0036] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0037] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention.

Claims

1. A device for improving wrinkling of copper foil pressed on a PCB, comprising a conveying device body (1), characterized in that: Three inverted U-shaped frames (2) are fixed between the front and rear sides of the conveying device body (1); a resin storage box (3) is fixed to the upper surface of the middle frame (2); and a coating device body (4) is fixed to the inner top wall of the middle frame (2); Wherein, a preheating mechanism (5) for preheating the PCB is provided on the left frame (2), and an adjustment mechanism (6) for adjusting the PCB coating environment is provided on the middle frame (2); The preheating mechanism (5) comprises an electric heating plate (501) fixed to the inner walls of the front and rear sides of the left frame (2); a fan A (502) is fixed to the upper surface of the left frame (2); a filter (503) is connected and fixed to the air inlet end of the fan A (502); a filter screen (504) is fixed to the upper surface of the filter (503); a horizontal transverse tube (505) is fixed to the interior of the left frame (2) via a bracket; and no less than two heating nozzles (506) are connected to the lower surface of the transverse tube (505).

2. The device for improving wrinkling of PCB pressed copper foil according to claim 1, characterized in that: No less than a number of heating nozzles (506) are distributed at equal intervals and arranged in a forward and backward tilted manner, and the heating nozzles (506) face the electric heating plate (501).

3. The device for improving wrinkling of PCB pressed copper foil according to claim 1, characterized in that: The electric heating plate (501) is a two-section structure, and both ends are inclined, and the angle of the lower inclined section of the electric heating plate (501) is greater than the angle of the upper inclined section.

4. The device for improving wrinkling of PCB pressed copper foil according to claim 1, characterized in that: A tee is connected between the air outlet of the fan A (502) and the transverse pipe (505), and the A port of the tee is connected to the air outlet of the fan A (502), and the BC port of the tee is connected to the transverse pipe (505).

5. The device for improving wrinkling of PCB pressed copper foil according to claim 1, characterized in that: The regulating mechanism (6) includes a fan B (61) fixed on the upper surface of the middle frame (2), the air outlet end of the fan B (61) is connected to a three-way pipe, the BC ports of the three-way pipe are both connected to a side flow pipe (62), the end of the side flow pipe (62) away from the three-way pipe is connected to an air flow nozzle (63), and a horizontal temperature control pipe (64) is fixed inside the middle frame (2), and the lower surface of the temperature control pipe (64) is connected to a number of not less than two hot air heads (65), and the temperature control pipe (64) is connected to the transverse pipe (505) and the side flow pipe (62) through a pipeline.

6. The device for improving wrinkling of PCB pressed copper foil according to claim 1, characterized in that: Two baffles and a temperature sensor are fixed inside the middle frame (2), convection fans are fixed on the front and back of the right frame (2), and a visual camera is fixed on the top of the right frame (2).

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