Jig

Abstract

The embodiment of the utility model relates to the technical field of galvanometer chip manufacturing, in particular to a jig. The jig comprises a base plate and a first cover plate. The base plate is provided with a first surface and a second surface which are opposite in the first thickness direction, the first surface is provided with a plurality of containing grooves, the containing grooves are used for containing galvanometer chips, and the first thickness direction is the thickness direction of the base plate. The first cover plate is provided with a plurality of first through grooves penetrating through the first cover plate, each containing groove corresponds to one first through groove, the first cover plate is used for being installed on the first surface so that the first through grooves can be communicated with the containing grooves, the first cover plate is provided with first limiting parts in the first through grooves, and the first limiting parts are used for abutting against the galvanometer chips contained in the containing grooves. Based on the structure, the first limiting part can abut against and fix the galvanometer chip located in the containing groove, and the first through groove facilitates scrubbing of the surface, exposed in the first through groove, of the chip. And when the process is switched to the oxygen washing process, the first cover plate is dismounted, the galvanometer chip does not need to be put in and taken out for many times, and damage to the galvanometer chip is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of galvanometer chip manufacturing, and in particular to a jig. Background Art

[0002] Currently, some lidars use galvanometer chips to deflect laser beams. Since the galvanometer chip includes a rotatable reflector, the laser beam can form a specific detection field of view outside the lidar under the action of the reflector.

[0003] During the manufacturing process, the galvanometer chip is bonded to a glass sheet to achieve thinning and other processes. After debonding, the galvanometer chip undergoes processes such as brushing, oxygen cleaning, mirror inspection, and coating. Utility Model Content

[0004] In related technologies, due to differences in process flow, the galvanometer chip is typically placed on different types of carrier plates for brush cleaning and oxygen cleaning, respectively. Each carrier plate is equipped with a slot for holding the galvanometer chip. Therefore, as the process switches, the galvanometer chip needs to be placed in and out multiple times, which can easily damage the galvanometer chip.

[0005] The embodiment of the present application provides a jig that can improve the current situation where the galvanometer chip needs to be taken out and put back into a carrier plate multiple times when switching between multiple processes, which easily causes damage to the galvanometer chip.

[0006] The jig is used to install the galvanometer chip, and the jig includes a chassis and a first cover. The chassis has a first surface and a second surface that are opposite to each other along a first thickness direction. The first surface is provided with a plurality of receiving grooves, and the receiving grooves are used to receive the galvanometer chip. The first thickness direction is the thickness direction of the chassis. The first cover is provided with a plurality of first through-grooves that pass through the first cover, and each receiving groove corresponds to a first through-groov. The first cover is used to be installed on the first surface so that the first through-grooves are connected to the receiving grooves. The first cover is provided with a first limiting portion on the first through-grooves, and the first limiting portion is used to support the galvanometer chip received in the receiving groove.

[0007] Optionally, a first through hole is provided on the bottom surface of the receiving groove.

[0008] Optionally, the plurality of receiving slots are arranged in a linear array along a first direction and a second direction, and a row of the receiving slots arranged along the first direction constitutes a receiving slot group, wherein the first direction, the second direction, and the first thickness direction are perpendicular to each other. The first surface is provided with a connecting groove, and within the same receiving slot group, two adjacent receiving slots are connected via the connecting groove, wherein the first direction, the second direction, and the first thickness direction are perpendicular to each other. The connecting groove passes through the chassis along the first thickness direction.

[0009] Optionally, the edge of the chassis is provided with two first protrusions arranged opposite each other along a third direction, the third direction being parallel to the first plane. Along the edge contour of the chassis, the first protrusions are provided to protrude away from the center of the first surface relative to adjacent edge portions. The edge of the first cover plate is provided with two second protrusions, each second protrusion corresponding to one first protrusion. Along the edge contour of the first cover plate, the second protrusions are provided to protrude away from the center of the first cover plate relative to adjacent edge portions.

[0010] Optionally, the sidewalls of the first through groove include two sidewalls opposite to each other along a first direction and two sidewalls opposite to each other along a second direction, wherein the first direction, the second direction and the first thickness direction are perpendicular to each other, and the first limiting portion connects two adjacent sidewalls.

[0011] Optionally, the jig further includes a base plate and a second cover plate. The base plate is mounted on the second surface to block the first through hole. The second cover plate is provided with a second through slot, with each receiving slot corresponding to a second through slot. The second cover plate is mounted on the first surface such that the second through slot communicates with the receiving slot, and the projection of the second through slot is located within the receiving slot.

[0012] Optionally, the second cover plate has a third surface and a fourth surface that are opposed to each other along a second thickness direction, where the second thickness direction is the thickness direction of the second cover plate, and the third surface is configured to be mounted on the first surface. The second cover plate further includes a second stopper protruding from the third surface, the second stopper being disposed around the second through-slot and configured to support the galvanometer chip received in the receiving slot.

[0013] Optionally, the second cover plate includes a fifth surface and a fourth surface arranged opposite to each other along the second thickness direction, the fifth surface is concavely arranged to form a receiving groove, the bottom surface of the receiving groove is the third surface, and the chassis is received in the receiving groove.

[0014] Optionally, the second cover plate is provided with an avoidance groove communicating with the side wall of the accommodating groove and the outer side surface of the second cover plate, and the avoidance groove is used to accommodate the first protrusion.

[0015] Optionally, the jig further comprises at least two positioning posts fixed to the base plate, the positioning posts extending along a third thickness direction, which is the thickness direction of the base plate. The chassis is provided with at least two first positioning holes, and the second cover is provided with at least two second positioning holes. The positioning posts, the first positioning holes, and the second positioning holes are correspondingly arranged, and the positioning posts are configured to pass through the corresponding first positioning holes and second positioning holes to achieve positioning of the base plate, the chassis, and the second cover.

[0016] The beneficial effects of the embodiments of the present application are as follows: Different from the prior art, the embodiments of the present application provide a jig for installing a galvanometer chip, and the jig includes a chassis and a first cover plate. The chassis has a first surface and a second surface opposite to each other along a first thickness direction, the first surface is provided with a plurality of receiving grooves, the receiving grooves are used to accommodate the galvanometer chip, and the first thickness direction is the thickness direction of the chassis. The first cover plate is provided with a plurality of first through grooves that pass through the first cover plate, each of the receiving grooves corresponds to a first through groove, the first cover plate is used to be installed on the first surface so that the first through groove is connected to the receiving groove, the first cover plate is provided with a first limiting portion on the first through groove, and the first limiting portion is used to support the galvanometer chip accommodated in the receiving groove.

[0017] Based on the above structure, the galvanometer chip is accommodated in the receiving groove, and the cover plate is then placed on the base plate, so that the first limiter can abut and fix the galvanometer chip in the receiving groove. The first through-groove is also provided to facilitate scrubbing of the chip surface exposed in the first through-groove during the scrubbing process. When switching to the oxygen scrubbing process, only the first cover plate needs to be removed, eliminating the need to repeatedly insert and remove the galvanometer chip, thus reducing damage to the galvanometer chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the drawings without creative work.

[0019] Figure 1 This is a three-dimensional diagram of a fixture provided in one embodiment of the present application;

[0020] Figure 2 This application Figure 1Enlarged view of the middle A area;

[0021] Figure 3 This application Figure 1 Exploded view of the middle fixture;

[0022] Figure 4 is a three-dimensional diagram of a fixture provided in another embodiment of the present application;

[0023] Figure 5 This application Figure 4 A three-dimensional schematic diagram of the middle fixture from another direction;

[0024] Figure 6 This application Figure 4 Exploded view of the middle fixture;

[0025] Figure 7 This application Figure 4 A three-dimensional view of the second cover plate.

[0026] The reference numerals of the fixture 1000 are as follows:

[0027] chassis 100 Second cover 400 First surface 110 Second through groove 410 Storage tank 111 The third surface 420 First through hole 1111 Fourth surface 430 Second surface 120 The second limiting part 440 connecting groove 130 Fifth Surface 450 First protrusion 140 Receiving slot 451 First positioning hole 150 avoidance groove 460 First cover 200 Second positioning hole 470 First through groove 210 First thickness direction F1 Side wall 211 First direction F2 The first limiting part 220 Second direction F3 Second protrusion 230 The third direction F4 baseplate 300 Second thickness direction F5 Positioning column 310 The third thickness direction F6 DETAILED DESCRIPTION

[0028] In order to facilitate understanding of the present application, the present application is described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or there can be one or more centered elements therebetween. When an element is described as "connected to" another element, it can be directly connected to the other element, or there can be one or more centered elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this specification are for illustrative purposes only.

[0029] Unless otherwise defined, all technical and scientific terms used in this specification have the same meanings as those commonly understood by those skilled in the art to which this application belongs. The terms used in this specification and in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the relevant listed items.

[0030] In related technologies, due to differences in process steps, the galvanometer chip is typically placed on different types of carrier plates for scrubbing, oxygen cleaning, and coating. Each carrier plate is equipped with a cradle for the galvanometer chip. Consequently, the galvanometer chip must be placed and removed multiple times between process steps, which can easily damage the chip.

[0031] Based on this, an embodiment of the present application provides a fixture 1000 for installing a galvanometer chip, which can improve the current situation in which the galvanometer chip is easily damaged due to the need to place and take out the galvanometer chip multiple times during the switching of multiple processes.

[0032] See also Figures 1 to 3 , which respectively show a stereogram of a fixture 1000 provided in one embodiment of the present application, Figure 1 An enlarged view of the area in the middle A and an exploded view of the fixture 1000. The fixture 1000 includes a chassis 100 and a first cover plate 200. The chassis 100 has a first surface 110 and a second surface 120 that are opposite to each other along a first thickness direction F1. The first surface 110 is provided with a plurality of receiving grooves 111, which are used to receive the galvanometer chip; wherein the first thickness direction F1 is the thickness direction of the chassis 100. The first cover plate 200 is provided with a plurality of first through grooves 210 that pass through the first cover plate 200, and each receiving groove 111 corresponds to a first through groove 210; the first cover plate 200 is used to be installed on the first surface 110 so that the first through groove 210 is connected to the receiving groove 111, and the first cover plate 200 is provided with a first limiting portion 220 in the first through groove 210, and the first limiting portion 220 is used to support the galvanometer chip received in the receiving groove 111.

[0033] It should be noted that, in this embodiment, the galvanometer chip is a two-dimensional galvanometer chip; specifically, the galvanometer chip includes a base, an inner frame and a reflector, the base is provided with a first through-groove, the inner frame is provided in the aforementioned first through-groove and can rotate relative to the base, the inner frame is provided with a second through-groove, the reflector is provided in the second through-groove and can rotate relative to the inner frame; the rotation direction of the reflector relative to the frame is different from the rotation direction of the inner frame relative to the base, so that the reflector can achieve two-dimensional rotation relative to the base. It is understandable that in other embodiments of the present application, the galvanometer chip can also be a one-dimensional galvanometer chip. Next, the specific structure of the above-mentioned chassis 100 and cover plate 200 will be described in detail in conjunction with the accompanying drawings.

[0034] For the chassis 100 above, see Figures 2 to 3 , while combining Figure 1The chassis 100 is a flat plate-like structure as a whole, and is provided with a plurality of receiving grooves 111 to accommodate the galvanometer chip through the receiving grooves 111. Specifically, the chassis 100 has a first surface 110 and a second surface 120 that are opposite to each other along the first thickness direction F1 shown in the figure. Among them, the first surface 110 is provided with a plurality of receiving grooves 111, and the receiving grooves 111 are concavely arranged from the first surface 110 toward the second surface 120, and the plurality of receiving grooves 111 are arranged in a linear array along the first direction F2 and the second direction F3 shown in the figure; of course, in other embodiments of the present application, the receiving grooves 111 can also be arranged in other ways, and the present application does not make specific limitations on this. The depth of the concave receiving groove 111 can be greater than the thickness of the galvanometer chip, so as to facilitate the accommodation of the galvanometer chip and improve the reliability of the galvanometer chip in the receiving groove. It should be noted that the "first direction", "second direction" and the above-mentioned first thickness direction described in the present application document are perpendicular to each other.

[0035] The bottom surface of the receiving groove 111 is provided with a first through-hole 1111, which extends through the second surface 120. This first through-hole 1111 is used to allow the cleaning medium to flow out of the receiving groove 111 during the brush cleaning or oxygen cleaning of the galvanometer chip, thereby preventing excessive cleaning medium from remaining in the receiving groove. In this embodiment, the bottom surface of the receiving groove 111 is provided with a plurality of first through-holes 1111, specifically including a first central through-hole located at the center of the bottom surface of the receiving groove 111 and a plurality of first peripheral through-holes arranged around the first central through-hole. The diameter of the first central through-hole can be larger than the diameter of the first peripheral through-holes.

[0036] Taking into account that after the galvanometer chip is placed in the receiving groove 111, the staff can more conveniently remove the galvanometer chip from the receiving groove 111 by using tools such as tweezers, in some embodiments, the first surface 110 is further provided with a connecting groove 130. Specifically, a row of receiving grooves 111 arranged along the first direction F2 constitutes a receiving groove group, and multiple receiving groove groups are arranged in sequence along the second direction F3. In the same receiving groove 111 group, a connecting groove is provided between two adjacent receiving grooves 111, and the two adjacent receiving grooves 111 are connected through the connecting groove 130. Since the connecting groove 130 is connected to the receiving groove 111, the staff can extend the claws of tweezers and other tools into the receiving groove 111 through the connecting groove 130, and then remove the galvanometer chip from the receiving groove 111; similarly, the connecting groove 130 also provides an avoidance space for the grasping tool, which is convenient for tweezers and other tools to store the tool when taking and placing the galvanometer chip to avoid interference. Optionally, the connecting groove 130 passes through the chassis 100 along the first thickness direction F1; since the chassis 100 itself is flat as a whole, the setting of the connecting groove 120 passing through the first surface 110 and the second surface 120 is easier to form during manufacturing, which is beneficial to reduce the manufacturing difficulty of the connecting groove 130 to a certain extent.

[0037] For the first cover plate 200, please refer to Figure 2 and Figure 3 and in combination with other attached drawings, the first cover plate 200 is also in an overall flat plate-like structure. The first cover plate 200 is used to cooperate with the chassis 100 together to fix the galvanometer chip during the brushing process, so as to facilitate the brushing of the galvanometer chip and prevent the galvanometer chip from detaching from the chassis 200 during the brushing process. Specifically, the first cover plate 200 has a grid-like structure and is provided with a plurality of first through slots 210 corresponding to the above-mentioned receiving grooves 111; when the first cover plate 200 is installed on the chassis 100, each first through slot 210 corresponds to and communicates with a receiving groove 111. In some embodiments, the first through slot 210 is generally square, and the side walls of the first through slot 210 include two side wall surfaces 211 opposite to each other along the first direction F2 and two side wall surfaces 211 opposite to each other along the second direction F3. In addition, the first cover plate 200 further has a first limiting portion 220 in the first through slot 111, and the first limiting portion 220 is used to abut against the galvanometer chip received in the receiving groove 111 to limit the movement of the galvanometer chip.

[0038] In some embodiments, the first limiting portions 220 are respectively connected to adjacent side wall surfaces 211. For example, the first limiting portion can be arc-shaped and extends from one side wall surface to the adjacent other side wall surface; optionally, a first limiting portion can be provided at each corner in each first through slot 210 to press against the four corners of the galvanometer chip, so that the galvanometer chip is uniformly stressed, thereby improving the reliability of fixing the galvanometer chip; among them, the four first limiting portions 220 at the center of the four first through slots 210 forming a "field" shape can enclose an approximate circle. Thus, while having the function of pressing against the galvanometer chip, the first limiting portion 220 can also act as a reinforcing rib to strengthen the rigidity of the first cover plate 200.

[0039] Combined with the above first cover plate 200 and chassis 100, the jig 1000 during the brushing process will be further described.

[0040] To facilitate handling and carrying of the chassis 100 and first cover plate 200, the edge of the chassis 100 is provided with two first protrusions 140 arranged opposite each other along the third direction F4 shown in the figure. Along the edge contour of the chassis 100, the first protrusions 140 project away from the center of the first surface 110 relative to the adjacent edge portions. The edge of the first cover plate 200 is provided with two second protrusions 230, each corresponding to a first protrusion 140. Along the edge contour of the first cover plate 200, the second protrusions 230 project away from the center of the first cover plate 200 relative to the adjacent edge portions. The design of the first and second protrusions 140 and 230 not only provides areas for gripping or clamping, thereby facilitating handling and carrying of the first cover plate 200 and chassis 100, but also facilitates rough positioning of the chassis 100 and first cover plate 200 using the first and second protrusions 140 and 230. Optionally, the first protrusion 140 and the second protrusion 230 are substantially arcuate in shape to reduce structural stress of the chassis 100 and the first cover plate 200 .

[0041] In some embodiments, to facilitate the fixing of the first cover plate 200 and the chassis 100, the first cover plate 200 and the chassis 100 may be connected by magnetic attraction. The magnetically connected first cover plate 200 and chassis 100, on the one hand, can improve the positioning accuracy between the first cover plate 200 and the chassis 100 due to the magnetic attraction force, and on the other hand, the installation connection of the magnetically connected first cover plate 200 and chassis 100 is simple and efficient. Of course, in some other embodiments, the first cover plate 200 and the chassis 100 may also be fixed by other connection structures such as a snap connection, a screw connection, etc., and this application does not specifically limit the connection method between the two.

[0042] Please also refer to Figures 1 to 3 , and further illustrate the method of using the fixture 1000 provided in this application in combination with the above-mentioned brushing and oxygen washing processes.

[0043] First, place the galvanometer chip in the receiving groove 111 and place the first cover plate 200 on the chassis 100. The first protrusion 140 and the second protrusion 230 are aligned to align the first cover plate 200 and chassis 100. The first cover plate 200 and chassis 100 are secured magnetically. At this point, the galvanometer chip can be cleaned. A cleaning medium can enter the receiving groove 111 from the first through-groove 210 to clean the galvanometer chip and then flow out of the chassis 100 through the first through-hole 1111.

[0044] After the scrubbing process is complete, the first cover plate 200 is removed from the top of the chassis 100, leaving only the chassis 100 to house the galvanometer chip. At this point, the galvanometer chip in the receiving groove 111 can be oxygen-washed. Gas can flow through the notch of the receiving groove 111, the first through-hole 1111, and the connecting groove 130 to the surface of the galvanometer chip.

[0045] The jig 1000 provided in the embodiment of the present application includes a chassis 100 and a first cover plate 200. The chassis 100 has a first surface 110 and a second surface 120 that are opposite to each other along a first thickness direction F1. The first surface 110 is provided with a plurality of receiving grooves 111, and the receiving grooves 111 are used to receive the galvanometer chip. The first cover plate 200 is provided with a plurality of first through grooves 210 that pass through the first cover plate 200, and each receiving groove 111 corresponds to a first through groove 210. The first cover plate 200 is used to be installed on the first surface 110 so that the first through grooves 210 are connected to the receiving grooves 111. The first cover plate 200 is provided with a first limiting portion 220 in the first through groove 210, and the first limiting portion 220 is used to support the galvanometer chip received in the receiving groove 111. Based on the above structure, the galvanometer chip is accommodated in the receiving groove 111, and the cover plate is then placed on the chassis 100. This allows the first stopper 220 to abut and secure the galvanometer chip in the receiving groove 111. Furthermore, the first through-groove 210 facilitates scrubbing of the chip surface exposed within the first through-groove 210 during the scrubbing process. When switching to the oxygen scrubbing process, only the first cover plate 200 needs to be removed, eliminating the need to repeatedly insert and remove the galvanometer chip from the receiving groove 111, thus reducing damage to the galvanometer chip.

[0046] See also Figures 4 to 7 , which respectively shows a three-dimensional view from two directions, an exploded view, and a three-dimensional view of the second cover plate 400 of a jig 1000 provided in another embodiment of the present application. In this embodiment, the jig 1000 includes not only a chassis 100 and a first cover plate 200 (not shown in the figure), but also a bottom plate 300 and a second cover plate 400. As can be seen from the above, in addition to brush cleaning and oxygen cleaning, the galvanometer chip also requires a coating process, and the jig 1000 including the first cover plate 200 and chassis 100 cannot meet the requirements of the coating process.

[0047] For the above base plate 300, please refer to Figure 6, and in combination with other drawings, the bottom plate 300 is used to be installed on the second surface 120 to block the first through hole 1111. For the convenience of explanation, the side of the reflector in the galvanometer chip that reflects is referred to as the front side, and the other side is referred to as the back side. Because in the coating process, when the galvanometer chip is accommodated in the receiving groove 111, the front side is arranged away from the first through hole 111; and the coating process only needs to coat the front side of the reflector in the galvanometer chip, so the above-mentioned bottom plate 300 is installed on the second surface 120, which can block the first through hole 1111, thereby preventing the granular vapor deposition material from being deposited on the bottom surface of the galvanometer chip through the first through hole 1111.

[0048] For the second cover plate 400, see Figure 7 , and combined with Figures 4 to 6 The second cover plate 400 is provided with a second through slot 410, and each receiving slot 111 corresponds to a second through slot 410. The second cover plate 400 is used to be installed on the first surface 110 so that the second through slot 410 is connected to the receiving slot 111, and the projection of the second through slot 410 is located in the receiving slot 111, and the second through slot 410 is used to expose the reflector of the galvanometer chip. The second cover plate 400 is used to expose the reflector of the galvanometer chip through the second through slot 410, while shielding other parts of the galvanometer chip through other parts. In this way, when the galvanometer chip is coated, the granular coating material can enter the receiving slot 111 through the second through slot 410 and be deposited on the reflector surface of the galvanometer chip to form a reflective film, without being deposited on other parts of the galvanometer chip.

[0049] Specifically, see Figure 6 and Figure 7 , and combined with Figure 4 and Figure 5 The second cover plate 400 has a third surface 420 and a fourth surface 430 that are opposite to each other along a second thickness direction F5. The third surface 420 is the surface for mounting on the first surface 110, and the fourth surface 430 is the surface facing away from the chassis 100. The second thickness direction F5 is the thickness direction of the second cover plate 400. When the second cover plate 400 is mounted on the first surface 110, the second thickness direction F5 is consistent with the first thickness direction. In some embodiments, please refer to Figure 7 , and in combination with other drawings. The second cover plate 400 includes a fifth surface 450 and a fourth surface 430 arranged opposite to each other along the second thickness direction F5, and the fifth surface 450 is concavely arranged to form a receiving groove 451 ( Figure 5), the bottom surface of the receiving groove 451 is the third surface 420. When the second cover plate 400 is installed on the chassis 100, the chassis 100 is received in the receiving groove 451, and the third surface 420 of the second cover plate 400 is in contact with the first surface 110 of the chassis 100. In this way, the bottom plate 300 and the second cover plate 400 completely wrap the chassis 100, which means that for the galvanometer chip 200 located in the chassis 100, only the second through groove 410 is connected to the outside atmosphere, which can effectively reduce the risk of the coating material of the particle transfer penetrating into the receiving groove 111 through the gap between the chassis 100, the bottom plate 200 and the second cover plate 300.

[0050] Further, see Figure 7 , and combined with Figures 4 to 6 The second cover plate 400 also includes a second limiting portion 440 protruding from the third surface 420; the second limiting portion 440 is arranged around the second through-slot 410. Similar to the above-mentioned first limiting portion, the second limiting portion 440 is used to resist the galvanometer chip accommodated in the receiving groove 111. The outer contour of the second limiting portion 440 is a flat rectangular parallelepiped, the middle of which is penetrated by the above-mentioned second through-slot 410, and the entire portion is arranged around the second through-slot 410. When the second cover plate 400 is installed on the chassis 100, the second limiting portion 440 extends into the above-mentioned receiving groove 111 and applies a resisting force to the galvanometer chip located in the receiving groove 111 to fix the galvanometer chip and ensure that the galvanometer chip is stable and motionless during the coating process.

[0051] In some embodiments, see Figure 6 , and combined with Figures 4 to 6 The second cover plate 400 is further provided with an escape groove 460 connecting the sidewall of the receiving groove 451 with the outer side surface of the second cover plate 400. The escape groove 460 is used to accommodate the first protrusion 140. The provision of the receiving groove 451 allows the second cover plate 400 to completely cover the chassis 100. On the other hand, it also provides a rough positioning effect for the second cover plate 400 and the chassis 100. The entire penetration of the receiving groove 451 through the edge of the second cover plate 400 facilitates observation of the first protrusion 130 during the positioning and installation process.

[0052] In order to facilitate the installation and positioning of the second cover plate 400, the chassis 100 and the bottom plate 300 in the coating process, please refer to the following for details. Figure 4 and Figure 6, further providing the following technical solution: the jig 1000 further includes at least two positioning posts 310 fixed to the base plate 300. The positioning posts 310 extend along a third thickness direction F6, which is the thickness direction of the base plate 300. The chassis 100 is provided with at least two first positioning holes 150, and the second cover plate 400 is provided with at least two second positioning holes 470. The positioning posts 310, the first positioning holes 150, and the second positioning holes 470 are correspondingly arranged. The positioning posts 310 are configured to pass through the corresponding first positioning holes 150 and second positioning holes 470 to achieve positioning of the base plate 300, chassis 100, and second cover plate 400. It can be understood that the plug-in fit between the two positioning posts 310 and the first positioning holes 150 and the second positioning holes 470, respectively, improves the accuracy of the installation and positioning of the second cover plate 400, chassis 100, and base plate 300, and reduces the circumferential deflection that can easily occur with a single positioning post 310 and positioning hole during positioning. Here, “circumferential deflection” refers to the process of rotating around the axis of one of the positioning posts 310 .

[0053] In the examples of this application, please refer to Figure 4 and Figure 6 , and combined with Figure 5 and Figure 7 There are five positioning posts 310 , four of which are connected to form a rectangle, and another positioning post 310 is placed at the geometric center of the rectangle. The first positioning hole 150 and the second positioning hole 470 are correspondingly arranged, thereby increasing the number of positioning posts 310 to improve the accuracy of installation and positioning.

[0054] Please also refer to Figures 1 to 7 , and further illustrate the method of using the fixture 1000 provided in this application in combination with the above-mentioned brushing, oxygen cleaning and coating processes.

[0055] First, place the galvanometer chip in the receiving groove 111 and place the first cover plate 200 on the chassis 100. The first protrusion 140 and the second protrusion 230 are aligned to align the first cover plate 200 and chassis 100. The first cover plate 200 and chassis 100 are secured magnetically. At this point, the galvanometer chip can be cleaned. A cleaning medium can enter the receiving groove 111 from the first through-groove 210 to clean the galvanometer chip and then flow out of the chassis 100 through the first through-hole 1111.

[0056] After the scrubbing process is complete, the first cover plate 200 is removed from the top of the chassis 100, leaving only the chassis 100 to house the galvanometer chip. At this point, the galvanometer chip in the receiving groove 111 can be oxygen-washed. Gas can flow through the notch of the receiving groove 111, the first through-hole 1111, and the connecting groove 130 to the surface of the galvanometer chip.

[0057] After oxygen washing is completed, the positioning post 310 of the bottom plate 300 is passed through the first positioning hole 150 of the chassis 100 to complete the positioning of the bottom plate 300 and the chassis 100; next, the positioning post 310 is extended into / through the second positioning hole 470 of the second cover plate 400 to complete the positioning between the chassis 100 and the second cover plate 400, and the chassis 100 is accommodated in the receiving groove 451. The second cover plate 400 is supported on the first surface 110 of the chassis 100 through the third surface 420, and the galvanometer chip accommodated in the chassis 100 is supported by the second limiting portion 440. At this time, the galvanometer chip can be coated. The granular coating material can enter the receiving groove 111 from the second through groove 410 and be deposited on the reflector to form a reflective film.

[0058] The jig 1000 provided in the embodiment of the present application includes a chassis 100 and a first cover plate 200. The chassis 100 has a first surface 110 and a second surface 120 that are opposite to each other along a first thickness direction F1. The first surface 110 is provided with a plurality of receiving grooves 111, and the receiving grooves 111 are used to receive the galvanometer chip. The first cover plate 200 is provided with a plurality of first through grooves 210 that pass through the first cover plate 200, and each receiving groove 111 corresponds to a first through groove 210. The first cover plate 200 is used to be installed on the first surface 110 so that the first through grooves 210 are connected to the receiving grooves 111. The first cover plate 200 is provided with a first limiting portion 220 in the first through groove 210, and the first limiting portion 220 is used to support the galvanometer chip received in the receiving groove 111. Based on the above structure, the galvanometer chip is accommodated in the receiving groove 111, and the cover plate is then placed on the chassis 100. This allows the first stopper 220 to abut and secure the galvanometer chip in the receiving groove 111. Furthermore, the first through-groove 210 facilitates scrubbing of the chip surface exposed within the first through-groove 210 during the scrubbing process. When switching to the oxygen scrubbing process, only the first cover plate 200 needs to be removed, eliminating the need to repeatedly insert and remove the galvanometer chip from the receiving groove 111, thus reducing damage to the galvanometer chip.

[0059] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of this application. However, the present application can be implemented in many different forms and is not limited to the embodiments described in this specification. These embodiments are not intended to be additional limitations on the content of this application. The purpose of providing these embodiments is to make the understanding of the disclosure of this application more thorough and comprehensive. In addition, the above-mentioned technical features can be combined with each other to form various embodiments not listed above, which are all considered to be within the scope of the description of this application; further, it is obvious to those skilled in the art that improvements or changes can be made based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A fixture for installing a galvanometer chip, characterized in that: include: A chassis having a first surface and a second surface opposite to each other along a first thickness direction, wherein the first surface is provided with a plurality of receiving grooves for receiving the galvanometer chip, and the first thickness direction is the thickness direction of the chassis; and The first cover plate is provided with a plurality of first through grooves passing through the first cover plate, each of the receiving grooves corresponds to one first through groove, the first cover plate is used to be installed on the first surface so that the first through grooves are connected with the receiving grooves, the first cover plate is provided with a first limiting portion in the first through groove, and the first limiting portion is used to support the galvanometer chip received in the receiving groove.

2. The fixture according to claim 1, characterized in that: A first through hole is provided on the bottom surface of the receiving groove.

3. The fixture according to claim 1, characterized in that: The plurality of receiving grooves are arranged in a linear array along the first direction and the second direction, and a row of the receiving grooves arranged along the first direction constitutes a receiving groove group, wherein the first direction, the second direction and the first thickness direction are perpendicular to each other; The first surface is provided with a connecting groove, and two adjacent receiving grooves in the same receiving groove group are connected through the connecting groove; The communicating groove passes through the bottom plate along the first thickness direction.

4. The fixture according to claim 1, characterized in that: The edge of the chassis is provided with two first protrusions arranged opposite to each other along a third direction, and the third direction is a direction parallel to the first surface; Along the edge contour of the chassis, the first protrusion is arranged to protrude in a direction away from the center of the first surface relative to the adjacent edge portion; Two second protrusions are provided on the edge of the first cover plate, and each second protrusion corresponds to one first protrusion; Along the edge contour of the first cover plate, the second protrusion is arranged to protrude in a direction away from the center of the first cover plate relative to the adjacent edge portion.

5. The fixture according to claim 1, characterized in that: The sidewall of the first through groove includes two side wall surfaces opposite to each other along a first direction and two side wall surfaces opposite to each other along a second direction, and the first direction, the second direction and the first thickness direction are perpendicular to each other; The first limiting portion connects two adjacent side wall surfaces.

6. The fixture according to claim 4, characterized in that: The bottom surface of the receiving groove is provided with a first through hole; The fixture also includes: a bottom plate, configured to be mounted on the second surface to block the first through hole; and The second cover plate is provided with a second through slot, each receiving slot corresponds to a second through slot, the second cover plate is used to be installed on the first surface so that the second through slot is connected to the receiving slot, and the projection of the second through slot is located in the receiving slot.

7. The fixture according to claim 6, characterized in that: The second cover plate has a third surface and a fourth surface opposite to each other along a second thickness direction, the second thickness direction being the thickness direction of the second cover plate, and the third surface is used for being mounted on the first surface; The second cover plate further includes a second limiting portion protruding from the third surface. The second limiting portion is disposed around the second through slot. The second limiting portion is used to support the galvanometer chip received in the receiving slot.

8. The fixture according to claim 7, characterized in that: The second cover plate includes a fifth surface and a fourth surface arranged opposite to each other along the second thickness direction. The fifth surface is concave to form a receiving groove. The bottom surface of the receiving groove is the third surface. The chassis is received in the receiving groove.

9. The fixture according to claim 8, characterized in that: The second cover plate is provided with an escape groove communicating with the side wall of the accommodating groove and the outer side surface of the second cover plate, and the escape groove is used to accommodate the first protrusion.

10. The fixture according to claim 6, characterized in that: The fixture further includes at least two positioning posts fixed to the base plate, wherein the positioning posts extend along a third thickness direction, and the third thickness direction is the thickness direction of the base plate; The chassis is provided with at least two first positioning holes, the second cover is provided with at least two second positioning holes, the positioning column, the first positioning hole and the second positioning hole are correspondingly arranged, and the positioning column is used to pass through the corresponding first positioning hole and the second positioning hole to achieve the positioning of the bottom plate, the chassis and the second cover.

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