Clamping device for semiconductor device production
By designing a clamping device including a chassis, strip through-holes, horizontal and vertical adjustment components, the problem of not being able to adapt to semiconductor devices of different sizes in the prior art is solved, and flexible clamping and cost savings are achieved.
Patent Information
- Application Number
- CN202422414597.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-08
- Publication Date
- 2025-08-05
- Estimated Expiration
- 2034-10-08
AI Technical Summary
The existing clamping devices for semiconductor device production cannot clamp semiconductor devices of different sizes, resulting in inflexible use, which increases the cost of making different clamping devices.
A clamping device including a chassis, a strip through-hole, a horizontal adjustment assembly and a vertical adjustment assembly are designed. The horizontal adjustment assembly consists of a first threaded rod, a first handwheel and a first clamping block. The vertical adjustment assembly consists of a second clamping block, a connecting block and a second threaded rod, and flexible clamping of the semiconductor device is achieved through threaded connection and sliding connection.
Flexible clamping of semiconductor devices of different sizes is achieved, which improves the convenience of use and reduces the cost of making different clamping devices.
Smart Images
Figure CN223186393U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device production, and particularly relates to a clamping device for semiconductor device production. Background Art
[0002] Semiconductor devices are electronic devices made of semiconductor materials and have the ability to regulate current and electric fields. Semiconductor devices play a crucial role in modern electronic technology and are widely used in fields such as computers, communications, consumer electronics, medical, and energy. During the manufacturing process of semiconductor devices, clamping devices are required to fix, clamp, and support the semiconductor devices.
[0003] However, the existing clamping devices for semiconductor device production cannot clamp semiconductor devices of different sizes. Different clamping devices are needed to clamp semiconductor devices of different sizes, which is not flexible and convenient to use, and increases the cost of manufacturing different clamping devices. Summary of the Utility Model
[0004] Aiming at the above deficiencies in the prior art, the utility model provides a clamping device for semiconductor device production, aiming to solve the problems that the existing clamping devices for semiconductor device production cannot clamp semiconductor devices of different sizes, different clamping devices are needed to clamp semiconductor devices of different sizes, it is not flexible and convenient to use, and the cost of manufacturing different clamping devices is increased.
[0005] In order to achieve the above utility model purpose, the technical solution adopted by the utility model is as follows:
[0006] A clamping device for semiconductor device production, including a chassis, a strip-shaped through-hole, a horizontal adjustment component, and a vertical adjustment component. The strip-shaped through-hole is opened on the chassis. The horizontal adjustment component is arranged on one side of the strip-shaped through-hole, and the vertical adjustment component is arranged on the side of the strip-shaped through-hole away from the horizontal adjustment component;
[0007] The horizontal adjustment component includes a first threaded rod, a first handwheel, and a first clamping block. The first threaded rod is threadedly connected to the chassis. The first clamping block is arranged in the strip-shaped through-hole. One end of the first threaded rod is rotatably connected to the first clamping block, and the first handwheel is fixedly connected to the end of the first threaded rod away from the first clamping block
[0008] The vertical adjustment component includes a second clamping block, a connecting block, a second threaded rod, and a second handwheel. The second clamping block is arranged in the strip-shaped through-hole. The connecting block is fixedly connected to the second clamping block. The second threaded rod is threadedly connected to the connecting block. The second handwheel is fixedly connected to one end of the second threaded rod, and the end of the second threaded rod away from the second handwheel is rotatably connected to the chassis.
[0009] Further, the first clamping block is L-shaped.
[0010] Further, a first slider is fixedly connected to the first clamping block, a first sliding groove is formed in the strip-shaped through hole, and the first slider is slidably connected to the first sliding groove.
[0011] Further, the second clamping block is stepped.
[0012] Further, a second slider is fixedly connected to the second clamping block, a second sliding groove is formed in the strip-shaped through hole, and the second slider is slidably connected to the second sliding groove.
[0013] Further, legs are provided at the four corners of the bottom of the chassis.
[0014] The beneficial effects of the present utility model are as follows:
[0015] A clamping device for semiconductor device production according to the present utility model can clamp a semiconductor device through the provided horizontal adjustment component, and can clamp semiconductor devices of different sizes through the provided vertical adjustment, which is flexible and convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;
[0017] Figure 2 is a structural schematic diagram of the horizontal adjustment component of the present utility model;
[0018] Figure 3 is a structural schematic diagram of the vertical adjustment component of the present utility model.
[0019] Correspondence table of reference numerals:
[0020] 1, chassis; 2, strip-shaped through hole; 3, horizontal adjustment component; 301, first threaded rod; 302, first handwheel; 303, first clamping block; 4, vertical adjustment component; 401, second clamping block; 402, connecting block; 403, second threaded rod; 404, second handwheel; 5, first slider; 6, first sliding groove; 7, second slider; 8, second sliding groove; 9, leg. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0021] The following further describes the specific embodiments of the present utility model with reference to the drawings. The same components are denoted by the same reference numerals.
[0022] It should be noted that the terms "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to the directions in the drawings, and the terms "inner" and "outer" respectively refer to the directions towards or away from the geometric center of a specific component.
[0023] In order to make the content of the present utility model easier to be clearly understood, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model.
[0024] As Figures 1 to 3 shown, a clamping device for semiconductor device production includes a chassis 1, a strip-shaped through hole 2, a horizontal adjustment component 3 and a vertical adjustment component 4. Legs 9 are provided at the four corners of the bottom of the chassis 1, and the strip-shaped through hole 2 is opened on the chassis 1.
[0025] The horizontal adjustment component 3 is arranged on one side of the strip-shaped through hole 2. The horizontal adjustment component 3 includes a first threaded rod 301, a first handwheel 302 and a first clamping block 303. The first threaded rod 301 is threadedly connected to the chassis 1. The first clamping block 303 is arranged in the strip-shaped through hole 2. One end of the first threaded rod 301 is rotatably connected to the first clamping block 303. The first handwheel 302 is fixedly connected to the end of the first threaded rod 301 away from the first clamping block 303. The first clamping block 303 is L-shaped, and a first slider 5 is fixedly connected to the first clamping block 303. A first chute 6 is opened in the strip-shaped through hole 2, and the first slider 5 is slidably connected to the first chute 6.
[0026] Turn the first handwheel 302, the first handwheel 302 drives the first threaded rod 301 to rotate, and the first threaded rod 301 drives the first clamping block 303 to move horizontally.
[0027] The vertical adjustment component 4 is arranged on the side of the strip-shaped through hole 2 away from the horizontal adjustment component 3. The vertical adjustment component 4 includes a second clamping block 401, a connecting block 402, a second threaded rod 403 and a second handwheel 404. The second clamping block 401 is arranged in the strip-shaped through hole 2. The connecting block 402 is fixedly connected to the second clamping block 401. The second threaded rod 403 is threadedly connected to the connecting block 402. The second handwheel 404 is fixedly connected to one end of the second threaded rod 403. The end of the second threaded rod 403 away from the second handwheel 404 is rotatably connected to the chassis 1. The second clamping block 401 is stepped, and a second slider 7 is fixedly connected to the second clamping block 401. A second chute 8 is opened in the strip-shaped through hole 2, and the second slider 7 is slidably connected to the second chute 8.
[0028] Turn the second handwheel 404, the second handwheel 404 drives the second threaded rod 403 to rotate, and the second threaded rod 403 drives the connecting block 402 and the second clamping block 401 to move vertically.
[0029] When clamping a semiconductor device, adjust the height of the vertical adjustment component 4 according to the size of the semiconductor device, so that the distance between the first clamping block 303 and the second clamping block 401 is slightly greater than the length of the semiconductor device. Place the semiconductor device between the first clamping block 303 and the second clamping block 401, and turn the first handwheel 302 to move the first clamping block 303 to clamp the semiconductor device.
[0030] A clamping device for semiconductor device production according to the present utility model is convenient for clamping semiconductor devices of different sizes and is flexible and convenient to use.
[0031] The above are only the preferred embodiments of the patent of the present utility model and are not intended to limit the patent of the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the patent of the present utility model shall be included within the protection scope of the patent of the present utility model.
Claims
1. A clamping device for semiconductor device production, characterized in that: The invention comprises a base frame (1), a strip-shaped through hole (2), a horizontal adjustment component (3) and a vertical adjustment component (4), wherein the strip-shaped through hole (2) is provided on the base frame (1), the horizontal adjustment component (3) is provided on one side of the strip-shaped through hole (2), and the vertical adjustment component (4) is provided on a side of the strip-shaped through hole (2) away from the horizontal adjustment component (3); The horizontal adjustment assembly (3) comprises a first threaded rod (301), a first hand wheel (302) and a first clamping block (303), wherein the first threaded rod (301) is threadedly connected to the base frame (1), the first clamping block (303) is arranged in the bar-shaped through hole (2), one end of the first threaded rod (301) is rotatably connected to the first clamping block (303), and the first hand wheel (302) is fixedly connected to the end of the first threaded rod (301) away from the first clamping block (303). The vertical adjustment assembly (4) comprises a second clamping block (401), a connecting block (402), a second threaded rod (403) and a second hand wheel (404); the second clamping block (401) is arranged in the bar-shaped through hole (2); the connecting block (402) is fixedly connected to the second clamping block (401); the second threaded rod (403) is threadedly connected to the connecting block (402); the second hand wheel (404) is fixedly connected to one end of the second threaded rod (403); and the end of the second threaded rod (403) away from the second hand wheel (404) is rotatably connected to the base frame (1).
2. A clamping device for semiconductor device production according to claim 1, characterized in that: The first clamping block (303) is L-shaped.
3. The clamping device for semiconductor device production according to claim 1, wherein: A first sliding block (5) is fixedly connected to the first clamping block (303), a first sliding groove (6) is provided in the strip-shaped through hole (2), and the first sliding block (5) is slidably connected to the first sliding groove (6).
4. A clamping device for semiconductor device production according to claim 1, characterized in that: The second clamping block (401) is in a stepped shape.
5. The clamping device for semiconductor device production according to claim 1, wherein: A second sliding block (7) is fixedly connected to the second clamping block (401), a second sliding groove (8) is provided in the strip-shaped through hole (2), and the second sliding block (7) is slidably connected to the second sliding groove (8).
6. The clamping device for semiconductor device production according to claim 1, wherein: Support legs (9) are provided at the four corners of the bottom of the base frame (1).