Adjustable feeding device for surface treatment of middle plates of mobile phones

Abstract

The utility model relates to the technical field of electroplating feeding, in particular to an adjustable feeding device for mobile phone middle plate surface treatment, which comprises an electroplating tank, a plurality of fixing frames arranged on one side of the electroplating tank and an adjusting feeding mechanism, the adjusting feeding mechanism used for improving the electroplating effect of electronic elements is arranged on one side of the electroplating tank, and the adjusting feeding mechanism is arranged on the other side of the electroplating tank. The adjusting feeding mechanism comprises a movable rod arranged at the top of the electroplating pool, and a feeding assembly is arranged on one side of the movable rod. According to the electronic component electroplating device, the electroplating mode can be adjusted during feeding and discharging electroplating through the feeding assembly, so that an electronic component continuously shakes when making contact with an electroplating solution, more uniform metal ion deposition is achieved when the electronic component is electroplated, the conditions of different thicknesses and non-uniform coverage are reduced, and the electroplating efficiency is improved. The positioning assembly can quickly take down the movable rod, and the distance between the multiple fixing frames can be adjusted or the movable rod can be overhauled and replaced more conveniently.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating feeding, in particular to an adjustable feeding device for surface treatment of a mobile phone mid-plate. Background Art

[0002] Electroplating of electronic components is a surface treatment technique primarily used to improve the functionality, durability, and appearance of electronic components. This treatment method, by depositing one or more layers of metal films on the surface of the component, can provide a variety of benefits, including corrosion protection, enhanced conductivity, anti-static properties, and improved mechanical stability. During electroplating of electronic components, a loading device is required to place the electronic components into the plating solution and then load the components after plating.

[0003] For example, in the electronic component electroplating device shown in the reference case "Electronic Component Electroplating Device" with announcement number "CN220977205U", the tube socket to be electroplated is placed in the groove on the inner wall of the sleeve frame, so that the pins of the tube socket are clamped on the inner wall of the clamping groove, the pressing plate is buckled with the sleeve frame, and then the sleeve rod is sleeved on the outside of the insertion rod to achieve batch electroplating. Then, the motor is driven to drive the bending frame to immerse the tube socket on the sleeve frame in the electroplating solution for electroplating. The electric drive method can quickly and conveniently pick up and place the electroplated parts;

[0004] When loading and unloading the electroplating material in a straight line, the electroplating solution and the electronic components will be static, which may easily lead to uneven distribution of metal ions in the electroplating solution, resulting in inconsistent thickness or incomplete coverage of the electroplating layer.

[0005] Therefore, an adjustable loading device for surface treatment of a mobile phone mid-plate is proposed to solve the above problems. Utility Model Content

[0006] The purpose of the present invention is to provide an adjustable loading device for surface treatment of mobile phone mid-plates in order to solve the above-mentioned problems, which improves the straight-up and straight-down loading and unloading of materials during electroplating, which makes the electroplating solution and electronic components static, easily leading to uneven distribution of metal ions in the electroplating solution, resulting in inconsistent thickness of the electroplating layer, incomplete coverage or local accumulation.

[0007] The utility model achieves the above-mentioned purpose through the following technical solutions: an adjustable feeding device for surface treatment of a mobile phone mid-plate, comprising: an electroplating pool, a plurality of fixing racks are provided on one side of the electroplating pool; an adjusting feeding mechanism, the adjusting feeding mechanism for improving the electroplating effect of electronic components is provided on one side of the electroplating pool; wherein the adjusting feeding mechanism comprises a movable rod provided on the top of the electroplating pool, a feeding assembly is provided on one side of the movable rod, a positioning assembly is provided on one side of the feeding assembly, and a plurality of the fixing racks are connected to the movable rod, so that the electronic components can be fixed on the fixing rack for electroplating, and the electroplating mode can be adjusted by the feeding assembly during loading and unloading electroplating, so that the electronic components are constantly shaken when in contact with the electroplating solution, so that the electronic components can achieve more uniform metal ion deposition during electroplating, thereby reducing the situation of uneven thickness and uneven coverage, and the positioning assembly can quickly remove the movable rod, which can make it more convenient to adjust the spacing between multiple fixing racks or to inspect and replace the movable rod.

[0008] Preferably, the loading assembly includes a positioning plate slidably installed on both sides of the electroplating pool, the movable rod is slidably installed between the two positioning plates, one end of the movable rod is fixedly installed with a driving rod, the surface of the driving rod is fixedly installed with a connecting plate, and a motor is fixedly installed on the surface of one side of the positioning plate, the motor is located on one side of the connecting plate, and the output end of the motor is fixedly installed with a reciprocating screw, one end of the reciprocating screw passes through the connecting plate and is slidably connected to the connecting plate. During electroplating, the movable rod and multiple fixed racks can be synchronously driven to move up and down by the up and down movement of the two positioning plates to discharge and load the electronic components, and when the electronic components are in contact with the electroplating solution, the motor is started to rotate the reciprocating screw, so that the reciprocating screw and the connecting plate perform threaded motion, so that the connecting plate can continuously reciprocate on the surface of the reciprocating screw, and the connecting plate synchronously drives the movable rod and multiple fixed racks to shake the electronic components back and forth, so that the electronic components can achieve more uniform metal ion deposition during electroplating, thereby reducing the situation of uneven thickness and uneven coverage.

[0009] Preferably, the loading assembly also includes an electric slide rail fixedly installed on one side of the electroplating pool, and a drive frame is fixedly installed on one side of the electric slide rail. The drive frame is fixedly connected to the two positioning plates respectively. When the two positioning plates are moved up and down, the drive frame can be driven to move by the electric slide rail, so that the drive frame can synchronously drive the two positioning plates to move, making it more convenient to drive the two positioning plates.

[0010] Preferably, a plurality of movable tubes are slidingly sleeved on the surface of the movable rod, and the plurality of movable tubes are respectively fixedly connected to the plurality of fixed frames. A limiting rod is installed through the surface of the movable tube, and a plurality of limiting holes are opened through the surface of the movable rod. One end of the limiting rod passes through an adjacent limiting hole. When it is necessary to adjust the spacing of the plurality of fixed frames, the limiting rod can be separated from the corresponding limiting hole by pulling the limiting rod, so that the movable tube can be synchronously driven to move the fixed frame. After the adjustment is completed, the limiting rod is connected to the adjacent limiting hole, so that the spacing of the plurality of fixed frames can be quickly adjusted.

[0011] Preferably, a spring is provided through the surface of the limit rod, and one end of the spring is fixedly connected to the adjacent movable tube. When the limit rod is connected to the limit hole, the spring tightens the limit rod and stably connects it with the corresponding limit hole, thereby preventing the limit rod from sliding out of the corresponding limit hole when the electronic component is shaken and electroplated.

[0012] Preferably, the positioning assembly includes a mounting plate arranged on one side of the positioning plate, two support plates are fixedly installed on one side of the mounting plate, one side of the two support plates extends to the inside of the mounting plate, the surfaces of the two support plates are penetrated by connecting holes, and the surface of the positioning plate is penetrated by a support rod, one end of the support rod penetrates two connecting holes, when the movable rod needs to be removed, the two support rods can be moved to separate from the corresponding positioning plate, that is, the two mounting plates can be moved to drive the corresponding two support plates to separate from the positioning plate, and the movable rod can be removed for inspection or replacement, which is very convenient.

[0013] Preferably, a guide groove is provided on the surface of the movable rod, and a guide block is fixedly installed on one side of the mounting plate. The guide block is slidably connected to the guide groove. When the movable rod shakes, the movable rod can be guided to move through the sliding connection between the guide block and the guide groove, so that the shaking movement of the movable rod is more stable.

[0014] The beneficial effects of the utility model are:

[0015] 1. The electronic components can be fixed on the fixed frame for electroplating. The electroplating mode can be adjusted by the loading assembly during loading and unloading, so that the electronic components are constantly shaken when in contact with the electroplating solution, so that the electronic components can achieve more uniform metal ion deposition during electroplating, thereby reducing the situation of uneven thickness and uneven coverage. The positioning assembly can quickly remove the movable rod, which is more convenient for adjusting the spacing between multiple fixed frames or repairing and replacing the movable rod;

[0016] 2. When the movable rod needs to be removed, the two support rods can be moved and separated from the corresponding positioning plates, and the two mounting plates can be moved to drive the corresponding two support plates to separate from the positioning plates, so that the movable rod can be removed for inspection or replacement, which is very convenient. When the movable rod shakes, the movable rod can be guided by the sliding connection between the guide block and the guide groove, so that the shaking movement of the movable rod is more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the structure of the regulating feeding mechanism of the present utility model;

[0019] Figure 3 This is a schematic diagram of the structure of the feeding component of the present utility model;

[0020] Figure 4 This is a schematic diagram of the positioning component structure of the present utility model.

[0021] In the figure: 1. Electroplating tank; 2. Fixed frame; 3. Adjustable feeding mechanism; 31. Movable rod; 32. Feeding assembly; 321. Positioning plate; 322. Driving frame; 323. Electric slide rail; 324. Driving rod; 325. Motor; 326. Reciprocating screw; 327. Connecting plate; 328. Movable tube; 329. Limiting rod; 3210. Spring; 3211. Limiting hole; 33. Positioning assembly; 331. Mounting plate; 332. Support plate; 333. Connecting hole; 334. Support rod; 335. Guide block; 336. Guide groove. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] When implementing: Figure 1-4As shown, an adjustable feeding device for surface treatment of a mobile phone mid-plate comprises: an electroplating pool 1, a plurality of fixing frames 2 are provided on one side of the electroplating pool 1; an adjusting feeding mechanism 3, the adjusting feeding mechanism 3 for improving the electroplating effect of electronic components is provided on one side of the electroplating pool 1; wherein, the adjusting feeding mechanism 3 comprises a movable rod 31 provided on the top of the electroplating pool 1, a feeding assembly 32 is provided on one side of the movable rod 31, a positioning assembly 33 is provided on one side of the feeding assembly 32, and multiple fixing frames 2 are connected to the movable rod 31, and the electronic components can be fixed on the fixing frame 2 for electroplating, and the electroplating mode can be adjusted by the feeding assembly 32 during loading and unloading electroplating, so that the electronic components are constantly shaken when in contact with the electroplating solution, so that the electronic components can achieve more uniform metal ion deposition during electroplating, thereby reducing the uneven thickness and uneven coverage, and the positioning assembly 33 can quickly remove the movable rod 31, which can be more convenient in adjusting the spacing between multiple fixing frames 2 or inspecting and replacing the movable rod 31.

[0024] like Figure 2 、 Figure 3 and Figure 4The cam 328 is actuated by a lever 321 which is secured to the upper and lower ends of the drive shaft 324 so that the cam 328 can be engaged with the lever 321 by a spring 322 which is secured to the upper and lower ends of the drive shaft 324. The cam 328 is actuated by a lever 321 which is secured to the upper and lower ends of the drive shaft 324 by a spring 322 which can be engaged with the lever 321 by a spring 322 When the electronic component comes into contact with the electroplating solution, the motor 325 is started to rotate the reciprocating screw 326, so that the reciprocating screw 326 and the connecting plate 327 perform threaded motion, so that the connecting plate 327 can continuously reciprocate on the surface of the reciprocating screw 326, and the connecting plate 327 synchronously drives the movable rod 31 and multiple fixed frames 2 to rock the electronic component back and forth, so that the electronic component can achieve more uniform metal ion deposition during electroplating, thereby reducing the situation of uneven thickness and uneven coverage. The loading assembly 32 also includes a fixed electric slide 323 fixedly installed on one side of the electroplating tank 1, and a driving frame 322 is fixedly installed on one side of the electric slide 323. The driving frame 322 is fixedly connected to the two positioning plates 321 respectively. When the two positioning plates 321 are moved up and down, the driving frame 322 can be driven to move by the electric slide 323, so that the driving frame 322 synchronously drives the two positioning plates 321 to move, making it more convenient to drive the two positioning plates 321;

[0025] The surface of the movable rod 31 is slidably sleeved with a plurality of movable tubes 328, and the plurality of movable tubes 328 are respectively fixedly connected to the plurality of fixed frames 2. A limiting rod 329 is installed on the surface of the movable tube 328, and a plurality of limiting holes 3211 are opened on the surface of the movable rod 31. One end of the limiting rod 329 passes through the adjacent limiting holes 3211. When it is necessary to adjust the spacing of the plurality of fixed frames 2, the limiting rod 329 can be separated from the corresponding limiting hole 3211 by pulling the limiting rod 329, and the movable tube 328 can be moved synchronously to drive the fixed frame 2 to move. After the section is completed, the limit rod 329 is connected to the adjacent limit hole 3211 to quickly adjust the spacing between multiple fixing frames 2. A spring 3210 is provided through the surface of the limit rod 329, and one end of the spring 3210 is fixedly connected to the adjacent movable tube 328. When the limit rod 329 is connected to the limit hole 3211, the spring 3210 tightens the limit rod 329 to stably connect it with the corresponding limit hole 3211, thereby preventing the limit rod 329 from sliding out of the corresponding limit hole 3211 when the electronic components are shaken and electroplated.

[0026] like Figure 2 and Figure 4 As shown, the positioning assembly 33 includes a mounting plate 331 arranged on one side of the positioning plate 321, and two support plates 332 are fixedly installed on one side of the mounting plate 331. One side of the two support plates 332 extends into the interior of the mounting plate 331. The surfaces of the two support plates 332 are penetrated with connecting holes 333. The surface of the positioning plate 321 is penetrated with a support rod 334, and one end of the support rod 334 penetrates the two connecting holes 333. When the movable rod 31 needs to be removed, the two support rods 334 can be moved to separate from the corresponding positioning plate 321. By moving the two mounting plates 331 to separate the corresponding two support plates 332 from the positioning plate 321, the movable rod 31 can be removed for inspection or replacement, which is very convenient. A guide groove 336 begins to be provided on the surface of the movable rod 31, and a guide block 335 is fixedly installed on one side of the mounting plate 331. The guide block 335 is slidably connected to the guide groove 336. When the movable rod 31 shakes, the movable rod 31 can be guided to move by the sliding connection between the guide block 335 and the guide groove 336, so that the shaking movement of the movable rod 31 is more stable.

[0027] When the present invention is in use, during electroplating, the two positioning plates 321 can be moved up and down to synchronously drive the movable rod 31 and multiple fixed racks 2 to move up and down, so as to discharge and load the electronic components. When the electronic components are in contact with the electroplating solution, the motor 325 is started to rotate the reciprocating screw 326, so that the reciprocating screw 326 and the connecting plate 327 can perform threaded motion, so that the connecting plate 327 can continuously reciprocate on the surface of the reciprocating screw 326. The connecting plate 327 synchronously drives the movable rod 31 and multiple fixed racks 2 to reciprocate and shake the electronic components, so that the electronic components can achieve more uniform metal ion deposition during electroplating, thereby reducing the situation of uneven thickness and uneven coverage. When the two positioning plates 321 are moved up and down, the driving rack 322 can be driven to move by the electric slide rail 323, so that the driving rack 322 synchronously drives the two positioning plates 321 to move. When the space between the plurality of fixing frames 2 needs to be adjusted, the limit rod 329 can be separated from the corresponding limit hole 3211 by pulling the limit rod 329, and the movable tube 328 can be moved to synchronously drive the fixing frame 2 to move. After the adjustment is completed, the limit rod 329 is connected to the adjacent limit hole 3211, and the space between the plurality of fixing frames 2 can be quickly adjusted. When the limit rod 329 is connected to the limit hole 3211, the spring 3210 tightens the limit rod 329 and the corresponding limit hole 3211 to ensure a stable connection, so as to prevent the limit rod 329 from sliding out of the corresponding limit hole 3211 when the electronic component is shaken and electroplated. When the movable rod 31 needs to be removed, the two support rods 334 can be moved to separate from the corresponding positioning plates 321, and the two mounting plates 331 can be moved to drive the corresponding two support plates 332 to separate from the positioning plate 321, so that the movable rod 31 can be removed for inspection or replacement, which is very convenient.

[0028] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An adjustable feeding device for surface treatment of mobile phone mid-plate, characterized in that: include: An electroplating pool (1), wherein a plurality of fixing frames (2) are provided on one side of the electroplating pool (1); An adjusting and feeding mechanism (3) for improving the electroplating effect of electronic components, the adjusting and feeding mechanism (3) being arranged on one side of the electroplating tank (1); The regulating feeding mechanism (3) comprises a movable rod (31) arranged on the top of the electroplating tank (1), a feeding assembly (32) is arranged on one side of the movable rod (31), a positioning assembly (33) is arranged on one side of the feeding assembly (32), and a plurality of the fixing frames (2) are connected to the movable rod (31).

2. The adjustable feeding device for surface treatment of mobile phone mid-plate according to claim 1, characterized in that: The loading assembly (32) includes positioning plates (321) slidably mounted on both sides of the electroplating tank (1), the movable rod (31) is slidably mounted between the two positioning plates (321), a driving rod (324) is fixedly mounted on one end of the movable rod (31), a connecting plate (327) is fixedly mounted on the surface of the driving rod (324), a motor (325) is fixedly mounted on the surface of one side of the positioning plate (321), the motor (325) is located on one side of the connecting plate (327), a reciprocating screw (326) is fixedly mounted on the output end of the motor (325), and one end of the reciprocating screw (326) passes through the connecting plate (327) and is slidably connected to the connecting plate (327).

3. The adjustable feeding device for surface treatment of mobile phone mid-plate according to claim 2, characterized in that: The loading assembly (32) further comprises an electric slide rail (323) fixedly mounted on one side of the electroplating tank (1); a driving frame (322) is fixedly mounted on one side of the electric slide rail (323); and the driving frame (322) is fixedly connected to the two positioning plates (321) respectively.

4. The adjustable feeding device for surface treatment of mobile phone mid-plate according to claim 2, characterized in that: The surface of the movable rod (31) is slidably sleeved with a plurality of movable tubes (328), and the plurality of movable tubes (328) are respectively fixedly connected to the plurality of fixed frames (2). A limiting rod (329) is installed through the surface of the movable tube (328), and a plurality of limiting holes (3211) are opened through the surface of the movable rod (31), and one end of the limiting rod (329) passes through an adjacent limiting hole (3211).

5. The adjustable feeding device for surface treatment of mobile phone mid-plate according to claim 4, characterized in that: A spring (3210) is sleeved through the surface of the limiting rod (329), and one end of the spring (3210) is fixedly connected to the adjacent movable tube (328).

6. The adjustable feeding device for surface treatment of mobile phone mid-plate according to claim 1, characterized in that: The positioning assembly (33) includes a mounting plate (331) arranged on one side of the positioning plate (321), two support plates (332) are fixedly installed on one side of the mounting plate (331), one side of the two support plates (332) extends into the interior of the mounting plate (331), and the surfaces of the two support plates (332) are penetrated by connection holes (333), and a support rod (334) is installed on the surface of the positioning plate (321), and one end of the support rod (334) penetrates the two connection holes (333).

7. The adjustable feeding device for surface treatment of mobile phone mid-plate according to claim 6, characterized in that: A guide groove (336) is formed on the surface of the movable rod (31), and a guide block (335) is fixedly mounted on one side of the mounting plate (331). The guide block (335) is slidably connected to the guide groove (336).

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