Vacuum glue pouring type cooling fan

Abstract

The utility model relates to a vacuum glue filling type cooling fan, and aims to solve the problems that a special glue filling jig is needed in the production of the conventional similar products, the overall production is inconvenient, the production cost is high, the production efficiency is low, the defective rate is high, and the heat conductivity of plastic packaging materials is high, so that the production cost is low. And the temperature rise of an enameled wire is easily caused to be directly guided into a frame body by a plastic packaging material, so that a circuit board is influenced, and the stability of the motor is reduced. The cooling fan is characterized in that a wrapping plastic packaging material is arranged on the outer diameter of a winding assembly of the cooling fan, and a first positioning column, a second positioning column, a third positioning column and a fourth positioning column which are subjected to plastic packaging and then exposed out of the plastic packaging material are arranged on the top of a lower insulating frame of the winding assembly and located below a circuit board; after the PINs and the wires of the winding assembly are connected with the circuit board, the circuit board at the circuit board groove of the fan frame body is provided with a glue pouring material which is formed through vacuum glue pouring; the lower insulating frame of the winding assembly is provided with a hole which extends out and is convenient for welding the upper end of the PIN to a circuit board.

Description

Technical Field

[0001] The utility model relates to a heat dissipation fan applied to photovoltaic inverter equipment, which is a vacuum glue-filling type heat dissipation fan. Background Art

[0002] Cooling fans generally refer to fans used to dissipate heat from motherboards, such as CPUs and graphics cards. Their primary purpose is to conduct heat away from the system and dissipate it into the surrounding air, achieving a cooling effect. Some cooling fans are used in electrical cabinets or industrial equipment cabinets. Currently, cooling fans used in server equipment generate significant heat due to the numerous operating modules within the server, leading to elevated internal server temperatures and hindering long-term temperature operation. Cooling fans are typically used to drive air circulation to lower internal server temperatures. Some cooling fans are currently used in photovoltaic inverter equipment. To dissipate heat and maintain proper operation of the IGBT power modules within these inverters, the motor and circuit boards within the fan must be protected to ensure stable operation, as most inverters are installed outdoors in harsh environments. The conventional glue potting process for existing cooling fans involves the following steps: installing the motor and circuit board into the fan frame, placing the frame into a jig and securing it, then potting the fan with glue, heating the jig, and finally disassembling and removing the fan frame. However, this approach has many problems, as follows: 1. The cost of jigs is high, and large quantities of jigs need to be made for mass production. 2. The jig defect rate is high. After a period of use, the jig may develop gaps in the glue, burrs on the finished product, and damage to the jig during disassembly, which may lead to jig damage. 3. Production efficiency is low, and each glue filling operation requires jig assembly and disassembly, which takes a lot of time. 4. After glue filling, the heat from the enameled wire in the motor is transferred to the circuit board. Because the thermal conductivity of the glue material used is low, the temperature rise of the entire motor enameled wire and the circuit board is high. For example, the application number 202221747859.5 disclosed in the Chinese patent literature, with the authorization announcement date of December 9, 2022, and the utility model name "New High-Protection Structure Fan"; the motor assembly of this fan has the problem that the wire package, silicon steel sheet, and wire frame are fixed to the middle tube of the fan frame through the wire package plastic seal. The high thermal conductivity of the glue material mentioned above causes a high temperature rise of the motor enameled wire and the circuit board. Summary of the Invention

[0003] To overcome the above-mentioned shortcomings, the purpose of the present invention is to provide a vacuum glue-potting cooling fan in the art, which solves the problems of existing similar products requiring dedicated glue-potting jigs during production, resulting in overall inconvenience, high production costs, low production efficiency, and a high defective rate. Furthermore, due to the high thermal conductivity of the plastic encapsulation material, the temperature rise of the enameled wire can be easily introduced directly into the frame through the plastic encapsulation material, affecting the circuit board and reducing the stability of the motor. Furthermore, there are technical problems such as the need for wire welding through the frame, the difficulty in fixing the winding assembly to the circuit board, and the inability to introduce automated production. This purpose is achieved through the following technical solution.

[0004] A vacuum glue-filled cooling fan, the fan frame of which includes a base and a middle tube, the middle tube being integrally arranged in the middle of a circuit board slot in the base, a wire groove being provided on one side of an opening of the circuit board slot of the fan frame, a winding assembly and a circuit board being fixedly provided on the outer diameter of the middle tube of the fan frame, the winding assembly being fixedly provided on the outer diameter of the middle tube of the fan frame through silicon steel sheets, the winding assembly including silicon steel sheets, an upper insulating frame, a lower insulating frame, enameled wire and plastic packaging material, the silicon steel sheets, the upper insulating frame and the lower insulating frame being connected as a whole through enameled wire, the winding assembly and the circuit board being connected as a whole to form a motor assembly, the shaft core of the fan blade assembly being inserted into the inner diameter of the middle tube of the fan frame to form a finished fan, the motor assembly being fixed to the outer diameter of the middle tube of the fan frame, and the wire being connected to the circuit board of the motor assembly through the wire groove of the fan frame. The key points of its structural design are that the outer diameter of the winding assembly is coated with plastic encapsulating material, and the top of the winding assembly's lower insulating frame is provided with positioning posts 1, 2, 3, and 4, which are first plastic encapsulated and then exposed to the plastic encapsulating material. These posts are located below the circuit board. After the PIN pins and wires of the winding assembly are connected to the circuit board, the circuit board slots of the fan frame are provided with a potting material that is then vacuum-formed. This potting material is formed by potting through the wire grooves of the fan frame. As a result, the winding assembly of the cooling fan is first plastic encapsulated, and the circuit board is potted afterwards. Due to the high thermal conductivity of the plastic encapsulating material, the temperature rise of the enameled wire is directly conducted into the frame by the plastic encapsulating material, no longer affecting the circuit board, thereby reducing the temperature rise of the circuit board and improving the stability of the motor. Furthermore, this production process no longer requires a dedicated potting jig, reducing overall production costs.

[0005] The winding assembly's lower insulating frame is equipped with PIN pins 1, 2, and 3, which extend and are soldered to holes 1, 2, and 3 on the circuit board. The winding assembly's enameled wire includes a head and a tail, with the head connected to the upper end of PIN pin 1 and the tail connected to the upper end of PIN pin 2. This structure facilitates wire frame welding, securing the winding assembly to the circuit board, and integration into automated production.

[0006] The wires are connected to the pads on the circuit board of the motor assembly through the wire grooves of the fan frame. The above structure is further convenient for introduction into automated production.

[0007] The utility model has reasonable structural design, convenient production, high efficiency, low production cost, high yield rate, good stability and long service life. At the same time, the wiring of PIN needles is convenient during the automated production process. The utility model is suitable for use as a vacuum glue-filled cooling fan and a structural improvement of similar products. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a partial exploded structural diagram of an embodiment of the present invention, in which the dotted line represents the effect of the winding assembly as a plastic-encapsulated assembly after being plastic-encapsulated by the plastic-encapsulating material.

[0009] Figure 2 yes Figure 1 Schematic diagram of the internal structure of the fan frame.

[0010] Figure 3 yes Figure 1 Schematic diagram of the enlarged structure of the winding component.

[0011] Figure 4 yes Figure 2 Schematic diagram of the structure of the winding component after being connected to the circuit board and plastic-sealed and connected to the wire state.

[0012] Figure 5 yes Figure 4 Schematic diagram of the structure after the motor assembly is installed in the fan frame.

[0013] Figure 6 yes Figure 5 Schematic diagram of the structure of the semi-finished product after vacuum filling of the circuit board component.

[0014] Figure 7 yes Figure 6 The fan blade assembly is installed to form a structural diagram of the finished fan.

[0015] Figure 8 yes Figure 7 Schematic diagram of the cross-sectional structure.

[0016] Serial number and name of the accompanying drawings: 1. Fan frame, 101. Base, 102. Middle tube, 1011. Wire trough, 2. Winding assembly, 201. Silicon steel sheet, 202. Upper insulating frame, 203. Lower insulating frame, 2031. PIN needle one, 2032. PIN needle two, 2033. PIN needle three, 2034. Positioning column one, 2035. Positioning column two, 2036. Positioning column three, 2037. Positioning column four, 204. Enameled wire, 2041. Wire end, 2042. Wire tail, 3. Plastic packaging assembly, 4. Plastic packaging material, 5. Circuit board, 501. Hole one, 502. Hole two, 503. Hole three, 504. Electronic components, 505. Pad, 6. Motor assembly, 7. Wire, 8. Glue-potting semi-finished product, 9. Glue-potting material, 10. Fan blade assembly, 11. Fan finished product. Implementation Method

[0017] Now, in conjunction with the accompanying drawings, the structure and use of the utility model are further described. Figures 1-8 As shown, the fan frame 1 of the cooling fan includes a base 101 and a middle tube 102, the base 101 includes a wire groove 1011; the winding assembly 2 includes a silicon steel sheet 201, an upper insulating frame 202, a lower insulating frame 203, an enameled wire 204 and a plastic packaging material 4, the silicon steel sheet 201, the upper insulating frame 202 and the lower insulating frame 203 are combined together by the enameled wire 204, the lower insulating frame 203 includes a PIN needle 1 2031, a PIN needle 2 2032, a PIN needle 3 2033, a positioning column 1 2034, a positioning column 2 2035, a positioning column 3 2036 and a positioning column 2037, the enameled wire 204 includes a wire end 2041 and a wire tail 2042. The wire end 2041 is connected to the upper end of PIN 1 2031, and the wire tail 2042 is connected to the upper end of PIN 2 2032. The plastic package assembly 3 includes the winding assembly 2 and plastic package material, wherein the first positioning post 2034, the first positioning post 2035, the third positioning post 2036, and the fourth positioning post 237 are exposed for a distance. The circuit board 5 includes the first hole 501, the second hole 502, the third hole 503, the electronic component 504, and the solder pad 505. The motor assembly 6 includes the plastic package assembly 3, the circuit board 5, and the wire 7. The first positioning post 2034, the second positioning post 2035, the third positioning post 2036, and the fourth positioning post 2037 of the lower insulating frame 203 are positioned with the circuit board 3. The lower end of PIN 1 2031 is welded to hole 1 301, the lower end of PIN 2 2032 is welded to hole 2 302, and the lower end of PIN 3 2033 is welded to hole 3 303. The outer diameter of the middle tube 102 of the fan frame 1 is fixed with silicon steel sheet 201, and the motor assembly is fixed to the outer diameter of the middle tube 102.

[0018] The semi-finished heat dissipation fan 8 includes a fan frame 1, a motor assembly 6, and a potting material 9. The wires 7 are placed in a wire groove 1011, and the glue is added near the wire groove to complete the potting. The finished heat dissipation fan 11 includes the semi-finished heat dissipation product 8 and the fan blade assembly 10. The potting method of the heat dissipation fan further includes the step of performing the entire potting process in a vacuum device.

[0019] In summary, the above-described method and structure thoroughly overcome the issues with traditional metal jigs in glue potting, significantly improving production efficiency and yield. Dedicated glue potting jigs are no longer required, reducing overall production costs. Furthermore, the cooling fan's winding assembly is first plastic-encapsulated, and the circuit board is subsequently glue-potted. Due to the high thermal conductivity of the plastic potting material, the temperature rise of the enameled wire is directly transferred to the frame through the plastic potting material, without affecting the circuit board. This reduces the temperature rise of the circuit board and improves the stability of the motor. Furthermore, the above-described production process no longer requires dedicated glue potting jigs, reducing overall production costs.

Claims

1. A vacuum glue-filled heat dissipation fan, wherein the fan frame (1) of the heat dissipation fan comprises a base (101) and a middle tube (102), the middle tube being integrally arranged in the middle of a circuit board slot in the base, a wire groove (1011) being provided on one side of an opening of the circuit board slot of the fan frame, a winding assembly (2) and a circuit board (5) being fixedly provided on the outer diameter of the middle tube of the fan frame, the winding assembly being fixedly arranged on the outer diameter of the middle tube of the fan frame through a silicon steel sheet (201), the winding assembly comprising a silicon steel sheet (201), an upper insulating frame (202), a lower insulating frame (203), an enameled wire (204) and a plastic sealing material (4), the silicon steel sheet, the upper insulating frame and the lower insulating frame being connected as a whole through the enameled wire, the winding assembly and the circuit board being connected as a whole to form a motor assembly (6), the shaft core of the fan blade assembly (10) being inserted into the inner diameter of the middle tube of the fan frame to form a finished fan (11), the motor assembly being fixed on the outer diameter of the middle tube of the fan frame, and the wire (7) being connected to the circuit board of the motor assembly through the wire groove of the fan frame; characterized in that The outer diameter of the winding assembly (2) is provided with a plastic packaging material (4) wrapped therein, and the top of the lower insulating frame (203) of the winding assembly is provided with a positioning column 1 (2034), a positioning column 2 (2035), a positioning column 3 (2036), and a positioning column 4 (2037) which are first plastic-sealed and then exposed to the plastic packaging material, and are located below the circuit board (5); after the PIN pin and the wire (7) of the winding assembly are connected to the circuit board, the circuit board at the circuit board slot of the fan frame (1) is provided with a potting material (9) which is then formed by vacuum potting.

2. The vacuum glue-filled cooling fan according to claim 1, characterized in that The lower insulating frame (203) of the winding assembly (2) is provided with PIN pin 1 (2031), PIN pin 2 (2032), and PIN pin 3 (2033) extending out and welded to hole 1 (501), hole 2 (502), and hole 3 (503) of the circuit board (5). The enameled wire (204) of the winding assembly includes a wire head (2041) and a wire tail (2042), wherein the wire head is connected to the upper end of PIN pin 1, and the wire tail is connected to the upper end of PIN pin 2.

3. The vacuum glue-filled cooling fan according to claim 1, characterized in that The wire (7) is connected to the soldering pad (505) on the circuit board (5) of the motor assembly (6) through the wire groove (1011) of the fan frame (1).

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